DE10055454A1 - Cooling body for electronic components or devices having a heat emitting region formed by an open pore metal foam body - Google Patents

Cooling body for electronic components or devices having a heat emitting region formed by an open pore metal foam body

Info

Publication number
DE10055454A1
DE10055454A1 DE2000155454 DE10055454A DE10055454A1 DE 10055454 A1 DE10055454 A1 DE 10055454A1 DE 2000155454 DE2000155454 DE 2000155454 DE 10055454 A DE10055454 A DE 10055454A DE 10055454 A1 DE10055454 A1 DE 10055454A1
Authority
DE
Germany
Prior art keywords
heat
metal foam
base plate
foam body
emitting region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2000155454
Other languages
German (de)
Inventor
Wilhelm Neukam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Technology Solutions GmbH
Original Assignee
Fujitsu Technology Solutions GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Technology Solutions GmbH filed Critical Fujitsu Technology Solutions GmbH
Priority to DE2000155454 priority Critical patent/DE10055454A1/en
Publication of DE10055454A1 publication Critical patent/DE10055454A1/en
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The cooling element has a heat absorbing region formed by a base plate (2). This is in contact with a component (1) to be cooled. The body also has a heat emitting region (3) attached to the heat absorbing region, for emitting heat to the surroundings of the body. The heat emitting region (3) is formed by an open pore metal foam body made of e.g. aluminium or an aluminium alloy.

Description

Die Erfindung betrifft einen Kühlkörper mit einem Wärmeauf­ nahmebereich, der durch eine Basisplatte gebildet ist und der in Kontakt mit einem zu kühlenden Bauteil steht, und einem Wärmeabgabebereich, der sich an den Wärmeaufnahmebereich an­ schließt, zur Abgabe von Wärme an die Umgebung des Kühlkör­ pers.The invention relates to a heat sink with a heat area, which is formed by a base plate and the is in contact with a component to be cooled, and one Heat dissipation area that adheres to the heat absorption area closes to give off heat to the surroundings of the heat sink pers.

Es ist eine große Vielfalt von Kühlkörpern bekannt. Klein­ kühlkörper sind an die genormten Gehäuse von beispielsweise Halbleiterbauelementen angepaßt und können einfach aufge­ steckt werden. Zur Verbesserung des Wärmeübergangs zwischen den Halbleiterbauelementen und dem Kühlkörper ist es bekannt, sogenannte Wärmeleitpaste zu verwenden. Für Großkühlkörper werden vorwiegen fertiggezogene Aluminium-Profile benutzt. Verschiedene Ausführungen von Kühlkörpern sind beispielsweise aus "Nührmann, Dieter: Das große Werkbuch Elektronik, Teil A, Francis-Verlag, München 1998" bekannt.A wide variety of heat sinks are known. Small heat sinks are adapted to the standardized housing of, for example, semiconductor components and can simply be plugged on. To improve the heat transfer between the semiconductor components and the heat sink, it is known to use so-called thermal paste. Pre-drawn aluminum profiles are mainly used for large heat sinks. Various designs of heat sinks are known, for example, from "Nührmann, Dieter: The Great Workbook Electronics, Part A, Francis Verlag, Munich 1998 ".

Bei Mikroprozessoren hängt die erzeugte Wärme in hohem Maß von der verwendeten Taktfrequenz ab. Je höher die Taktfre­ quenz ist, desto größer ist die Verlustleidtung und damit Wärme, die an die Umgebung abgeführt werden muß. Durch Fort­ schritte in der Halbleitertechnologie ist die Taktfrequenz mittlerweile so hoch, daß bisher bekannte Kühlkörper in der üblichen Größe nicht mehr ausreichen, selbst wenn Lüfter zur Zwangskühlung eingesetzt werden. Die einzige Möglichkeit, dennoch eine ausreichende Kühlung sicher zu stellen, ist da­ her, die Kühlkörper weiter zu vergrößern, was aber aus ande­ ren konstruktiven und technischen Gründen nicht wünschenswert oder nicht möglich ist.The heat generated in microprocessors depends to a large extent depends on the clock frequency used. The higher the clock frequency quenz is, the greater the loss suffering and thus Heat that must be dissipated to the environment. By fort Steps in semiconductor technology is the clock frequency meanwhile so high that previously known heat sinks in the usual size is no longer sufficient, even if fans are used Forced cooling can be used. The only way nevertheless there is sufficient cooling to ensure forth to enlarge the heat sink further, but what else ren constructive and technical reasons not desirable or is not possible.

