DE10040397A1 - Process controller e.g. for semiconductor manufacture, selects item to be processed from number of items based on performance of processing device evaluated by evaluation unit and characteristics of items - Google Patents

Abstract

The process controller has an evaluation unit for evaluating the performance of a processing device based on the processing result for the product processed by the device. An item selection unit selects an item to be processed from a number of items based on the performance of the processing device evaluated by the evaluation unit and the characteristics of the items.

Description

The present invention relates generally to a pro zeßcontrollereinrichtung, which is a process device, which a processing object (hereinafter referred to as a product) processed in one step to produce semi-lead or liquid crystal display devices controls. In particular, the present invention relates to a process control device that has an ultramicrofa application with high accuracy through real-time evaluation of the Performance of the process device, which during a ver work changes, enables.

Are different semiconductor devices such as DRAMs through a process facility during the manufacture of the same works, the process result often shows great fluctuation because the required accuracy of the microfabrication used cation is almost equal to the accuracy range thereof. There is a variation in the results of the microfabrication on, the performance of the semiconductor chips on a wafer, who has been exposed to this processing deteriorates his. However, the deterioration in performance is not recognized sooner  until the semiconductor chip is tested. To this pro To solve the problem, a proposal is disclosed in which automa table a sort of process by any process facility is carried out in every process step is recorded. Simulations of foreign atom implantation and shaping and a simulation of the semiconductor chip, based on the taken data, are carried out and an optimal produc tion condition, based on the simulation result is found and a recipe for subsequent steps is automa created table (in Japanese Patent Laid-Open No. 63-249328). With this technique, if an unsuitable one Process during the manufacture of the semiconductor chip before Completion is carried out, a healing process leads to a deterioration in performance after prevent the following step.

In some cases, though the process is controlled automatically is an additional control manually based on the of a test performed after the process. Therefore, control becomes an unforeseen factor influenced, which is attributed to the manual control will, and it is particularly difficult to get an optimization tax tion or a high-precision control that a plurality of Steps to get. To solve this problem, the following proposal has been made (in Japanese Of Publication No. 60-200301). The proposed path is aimed depends on a series of manufacturing processes be created by connecting each process step in the semiconductor manufacturing process with a measuring step and Performing control such as B. an adaptive controller or a feedforward control (FF) in each process step based on data obtained during the measurement step were held. In addition, there are process steps before and after the process step made controllable due to the during the Measurement step received data or a design value. With the This technology is the control of each process step au automated and the optimization control, which the majority  that covers process steps is made possible. As a result high-precision control and therefore an improvement in Yield can be achieved.

Lately has been improving production efficiency A production line has often been designed in such a way that a plurality of process devices arranged in parallel in a process step are included. The proposal reveals that if the majority of the facilities are parallel to each other which are arranged in such a production line, in more should be used as a process step, so a lot by the same device (Japanese patent disclosure Font No. 6-168865). After that, each of the Lots through the same facility in different process edited steps, creating a desirable character stik can be obtained.

The semiconductor devices have been miniaturized continuously and the size of the manufacturing facilities is increasing for the purpose of sen production costs. The process condition is set to subtly controlled in every process step to the Ultra to achieve microfabrication with high precision, while that Balance is maintained by various factors. The Change a process condition of such a process device is accompanied by a risk in which a deterioration generation factor, which is a side effect of the changes can be considered. In addition, the lei changes process equipment with a certain tendency, wuh All processing is carried out even if the Process condition does not change. As the degree progresses miniaturization, this change becomes a problem. Should the process condition change out of necessity be changed, the change must be made with regard to the lei fluctuation of the process device are carried out. If not, the process result will not reach the target value enough or will not be very close to the target.  

Furthermore, even if the same process equipment for it ge was made to be used for a lot, it is with ultra-microfabrication with high precision, as with the ge current manufacture of semiconductor devices, not sufficient if the majority of the Pro metering devices in more than one different process step as described above (Japanese Patent Laid-Open No. 6-168865). It is not obvious whether using the same process equipment for a lot is optimal or not in ultramicrofabrication. A be preferred result can be obtained by ver different process facilities can be used for one lot. Therefore, the control technology can only be described according to the above concept does not imply the need for the current trend satisfy in ultra-microfabrication.

The object of the present invention is therefore a pro provide control device capable of perform microfabrication with high accuracy, oh ne to take the risk that a process condition changes is and is capable of a microfabrication with high Ge to perform accuracy while the process condition only is changed when it is necessary. Furthermore, the present invention, the process control device with Fle Provide flexibility to match the process condition for each pro product that forms an item to change and an item choice to perform and the process condition based only on change an event according to a kind of process.

If the whole product as described above, as a unit as viewed in the process known to the applicant, so is due to the progress of microfabrication Semiconductor devices only a small section in one Target range and the yield may decrease under certain circumstances men. Therefore, with the present invention, one finally  Process control device provided which is a size re yield by dividing the product into a plurality of Be ensures that an event (characteristic) the basis of sections.

The process control device according to one aspect of the present The present invention is a process control device for a Process device, which un in a plurality of lots processed product processed. The process control device device includes a process device evaluation unit which the performance of the process device based on a process result nis evaluates the product by the process facility was processed, and a lot selection unit to ver working lot from the majority of the lots due to the lei stung of the process device by the Prozesseinrich tion evaluation unit was evaluated, and the characteristics to select the majority of the lots.

With this structure, the process device can have an item which is currently the most suitable for the facility select the majority of the items. After the item selection ver the processing device operates the item according to a predetermined process condition. Although the process condition na can be changed at this point in time, so the Changing the process condition has an unforeseen effect cause and a risk of improper processing the result in ultra-microfabrication. A wish Valuable result very close to the target value can be obtained from one Processing without the risk described above the one in which processing without changing the process condition is executed and a processing device has a lot a certain characteristic to the tendency of the Performance of the processing facility, depending on the target gives way to balance. For example, if you look at the case in which an etching process is to be controlled and an etching device is to be used, which is currently a faster etching rate  the width of a pattern than the average value. Then a lot with a paint sample interval that is narrower than a target value from the majority of the items selected. If the etching device is in a state as above is used, an overetch is ver causes. Will the lot have a narrow lacquer sample interval edited with this facility, so the resulting However, run a width very close to the target value point.

The condition (performance) of the etching device is checked during a test product after processing by the et device was carried out, measured. In the course of the ver work and with increasing number of completed processes new measured values from an event storage unit given. The processing device evaluation unit directs usually a changing average of a few of the newly recorded data and updates the facility performance so that the last facility performance again is given. Alternatively, only a last data value can be used be used.

The concept of executing a control in which an opti paint lot regarding the condition of the facility just before the processing is selected, there was in the prior art Not. By using this control concept, the Target value or a value very close to the target value the processing is obtained without taking any risk, that an unforeseen deterioration factor he is witnessed that the change in the control condition is written. In this way, the yield by Be limitation of fluctuations in the lot characteristics be improved. In addition, the reliability of the ul Ceramic manufacturing improved and compared to the case in which the control unit of the present invention does not Ultramicrofabrication can be used at a higher level  Level with a device known to the applicant be managed without the need to set up a new facility to acquire a large capital investment.

The process control device according to one aspect as above also includes an event memory unit to save an event, the event being the same information regarding the process result of the pro product processed by the process device is the event being the characteristics of the majority of the lots includes.

With this structure, the comparison of process results the majority of the process steps are simplified and the improvements Process control becomes both qualitative and quan titative enables. While the information regarding the Select process result of each process step together rend between the process steps , it can also be used for other production lines are simply executed. The event storage device can from a characteristic memory unit, the Meßda ten stores, and a process step storage unit, the ei ne process condition is saved independently that are preferred for sorting out the enormous Da quantities is available. The event mentioned above includes here except the process / test condition or the pro test / test result the following events in an ordinary step.

