DE102009023113A1 - Cooling device and method for its production - Google Patents

Abstract

The invention relates to a cooling device, which consists of a flat evaporator (1), a steam pipe (2), a liquid pipe (3) and a condenser (4). The evaporator (1) comprises a main body having a bottom plate (11), a porous material (12) and an upper lid (13), wherein the porous material (12) steam channels (121) forms, the upper lid with the bottom plate ( and a liquid opening (134) connected to the steam pipe (2) and the liquid pipe (3) connected to the condenser (4) at the other end. The flat evaporator (1) can be sealed The invention is suitable for computer chip, light emitting diode lamp, high performance chip of communication, heat generating electronic components of military, medical, aerospace and aerospace industries.

Description

Technical area

The The invention relates to a cooling device for electronic Products, in particular a heat pipe loop, and a Process for the preparation of this cooling device.

State of the art

The Cooling of the high performance chip for electronics, Computer, communication and optoelectronics is an important technology. At present, the cooling of the high-power chip usually uses the following Cooling modules: (1) fan + heat sink, (2) fan + heat pipe + heat sink, (3) fan + liquid cooler. These cooling modules However, they have the following disadvantages: (1) fan + heat sink: around To increase the cooling effect, the area must be the cooling fins increased and the speed be increased by the fan, reducing the space requirement and the Noise can be increased; (2) fan + Heat pipe + heat sink: the construction is complicated and the arrangement of the heat pipe is limited so that the cooling effect is limited; (3) Fan + liquid cooler: the liquid cooler has a higher Cooling effect and a lower noise, so that the cooling effect of 1000 W is achievable (the Thermal resistance of the liquid cooler can below 0.12 ° C / W). The construction of the liquid cooler but it is complicated. The pump that pumps the working fluid and the piping can extend the life of the chiller influence. In addition, the manufacturing cost of the liquid cooler three times the normal heat sink (with the same Cooling effect).

Around to solve the above problems became a 1974 Cooling device developed with a heat pipe loop which finds a great application to aerospace. The heat pipe loop is also getting more and more for used the cooling of the chip. The heat pipe loop combines the advantages of the heat pipe and the liquid cooler and can have a compact shape and a cooling effect of over 500 W (the thermal resistance of the heat pipe loop is below 0.15 ° C / W). The cooling device with the Heat pipe loop has the following advantages: (1) the Influence of the power by gravity is smaller as the normal heat pipe; (2) the shape can be arbitrary be designed; (3) a long-distance heat transport is possible. In addition, the manufacturing technique of the heat pipe loop is similar like that of the normal heat pipe, so that the reliability and the lifespan are also similar.

The includes conventional heat pipe loop an evaporator with a capillary structure, a steam pipe, a Liquid pipe and a condenser. When using lies the evaporator on the heat source (like chip) to her To absorb heat. This will change the working medium into the capillary structure evaporates and flows through the steam pipe in the condenser with cooling fins, so that the heat is discharged into the surrounding medium (such as air) of the condenser. The condensate flows through the capillary action into the evaporator back, creating a cycle. Therefore, can the heat of the heat source continuously in the Ambient air to be dissipated.

Like CN 01259718.X and 200810028106.7 is a heat pipe loop known. The evaporators in the known patents have two forms: (1) cylindrical shape, and (2) flat shape. 1A and 1B show a conventional cylindrical evaporator. The flat evaporator has the following two types: (1) disk evaporator, as in 1C . 1D and 1E ; (2) Plate evaporator made by the microelectronic machining technique (ZL01259718.X) as shown in Figs 1F and 1G is shown.

Of the The chip is designed to be square (or rectangular). The cylindrical evaporator has only a small contact area with the chip. The disk evaporator has a heavy production and a high space requirement. The conventional plate evaporator, made by the microelectronic machining technique can not yet meet the requirement of the industry.

Object of the invention

Of the Invention is based on the object, a cooling device and to provide a method of manufacturing the same overcome the above disadvantages.

These Task is achieved by the cooling device according to the invention solved that from an evaporator, a steam pipe, a Liquid tube and a capacitor consists. The evaporator is a flat evaporator and has a rectangular, polygonal or other geometric shape. The flat evaporator includes a main body that has a bottom plate, a porous one Material and has an upper lid. The porous material is arranged on the base plate. The top cover is with the bottom plate connected. The porous material forms vapor channels. The upper lid has a steam opening on both sides and a liquid opening communicating with the Steam pipe and the liquid pipe are connected.

The upper lid has inside a partition plate, wherein between the partition plate and the Liquid opening a refill and between the separation plate and the vapor opening a vapor collection chamber is formed. The upper lid of the evaporator has on top of an opening for evacuating or filling the working medium.

• (1) Bereitstellung des porösen Materials: das poröse Material kann durch ein Metallpulver oder Metallnetz mit hoher Wärmeleitfähigkeit oder ein anorganisches Material, wie Keramikpulver, hergestellt werden; wenn das poröse Material aus Metallpulver hergestellt ist, kann es durch ein separates Sintern erhalten werden oder direkt auf der Bodenplatte gesintert werden; beim Sintern werden ein Formwerkzeug und ein Dorn verwendet; das Formwerkzeug kann aus Stahl oder Hochtemperaturkeramik hergestellt werden; der Dorn dient zur Bildung der Dampfkanäle des poröses Materials und kann aus Graphit oder Stahl hergestellt werden; das Formwerkzeug mit dem gefüllten Sinterpulver wird in einen Sinterofen gebracht, um das Pulvermaterial zu sintern; nach der Entfernung des Formwerkzeugs und der Dorne wird das poröse Material erhalten; das poröse Material kann auch durch mikroelektronische Bearbeitungstechnik oder mit Nanostab hergestellt werden.
• (2) Bereitstellung des Oberdeckels: der Oberdeckel ist aus Metall oder Halbleitermaterial hergestellt; wenn der Oberdeckel aus Metall hergestellt ist, kann er durch mechanische Bearbeitung oder Gießen geformt werden; wenn der Oberdeckel aus Halbleitermaterial hergestellt ist, kann er durch mikroelektronische Bearbeitung geformt werden;
• (3) Bereitstellung der Bodenplatte: die Bodenplatte ist aus Kupfer, Aluminium oder Silizium hergestellt und durch mechanische Bearbeitung, Stanzen, Gießen oder mikroelektronische Bearbeitung geformt;
• (4) nach der Herstellung des porösen Materials werden der Oberdeckel und die Bodenplatte des Verdampfers miteinander verbunden; wenn der Oberdeckel und die Bodenplatte aus Metell hergestellt sind, kann das Löten verwendet werden; wenn sie aus Halbleitermaterial hergestellt sind, kann das Bonden verwendet werden;
• (5) der dadurch erhaltene Verdampfer werden über Rohre mit dem Kondensator verbunden; danach wird das Wärmerohr hergestellt; dies enthält die Schritte wie Reinigen, Evakuieren, Füllen des Arbeitsmediums und Verschließen.

The method of manufacturing the cooling device includes the following steps:

• (1) Provision of the porous material: the porous material can be produced by a metal powder or metal net with high thermal conductivity or an inorganic material such as ceramic powder; if the porous material is made of metal powder, it can be obtained by a separate sintering or sintered directly on the bottom plate; during sintering, a mold and a mandrel are used; the mold can be made of steel or high temperature ceramics; the mandrel serves to form the vapor channels of the porous material and can be made of graphite or steel; the mold with the filled sintered powder is placed in a sintering furnace to sinter the powder material; after removal of the mold and mandrels, the porous material is obtained; The porous material can also be produced by microelectronic machining technology or with nanostab.
• (2) provision of the upper lid: the upper lid is made of metal or semiconductor material; when the upper lid is made of metal, it can be formed by mechanical working or casting; if the top cover is made of semiconductor material, it can be formed by microelectronic machining;
• (3) provision of the bottom plate: the bottom plate is made of copper, aluminum or silicon and formed by mechanical working, stamping, casting or microelectronic machining;
• (4) after the production of the porous material, the upper lid and the bottom plate of the evaporator are bonded together; if the top cover and bottom plate are made of metal, soldering can be used; if made of semiconductor material, bonding can be used;
• (5) the evaporator obtained thereby is connected to the condenser via pipes; then the heat pipe is made; this includes the steps of cleaning, evacuating, filling the working fluid and closing.