Aufgabe der Erfindung ist es daher, einen Kühlkörper anzuge­ ben, der eine verbesserte Wärmeabgabefähigkeit besitzt, ohne deswegen größere Abmessungen aufzuweisen. Außerdem soll das Gewicht des Kühlkörpers gering sein.The object of the invention is therefore to provide a heat sink ben who has an improved heat dissipation ability without  therefore to have larger dimensions. In addition, that should Weight of the heat sink should be low.

Diese Aufgabe wird erfindungsgemäß durch einen Kühlkörper der eingangs genannten Art gelöst, der dadurch gekennzeichnet ist, daß der Wärmeabgabebereich durch einen offenporigen Me­ tallschaumkörper gebildet ist.This object is achieved by a heat sink solved type mentioned, characterized in that is that the heat dissipation area by an open-pore Me tall foam body is formed.

Durch die Basisplatte ist gewährleistet, daß ein guter Wärme­ übergang von einem zu kühlenden Bauteil auf den Kühlkörper erfolgt. Optimiert ist bei den erfindungsgemäßen Kühlkörpern hingegen der Wärmeabgabebereich. Der offenporige Metallschaum hat naturgemäß eine wesentlich größere Oberfläche als die Kühlrippen bekannter Kühlkörper. Dadurch ist die Vorausset­ zung gegeben, eine größere Wärmemenge an die Umgebung abzuge­ ben. Trotzdem bleibt es wichtig, daß das verwendete Material auch gute Wärmeleiteigenschaften aufweist. Daher ist es vor­ teilhaft, einen Aluminiumwerkstoff zu verwenden, da Aluminium sehr gute Wärmeleiteigenschaften aufweist. Weiterhin ist es für die Kühleigenschaften wichtig, daß eine Luftzirkulation zum Abtransport der Wärme ermöglicht ist. Vorteilhaft erweist es sich diesbezüglich, wenn die Dichte des Metallschaums von der Basisplatte zu der von der Basisplatte abgewandten Seite des Wärmeabgabebereichs abnimmt. Dadurch ist sichergestellt, daß der Metallschaum die Wärme, die von dem zu kühlenden Bau­ element auf die Basisplatte übertragen wird, von dieser an den Metallschaumkörper weitergeleitet wird und der Metall­ schaumkörper diese auch aufnehmen kann. In den äußeren Be­ reich ist es dagegen eher wichtig, daß die Möglichkeiten zur Luftzirkulation möglichst gut sind, die Poren also größer sind beziehungsweise die Dichte kleiner ist. Die Gewichtser­ sparnis gegenüber einem Kühlkörper konventioneller Bauart be­ trägt bei gleicher Kühlleistung 80-90%.The base plate ensures that good heat transition from a component to be cooled to the heat sink he follows. The heat sinks according to the invention are optimized however, the heat dissipation area. The open-pore metal foam naturally has a much larger surface than that Cooling fins of known heat sinks. This is the prerequisite given a larger amount of heat to the environment ben. Nevertheless, it remains important that the material used also has good thermal conductivity. Therefore it is before partial to use an aluminum material because aluminum has very good thermal conductivity. Furthermore it is important for the cooling properties that air circulation to remove the heat is made possible. Proves advantageous it is in this regard if the density of the metal foam of the base plate to the side facing away from the base plate of the heat dissipation area decreases. This ensures that the metal foam the heat from the building to be cooled element is transferred to the base plate from there on the metal foam body is passed on and the metal foam body can also accommodate this. In the outer Be rich it is rather important that the possibilities for Air circulation is as good as possible, so the pores are larger or the density is smaller. The weights savings compared to a conventional heat sink carries 80-90% with the same cooling capacity.

