DE102004008256B3 - Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren - Google Patents

Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren Download PDF

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Publication number
DE102004008256B3
DE102004008256B3 DE102004008256A DE102004008256A DE102004008256B3 DE 102004008256 B3 DE102004008256 B3 DE 102004008256B3 DE 102004008256 A DE102004008256 A DE 102004008256A DE 102004008256 A DE102004008256 A DE 102004008256A DE 102004008256 B3 DE102004008256 B3 DE 102004008256B3
Authority
DE
Germany
Prior art keywords
laser beam
laser
intensity distribution
shaping element
shaping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE102004008256A
Other languages
German (de)
English (en)
Inventor
Hans Jürgen Mayer
Uwe Dr. Metka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34832840&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102004008256(B3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE102004008256A priority Critical patent/DE102004008256B3/de
Priority to CNA2005800007781A priority patent/CN1859995A/zh
Priority to JP2006553574A priority patent/JP2007522946A/ja
Priority to PCT/EP2005/050197 priority patent/WO2005080044A1/de
Application granted granted Critical
Publication of DE102004008256B3 publication Critical patent/DE102004008256B3/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE102004008256A 2004-02-19 2004-02-19 Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren Revoked DE102004008256B3 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102004008256A DE102004008256B3 (de) 2004-02-19 2004-02-19 Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren
CNA2005800007781A CN1859995A (zh) 2004-02-19 2005-01-19 用于整形激光束的方法和激光处理方法
JP2006553574A JP2007522946A (ja) 2004-02-19 2005-01-19 レーザービーム形成方法及びレーザー処理方法
PCT/EP2005/050197 WO2005080044A1 (de) 2004-02-19 2005-01-19 Verfahren zum formen eines laserstrahls, laserbearbeitungsverfahren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004008256A DE102004008256B3 (de) 2004-02-19 2004-02-19 Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren

Publications (1)

Publication Number Publication Date
DE102004008256B3 true DE102004008256B3 (de) 2005-09-08

Family

ID=34832840

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004008256A Revoked DE102004008256B3 (de) 2004-02-19 2004-02-19 Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren

Country Status (4)

Country Link
JP (1) JP2007522946A (ja)
CN (1) CN1859995A (ja)
DE (1) DE102004008256B3 (ja)
WO (1) WO2005080044A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102759799A (zh) * 2011-04-29 2012-10-31 昆山思拓机器有限公司 激光光束整型方法和激光光束整型装置
JP2013180298A (ja) * 2012-02-29 2013-09-12 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置
CN105983780A (zh) * 2015-03-06 2016-10-05 中国兵器装备研究院 一种增材制造中加热金属材料的方法
IT201600070352A1 (it) * 2016-07-06 2018-01-06 Adige Spa Procedimento di lavorazione laser di un materiale metallico con controllo della distribuzione di potenza trasversale del fascio laser in un piano di lavorazione, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento.
CN106271040B (zh) * 2016-08-24 2017-12-05 江苏大学 一种用于球体表面激光微造型的装置及其方法
DE102017200119A1 (de) * 2017-01-05 2018-07-05 Robert Bosch Gmbh Verfahren und Vorrichtung zur prozessorientierten Strahlformanpassung und Strahlorientierung
CN113275736A (zh) * 2021-05-11 2021-08-20 苏州科韵激光科技有限公司 一种可变线宽的激光加工方法以及装置
CN113253451B (zh) * 2021-05-27 2023-07-25 浙江师范大学 一种高维衍射突变光束产生方法和系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616863C2 (de) * 1995-04-28 1998-08-06 Fraunhofer Ges Forschung Anordnung zur Kohärenzreduktion und Strahlhomogenisierung von Laserstrahlung hoher Leistung
US5925271A (en) * 1994-02-09 1999-07-20 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Laser beam shaping device and process including a rotating mirror
DE10145184A1 (de) * 2001-09-13 2003-04-03 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19744368A1 (de) * 1997-10-08 1999-05-20 Lzh Laserzentrum Hannover Ev Verfahren und Vorrichtung zur Mikrobearbeitung von Werkstücken mittels Laserstrahlung, insbesondere zum Bilden von im wesentlichen rotationssymmetrischen Ausnehmungen in Werkstücken
US6605796B2 (en) * 2000-05-25 2003-08-12 Westar Photonics Laser beam shaping device and apparatus for material machining
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
DE10123018A1 (de) * 2001-05-11 2002-12-12 Lzh Laserzentrum Hannover Ev Verfahren und Einrichtung zum Bilden von im wesentlichen kreiszylindrischen Ausnehmungen in Werkstücken
US6717104B2 (en) * 2001-06-13 2004-04-06 The Regents Of The University Of California Programmable phase plate for tool modification in laser machining applications

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925271A (en) * 1994-02-09 1999-07-20 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Laser beam shaping device and process including a rotating mirror
DE19616863C2 (de) * 1995-04-28 1998-08-06 Fraunhofer Ges Forschung Anordnung zur Kohärenzreduktion und Strahlhomogenisierung von Laserstrahlung hoher Leistung
DE10145184A1 (de) * 2001-09-13 2003-04-03 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske

Also Published As

Publication number Publication date
CN1859995A (zh) 2006-11-08
WO2005080044A1 (de) 2005-09-01
JP2007522946A (ja) 2007-08-16

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI VIA MECHANICS,LTD., EBINA, KANAGAWA, JP

8328 Change in the person/name/address of the agent

Representative=s name: BEETZ & PARTNER PATENTANWAELTE, 80538 MUENCHEN

8331 Complete revocation