DE10123249A1 - Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contacts - Google Patents
Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contactsInfo
- Publication number
- DE10123249A1 DE10123249A1 DE2001123249 DE10123249A DE10123249A1 DE 10123249 A1 DE10123249 A1 DE 10123249A1 DE 2001123249 DE2001123249 DE 2001123249 DE 10123249 A DE10123249 A DE 10123249A DE 10123249 A1 DE10123249 A1 DE 10123249A1
- Authority
- DE
- Germany
- Prior art keywords
- contacts
- circuit boards
- carrier device
- circuit arrangement
- arrangement according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Die Erfindung betrifft eine Schaltungsanordnung aus einer Trägervorrichtung und aus mindestens zwei Leiterplatten gemäß dem Patentanspruch 1.The invention relates to a circuit arrangement comprising a carrier device and from at least two printed circuit boards according to claim 1.
Bei Schaltungsanordnungen, deren Bauelemente auf mehreren Leiterplatten ange ordnet sind, besteht das Problem, die Leiterplatten zuverlässig und kostengünstig durch Kontakte miteinander zu verbinden. Dies gilt insbesondere im Hinblick auf eine automatisierte Serienfertigung der Schaltungsanordnung.In circuit arrangements, the components on several circuit boards are the problem, the circuit boards are reliable and inexpensive to connect with each other through contacts. This is especially true with regard to an automated series production of the circuit arrangement.
Bekannt ist dabei die Verbindung von Leiterplatten, bei der als Kontakte Flachband kabeln verwendet werden, wie es beispielsweise in der DE 43 34 150 A1 beschrie ben ist.The connection of printed circuit boards is known, in which the ribbon is used as contacts cables are used, as described for example in DE 43 34 150 A1 ben is.
Der Nachteil bei der Verwendung von Flachbandkabeln als Kontakte besteht in der nur sehr aufwendig zu bewerkstelligenden automatisierten Serienfertigung, in der hohen Störanfälligkeit der zu lotenden Anschlüsse des Flachbandkabels sowie in der Anfälligkeit des Flachbandkabels selbst.The disadvantage of using ribbon cables as contacts is that Automated series production, which is very complicated to accomplish, in the high susceptibility to interference of the connections of the ribbon cable to be soldered as well as in the Vulnerability of the ribbon cable itself.
Der Erfindung liegt die Aufgabe zugrunde, eine Schaltungsanordnung aus einer Trägervorrichtung und aus mindestens zwei Leiterplatten anzugeben, die eine auto matisierte Serienfertigung ermöglicht und bei der die Kontakte eine zuverlässige Verbindung der mindestens zwei Leiterplatten ermöglicht.The invention has for its object a circuit arrangement from a Carrier device and from at least two printed circuit boards specifying an auto Automated series production enables and in which the contacts a reliable Connection of the at least two circuit boards enables.
Diese Aufgabe wird erfindungsgemäß durch das Merkmal in den Kennzeichen des Patentanspruches 1 gelöst.This object is achieved by the feature in the characteristics of Claim 1 solved.
Demnach werden die mindestens zwei Leiterplatten durch an der Trägervorrichtung befestigten Kontakte miteinander elektrisch verbunden. Accordingly, the at least two printed circuit boards are through on the carrier device attached contacts electrically connected to each other.
In einer Weiterbildung der Erfindung ist vorgesehen, daß die Schaltungsanordnung weitere Baugruppen enthält, und daß die weiteren Baugruppen über die Kontakte untereinander und mit den mindestens zwei Leiterplatten elektrisch verbunden sind.In a development of the invention it is provided that the circuit arrangement contains further assemblies, and that the further assemblies via the contacts are electrically connected to one another and to the at least two printed circuit boards.
Dabei sind die Kontakte vorteilhaft als Stanzgitter ausgebildet.The contacts are advantageously designed as a lead frame.
Beispielsweise zum Anschluß der Leiterplatten an eine Spannungsversorgung ist mindestens einer der Kontakte als Durchführung durch die Trägervorrichtung ausge bildet.For example, to connect the circuit boards to a power supply at least one of the contacts as a passage through the carrier device forms.
Die Kontakte können mit den Leiterplatten beispielsweise durch löten, schweißen, nieten oder pressen miteinander elektrisch verbunden sein.The contacts can for example be soldered, welded, rivets or presses can be electrically connected to each other.
In ein weiteren Weiterbildung der Erfindung ist vorgesehen, daß die Verbindung der Kontakte mit der Trägervorrichtung bei der Herstellung der Trägervorrichtung erfolgt, und daß die Kontakte mit der Trägervorrichtung vergossen oder umspritzt sind.In a further development of the invention it is provided that the connection of the Contacts are made with the carrier device during the manufacture of the carrier device, and that the contacts are potted or overmolded with the carrier device.
In einer alternativen Weiterbildung der Erfindung ist vorgesehen, daß die Verbindung der Kontakte mit der Trägervorrichtung nach der Herstellung der Trägervorrichtung erfolgt, und daß die Kontakte mit der Trägervorrichtung verschraubt, vernietet, verschweißt, geklebt oder geklemmt sind.In an alternative development of the invention it is provided that the connection the contacts with the carrier device after the carrier device has been manufactured and that the contacts are screwed, riveted to the carrier device, are welded, glued or clamped.
In einer weiteren Weiterbildung der Erfindung ist vorgesehen, daß die Kontakte zur Befestigung der mindestens zwei Leiterplatten ausgebildet sind, wodurch auf eine separate Befestigung der mindestens zwei Leiterplatten, beispielsweise durch Ver schraubung, verzichtet werden kann.In a further development of the invention it is provided that the contacts to Attachment of the at least two printed circuit boards are formed, resulting in a separate attachment of the at least two circuit boards, for example by Ver screwing, can be dispensed with.
Zudem sind die Kontakte so ausgebildet, daß sie eine federnde Lagerung der minde stens zwei Leiterplatten bilden, wozu die Kontakte beispielsweise halbringartig ausgebildet sind, der beim einwirken einer Kraft elastisch nachgeben kann.In addition, the contacts are designed so that they have a resilient mounting of the mind form at least two printed circuit boards, for which the contacts, for example, like a half ring are formed, which can yield elastically when a force acts.
In einer letzten Weiterbildung der Erfindung ist vorgesehen, daß die Trägervorrich tung das Gehäuse der Schaltungsanordnung ist.In a last development of the invention it is provided that the carrier device device is the housing of the circuit arrangement.
Im folgenden ist eine einer Trägervorrichtung und mit mindestens zwei Leiterplatten anhand von einem Ausführungsbeispiel im Zusammenhang mit zwei Figuren darge stellt und erläutert. The following is one of a carrier device and with at least two printed circuit boards Darge based on an embodiment in connection with two figures provides and explains.
Es zeigen:Show it:
Fig. 1 eine schematische Darstellung einer Trägervorrichtung mit zwei an der Trägervorrichtung verschraubten Leiterplatten, die über mit der Trägervorrichtung vergossene Kontakte miteinander verbunden sind, Fig. 1 is a schematic representation of a carrier device with two screwed to the support device boards that are interconnected via molded with the carrier device contacts,
Fig. 2 eine schematische Darstellung einer Trägervorrichtung, bei der die elektrische Verbindung sowie die mechanische Befestigung an der Trägervorrichtung der Leiterplatten über eine Federung erlaubende Kontakte erfolgt. Fig. 2 is a schematic representation of a carrier device, in which the electrical connection and the mechanical attachment to the carrier device of the printed circuit boards is carried out by means of contacts which allow suspension.
Trägervorrichtungen für Schaltungsanordnungen, beispielsweise eines in einem Gehäuse angeordneten Steuergerätes für ein Kraftfahrzeug, sind zur Kostenreduzie rung so aufgebaut, daß die Montage in weitgehend automatisierten Herstellungs schritten erfolgen kann.Carrier devices for circuit arrangements, for example one in one Housing arranged control device for a motor vehicle, are to reduce costs tion constructed so that the assembly in largely automated manufacturing steps can take place.