Die Erfindung wird nachfolgend anhand eines Ausführungsbei­ spieles näher erläutert. Die Figur zeigt dabei ein Halbleiterbauelement, auf das ein erfindungsgemäßer Kühlkörper auf­ gesetzt ist.The invention is illustrated below with the aid of an embodiment game explained in more detail. The figure shows a semiconductor component,  on which a heat sink according to the invention is set.

Das zu kühlende Bauelement in der Figur ist ein Halbleiter-IC 1. Dieses ist schematisch dargestellt und besitzt nur wenige Anschlußpins 6. In der Regel wird dies ein Prozessor sein, der wesentlich mehr Anschlüsse aufweist. Die Bedeutung der Kühlung hängt aber natürlich nicht von der Anzahl der An­ schlußpins 6 ab, sondern von der in dem Bauelement 1 erzeug­ ten Wärme. Bei Prozessoren ist sie in der Regel abhängig von der Taktfrequenz. Bei Leistungshalbleitern, die ebenfalls ge­ kühlt werden müssen, ist dagegen die Höhe des Stromes für die Größe der erzeugten Verlustleistung ausschlaggebend. Auf die­ ses Halbleiter-Bauelement 1 ist ein Kühlkörper 7 mit einer Basisplatte 2 aufgesetzt. Zur Befestigung des Kühlkörpers 7 auf dem Halbleiter-Bauelement 1 sind verschiedene Techniken bekannt. Eine Technik besteht darin, den Kühlkörper 7 auf dem Halbleiter-Bauelement 1 festzuklammern. In einer anderen Mög­ lichkeit wird der Kühlkörper 7 auf dem Halbleiter-Bauelement 1 festgeklebt. Insbesondere finden dabei wärmeleitfähige Kle­ ber Verwendung. Die Verbindung der Basisplatte 2 des Kühlkör­ pers 7 mit dem Halbleiter-Bauelement 1 erfolgt jedenfalls nicht anders, als vom Stand der Technik her bekannt ist. Auf der von dem Halbleiter-Bauelement 1 abgewandten Seite der Ba­ sisplatte 2 ist ein Metallschaumkörper 3 mit einer offenzel­ ligen Honigwabenstruktur als Wärmeabgabebereich vorgesehen. Nahe der Basisplatte 2 befindet sich ein Bereich 4 des Me­ tallschaumkörpers 3, in dem dessen Dichte relativ groß ist. Die Wärmeleitung von der Basisplatte 2 in den unteren Metall­ schaumkörperbereich 4 ist daher unproblematisch. Allerdings ist die Konvektion, durch die Wärme an die Umgebung des Kühl­ körpers 7 abgegeben werden kann, relativ gering. Um eine bes­ sere Konvektion zu erreichen, verringert sich die Dichte mit zunehmendem Abstand von der Basisplatte 2. Dadurch wird in einem von der Basisplatte beabstandeten Metallschaumkörperbe­ reich 5 eine freie Konvektion ermöglicht. The component to be cooled in the figure is a semiconductor IC 1 . This is shown schematically and has only a few connection pins 6 . As a rule, this will be a processor that has significantly more connections. The importance of cooling, of course, does not depend on the number of connection pins 6 , but on the heat generated in component 1 . For processors, it is usually dependent on the clock frequency. In the case of power semiconductors, which also have to be cooled, the amount of current is decisive for the size of the power loss generated. A heat sink 7 with a base plate 2 is placed on the semiconductor component 1 . Various techniques are known for fastening the heat sink 7 to the semiconductor component 1 . One technique is to clamp the heat sink 7 on the semiconductor component 1 . In another possibility, the heat sink 7 is glued to the semiconductor device 1 . In particular, thermally conductive adhesives are used. The connection of the base plate 2 of the Kühlkör pers 7 with the semiconductor device 1 is in any case no different from what is known from the prior art. On the side facing away from the semiconductor component 1 of the base plate 2 , a metal foam body 3 with an open-cell honeycomb structure is provided as the heat dissipation area. Near the base plate 2 is an area 4 of the tall foam body 3 in which the density thereof is relatively large. The heat conduction from the base plate 2 into the lower metal foam body region 4 is therefore unproblematic. However, the convection through which heat can be given off to the surroundings of the cooling body 7 is relatively low. In order to achieve better convection, the density decreases with increasing distance from the base plate 2 . This allows free convection in a metal foam body region 5 spaced from the base plate.

