DE10121136A1 - Lighting device on chip card principle has circuit board with micro-LED chip or deposited light conducting substances offset by 90 degrees to conducting track carrying surfaces - Google Patents

Lighting device on chip card principle has circuit board with micro-LED chip or deposited light conducting substances offset by 90 degrees to conducting track carrying surfaces

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Publication number
DE10121136A1
DE10121136A1 DE10121136A DE10121136A DE10121136A1 DE 10121136 A1 DE10121136 A1 DE 10121136A1 DE 10121136 A DE10121136 A DE 10121136A DE 10121136 A DE10121136 A DE 10121136A DE 10121136 A1 DE10121136 A1 DE 10121136A1
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Germany
Prior art keywords
lighting device
circuit board
chip card
card principle
substances
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Granted
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DE10121136A
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German (de)
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DE10121136B4 (en
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Priority to DE10121136A priority Critical patent/DE10121136B4/en
Publication of DE10121136A1 publication Critical patent/DE10121136A1/en
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Publication of DE10121136B4 publication Critical patent/DE10121136B4/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/03—Ceiling bases, e.g. ceiling roses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The device consists of a circuit board (2) with at least one micro-LED chip (1) or deposited light conducting substances arranged so that they are predominantly offset by 90 degrees with respect to the conducting track carrying surfaces, housed in a circuit board aperture, sealed watertight (7), shock-protected and insensitive to vibration.

Description

Die Erfindung bezieht sich auf eine LED-Vorrichtung zur Beleuchtung verschiedenster Beleuchtungserfordernisse.The invention relates to an LED device for lighting various lighting requirements.

Darin sind die Leuchtmittel (mind. 1 Micro-LED-Chip oder auch auf­ gedampfte lichtführende Substanzen) so platziert, dass sie vorwiegend 90° versetzt gegenüber der leiterbahnführenden Fläche angeordnet liegen.Inside are the bulbs (at least 1 micro LED chip or on steamed light-guiding substances) so that they predominantly 90 ° offset from the surface guiding the conductor track lie.

Als Trägermaterial dienen Leiterplatten, vorwiegend aus Epoyxdmaterial.Printed circuit boards are used primarily as the carrier material Epoyxdmaterial.

Die Geometrie der Leiterplatten kann verschiedenartig, je nach techni­ schen Erfordernissen ausgebildet sein.The geometry of the circuit boards can vary depending on the techni trained requirements.

Um den Abstrahlwinkel der Micro-LED-Chips oder lichtführenden Substanzen voll auszuschöpfen, sind entsprechende Aussparungen an den Kanten der Leiterplatte platziert, sie dienen als Aufnahme der SMD-Micro-LED's oder auch aufgedampften lichtführenden Substanzen.To the beam angle of the micro LED chips or light-guiding Appropriate recesses are available to fully exhaust substances placed on the edges of the circuit board, they serve to accommodate the SMD micro LEDs or vapor-deposited light-guiding Substances.

Die gleichmäßige Lichtstärke o. g. Leuchtmittel wird durch Vorschal­ tung entsprechender Vorwiderstände gesichert.The uniform light intensity o. G. Bulb is through front appropriate series resistors secured.

Die LED-Chips werden mittels leitfähigem Kleber, plus angepassten Steckverbindern, bestehend aus leitendem oder isolierendem Material, zu der Durchkontaktierung der Leiterbahnen elektrisch verbunden. Das bisherige Heranführen einer Lichtquelle hat man bisher, wenn Leiterplatten als Systemlösungen erfolgen sollten, in der Regel von der leiterbahnführenden Fläche aus vorgenommen. Das hat sich jedoch aus konstruktiven, sowie aus wirtschaftlichen Gesichtspunkten, meist als technisch zu aufwendig dargestellt.The LED chips are customized using conductive adhesive, plus Connectors consisting of conductive or insulating material, electrically connected to the through-connection of the conductor tracks. The previous approach to a light source has so far, if Printed circuit boards should be made as system solutions, usually from the made from the conductor-guiding surface. However, that turned out to be the case  constructive, as well as from an economic point of view, mostly as technically too complex.

Im Gegensatz zum bisher beschriebenen Sachverhalt, verfährt man nach der neuen Beleuchtungsmethode; dem Chip-Karten-Prinzip, nach einfachsten Lösungsprinzipien.In contrast to the situation described so far, one proceeds according to the new lighting method; according to the chip card principle simplest solution principles.