Fig. 1 zeigt eine das Gehäuse 3 der Schaltungsanordnung bildende Trägervorrich tung, bei der die Leiterplatten 1, 2 über Schrauben mit der Trägervorrichtung 3 verbunden sind. Die Leiterplatten 1, 2 sowie ein Transformator als weitere Baugrup pe 4 der Schaltungsanordnung sind über als Stanzgitter 6 ausgebildete Kontakte miteinander elektrisch verbunden. Fig. 1 shows a housing 3 of the circuit arrangement forming Trägerervorrich device, in which the circuit boards 1 , 2 are connected by screws to the carrier device 3 . The printed circuit boards 1 , 2 and a transformer as a further assembly group 4 of the circuit arrangement are electrically connected to one another via contacts designed as lead frames 6 .
Die Stanzgitter 6 sind bei der Herstellung des Gehäuses 3 mit dem Gehäuse 3 vergossen worden. Dabei ist ein Kontakt 5 des Stanzgitters 6 so ausgebildet, daß er eine Durchführungen durch das Gehäuse 3 bildet, und beispielsweise als Massean schluß oder zur Spannungsversorgung der Schaltungsanordnung dient.The lead frames 6 have been cast with the housing 3 in the manufacture of the housing 3 . Here, a contact 5 of the lead frame 6 is formed so that it forms a bushing through the housing 3 , and is used for example as a Massean circuit or for the voltage supply of the circuit arrangement.
Das Verbinden der Leiterplatten 1, 2 mit dem Stanzgitter 6 erfolgt maschinell, wobei die starren Kontakte des Stanzgitters 6 ein zuverlässiges Aufsetzen der Leiterplatten 1, 2 gewährleisten. Nach dem Aufsetzen werden die beiden Leiterplatten 1, 2 über Schrauben 8 mit dem Gehäuse 3 verbunden. Anschließend werden die Kontakte des Stanzgitters 6 mit den Leiterbahnen 1, 2 der Schaltungsanordnung maschinell verlötet. The circuit boards 1 , 2 are connected to the lead frame 6 by machine, the rigid contacts of the lead frame 6 ensuring reliable placement of the circuit boards 1 , 2 . After mounting, the two circuit boards 1 , 2 are connected to the housing 3 by means of screws 8 . The contacts of the lead frame 6 are then soldered mechanically to the conductor tracks 1 , 2 of the circuit arrangement.
Fig. 2 zeigt ebenfalls das Gehäuse 3 einer Schaltungsanordnung, bei dem die Stanzgitter 6 über Schrauben 8 mit dem Gehäuse 3 verbunden sind. Das Gehäuse 3 ist dafür vorgesehen auf einer Wärmequelle montiert zu werden. Dabei sind auf der ersten Leiterplatte 1 Bauteile angeordnet, die zum Betrieb bei hohen Temperaturen vorgesehen sind. Auf der zweiten Leiterplatte 2 sind dementsprechend solche Bau elemente angeordnet, die keinen hohen Temperaturen ausgesetzt werden sollen. Zur thermischen Isolation ist zwischen beiden Leiterplatten 1, 2 eine Wärmedämm schicht 7 angeordnet. Fig. 2 also shows the housing 3 of a circuit arrangement in which the lead frames 6 are connected to the housing 3 by screws 8 . The housing 3 is intended to be mounted on a heat source. Components are arranged on the first printed circuit board 1 which are intended for operation at high temperatures. Accordingly, such construction elements are arranged on the second circuit board 2 that should not be exposed to high temperatures. For thermal insulation, a thermal insulation layer 7 is arranged between the two circuit boards 1 , 2 .