• a) Monitoring the test data: the process is based a unit of one hundred wafers (four lots, each of which of which contains 25 wafers), such as in one Diffusion process step, so three dummy wafers become the above ren, middle or lower position added. To this 103 wafers are processed. A batch number is for the diffusion process in connection with the numbers of 4 lots  assigned. The measurement of the wafer thickness is only made on three Dummy wafers performed. According to the batch number of the Diffusion process and according to the lot number of the four Loose the thickness of three dummies as the process result added. In this way, the process data steps that were not performed on the lot number base which, of course, can be used as an event of the lot.
• b) Data of the photolithographic reissue lot: After the alignment of a mask after the paint application becomes a sample dimension in the photolithographic process measured. Is the resumption of the process based on wafers necessary, so these wafers are collected and the reopened is carried out together. First there is a revival Assigned lot number and the applied varnish is removed distant. The varnish is applied again and the photolithogra phical process is carried out. The wafer is after this Process combined with parental holdings (other lots) and the subsequent process together with the parental lot exposed. As an event of a wafer, which a how the lot number in the photolithographic step an event should indicate a process condition the resumption in the photolithographic process step be included. In fact, the process condition for resumed. Hence process control for the wafer that has been exposed to resumption is, based on the process condition of the resumption leads.

If the process control device of the present inven as described above in the resume process step used for the re-entry lots that consist of a product which is subject to resumption, the Recovery process using the data from the previous taken step, collected by the parental lots were controlled. In this way, the process control device  of the present invention applicable to the Processing facility involved in the resumption process step of the re-entry lots that are best from one product hen that is subject to resumption is used.

The process control device according to one aspect as above described, can furthermore a lot characteristic derivation unit include the characteristics of a plurality the lots from the event of a step before the process step.

With this structure, the characteristics of the majority the lots, which are the same as the processing objects, are suitable are derived as numerical values. Becomes the Example a target value of an event from a previous one taken as the reference value of the lot, the Lot characteristic derivation unit derive a final value that represents a final value, which depends on the reference value varies by the value of the event. In addition, the Machining device evaluation unit described above Institution and presents it as an institution with one Reference value that produces a result value that starts with matches the target value from the previous event received product. Then the Bear processing device evaluation unit an instrument deviation derive the level of the device represents power depending on the value around the reference value varies. Furthermore, the lot selection unit can be a lot select the quotient or the product between the Final value and the instrument deviation coefficient, which is close to the quotient or product between the reference values of the final values and the instrument deviation coefficient. With this structure you can use the last object-related, numerical data an automatic lot selection. In some varieties of The process result is based on a process step  positive dimension, which is equal to a dimension one after the Process is lagging section, or a negative Dimension that is equal to a dimension one through the process removed section is evaluated. The evaluation value that based on the positive dimension and the evaluation value, the based on the negative dimension are roughly the reverse proportional to each other. Both the final value as well the instrument deviation coefficient from the positive dimension solution to make the lot selection, so the Lot selection based on the quotient mentioned above guided. If the device status is based on the nega tive dimension evaluated, the lot selection is based performed on the product mentioned above.

Here the lot characteristics do not only contain a character teristik, a dimension or the like of a product that was obtained from a plurality of test steps, but also a processing device, which in a plurality of previous steps was used, a process condition material, etc. and a characteristic which the reflects the characteristics listed above. Similar ones So the performance of the facility is equal to the characteristics stiken of a product manufactured by the processing facility in a plurality of previous and applied ones Steps have been processed or equal to a characteristic, that reflects the same thing. In this description "Information regarding the process result", "event", "Performance", "characteristics" and "condition" occasionally ver uses to point out the same thing. Will the performance of the Established by an index based on a calculation with the original data is obtained, and not the original data represented itself, a value is calculated with an optional event in a range of one taken step up to the current position in egg received in the subsequent step.  

The process control device according to one aspect as above comprises a reference information storage unit, wherein the reference information storage unit information regarding a method for controlling the lots in the pro zeß, a condition for changing a process condition and whether Data related to the process is in the event memory should be collected, saved.

With the structure described above, the process control tion device of the present invention a central Ab cut the controller, such as (a) storing the collected data, (b) selection of an optimal process condition and (c) choosing an optimal facility, etc., as an un dependent system formed. Therefore, the process control device of the present invention in another FA system can be installed and the versatility is ver improves. During the process of controlling the machining facilities, such as a separator and an etching device differ from each other, so is the arrangement of a device control port for respective units in the process control device for the integrated control desirable.

The process control device according to one aspect of the present ing invention, the reference information storage unit includes a process condition changing unit maintain the process condition of a machining facility on a lot basis according to a relationship between a service ner equipment and a characteristic of a lot changes.

There are cases where a desirable result is not only due to the selection of suitable lots for the furnishing can be expected at the time of processing, or a power failure is expected due to the out Choice of the device so that the ready state of the on direction will be minimized. In such cases there will be process conditions  of the respective facilities changed. Will the Change the process condition as in the cases mentioned above needed, it is expected that the lot characteristics sooner be improved than be deteriorated. As a result, the Achieve a result equal to or near the process Target value is while a high work rate of the facility tion is maintained. In some cases there is no sub differed in the tendency among the institutions. In one In such a case, the process condition is changed to one process Get result that is equal to or near the target worth lies. As a result, the accuracy of the microfa brication can be improved.

The process condition is set in each processing device based on a regulation code that corresponds to a regulation, which defines a number of conditions of the process flow, or a condition parameter regarding a changeable Ren process factor of the process flow in accordance with the Condition setting scheme of each unit set. There ago the process condition change unit changes the previous one Font code or the process parameters of the facility according to the condition setting scheme of each facility.

Include the process control device in one aspect Lich the reference information storage unit can also Product control change unit include a process product-based condition for the machining facility that each product edited to change according to a relationship between the characteristics of the product that forms the lot, and the performance of the machining equipment.

As the level of microfabrication increases, the target accuracy in many process steps by the control Lot base unreachable. In such a process step the Control based on a product that forms the lot, carried out. By adapting such a product control unit  the fluctuation of the lots is reduced and the pro zeßgenauigkeit can with the same device on higher Level can be achieved. It is possible to run a process under Ver application of this product control unit with the same process conditions for all products that make up the lot ren.

The process control device according to one aspect as above described, including the reference information storage can also be a simplified control unit include either a lot selection and a change of Process condition on a lot basis or both in processing Setup only according to the lot characteristics.

With this structure, the lot or the process can be selected condition can easily be set in which a facility which was used in a previous step, a Ma material, a process condition (regulation, process code) without for example, the performance of the facility or the like forward, is checked. Alternatively, the characteristic be classified in the previous step and the Process condition (regulation, process code) can be according to this Classification can be set. One step to the end Managing a simplified process is the type of tax insufficient. In this way, the setting of Process condition is simplified and the occurrence of errors decreased.

The process control device according to one aspect as above described, including the reference information storage The unit can also simplify product control change change unit to include the process condition Change product base, only in accordance with the Product characteristics for the machining device, each edited the product.  

With this structure, the process condition can be easily understood These are only changed in accordance with the product list characteristics and without evaluating the performance of the facility shortly before the process even if the process conditions is changed on a product basis.

The process control device according to one aspect as above a device selection unit may also be described to order for a plurality of the Bear arranged in parallel processing facilities that are similar in the process step select a processing device to process one lot from the majority of the processing facilities edit in accordance with the characteristics of the processing lots and the performance of the majority of the parallel arranged processing facilities.

With this structure, an optimal setup for a lot can be made be selected and the machining will be done with high accuracy speed in a process step in which a plurality of facilities with large fluctuations in performance parallel to are arranged one another.

In the process control device according to an aspect such as The process control evaluation unit can be described above furthermore a process device prediction unit sen to the performance of the processing device by means of a Loses whose data is collected by data in the event nis storage unit is not yet among the data of the lots that have already been processed by the processing device are, are stored and a change in the performance of the Be work facility, caused by a drawing process with unsaved data that have been taken into account to predict.

Generally it takes a few hours to a few days until the check after the process in the control step  has been completed. During this period of Processing the lots will take a few hours to a few days continued successively. During this period, a fatter Film are formed during a deposition process according to the number of lots that have been processed or can an etching characteristic changes. That way changes the performance of the facility over time. More conventional wise one has dealt with the problem of changing the device performance concentrated over time. Together with the However, progress in microfabrication has the smallest Change with time with respect to the etching characteristic significant effect on the quality of the product. In the above structure described, the change can take time into account can be viewed and the performance of the facility can shortly before from the beginning of the control step of the lot to be controlled be directed. As a result, microfabrication can be done with high precision and maintain a high yield be.

