DE10084632T1 - A Method of Manufacturing a light Emitting Diode unit Body - Google Patents

A Method of Manufacturing a light Emitting Diode unit Body

Info

Publication number
DE10084632T1
DE10084632T1 DE10084632T DE10084632T DE10084632T1 DE 10084632 T1 DE10084632 T1 DE 10084632T1 DE 10084632 T DE10084632 T DE 10084632T DE 10084632 T DE10084632 T DE 10084632T DE 10084632 T1 DE10084632 T1 DE 10084632T1
Authority
DE
Germany
Prior art keywords
manufacturing
light emitting
emitting diode
unit body
diode unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10084632T
Other languages
English (en)
Inventor
Tsung-Wen Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE10084632T1 publication Critical patent/DE10084632T1/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F27/00—Combined visual and audible advertising or displaying, e.g. for public address
    • G09F27/008—Sun shades, shades, hoods or louvres on electronic displays to minimise the effect of direct sun light on the display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
DE10084632T 1999-09-14 2000-08-18 A Method of Manufacturing a light Emitting Diode unit Body Ceased DE10084632T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26025199A JP2001094154A (ja) 1999-09-14 1999-09-14 発光ダイオードユニットの製造方法
PCT/CN2000/000240 WO2001020688A1 (en) 1999-09-14 2000-08-18 A method of manufacturing a light emitting diode unit body

Publications (1)

Publication Number Publication Date
DE10084632T1 true DE10084632T1 (de) 2002-05-16

Family

ID=17345461

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10084632T Ceased DE10084632T1 (de) 1999-09-14 2000-08-18 A Method of Manufacturing a light Emitting Diode unit Body

Country Status (5)

Country Link
US (1) US6757969B1 (de)
JP (1) JP2001094154A (de)
AU (1) AU6554100A (de)
DE (1) DE10084632T1 (de)
WO (1) WO2001020688A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004004432A1 (de) * 2003-08-29 2005-05-04 Theodor Rusler Strahler

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7066628B2 (en) 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US7695166B2 (en) * 2001-11-23 2010-04-13 Derose Anthony Shaped LED light bulb
US20050188569A1 (en) * 2001-11-23 2005-09-01 Derose Anthony Display signs and ornaments for holiday seasons
US20080084009A1 (en) * 2005-05-02 2008-04-10 Derose Anthony Method of Making Shaped LED Light Bulb
JP3993475B2 (ja) * 2002-06-20 2007-10-17 ローム株式会社 Ｌｅｄチップの実装構造、およびこれを備えた画像読み取り装置
TW550524B (en) * 2002-08-30 2003-09-01 Ownway Biotronics Inc Image display system with distributed light-emitting module and method thereof
US20040254503A1 (en) * 2003-06-13 2004-12-16 Sarvazyan Armen P. Internet-based system and a method for automated analysis of tactile imaging data and detection of lesions
WO2006095729A1 (ja) 2005-03-09 2006-09-14 Nippon Telegraph And Telephone Corporation マトリクススイッチ
US8465175B2 (en) * 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
DE112007001950T5 (de) 2006-08-21 2009-07-02 Innotec Corporation, Zeeland Elektrische Vorrichtung mit platinenloser Montageanordnung für elektrische Komponenten
US7712933B2 (en) * 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
TWI344226B (en) * 2007-10-29 2011-06-21 Ind Tech Res Inst Method of packaging light emitted diode
EP2232592B1 (de) 2007-12-12 2013-07-17 Innotec Corporation Verfahren zum umspritzen einer leiterplatte
US7815339B2 (en) 2008-01-09 2010-10-19 Innotec Corporation Light module
US9022631B2 (en) 2012-06-13 2015-05-05 Innotec Corp. Flexible light pipe
US10327812B2 (en) 2015-11-04 2019-06-25 Rainbow Medical Ltd. Pericardial access device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036248A (en) * 1989-03-31 1991-07-30 Ledstar Inc. Light emitting diode clusters for display signs
JPH03206672A (ja) * 1990-01-08 1991-09-10 Seiwa Denki Kk 発光ダイオード素子およびその製造方法
US5278235A (en) * 1990-12-14 1994-01-11 Polyplastics Co., Ltd. Polyacetal resin composition
JPH0584978U (ja) * 1991-05-02 1993-11-16 スタンレー電気株式会社 Ｌｅｄ表示器
JP2877611B2 (ja) * 1991-06-07 1999-03-31 株式会社東芝 光半導体装置
US5808592A (en) * 1994-04-28 1998-09-15 Toyoda Gosei Co., Ltd. Integrated light-emitting diode lamp and method of producing the same
JPH08202290A (ja) * 1995-01-26 1996-08-09 Daihatsu Motor Co Ltd Ｌｅｄディスプレイモジュール
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004004432A1 (de) * 2003-08-29 2005-05-04 Theodor Rusler Strahler

Also Published As

Publication number Publication date
WO2001020688A1 (en) 2001-03-22
AU6554100A (en) 2001-04-17
US6757969B1 (en) 2004-07-06
JP2001094154A (ja) 2001-04-06

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H01L 2513

8131 Rejection