• 1. ein dichter Kontakt mit dem Chip, eine größere Kontaktfläche und ein kleinerer Raumbedarf der Chip ist überlicherweise quadratisch ausgebildet; der erfindungsgemäße flache Verdampfer kann eine rechteckige, mehrkantige oder andere geometrische Form haben und weist eine plane Kontaktfläche auf. Daher kann der flache Verdampfer dicht auf dem Chip aufliegen;
• 2. Reduzierung des Wärmewiderstands das poröse Material des Verdampfers kann eine Kapillarwirkung erzeugen und direkt auf der Bodenplatte des porösen Materials gesintert werden, wodurch der Wärmewiderstand erheblich reduziert wird, so dass die Kühlwirkung erhöht wird; nach Test des Erfinders beträgt der Wärmewiderstand des Systems 0,15
  
  und der Wärmewiderstand des Wärmerohrs unter 0,05
  
  Die Kühlwirkung ist höher als 600 W;
• 3. einfache Herstellung und niedrige Kosten der Oberdeckel, die Bodenplatte und die Füllöffnung des Verdampfers sowie das Flüssigkeitsrohr und das Dampfrohr können durch Löten miteinander verbunden werden, so dass die Bearbeitungszeit und -kosten reduziert werden.

In comparison with the conventional solution, the invention has the following advantages:

• 1. a close contact with the chip, a larger contact area and a smaller space requirement of the chip is usually formed square; the flat evaporator according to the invention may have a rectangular, polygonal or other geometric shape and has a flat contact surface. Therefore, the flat evaporator can rest close to the chip;
• 2. Reduction of thermal resistance The porous material of the evaporator can create a capillary action and be sintered directly on the bottom plate of the porous material, whereby the thermal resistance is significantly reduced, so that the cooling effect is increased; according to the inventor's test, the thermal resistance of the system is 0.15
  
  and the thermal resistance of the heat pipe below 0.05
  
  The cooling effect is higher than 600 W;
• 3. Easy manufacture and low cost of the upper lid, the bottom plate and the filling opening of the evaporator and the liquid tube and the steam tube can be connected by soldering, so that the processing time and costs are reduced.

Brief description of the drawings

1A a representation of the conventional cylindrical evaporator,

1B a sectional view taken along the line AA in 1A .

1C a representation of the conventional flat evaporator,

1D a sectional view taken along the line AA in 1C .

1E a sectional view taken along the line BB in 1C .

1F a representation of the conventional flat evaporator, which is made by the microelectronic processing technology,

1G a sectional view taken along the line AA in 1F .

2 a perspective view of the invention,

3A a sectional view of the flat evaporator in 2 .

3B a sectional view taken along the line AA in 3A .

4 a perspective view of the bottom plate in 3A .

5A a perspective view of Steam channels of the porous material, which have an arcuate cross-section,

5B a perspective view of the vapor channels of the porous material, which have a rectangular cross-section,

5C a perspective view of the vapor channels of the porous material, which have an oval cross section,

5D a perspective view of the vapor channels of the porous material, which have a round cross-section,

5E a representation of the processing of the porous material,

6A a perspective view of the upper lid of the flat evaporator from above,

6B a perspective view of the upper lid of the flat evaporator from below,

7 an exploded view of the flat evaporator,

8th an exploded view of the cooling device according to the invention.

Ways to execute the invention

How out 2 it can be seen, the cooling device according to the invention consists of a flat evaporator 1 , a steam pipe 2 , a liquid pipe 3 , a capacitor 4 and / or a fan 5 , The ventilator 5 is on one side of the capacitor 4 arranged and can generate an air flow for the capacitor. The flat evaporator 1 has a rectangular, polygonal or other geometric shape.