The process control device according to one aspect as above described, a processing device can furthermore have unit input unit for manual input of the To enable performance of the processing device.

With the manual entry, a service at the time of Update, which is known from experience or a Power entered based on a measured value, if the facility's performance at the time of regular Maintenance or an accident repair is updated. This way, the facility can perform properly at this point in time and the process Result can be achieved so that it is closer to the target value lies. With the addition of a unit that allows manual entry allowed, the process control can be carried out during it deals with any situation appropriately.  In this way, the improvement in yield and of productivity can be achieved.

A process control device according to another aspect the present invention is equivalent to process control device which is a processing device which is a pro product processed, controls. The process control device around holds an event storage unit to match events appropriate areas, with the event equal to In Formations with regard to a process result of the product tes, which is processed by the processing device, is; a processing device evaluation unit to the Lei processing equipment in appropriate areas by means of the event of a previous product that by the processing device in the processing step was processed to evaluate; and a process condition setting unit to a process condition of the machining device according to a relationship between the performance of the processing device in the corresponding areas and events nissen of the product in appropriate areas, such as game that the process result in the process is close to the Target value arrives.

If the processing device, as described above, by Deriving the characteristics of the product for the corresponding Areas controlled so that an even characteristic across the product and a great improvement The yield can be achieved. Described in the above NEN control can, even if the processing device not the function of the process condition setting for ent speaking areas, and the tendency in the process is known by the processing device, a suitable Control condition according to the characteristics of the product in the relevant areas. With other wor only the event derivation and the characteristics Cables for appropriate areas carried out, so can  the process condition according to the tendency of the machining equipment be adjusted and the fluctuation of the product character teristics across the areas can be minimized. Allows the processing device the control condition setting area based, the control condition can be based on Area basis set in the manner described above the. The control condition setting described above can be done on a product or lot basis.

The process control device according to a further aspect, as described above, an adjustment unit, which is based on areas include the process condition to adjust based on area.

By the process condition of the machining device on Be rich basis is set, a Pro product can be obtained with even greater uniformity and the Product value can be increased.

A process control device according to another aspect the present invention is equivalent to process control device for a processing device that a product processed, which is divided into a plurality of lots. The process control device includes an event memory unit to save an event based on area, the event being equal to information regarding one Process result of the product from the processing direction worked is; a processing facility processing unit to provide a performance of the machining device in appropriate areas by means of an event nes evaluating the previous product, which the Be processing device was processed in the process step; and a lot selection unit to select a lot to be processed the majority of the lots according to a relationship between the Er event of the lot and performance in the corresponding areas,  by the processing device evaluation unit the process step was evaluated.

The characteristic tends to be along a set Direction according to an area of the product that the Lot makes to increase. The increase is largely below different from facility to facility. Therefore enables the optimal lot selection based on the performance of the one direction shortly before the process, with the production of wafers uniform characteristic that is equal to the average across is about the product without changing the process condition attributed risk. That way they can good chip products can be obtained in large numbers and the Yield can be, for example, in the chip manufacture of one Wafers can be improved. As a result, the value of the Pro product increased. In addition, the microfabrication process at a higher level through the same facility be performed.

The process control device according to a further aspect, as described above, a lot characteristic may also be used cabling unit to record events of the majority of Loose in appropriate areas from the event in the pro deduce step before the process step.

With this structure, an index for a preferred tax can be The process is derived from a previous event be tested. In this way, the microfabrication with high accuracy.

In the process control device according to the last two Aspects mentioned, as described above, the product is a The semiconductor wafer and the semiconductor wafer can be a plurality be divided by areas.  

In the case of a wafer in which the characteristic converges changes centrally, the change in the characteristic occurs in the most cases on the border of the first and fourth qua area, which is divided by dividing the wafer with a cross, the center of which is at the origin, ge be formed. The way the areas are divided varies depending on the types of machining directions. A suitable shape of the area will depend on the type of processing device determines the events of the appropriate areas are for a suitable tax received, such as a correction of the characters Distribution of statistics on a divisional basis. As a result, the Va Riation of the wafer characteristics minimized and the market value of the wafer can be increased.

