DE10085150T1 - Befestigungsverfahren und -vorrichtung für elektrische Komponenten - Google Patents

Befestigungsverfahren und -vorrichtung für elektrische Komponenten

Info

Publication number
DE10085150T1
DE10085150T1 DE10085150T DE10085150T DE10085150T1 DE 10085150 T1 DE10085150 T1 DE 10085150T1 DE 10085150 T DE10085150 T DE 10085150T DE 10085150 T DE10085150 T DE 10085150T DE 10085150 T1 DE10085150 T1 DE 10085150T1
Authority
DE
Germany
Prior art keywords
electrical components
fastening method
fastening
electrical
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10085150T
Other languages
English (en)
Other versions
DE10085150B4 (de
Inventor
Brian S Guthrie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harman International Industries Inc
Original Assignee
Harman International Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harman International Industries Inc filed Critical Harman International Industries Inc
Publication of DE10085150T1 publication Critical patent/DE10085150T1/de
Application granted granted Critical
Publication of DE10085150B4 publication Critical patent/DE10085150B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/30—Trim molding fastener
    • Y10T24/304—Resilient metal type
    • Y10T24/307—Sheet metal formed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE10085150T 1999-10-25 2000-09-26 Wärmesenke mit Klemmvorrichtung für elektrische Komponenten Expired - Fee Related DE10085150B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/426,731 US6266244B1 (en) 1999-10-25 1999-10-25 Mounting method and apparatus for electrical components
US09/426,731 1999-10-25
PCT/US2000/026398 WO2001031703A1 (en) 1999-10-25 2000-09-26 Mounting method and apparatus for electrical components

Publications (2)

Publication Number Publication Date
DE10085150T1 true DE10085150T1 (de) 2002-10-31
DE10085150B4 DE10085150B4 (de) 2008-03-27

Family

ID=23691982

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10085150T Expired - Fee Related DE10085150B4 (de) 1999-10-25 2000-09-26 Wärmesenke mit Klemmvorrichtung für elektrische Komponenten

Country Status (6)

Country Link
US (1) US6266244B1 (de)
JP (1) JP3649394B2 (de)
CA (1) CA2377336C (de)
DE (1) DE10085150B4 (de)
GB (1) GB2370917B (de)
WO (1) WO2001031703A1 (de)