Die elektrischen Kontaktstellen der Beleuchtungsvorrichtung befinden sich je 4-fach auf beiden Längsflächen, alternativ ist die Platzierung derselben, je nach technischen Erfordernissen, kantenseitig denkbar. Auf diese Weise ist die Handhabung zur technischen Montage der Beleuchtungsvorrichtung einfachst möglich, entsprechend dem Chip- Karten-Prinzip.The electrical contact points of the lighting device are located 4 times on both longitudinal surfaces, alternatively the placement the same, depending on the technical requirements, conceivable on the edge side. In this way, the handling for technical assembly of the Lighting device as simple as possible, according to the chip Cards principle.

Dieser Aufbau verleiht dem geschilderten Beleuchtungssystem besondere Eigenschaften. Temperaturbeständigkeit, Dichtigkeit gegen Umwelteinflüsse, Feuchtigkeitsunempfindlichkeit, Widerstandsfähig­ keit gegen Erschütterungen, beste Handhabung.This structure gives the described lighting system special properties. Temperature resistance, tightness against Environmental influences, insensitivity to moisture, resistant against vibrations, best handling.

Die hermetisch abgeschlossene Versiegelung der Leuchtmittel bietet dazu einen absoluten Kantenschutz. LED-Fassungen herkömmlicher Art sind somit entbehrlich. Z-Leisten oder anderweitig bekannte Klippstechnik dienen einer vorteilhaften Fixierung. Die Leiterplatte selbst kann je nach Erfordernis, auf eine relative Mindeststärke reduziert sein.The hermetically sealed seal of the illuminant offers plus an absolute edge protection. LED sockets more conventional Kinds are therefore unnecessary. Z strips or otherwise known Clip technology is used for advantageous fixation. The circuit board itself, depending on the requirement, to a relative minimum strength be reduced.

Hierdurch bieten sich konstruktiv für verschiedenste Applikationen größte Anwendungsfelder, genannt sei der Kfz-Sektor, sowie diverse Automaten- und Displaybestückungen.This makes them suitable for a wide variety of applications largest fields of application, the automotive sector, and various Vending machines and displays.

Vorteilhafte Ausgestaltung ist Gegenstand von Unteransprüchen. An advantageous embodiment is the subject of subclaims.  

Vorzugsweise wird die Beleuchtungsvorrichtung mit Schwachstrom betrieben, insbesondere mit 12 V, wie sie im Bordnetz von Kraftfahr­ zeugen über die wiederaufladbare Batterie zur Verfügung steht. Beleuchtungsanlagen mittels Akkubetrieb sind denkbar. Dazu wäre zu nennen, Beleuchtungsanlagen über das normale Stromnetz (220 V) zu betreiben, jedoch mit Vorschaltung entsprechender Z-Dioden.The lighting device is preferably operated with low current operated, especially with 12 V, as they are in the on-board network of motor vehicles testify about the rechargeable battery is available. Lighting systems using battery power are conceivable. That would be too name, lighting systems via the normal electricity network (220 V) operate, but with appropriate Z diodes.

In einer sinnvollen Weiterbildung ist die Beleuchtungsvorrichtung mit einem oder mehreren Vorwiderständen ausgestattet, so dass durch den relativen Versatz nach innen ein Freiraum entstehen kann. Das kommt ähnlich einer Verzahnung gleich. Diese dient zur Nutzbarmachung einer genauen Fixierung der Kontaktpunkte (±) für die Installation der Beleuchtungsvorrichtung.In a useful further development, the lighting device is included one or more series resistors, so that by the relative offset to the inside a free space can arise. That comes similar to a toothing. This is used an exact fixation of the contact points (±) for the installation of the Lighting device.

Weitere Einzelheiten, Merkmale sowie Vorteile der Erfindung sind dem nachfolgenden Beschreibungsteil zu entnehmen.Further details, features and advantages of the invention are can be found in the following description.

Anhand einer Zeichnung sind weitere Details der Erfindung erkennbar.Further details of the invention can be seen from a drawing.

Aus Einfachheitsgründen wird auf die Darstellung, Unteransicht der Leiterplatte, verzichtet.For the sake of simplicity, the representation, bottom view of the Printed circuit board, waived.