Like from the 3A . 3B and 7 can be seen, includes the flat evaporator 1 a main body that has a bottom plate 11 , a porous material 12 and an upper lid 13 having. How out 4 it can be seen has the bottom plate 11 on the bottom of a flat surface (not shown), which can rest on a chip. The bottom plate 11 forms on the top of a projection 111 which has a hook, needle or anchor-shaped cross-section to the porous material on the bottom plate 11 to fix. Like from the 3A and 3B is apparent, is on the bottom plate 11 a porous material 12 provided, which is formed by a metal powder or metal mesh with high thermal conductivity. The porous material may also be made by an inorganic material such as ceramic powder. The porous material forms vapor channels 121 that like in 5A an arcuate cross-section, as in 5B a rectangular cross-section, as in 5C an oval cross-section, as in 5D have a round cross-section, a honeycomb-shaped cross section, a polygonal cross section or another geometric cross section (not shown).

Like from the 6A and 6B can be seen, the upper lid 13 inside a partition plate 134 and on the top an opening 133 for evacuating or filling the working medium. The opening can be connected to a pipe which is connected at the other end to a vacuum pump and the working medium container. After filling the working medium and evacuating the tube is cut and sealed by soldering ( 2 ). Therefore, the tube is in 6 not shown. The filling of the working medium is known and will therefore not be described in detail here. The upper lid 13 has a liquid opening on both sides 132 and a steam opening 131 on. How out 3A it can be seen is between the partition plate 134 and the liquid opening 132 a refill chamber 135 and between the partition plate 134 and the steam opening 131 a vapor collection chamber 136 formed, whereby the working medium in the evaporator can flow only in one direction. The steam pipe 2 is at the two ends with the steam opening 131 the top lid of the flat evaporator and one side of the condenser 4 connected. The liquid pipe 3 is at the two ends with the liquid opening 132 and the other side of the capacitor 4 connected.

• (1) Bereitstellung des porösen Materials: das poröse Material 12 kann durch ein Metallpulver oder Metallnetz mit hoher Wärmeleitfähigkeit oder ein anorganisches Material, wie Keramikpulver, hergestellt werden. Wie aus 5 ersichtlich ist, bildet das poröse Material Dampfkanäle 121. Wenn das poröse Material 12 aus Metallpulver hergestellt ist, kann es durch ein separates Sintern erhalten werden oder direkt auf der Bodenplatte gesintert werden. Beim Sintern werden ein Formwerkzeug und ein Dorn 8 verwendet, um die Dampfkanäle 121 zu bilden. Das Formwerkzeug und der Dorn können aus Hochtemperaturgraphit, Hochtemperaturkeramik oder Kohlenstoffstahl hergestellt werden. Wie aus 5E ersichtlich ist, werden die Dorne 8 und das Formwerkzeug miteinander kombiniert. Das Formwerkzeug umfaßt eine Unterplatte 71, eine Oberplatte 72 und einen Rahmen 73. Die Unterplatte 71 und die Dorne 8 sind einteilig ausgebildet, wodurch eine Positionierung der Dorne nicht erforderlich ist. Anschließend wird das Pulvermaterial 9 in das Formwerkzeug gefüllt. Danch wird die Oberplatte 72 auf den Rahmen 73 gebracht, so dass das Pulvermaterial den Innenraum des Formwerkzeugs ausfüllt. Schließlich (wie bekanntes Sintern von Wärmerohr) wird das Formwerkzeug in einen Sinterofen gebracht, um das Pulvermaterial zu sintern. Nach der Entfernung des Formwerkzeugs und der Dorne wird das poröse Material erhalten. Das poröse Material kann auch durch mikroelektronische Bearbeitungstechnik, wie standardisiertes Ätzen von porösem Silzium oder mit Nanostab, wie standardisierte Pfeilung-Depositionstechnik, hergestellt werden.
• (2) Bereitstellung des Oberdeckels: der Oberdeckel ist aus Kupfer oder Aluminium oder Halbleitermaterial hergestellt. Wenn der Oberdeckel aus Metall hergestellt ist, kann er durch mechanische Bearbeitung oder Gießen geformt werden. Wenn der Oberdeckel aus Halbleitermaterial hergestellt ist, kann er durch mikroelektronische Bearbeitung geformt werden.
• (3) Bereitstellung der Bodenplatte: die Bodenplatte ist aus Kupfer, Aluminium oder Silizium hergestellt und durch mechanische Bearbeitung, Stanzen, Gießen oder mikroelektronische Bearbeitung geformt.
• (4) Nach der Herstellung des porösen Materials werden der Oberdeckel und die Bodenplatte des Verdampfers miteinander verbunden. Wenn der Oberdeckel und die Bodenplatte aus Metell (wie Kupfer) hergestellt sind, kann das Löten (Weichlöten, Hartlöten oder Diffusionslöten) verwendet werden. Wenn sie aus Halbleitermaterial (wie Silizium) hergestellt sind, kann das Bonden verwendet werden.
• (5) der dadurch erhaltene Verdampfer werden über Rohre durch Löten mit dem Kondensator verbunden. Danach wird das Wärmerohr hergestellt. Dies enthält die Schritte wie Reinigen, Evakuieren, Füllen des Arbeitsmediums und Verschließen.