Die Kühlung ist wesentlich verbessert, wenn sich der Kühlkör­ per 7 beziehungsweise dessen Metallschaumkörper 3 sich in ei­ nem Luftstrom befindet, wie dies auch beim Stand der Technik häufig der Fall ist.The cooling is significantly improved if the heat sink by 7 or its metal foam body 3 is in an air flow, as is often the case in the prior art.

Gegenüber Kühlkörpern des Standes der Technik weist ein er­ findungsgemäßer Kühlkörper 7 ein kleineres Gewicht auf. Auch ist vorteilhaft, daß dem Metallschaumkörper 3 eine beliebige Form gegeben werden kann. Dadurch können auch kleinere Bau­ räume genutzt werden.Compared to heat sinks of the prior art, he heat sink 7 according to the invention has a smaller weight. It is also advantageous that the metal foam body 3 can be given any shape. This means that even smaller spaces can be used.

Als Material für den Metallschaum wurde Aluminium angegeben. Es ist aber auch denkbar, statt dessen Kupfer, Eisen oder Zinn zu verwenden.Aluminum was specified as the material for the metal foam. But it is also conceivable, instead of copper, iron or To use tin.

Claims (3)

1. Kühlkörper mit
einem Wärmeaufnahmebereich, der durch eine Basisplatte (2) gebildet ist und der in Kontakt mit einem zu kühlenden Bau­ teil (1) steht, und
einem Wärmeabgabebereich (3), der sich an den Wärmeaufnahme­ bereich (1) anschließt, zur Abgabe von Wärme an die Umgebung des Kühlkörpers,
dadurch gekennzeichnet, daß
der Wärmeabgabebereich (3) durch einen offenporigen Metall­ schaumkörper gebildet ist.1. Heatsink with
a heat absorption area which is formed by a base plate ( 2 ) and which is in contact with a part to be cooled ( 1 ), and
a heat dissipation area ( 3 ), which adjoins the heat absorption area ( 1 ), for dissipating heat to the surroundings of the heat sink,
characterized in that
the heat dissipation area ( 3 ) is formed by an open-pored metal foam body. 2. Kühlkörper nach Anspruch 1, dadurch gekennzeichnet, daß der Metallschaum (3) aus Aluminium oder einer Legierung mit Aluminium als größtem Anteil besteht.2. Heat sink according to claim 1, characterized in that the metal foam ( 3 ) consists of aluminum or an alloy with aluminum as the largest proportion. 3. Kühlkörper nach Anspruch 1, dadurch gekennzeichnet, daß die Dichte des Metallschaums von der Basisplatte zu der von der Basisplatte (2) abgewandten Seite des Wärmeabgabeberei­ ches (3) abnimmt.3. Heat sink according to claim 1, characterized in that the density of the metal foam decreases from the base plate to the side of the heat dissipation ches ( 3 ) facing away from the base plate ( 2 ).
DE2000155454 2000-11-09 2000-11-09 Cooling body for electronic components or devices having a heat emitting region formed by an open pore metal foam body Ceased DE10055454A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2000155454 DE10055454A1 (en) 2000-11-09 2000-11-09 Cooling body for electronic components or devices having a heat emitting region formed by an open pore metal foam body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000155454 DE10055454A1 (en) 2000-11-09 2000-11-09 Cooling body for electronic components or devices having a heat emitting region formed by an open pore metal foam body

Publications (1)

Publication Number Publication Date
DE10055454A1 true DE10055454A1 (en) 2002-05-23

