DE10196301T1 - Polierballenfenster für ein chemisch-mechanisches Polierwerkzeug - Google Patents

Polierballenfenster für ein chemisch-mechanisches Polierwerkzeug

Info

Publication number
DE10196301T1
DE10196301T1 DE10196301T DE10196301T DE10196301T1 DE 10196301 T1 DE10196301 T1 DE 10196301T1 DE 10196301 T DE10196301 T DE 10196301T DE 10196301 T DE10196301 T DE 10196301T DE 10196301 T1 DE10196301 T1 DE 10196301T1
Authority
DE
Germany
Prior art keywords
polishing
bale
window
chemical
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10196301T
Other languages
English (en)
Inventor
Clinton O Fruitman
Mark A Meloni
Periya Gopalan
Andrew Yednak Iii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of DE10196301T1 publication Critical patent/DE10196301T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
DE10196301T 2000-06-05 2001-06-04 Polierballenfenster für ein chemisch-mechanisches Polierwerkzeug Withdrawn DE10196301T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/587,593 US6685537B1 (en) 2000-06-05 2000-06-05 Polishing pad window for a chemical mechanical polishing tool
PCT/US2001/018110 WO2001094074A1 (en) 2000-06-05 2001-06-04 Polishing pad window for a chemical-mechanical polishing tool

Publications (1)

Publication Number Publication Date
DE10196301T1 true DE10196301T1 (de) 2003-05-22

Family

ID=24350416

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10196301T Withdrawn DE10196301T1 (de) 2000-06-05 2001-06-04 Polierballenfenster für ein chemisch-mechanisches Polierwerkzeug

Country Status (7)

Country Link
US (1) US6685537B1 (de)
JP (1) JP2003535484A (de)
KR (1) KR20030047893A (de)
AU (1) AU2001275229A1 (de)
DE (1) DE10196301T1 (de)
GB (1) GB2379627A (de)
WO (1) WO2001094074A1 (de)

Cited By (1)

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DE102004014179A1 (de) * 2003-06-16 2005-01-13 Samsung Electronics Co., Ltd., Suwon Polierkissen, Auflageplatte, Überwachungsverfahren, Herstellungsverfahren und Verfahren zum Detektieren

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WO2002070200A1 (en) 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
CN100417493C (zh) * 2002-09-25 2008-09-10 Ppg工业俄亥俄公司 平面化用的具有窗口的抛光垫片及制备方法
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
TWI220405B (en) * 2002-11-19 2004-08-21 Iv Technologies Co Ltd Method of fabricating a polishing pad having a detection window thereon
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US6991514B1 (en) 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7195539B2 (en) 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
JP2005197408A (ja) * 2004-01-06 2005-07-21 Toyo Tire & Rubber Co Ltd Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
US7204742B2 (en) 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7226339B2 (en) * 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7549914B2 (en) 2005-09-28 2009-06-23 Diamex International Corporation Polishing system
JP2007276009A (ja) * 2006-04-03 2007-10-25 Toyo Tire & Rubber Co Ltd 研磨パッド
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
JP4941735B2 (ja) * 2007-03-30 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
WO2008154185A2 (en) * 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process
JP5130138B2 (ja) * 2008-07-18 2013-01-30 富士紡ホールディングス株式会社 研磨パッドおよびその製造方法
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8393940B2 (en) 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8257545B2 (en) 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9186772B2 (en) 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
KR101916119B1 (ko) * 2017-02-06 2019-01-30 주식회사 리온에스엠아이 화학적 기계 연마용 연마패드
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
JP7041638B2 (ja) * 2019-01-10 2022-03-24 株式会社荏原製作所 研磨装置
CN114029856B (zh) * 2021-11-30 2022-11-08 万华化学集团电子材料有限公司 一种终点检测精度高的化学机械抛光垫、制备方法及其应用

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004014179A1 (de) * 2003-06-16 2005-01-13 Samsung Electronics Co., Ltd., Suwon Polierkissen, Auflageplatte, Überwachungsverfahren, Herstellungsverfahren und Verfahren zum Detektieren
DE102004014179B4 (de) * 2003-06-16 2006-08-10 Samsung Electronics Co., Ltd., Suwon Polierkissen mit Überwachungsfunktionalität
US7442111B2 (en) 2003-06-16 2008-10-28 Samsung Electronics Co., Ltd. Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
US7662022B2 (en) 2003-06-16 2010-02-16 Samsung Electronics Co., Ltd. Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting

Also Published As

Publication number Publication date
GB0227540D0 (en) 2002-12-31
WO2001094074A1 (en) 2001-12-13
JP2003535484A (ja) 2003-11-25
KR20030047893A (ko) 2003-06-18
US6685537B1 (en) 2004-02-03
GB2379627A (en) 2003-03-19
AU2001275229A1 (en) 2001-12-17

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8139 Disposal/non-payment of the annual fee