The following describes the steps of the method for producing the cooling device according to the invention:

• (1) Provision of the porous material: the porous material 12 can be produced by a metal powder or metal net with high thermal conductivity or an inorganic material such as ceramic powder. How out 5 As can be seen, the porous material forms vapor channels 121 , If the porous material 12 Made of metal powder, it can be obtained by a separate sintering or sintered directly on the bottom plate. During sintering, a mold and a mandrel are used 8th used to the steam channels 121 to build. The mold and mandrel can be made of high temperature graphite, high temperature ceramics or carbon steel. How out 5E it can be seen, the spines are 8th and combined the mold with each other. The mold comprises a lower plate 71 , a top plate 72 and a frame 73 , The lower plate 71 and the spines 8th are formed in one piece, whereby a positioning of the mandrels is not required. Subsequently, the powder material 9 filled in the mold. Danch becomes the top plate 72 on the frame 73 brought so that the powder material fills the interior of the mold. Finally, as known heat pipe sintering, the mold is placed in a sintering furnace to sinter the powder material. After removal of the mold and mandrels, the porous material is obtained. The porous material can also be made by microelectronic machining technology, such as standardized etching of porous silicon or nanorod, such as standard sweep deposition technique.
• (2) Provision of upper lid: the upper lid is made of copper or aluminum or semiconductor material. When the upper lid is made of metal, it can be formed by mechanical working or casting. When the upper lid is made of semiconductor material, it can be molded by microelectronic machining.
• (3) Provision of the bottom plate: The bottom plate is made of copper, aluminum or silicon and formed by mechanical working, stamping, casting or microelectronic machining.
• (4) After the production of the porous material, the upper lid and the bottom plate of the evaporator are bonded together. When the top lid and base plate are made of metal (such as copper), brazing (soldering, brazing or diffusion brazing) can be used. When made of semiconductor material (such as silicon), bonding can be used.
• (5) The evaporator obtained thereby is connected to the condenser through pipes by brazing. Thereafter, the heat pipe is made. This includes the steps of cleaning, evacuating, filling the working fluid, and closing.

Of the Condenser and pipes are commercially available.

When used, the bottom plate of the evaporator 1 absorb the heat of the heat source, whereby the working fluid in the evaporator is evaporated. The steam flows out of the evaporator and passes over the steam pipe 2 in the condenser 4 one. The vapor is condensed into the condenser, releasing the heat into the surrounding medium (such as air) of the condenser. The steam is under the support of the fan 5 condensed. The condensate flows through the capillary action (of the porous material in the evaporator) via the liquid tube into the evaporator 1 back. As a result, a cycle of the working medium is formed, so that the heat of the heat source can be continuously dissipated in the ambient air.

The Invention is suitable for computer chip, such as CPU and GPU. The invention is also suitable for light-emitting diode lamp, High performance chip of wireless or wired communication. The invention is even suitable for the heat-generating electronic Components of radar, laser, medical devices or Aeronautics and Space.