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* Cited by examiner, † Cited by third party
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JP4048076B2 (ja) * 2001-07-10 2008-02-13 株式会社日本触媒 ミカエル型付加物の分解方法
US6545352B1 (en) 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
DE102004009055B4 (de) * 2004-02-23 2006-01-26 Infineon Technologies Ag Kühlanordnung für Geräte mit Leistungshalbleitern und Verfahren zum Kühlen derartiger Geräte
US7082034B2 (en) * 2004-04-01 2006-07-25 Bose Corporation Circuit cooling
US8068346B2 (en) 2004-05-04 2011-11-29 Hamilton Sundstrand Corporation Circuit board with high density power semiconductors
SE529673C2 (sv) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Kretsarrangemang för kylning av ytmonterade halvledare
DE102006027104B3 (de) * 2006-06-09 2007-08-23 Fpe Fischer Gmbh Verbindungsbox und Verfahren zum Schutz und Überwachung von einzelnen Solar-Panels vor Überhitzung
TW200846881A (en) * 2007-05-18 2008-12-01 Acbel Polytech Inc Mounting device for chips and heat dissipating fins
US20090161318A1 (en) * 2007-12-19 2009-06-25 Dialogic Corporation Thermal management systems and methods
DE102008041488A1 (de) * 2008-08-22 2010-02-25 BSH Bosch und Siemens Hausgeräte GmbH Haushaltsgerät für den Einbau in einem Möbelrahmen
AT510195B1 (de) * 2010-07-28 2013-08-15 Siemens Ag Spannvorrichtung
JP5766451B2 (ja) 2011-01-28 2015-08-19 矢崎総業株式会社 端子及び端子の接続構造
WO2013059917A1 (en) * 2011-10-26 2013-05-02 Accelerated Systems Inc. Enclosure for an electronic assembly for a battery powered lawn mower
US9049811B2 (en) 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
WO2014178876A1 (en) * 2013-05-03 2014-11-06 Schneider Electric USA, Inc. Heat sink and method of assemblying
DE102015202142A1 (de) * 2015-02-06 2016-08-11 Mahle International Gmbh Elektrische Einrichtung
KR102457660B1 (ko) * 2016-01-08 2022-10-24 엘지이노텍 주식회사 전력 변환 장치
JP6722540B2 (ja) * 2016-07-28 2020-07-15 株式会社Ｊｖｃケンウッド 放熱構造および電子機器
DE102018110754A1 (de) * 2018-05-04 2019-11-07 C. & E. Fein Gmbh Elektronikeinheit
US11647611B2 (en) * 2019-04-05 2023-05-09 Dana Tm4 Inc. Thermal interface for plurality of discrete electronic devices
WO2021186935A1 (ja) * 2020-03-19 2021-09-23 富士電機株式会社 電力変換装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4193444A (en) 1978-02-16 1980-03-18 Ramsey Controls, Inc. Electrical mounting means for thermal conduction
US4204248A (en) 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4288839A (en) 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4509839A (en) 1983-06-16 1985-04-09 Imc Magnetics Corp. Heat dissipator for semiconductor devices
US4707726A (en) 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
SE460008B (sv) * 1987-11-04 1989-08-28 Saab Scania Ab Kylkropp foer ett elektriskt kretskort samt anvaendning daerav
US4803545A (en) * 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5068764A (en) * 1990-03-05 1991-11-26 Thermalloy Incorporated Electronic device package mounting assembly
US5060112A (en) 1990-04-02 1991-10-22 Cocconi Alan G Electrical component assembly with heat sink
DE4012182A1 (de) * 1990-04-14 1991-10-17 Bosch Gmbh Robert Elektrisches schalt- und steuergeraet, insbesondere fuer kraftfahrzeuge
US5122480A (en) 1990-04-30 1992-06-16 Motorola, Inc. Method for assembling a heat sink to a circuit element using a retentive spring force
DE4141650C2 (de) * 1991-12-17 1997-03-13 Vero Electronics Gmbh Kühlkörper mit abnehmbarer Andruckklammer
FR2686765B1 (fr) * 1992-01-28 1994-03-18 Alcatel Converters Dispositif de fixation, notamment pour la fixation d'un composant electronique sur une paroi d'un dissipateur thermique .
US5274193A (en) 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5283467A (en) 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip
US5321582A (en) 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5309979A (en) 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
US5363552A (en) 1993-07-23 1994-11-15 Eaton Corporation Method of heat sinking and mounting a solid-state device
US5327324A (en) 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5343362A (en) * 1994-01-07 1994-08-30 Zytec Corporation Heat sink assembly
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
DE29510701U1 (de) * 1995-06-30 1995-08-24 Siemens AG, 80333 München Einrichtung zum Halten eines elektrischen Bauelements an einem Trägerteil
JPH09199645A (ja) * 1996-01-17 1997-07-31 Mitsubishi Electric Corp 半導体装置および半導体モジュール
US5812376A (en) 1997-04-21 1998-09-22 Chrysler Corporation Mounting assembly for electrical components and heat sinks
US5896270A (en) * 1997-05-21 1999-04-20 Artesyn Technologies, Inc. Heat sink spring clip
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip

Also Published As

Publication number Publication date
GB2370917A (en) 2002-07-10
GB0209075D0 (en) 2002-05-29
JP2003513449A (ja) 2003-04-08
DE10085150B4 (de) 2008-03-27
WO2001031703A1 (en) 2001-05-03
CA2377336C (en) 2005-02-08
GB2370917B (en) 2004-02-18
US6266244B1 (en) 2001-07-24
JP3649394B2 (ja) 2005-05-18
CA2377336A1 (en) 2001-05-03

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee