DE102004010013B4 - Method for contacting a chip module - Google Patents

Abstract

method for contacting a chip module with a laid on or in a card body Conductor track, characterized in that the chip module outside of the card body with out of the card body exposed, lifted sections of the track contacted becomes.

Description

The The invention relates to a method for contacting a chip module with a laid on or in a card body trace after the Preamble of claim 1.

smart cards with laid in the card body Antenna tracks are included to the state of the art. These smart cards are for example for contactless Data transfer between a reading terminal and one for Used for identification purposes. In general Such cards contain one in a cavity of a preferably one Plastic running Card base body fixed chip module, wherein the routed conductor track as an antenna device is being used. Chip module and trace are electrical to each other contacted. The contacting is usually carried out so that the chip module into the cavity of the card body used and connected here or subsequently to the track becomes.

For this Contacting different contacting methods are applied. So For example, the connection by means of an electrically conductive adhesive be realized. There is a risk of this procedure Oxidation of exposed portions of preferably made of copper Conductor, with the Kontaktierproblemen between chip module and trace can go along. Furthermore, such Leitkleberverbindungen prove often not sufficiently resistant to bending loads. So come it is relatively common to a breakage of the adhesive bond or to a detachment of the Splice from the chip module or the corresponding section of the Trace.

at a contact between the conductor track and chip module by means of a solder turns the process monitoring while of the soldering process, in particular the warranty sufficient heating the solder joints, as problematic. Thus, under certain circumstances, "cold" solder joints which produces only insufficient establish electrical contact between chip module and conductor track and often fail after a while. In case of overheating the solder joint For example, the surrounding material of the card base may melt and the chip card become useless.

From the DE 198 48 009 C2 a method for producing a conductor loop with a connected chip module for use in contactless chip cards is previously known. In this method, first a chip module is punched out of a chip module assembly. Subsequently, the insertion of the insulated chip or chip module takes place in a movable two-part running carrier device, consisting of a base part and a removable holding part. The holding part has a clamping device, by means of which the chip or the chip module is fixed on a carrier device. In the next step, a relative movement of the carrier device to a Leitschleifenwickeleinrichtung takes place. Then, the holding part is removed from the base part and it is used the holding part with clamping device in the winding device. In the next step, a conductor loop wire is fed and the wire is fastened to the holding part inserted in the winding device. About a rotation of the holding member used is a creating a multi-winding conductor loop, wherein the conductor loop is determined in shape by existing on the support device winding supports and thereby contains the shape that is suitable for introduction into the transponder body.

The Contacting of the chip module with the conductor takes place outside of the card body, However, at the time of contacting the conductor at no Place with the card body itself is connected.

From the DE 196 47 846 C1 , which discloses a method for manufacturing a chip card, is made by means of a milling step within a recess in a card module, an exposure of conductor tracks connections for the purpose of contacting.

With regard to the method for producing a contact-type as well as non-contact signal and energy transmission in a chip card is according to the DE 197 32 645 A1 proposed to expose conductive bumps of solder paste or adhesive by milling, wherein the local chip module facedown is introduced with contact surfaces in the milled cavity with exposed terminals.

From the DE 198 44 089 A1 a method for producing transponder chips is previously known, wherein a connection method by means of ultrasound application is used for electrically contacting the antenna coil there.

Out The above, it is therefore an object of the invention, an evolved Method for contacting a chip module with or in one card body specify laid track, in which an electrical connection possible for functional test is before it becomes a final one Connection between chip module and card main body comes.

These The object is achieved by a method for contacting a chip module according to the characteristics of claim 1 solved, the dependent claims expedient embodiments of the method.

According to the invention Chip module outside of the card body with out of the card body exposed and lifted sections of the track contacted.

in the Contrary to the commonly used in the prior art contacting method, in which first inserted the chip module in the card body and then with the conductor is contacted, fiction, according to sections or Ends of the track exposed and pulled out of the card body, so these sections are outside the card body are located. With these outside lying sections, the chip module is contacted. Thus finds the electrical contacting takes place completely outside the card base body and lets thus the map basic body unchanged.

Especially the contacting is carried out by the following method steps. First, will the conductor track in the form of the chip module to be fastened a pull-out contacting section, in particular a Wire loop, laid in the card body. Below is the contacting section exposed. The contacting section will do this detected and pulled out with a mechanical gripping device. After all becomes the chip module with the withdrawn contacting portion connected.

advantageously, can be used in conjunction with or directly after the contacting process a bump test, taking place after completion of the bump test the contacted chip module inserted into the cavity of the card body and is fixed. By this embodiment of the contacting method is achieved that the functionality of the contact is checked before the chip module unsolvable connected to the card body is and the entire chip card may result in one Failed contact must be discarded.

The outside of the card body making contact possible in particular, the chip module and the contacting section under Use of a welded joint to contact. In connection with this is also a stripping executed the contacting section. The welding process is especially good for a very firm and permanent contact of the usually consisting of copper contacting sections with the substantially made of copper, nickel or gold existing contacts of the chip modules. The welding process resulting heat development damages not the card body and is therefore unproblematic.

A Device for execution of the contacting method is exposed by a on a card body arranged Kontaktie ing section detecting mechanical gripping device in connection with a positioning module holding a chip module and a contacting device for contacting the contacting section and chip module.

The Contact between conductor track and chip module is thus completely mechanical and automatically executed wherein the chip module by the positioning precisely adjustable position is.

Of the Contacting section is preferably in the form of a wire loop executed. This wire loop can be especially easy to grasp and handle mechanically.

The The mechanical gripping device is expediently in the form of a hook device educated. This has a number of hooks for pulling out and for the purposeful positioning of the Wire loop for the contact on. The hook device thus grips the wire loop and stops until the contact is completed in the required position.

The Contacting device may preferably as a spot welding device be educated. With such a device is an accurate and clean contact with individual points of the wire loop with the chip module or the contact areas of the chip module possible.

As well is the use of a soldering device as a contacting device possible.

The method according to the invention will be explained in more detail below with reference to exemplary embodiments. To clarify serve the 1 to 7 , The same reference numbers are used for identical or equivalent parts. Hereby show:

1 an exemplary representation of a chip card blank with a card main body, a wire loop, a conductor track and a cavity in a plan view,

2 exemplary sectional views of a chip card blank with a closed or opened cavity,

3 an exemplary representation of the smart card blank 2 in connection with a hook device and a contacting device in a starting position,

4 an exemplary representation of the hook and contacting device according to 3 while grasping the wire loop,

5 an exemplary representation of a detected by the hook device and pulled out of the cavity wire loop,

6 an exemplary representation of a device held by a Positioniervorrich and supplied chip module during a Kontaktiervorgangs and

7 an exemplary representation of an insertion of the contacted chip module in the card body of the smart card blank.

An exemplary embodiment of a smart card blank is shown in FIG 1 shown in a plan view. The smart card blank has a card base, which generally consists of a plastic material 10 on. In the card main body is a trace 30 misplaced the one wire loop 20 within a cavity 40 having the material of the card body. The conductor track 30 For example, it may be part of an antenna intended for non-contact signal transmission. It consists in this embodiment of an insulated copper wire, which has been introduced using a commonly used for the production of such chip cards installation method in the card body.

For example, the card body 10 consist of an upper and lower layer, between which the copper wire of the conductor is laid and sandwiched, wherein the copper wire of the conductor is fixed immovably fixed between the sandwich halves of the card body.

In contrast to the rest of the track 30 becomes the wire loop 20 loose between the sandwich halves of the card body 10 arranged so that it is in principle displaceable. This can be achieved, for example, by applying no adhesive, adhesive or similar fastening means in the region of the wire loop. Furthermore, it is possible that the sandwich halves of the card body a cavity 40 form, in which the wire loop 20 is loosely received.

2 shows two exemplary sectional views of another embodiment of a card body with laid track 30 , The upper illustration off 2 shows the wire loop 20 in the still closed by the sandwich halves of the card body cavity 40 , As already in connection with 1 explains, is the trace 30 within the card body 10 immobilized while the wire loop 20 inside the cavity 40 free and mobile.

In the lower illustration off 2 is the cavity 40 on top of the card body 10 opened in a preparatory step. The wire loop 20 is thus free, can be detected and removed from the cavity 40 be pulled out.

The 3 to 6 show continuously an exemplary hook device 50 and contacting device 80 in conjunction with an exemplary process flow of a contacting process. The in 2 shown, with wire loop 20 , Trace 30 and cavity 40 provided card body 10 gets under the hook device 50 inserted. This has an arrangement of two or more hooks 51 on, in their direction of the wire loop 20 pointing ends with eyelets 52 can be provided. Depending on the shape, size and shape of the wire loop 20 or the cavity 40 can in the context of expert action both number, as well as arrangement and size of the hook 51 or eyelets 52 from the representation in 3 be executed deviating.

How out 4 it can be seen, the hook device 50 in the direction of the wire loop 20 so far lowered that the eyelets 52 at the lower ends of the hooks 51 in the cavity 40 are located. The hooks 51 are then moved outwards, with wire sections of the wire loop 20 in the eyelets 52 slide in and the wire loop 20 thus from the hook device 50 is captured and stretched.

As in 5 shown, the hook device 50 subsequently raised, taking the hooks 51 recorded wire loop 20 from the cavity 40 is pulled out and then above the level of the card body 10 located. The way of pulling out the wire loop 20 , in particular the required height, depends on the size of the wire loop 20 , the size of the cavity 40 and the dimensions of the contacting device 80 from and can be easily adapted in the context of expert action to concrete conditions of use.

How out 6 can be seen, the wire loop 20 subsequently for proper contacting with respect to the contacting device 80 positioned. In the embodiment shown in the figure, this is done by a vertical rotation of the entire hook means 50 , where in the eyelets 52 held wire loop 20 is moved. Optionally, this rotation can also be omitted. The contacting device 80 In another embodiment, not shown in the figure, it can be horizontally submerged below that of the hook means 50 held wire loop are inserted, provided that the present form of wire loop 20 and their connection with the one in the card body 10 laid track 30 this allows.