The The above description represents only a preferred embodiment of the invention and should not be used as a definition of boundaries and serve the scope of the invention. All equivalent changes and modifications are within the scope of this invention.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - CN 01259718 [0005]
• - CN 20080028106 [0005]

Claims (17)

Cooling device consisting of an evaporator ( 1 ), a steam pipe ( 2 ), a liquid pipe ( 3 ) and a capacitor ( 4 ), characterized in that the evaporator ( 1 ) is a flat evaporator and a main body and at least one porous material ( 12 ), wherein the main body has a receiving space for the porous material ( 12 ) and at the two sides each having an opening which is connected to the steam pipe ( 2 ) and the liquid tube ( 3 ) and wherein the porous material ( 12 ) Steam channels ( 121 ). Cooling device according to claim 1, characterized in that the main body has a bottom plate ( 11 ) and an upper lid ( 13 ) having. Cooling device according to claim 2, characterized characterized in that the bottom plate on the underside of a plane surface has, which can rest on a chip. Cooling device according to claim 2, characterized in that the bottom plate ( 11 ) on the top a projection ( 111 ) forms the porous material ( 12 ) on the bottom plate ( 11 ) to fix. Cooling device according to claim 1, characterized in that the main body at both sides of a steam opening ( 131 ) and a liquid opening ( 132 ) having. Cooling device according to claim 1, characterized in that on one side of the condenser ( 4 ) a fan ( 5 ) is arranged. Cooling device according to claim 2 or 5, characterized in that the upper cover ( 13 ) inside a separating plate ( 134 ), wherein between the partition plate ( 134 ) and the liquid opening ( 132 ) a refill chamber ( 135 ) and between the separating plate ( 134 ) and the steam opening ( 131 ) a vapor collection chamber ( 136 ) is formed. Cooling device according to claim 1 or 2, characterized in that the upper cover ( 13 ) of the evaporator ( 1 ) on top of an opening ( 133 ) for evacuating or filling the working medium has. Cooling device according to claim 7, characterized in that the upper cover ( 13 ) of the evaporator ( 1 ) on top of an opening ( 133 ) for evacuating or filling the working medium has. Cooling device according to claim 1, characterized in that the flat evaporator ( 1 ) has a rectangular, polygonal or other geometric shape. Cooling device according to claim 1, characterized in that the steam channels ( 121 ) have an arcuate, rectangular, oval, round, honeycomb, polygonal cross section or another geometric cross section. A method of manufacturing the cooling apparatus, comprising the steps of: (1) providing the porous material: the porous material ( 12 ) can be produced by a metal powder with high thermal conductivity or a ceramic powder; when the porous material ( 12 ) is made of metal powder, it can be obtained by a separate sintering or sintered directly on the bottom plate; during sintering, a mold for the sintering powder and a mandrel ( 8th ) for the steam channels ( 121 ) of the porous material ( 12 ) used; the mold with the sintered powder is placed in a sintering furnace; after removal of the mold and mandrels, the porous material is obtained; (2) provision of the upper lid: the upper lid is made of metal or semiconductor material; when the upper lid is made of metal, it can be formed by mechanical working or casting; if the top cover is made of semiconductor material, it can be formed by microelectronic machining; (3) provision of the bottom plate: the bottom plate is made of copper, aluminum or silicon and formed by mechanical working, stamping, casting or microelectronic machining; (4) after the production of the porous material, the upper lid and the bottom plate of the evaporator are bonded together; if the top cover and bottom plate are made of metal (such as copper), soldering can be used; if made of semiconductor material, bonding can be used; (5) the evaporator obtained thereby is connected to the condenser via pipes; then the heat pipe is made; this includes the steps of cleaning, evacuating, filling the working fluid and closing. Method according to claim 12, characterized in that in step ( 1 ) the porous material ( 12 ) can be made of metal mesh. Method according to claim 12, characterized in that in step ( 1 ) the porous material ( 12 ) can be produced by microelectronic processing technology or with nanostab. Method according to claim 12, characterized in that in step ( 1 ) the mold and the mandrel ( 8th ) made of high temperature graphite, high temperature ceramics or carbon steel can be. Method according to claim 12, characterized in that that the top cover and the bottom plate of a same or different metal can be produced. Method according to claim 14, characterized in that that the electronic machining technique is a standardized etching of semiconductor material and that can be made with nanostab may be a standard sweep deposition technique.