Es zeigt:It shows:

Fig. 1 Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, Draufsicht (isometrisch) FIG. 1 lighting device according to the chip card principle top view (isometric)

Bei dem in Fig. 1 dargestellten Ausführungsbeispiel der Erfindung handelt es sich um eine Leiterplatte (2) mit entsprechenden Aussparungen zur Aufnahme der LEDs, vorwiegend SMD-LED- Chips (1) oder aufgedampfte lichtführende Substanzen, auf der nach innen liegenden Kante der Leiterplatte (2) platziert, d. h. vorwiegend 90° versetzt gegenüber der leiterbahnführenden Fläche angeordnet.The exemplary embodiment of the invention shown in FIG. 1 is a printed circuit board ( 2 ) with corresponding cutouts for receiving the LEDs, predominantly SMD LED chips ( 1 ) or vapor-deposited light-conducting substances, on the inner edge of the printed circuit board ( 2 ) placed, ie predominantly 90 ° offset from the surface carrying the conductor track.

Meist parallel zu den Leuchtmitteln befinden sind Vorwiderstände (3) mit den Leiterbahnen (4) zu den Steckverbindern (5), die wiederum einen geschlossenen Stromkreis zu den Kontaktpunkten (6) führen. Die Wasserdichte und optisch reine Versiegelung (7) bietet einen absoluten Kantenschutz.Series resistors ( 3 ) with the conductor tracks ( 4 ) to the plug connectors ( 5 ), which in turn lead a closed circuit to the contact points ( 6 ), are usually located parallel to the lamps. The watertight and optically pure seal ( 7 ) offers absolute edge protection.

Der relative Innenversatz (8) im Bereich der Vorwiderstände (3) erleichtert die genaue Justierung der elektrischen Kontaktstellern (±). Die Anzahl der Freiräume zum Innenversatz (8) ist frei wählbar.The relative internal offset ( 8 ) in the area of the series resistors ( 3 ) facilitates the precise adjustment of the electrical contact plates (±). The number of free spaces for the internal offset ( 8 ) can be freely selected.

Claims (7)

1. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, für verschiedenste Beleuchtungserfordernisse, bestehend aus einer Leiterplatte (2) mit mindestens 1 Micro-LED-Chip (1) oder aufgedampfte lichtführende Substanzen, welche so angeordnet sind, dass sie vorwiegend 90° versetzt gegenüber der leiterbahn­ führenden Fläche, in einer Aussparung der Leiterplatte eingehaust, wasserdicht versiegelt (7), sowie stoßgesichert und erschütterungsunempfindlich platziert sind.1. Lighting device according to the chip card principle, for various lighting requirements, consisting of a printed circuit board ( 2 ) with at least 1 micro-LED chip ( 1 ) or vapor-deposited light-conducting substances, which are arranged so that they are predominantly offset by 90 ° the surface guiding the conductor track, housed in a recess in the printed circuit board, sealed watertight ( 7 ), and placed in a shockproof and vibration-resistant manner. 2. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, dadurch gekennzeichnet, dass mehrere LED-Chips (1) oder aufgedampfte lichtführende Substanzen, insbesondere miniaturisierte LED-Chips vorhanden sind, die meist so platziert liegen, dass sie mit Leiterbahnen vernetzt, auf der Kante der Leiterplatte (2) mittels leitendem Kleber (9) und den Steckverbindern (5) mittels Durch­ kontaktierung der Leiterplatte und Verbindung zu meist deckungs­ gleich angeordneten Vorwiderständen (3) eine Leiterbahnver­ bindung (4) einnehmen. Die wiederum den geschlossenen Stromkreis zu den Kontaktpunkten (6) bilden.2. Lighting device according to the chip card principle, characterized in that several LED chips ( 1 ) or evaporated light-guiding substances, in particular miniaturized LED chips, are present, which are usually placed in such a way that they are networked with conductor tracks, on the edge the circuit board ( 2 ) by means of conductive adhesive ( 9 ) and the connectors ( 5 ) by means of contacting the circuit board and connection to mostly congruently arranged series resistors ( 3 ) occupy a circuit connection ( 4 ). Which in turn form the closed circuit to the contact points ( 6 ). 3. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, dadurch gekennzeichnet, dass der relative Innenversatz (8) der Vorwider­ stände (3) zur Fixierung der elektrischen Kontaktstellen (6) dient (±), wobei die Anzahl des Innenversatzes (8) frei wählbar ist.3. Lighting device according to the chip card principle, characterized in that the relative internal offset ( 8 ) of the series resistors ( 3 ) serves to fix the electrical contact points ( 6 ) (±), the number of internal offset ( 8 ) being freely selectable is. 4. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, dadurch gekennzeichnet, dass - wie die Bezeichnung es andeutet - weder Fassungen, noch Zeilenleisten (als Lichtumlenkung) notwendig sind. Überstehende Elemente, wie üblich bei Leiterplatten, sind nach dem Chip-Karten-Prinzip nicht vorhanden.4. Lighting device according to the chip card principle, thereby characterized that - as the name suggests - neither Sockets, row bars (as light deflection) necessary are. Protruding elements, as usual with printed circuit boards, are according to the chip card principle not available. 5. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, dadurch gekennzeichnet, dass die Geometrie der Leiterplatte (2) verschiedenartig je nach technischem Erfordernis ausgebildet sein kann.
Schlitzartige Verwahrung oder geklipste Trägeraufnahmen können eine vorteilhafte Lösung auszeichnen.5. Lighting device according to the chip card principle, characterized in that the geometry of the circuit board ( 2 ) can be designed differently depending on the technical requirements.
Slot-like storage or clipped carrier recordings can be an advantageous solution. 6. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip, dadurch gekennzeichnet, dass die hermetisch abgeschlossene Lage der SMD-LED-Chips oder aufgedampfte lichtführende Substanzen (1) durch Versiegelung (7) einen Kanten- und Feuchtigkeitsschutz darstellen.6. Lighting device according to the chip card principle, characterized in that the hermetically sealed layer of the SMD LED chips or vapor-deposited light-conducting substances ( 1 ) by sealing ( 7 ) represent edge and moisture protection. 7. Beleuchtungsvorrichtung nach dem Chip-Karten-Prinzip dadurch gekennzeichnet, dass die Lage der SMID-LED-Chips oder licht­ leitende Substanzen in einer Einhausungsmarkierung (Aussparung) an der Kante der Leiterplatte den Abstrahlungswinkel o. g. Leucht­ mittel wirksam umsetzt.7. Lighting device according to the chip card principle characterized that the location of the SMID LED chips or light conductive substances in a housing marking (recess) at the edge of the circuit board the radiation angle o. g. light implemented effectively.
DE10121136A 2001-04-30 2001-04-30 LED module Expired - Fee Related DE10121136B4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10121136A DE10121136B4 (en) 2001-04-30 2001-04-30 LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10121136A DE10121136B4 (en) 2001-04-30 2001-04-30 LED module

Publications (2)

Publication Number Publication Date
DE10121136A1 true DE10121136A1 (en) 2002-11-21
DE10121136B4 DE10121136B4 (en) 2004-02-26

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DE10121136A Expired - Fee Related DE10121136B4 (en) 2001-04-30 2001-04-30 LED module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006005045U1 (en) * 2006-03-24 2007-08-09 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board module, has connecting device provided at printed circuit board for direct mechanical or electrical connection with another printed circuit board module comprising similar connecting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3320953A1 (en) * 1983-06-10 1984-12-13 Telefunken electronic GmbH, 7100 Heilbronn Optoelectronic component
KR100196296B1 (en) * 1991-01-18 1999-06-15 마쯔무라 미노루 Rear window stop lamp for motor vehicles
US5226723A (en) * 1992-05-11 1993-07-13 Chen Der Jong Light emitting diode display
US5404282A (en) * 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
JPH07281619A (en) * 1994-04-04 1995-10-27 Rohm Co Ltd Led lamp and mounting structure of the lamp on substrate
US5539623A (en) * 1994-10-12 1996-07-23 General Signal Corporation Lighting device used in an exit sign
DE19851265C2 (en) * 1998-11-06 2001-06-21 Harting Elektrooptische Bauteile Gmbh & Co Kg Electro-optical assembly and method for producing such an assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006005045U1 (en) * 2006-03-24 2007-08-09 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board module, has connecting device provided at printed circuit board for direct mechanical or electrical connection with another printed circuit board module comprising similar connecting device
EP1848254A2 (en) 2006-03-24 2007-10-24 Würth Elektronik Rot am See GmbH & Co. KG Circuit board module

Also Published As

Publication number Publication date
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Free format text: PATENTANSPRUCH 7, SPALTE 3, ZEILE 14 "SMID-LED-CHIPS" AENDERN IN "SMD-LED-CHIPS"

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