One the chip module 60 carrying positioning device 70 then moves the chip module to be contacted in a suitable position for the contact. The chip module can be, for example, a dual interface module used for chip cards provided with antenna devices. In the illustration according to 6 The positioning is done by placing it on a holding plate 72 mechanically held on a back and supported chip module 60 through a sliding bolt 71 through a feed channel of the hook device 50 through in the direction of the wire loop 20 moved and positioned in close proximity to the wire loop.

Subsequently, the contacting device moves 80 in the direction of the whole of wire loop 20 and chip module 60 , where a series of spot welding contacts 81 the intended for contacting sections of the wire loop 20 on contact surfaces of the chip module 60 press. Under application of a voltage and under a current flow caused thereby, which in the in 6 illustrated embodiment by the sliding bolt 71 and the holding plate 60 over the chip module 60 and the wire loop 20 to the spot welding contacts 81 can be done, the wire loop is spot welded to the chip module by an active welding. In conjunction therewith, if necessary, a local Entisolierung of the copper wire of the wire loop in the contact area.

Alternatively, the contacting device 80 be executed in the form of a soldering device. In this case, the spot welding contacts 81 replaced by Lotzuführeinrichtungen that settle a prepared in the contacting device lot at the contact points between wire loop and chip module and form by local heating solder joints.

The unit of hook device 50 , Positioning device 70 and contacting device 80 may suitably also for testing the manufactured contact connection between wire loop 20 and chip module 60 be used. Thus it is possible, for example, a test signal following the spot welding pulse or a test voltage between individual spot welding contacts 81 and thus the current flow within the contacted wire loop 20 to measure between the individual contact points and to determine whether the contact between the chip module 60 and wire loop 20 or is executed properly and in particular the wire loop 20 is not broken at any point by the contacting process.

Likewise, test voltages can be between the holding plate 72 and each individual spot welding contacts 81 applied and the current flow between the retaining plate and the spot welding contacts are measured by the contact produced. Within the scope of expert action, it is also readily possible to combine both test methods or to use other test apparatuses not shown in the figure in a suitable manner.

Following this, the contacted chip module 60 into the cavity 40 of the card body 10 used. How out 7 can be seen by way of example, this is done using the hook device 50 and the positioning device 70 executed. This is the hook device 50 vertically to the starting position 3 turned back, so that the surface of the contacted chip module substantially parallel to the surface of the card body 10 or the bottom of the cavity 40 located. Next is the positioning device 70 in the direction of the cavity 40 moved downwards. As a result of an elastic bending of the eyelets 52 on the hook 51 slips the wire loop 20 by the downward movement of the positioning device 70 out and comes with the chip module 60 on the bottom of the cavity 40 placed.

The positioning device 70 , in particular the holding plate 72 , finally gives the chip module 60 free and is finally moved back up. In connection with it take the hooks 51 the hook device 50 their starting position 3 and drive to their starting position.

The card body 10 is together with the used contacted chip module 60 moved on by a conveyor not shown in the figure. Next, another card body can be fed into the device and the flow of the in the 3 to 7 can be restarted at another chip card blank described contacting method.

10

Card base

20

wire loop

30

conductor path

40

cavity

50

hook device

51

hook

52

hook eye

60

chip module

70

positioning

71

sliding bolts

72

retaining plate

80

contacting

81

Spot welding Contact

Claims (9)

Method for contacting a chip module with a conductor track laid on or in a card main body, characterized in that the chip module is contacted outside the card main body with raised sections of the printed circuit track exposed from the card main body. Method according to claim 1, characterized, that the conductor track in the region of the chip module to be fastened in the form of a pull-out contacting section, in particular a wire loop is laid in the card body, wherein - below the contacting section is exposed, - The contacting section is grasped and pulled out with a mechanical gripping device, - the chip module with the out of the cavity pulled out contacting portion is electrically connected. Method according to claim 1 or 2, characterized, that in connection with or contacting immediately below a functional test of contacted with the conductor chip module takes place, where - to Completion of the functional test, the contacted chip module inserted into the card body and is attached. Method according to one of the preceding claims, characterized characterized in that the contacting of the chip module and the contacting section in connection with a stripping of the contacting section through a soldering or welded joint he follows. Device for carrying out a method according to one of Claims 1 to 4, characterized by a device which is exposed on a card base body ( 10 ) arranged contacting section ( 20 ) a conductor track ( 30 ) detecting mechanical gripping device ( 50 ) in conjunction with a chip module ( 60 ) holding positioning device ( 70 ) and a contacting device ( 80 ) for contacting of Kontaktierungsabschnitt and chip module. Apparatus according to claim 5, characterized in that the contacting section ( 20 ) is formed in the form of a wire loop. Apparatus according to claim 5 and 6, characterized in that the mechanical gripping device in the form of a hook device ( 50 ), wherein the hook means comprises a series of hooks ( 51 ) for pulling out and for convenient positioning of the wire loop ( 20 ) has for contacting. Device according to one of claims 5 to 7, characterized in that the contacting device ( 80 ) is formed as a spot-welding device. Device according to one of claims 5 to 8, characterized in that the contacting device ( 80 ) is a soldering device.