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10221138A1 (en) * 2002-05-11 2004-02-05 Madex Electronic Components Gmbh Heat sink has coating of carbon compound, is based on metal foam, has open-pored structure and massive contact surface
DE10244805A1 (en) * 2002-09-26 2004-04-08 Sma Regelsysteme Gmbh Open-pored heat sink cast, sintered or foamed from a heat-conductive material for a heat exchanger maintains contact with an object to be cooled
DE10324190A1 (en) * 2003-05-28 2005-01-05 M.Pore Gmbh Metal foam heat exchanger, especially for electronic components, has a metal film on at least one of its outer surfaces with which a contact or connection is formed or made with the component that is to be cooled
EP1519217A1 (en) * 2003-09-26 2005-03-30 Samsung SDI Co., Ltd. Display apparatus having heat transfer sheet
DE10352711A1 (en) * 2003-11-06 2005-06-09 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board structure for electronic components links with its rear side to a metal foam printed circuit board support
DE10346423B4 (en) * 2003-10-07 2006-07-13 M.Pore Gmbh Modular heat exchanger
DE102005004695B3 (en) * 2005-02-02 2006-09-28 Fpe Fischer Gmbh Heat sink for microprocessor, has base body at which lamellas are attached, and heat exchanger made of porous material, and including hollow space, where lamellas are inserted in exchanger so that gap exists between base body and exchanger
WO2009083107A1 (en) * 2007-12-21 2009-07-09 Eichenauer Heizelemente Gmbh & Co. Kg Heating device
EP2400252A1 (en) * 2010-06-24 2011-12-28 Valeo Vision Heat-exchange device, in particular for a car
DE102013215592A1 (en) * 2013-08-07 2015-02-12 Siemens Aktiengesellschaft Power electronic circuit with planar electrical contacting
CN105845662A (en) * 2015-01-29 2016-08-10 英飞凌科技股份有限公司 Device including a metallization layer and method of manufacturing a device
WO2017021394A1 (en) * 2015-08-05 2017-02-09 Siemens Aktiengesellschaft Component module and power module
WO2017029029A1 (en) * 2015-08-14 2017-02-23 Siemens Aktiengesellschaft Heat sink for an electronic component and method for producing said heat sink
EP2989659A4 (en) * 2013-04-23 2017-04-12 Alexiou & Tryde Holding ApS Heat sink having a cooling structure with decreasing structure density
EP3176881A1 (en) * 2015-12-02 2017-06-07 Schneider Electric Industries SAS Electrical connector comprising a thermal dissipator and electrical apparatus equipped with such a connector
DE10343020B4 (en) * 2003-09-16 2018-01-18 Mayser Holding Gmbh & Co. Kg Heatsink, especially for electronic components
WO2018077321A1 (en) * 2016-10-26 2018-05-03 Peter Marchl Structure for controlling the temperature of solid bodies and containers, and use of same
EP4328959A1 (en) * 2022-08-24 2024-02-28 Siemens Aktiengesellschaft Heat sink for an electronic component comprising a pressed metal foam

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EP0559092A1 (en) * 1992-03-05 1993-09-08 Texas Instruments Incorporated Metal foam heat dissipator
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JPH07161884A (en) * 1993-12-07 1995-06-23 Kitagawa Ind Co Ltd Heat radiation material for electronic part