Die Kontakte des Stanzgitters 6 sind dabei so ausgeformt, daß sie sich beim einwir ken eine Kraft elastisch verformen können, und so eine Federung für die Leiterplat ten 1, 2 darstellen. Die Leiterplatten 1, 2 sind dabei mit dem Gehäuse 3 selbst nicht direkt verbunden, sondern werden vollständig von den Kontakten der Stanzgitter 6 getragen. Zudem stellen die längeren Kontakte der Stanzgitter 6 eine schlechtere Wärmebrücke dar. Die Verbindung zwischen den Kontakten des Stanzgitters 6 und den Leitbahnen der Leiterplatten 1, 2 erfolgt durch eine Preßverbindung, die eine gute elektrische Leitfähigkeit in Verbindung mit einer relativ schlechten Wärmeleit fähigkeit aufweist.The contacts of the lead frame 6 are shaped so that they can deform a force elastically when einwir ken, and thus represent a suspension for the PCB th 1 , 2 . The circuit boards 1 , 2 are not directly connected to the housing 3 itself, but are carried entirely by the contacts of the lead frame 6 . In addition, the longer contacts of the lead frame 6 represent a poorer thermal bridge. The connection between the contacts of the lead frame 6 and the interconnects of the circuit boards 1 , 2 is made by a press connection that has good electrical conductivity in conjunction with a relatively poor thermal conductivity.
Das Verbinden der Leiterplatten 1, 2 mit dem Stanzgitter erfolgt maschinell, wobei zuerst beide Leiterplatten 1, 2 mit dem Stanzgitter verpreßt werden, und dann die Baugruppe aus Stanzgitter und den zwei Leiterplatten in das Gehäuse eingesetzt und mit dem Gehäuse verschraubt wird.The connection of the circuit boards 1 , 2 to the lead frame is carried out mechanically, with both circuit boards 1 , 2 being pressed with the lead frame first, and then the assembly of the lead frame and the two circuit boards being inserted into the housing and being screwed to the housing.
Das erfindungsgemäße Gehäuse 3 mit zwei Leiterplatten 1, 2, bei dem die Leiter platten 1, 2 durch mit dem Gehäuse 3 verbundene Stanzgitter 6 kontaktiert sind, ermöglicht eine mechanisierte Montage der Leiterplatten 1, 2 bei der Herstellung des Steuergerätes, wobei die Leiterplatten 1, 2 zuverlässig kontaktiert werden.The housing according to the invention 3, with two conductor plates 1, 2, wherein the printed circuit boards 1 are contacted by 2 by connected to the housing 3 punched grid 6, enables a mechanized mounting of the printed circuit boards 1, 2 in the manufacture of the control device, wherein the printed circuit boards 1, 2 can be contacted reliably.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001123249 DE10123249A1 (en) | 2001-05-12 | 2001-05-12 | Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contacts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001123249 DE10123249A1 (en) | 2001-05-12 | 2001-05-12 | Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contacts |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10123249A1 true DE10123249A1 (en) | 2002-11-28 |
Family
ID=7684627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2001123249 Ceased DE10123249A1 (en) | 2001-05-12 | 2001-05-12 | Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contacts |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE10123249A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009003791A1 (en) * | 2007-06-30 | 2009-01-08 | Robert Bosch Gmbh | Electronic module and method for producing an electronic module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3404823A1 (en) * | 1983-02-09 | 1984-09-20 | Thomas & Betts Corp., Raritan, N.J. | SWITCHWIRE |
DE19756345C2 (en) * | 1997-12-18 | 1999-12-30 | Telefunken Microelectron | Arrangement for contacting printed circuit boards |
DE19932120A1 (en) * | 1999-07-02 | 2001-02-01 | Schleicher Relais | Electrical triple terminal connector for circuit boards, has contact arms bent in opposite directions at predetermined angle from strip-type contact part |
-
2001
- 2001-05-12 DE DE2001123249 patent/DE10123249A1/en not_active Ceased
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3404823A1 (en) * | 1983-02-09 | 1984-09-20 | Thomas & Betts Corp., Raritan, N.J. | SWITCHWIRE |
DE19756345C2 (en) * | 1997-12-18 | 1999-12-30 | Telefunken Microelectron | Arrangement for contacting printed circuit boards |
DE19932120A1 (en) * | 1999-07-02 | 2001-02-01 | Schleicher Relais | Electrical triple terminal connector for circuit boards, has contact arms bent in opposite directions at predetermined angle from strip-type contact part |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009003791A1 (en) * | 2007-06-30 | 2009-01-08 | Robert Bosch Gmbh | Electronic module and method for producing an electronic module |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
OP8 | Request for examination as to paragraph 44 patent law | ||
R002 | Refusal decision in examination/registration proceedings | ||
R003 | Refusal decision now final |
Effective date: 20110428 |