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10221138A1 (en) * 2002-05-11 2004-02-05 Madex Electronic Components Gmbh Heat sink has coating of carbon compound, is based on metal foam, has open-pored structure and massive contact surface
DE10244805A1 (en) * 2002-09-26 2004-04-08 Sma Regelsysteme Gmbh Open-pored heat sink cast, sintered or foamed from a heat-conductive material for a heat exchanger maintains contact with an object to be cooled
DE10324190A1 (en) * 2003-05-28 2005-01-05 M.Pore Gmbh Metal foam heat exchanger, especially for electronic components, has a metal film on at least one of its outer surfaces with which a contact or connection is formed or made with the component that is to be cooled
DE10324190B4 (en) * 2003-05-28 2009-07-23 M.Pore Gmbh heat exchangers
DE10343020B4 (en) * 2003-09-16 2018-01-18 Mayser Holding Gmbh & Co. Kg Heatsink, especially for electronic components
EP1519217A1 (en) * 2003-09-26 2005-03-30 Samsung SDI Co., Ltd. Display apparatus having heat transfer sheet
JP2005107487A (en) * 2003-09-26 2005-04-21 Samsung Sdi Co Ltd Display apparatus and plasma display apparatus
DE10346423B4 (en) * 2003-10-07 2006-07-13 M.Pore Gmbh Modular heat exchanger
DE10352711B4 (en) * 2003-11-06 2015-05-13 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board assembly
DE10352711A1 (en) * 2003-11-06 2005-06-09 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board structure for electronic components links with its rear side to a metal foam printed circuit board support
DE102005004695B3 (en) * 2005-02-02 2006-09-28 Fpe Fischer Gmbh Heat sink for microprocessor, has base body at which lamellas are attached, and heat exchanger made of porous material, and including hollow space, where lamellas are inserted in exchanger so that gap exists between base body and exchanger
WO2009083107A1 (en) * 2007-12-21 2009-07-09 Eichenauer Heizelemente Gmbh & Co. Kg Heating device
US9103605B2 (en) 2010-06-24 2015-08-11 Valeo Vision Heat exchange device
EP2400252A1 (en) * 2010-06-24 2011-12-28 Valeo Vision Heat-exchange device, in particular for a car
FR2961894A1 (en) * 2010-06-24 2011-12-30 Valeo Vision HEAT EXCHANGE DEVICE, IN PARTICULAR FOR A MOTOR VEHICLE
EP2989659A4 (en) * 2013-04-23 2017-04-12 Alexiou & Tryde Holding ApS Heat sink having a cooling structure with decreasing structure density
DE102013215592A1 (en) * 2013-08-07 2015-02-12 Siemens Aktiengesellschaft Power electronic circuit with planar electrical contacting
CN105845662A (en) * 2015-01-29 2016-08-10 英飞凌科技股份有限公司 Device including a metallization layer and method of manufacturing a device
WO2017021394A1 (en) * 2015-08-05 2017-02-09 Siemens Aktiengesellschaft Component module and power module
US10741474B2 (en) 2015-08-05 2020-08-11 Siemens Aktiengesellschaft Component module and power module
US10582642B2 (en) 2015-08-14 2020-03-03 Siemens Aktiengesellschaft Pourous heat sink with chimney
WO2017029029A1 (en) * 2015-08-14 2017-02-23 Siemens Aktiengesellschaft Heat sink for an electronic component and method for producing said heat sink
CN106992410A (en) * 2015-12-02 2017-07-28 施耐德电器工业公司 Electric connector including radiator and the electrical equipment equipped with such connector
FR3044821A1 (en) * 2015-12-02 2017-06-09 Schneider Electric Ind Sas ELECTRICAL CONNECTOR COMPRISING A THERMAL DISSIPATOR AND ELECTRICAL APPARATUS PROVIDED WITH SUCH A CONNECTOR
US10230188B2 (en) 2015-12-02 2019-03-12 Schneider Electric Industries Sas Electrical connector comprising a heat dissipator and electrical apparatus equipped with such a connector
EP3176881A1 (en) * 2015-12-02 2017-06-07 Schneider Electric Industries SAS Electrical connector comprising a thermal dissipator and electrical apparatus equipped with such a connector
CN106992410B (en) * 2015-12-02 2020-09-11 施耐德电器工业公司 Electrical connector comprising a heat sink and electrical apparatus equipped with such a connector
WO2018077321A1 (en) * 2016-10-26 2018-05-03 Peter Marchl Structure for controlling the temperature of solid bodies and containers, and use of same
EP4328959A1 (en) * 2022-08-24 2024-02-28 Siemens Aktiengesellschaft Heat sink for an electronic component comprising a pressed metal foam
WO2024041985A1 (en) * 2022-08-24 2024-02-29 Siemens Aktiengesellschaft Heat sink for an electronic component, having a pressed metal foam

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