The process control device according to the further aspect, such as described above includes a reference information store unit and the reference information storage unit can informa tion on a method of controlling lots in the process, a condition for changing the process condition and whether an event related to the process is collected should save.

With the structure described above, enormous amounts of data can be for the relevant areas together in the above mentioned th storage unit can be stored and if necessary for Time of processing used in each process step become. This way the process can be in any Process step can be integrated as a sentence. Hence the Versatility regardless of the sensitive controls at ho fro precision increased. In addition, the control device in one process step easily and without serious changes be integrated.

The process control device according to the further aspect, such as described above, including the reference information storage unit  can also be a process condition change include the process condition in the machining unit to change the equipment for corresponding lots according to a Be drawing between a performance of the device in the ent speaking areas and the events of the lots in the ent speaking areas.

With the structure described above, the process condition (Regulation code, process parameters, or the like) with a view adjusted to the events in the corresponding areas become. Therefore, the yield and reliability of the Ultra microfabrication can be improved. In addition, the micro manufacturing process at a higher level with the same one direction.

The process control device according to the further aspect of The present invention can also change a product process unit to include the process condition on a product basis to change according to a relationship between a performance of the Establishment in the relevant areas and the character in the corresponding areas of the product that the Lots for the machining facility that the process on Pro Execute product base, forms.

By changing the process condition on a product basis, the fine control can be achieved and the microfabrication on higher level.

The process control device including the reference formation storage unit according to a further aspect, such as Described above may also be simplified control include either batch selection or process Change of conditions on a lot basis in the processing facility only performs according to the lot characteristics of the corresponding the areas or both.  

With the structure described above, a flexible and high-precision control can be carried out easily according to the characteristics of the process step.

The process control device including the reference formation storage unit according to the further aspect, as above described, can also a simplified product tax change change unit that include a process condition Product base only according to the characteristics of the product in ent speaking areas for the processing device changes, which is processed on a product basis.

Most of the process steps to which the process control tion unit of the present invention is applied automated process steps. Therefore, the setting of the Process condition on a product basis almost equal to the change the process condition on a lot basis. As a result, the fine and high-precision microfabrication in a simple way be performed.

The process control device including the reference formation storage unit according to the further aspect, as above described further comprises a change unit on area basis that changes the process condition on a per area basis.

By setting the process condition based on area, it becomes allows the process to be in accordance with the area characteristic significantly improved the product characteristics. In this way, microfabrication can be performed using the existing facility at a higher level without the actual sation of the device known to the applicant become. In the automated process step, the process condition set in a simple manner based on area and microfabrication can be at a higher level simple way without updating the expensive equipment be performed.  

The process control device according to the further aspect, such as A device selection unit may also be described above include, which selects a processing device, the one Lot from a plurality of processing facilities in accordance with the characteristics of the ent speaking areas of the lot to be processed and the lei of the majority of the processing units arranged in parallel directions in appropriate areas regarding the majority number of parallel facilities of the same Sor te in the process step.

While the optimal setup for a lot based on the Data of the corresponding areas can be selected, so the exact facility selection can be carried out.

The process control device according to the further aspect, such as A process device may also be described above predictive unit that include a performance of editing establishment in appropriate areas predicts with regard on data of a product that is not in the event file are saved under products that are listed in Be have been processed, and with regard to the change in performance in every area of machining facility created by editing the product, its Data has not been saved.

In this way, with the structure described above Performance of the facility in relevant areas shortly before be predicted to the process. In addition, the change the process condition for each area and the lot selection below Using the values that are close to the actual lei value are carried out. That way can the reliability of high-precision microfabrication be further increased.  

Further features and advantages of the invention result itself from the description of embodiments of the invention based on the figures. From the figures show:

FIG. 1 shows a structure of a Prozeßsteuerungsein direction according to the first embodiment;

Fig. 2 is a block diagram showing a schematic structure of a process control device shown in Fig. 1;

Fig. 3 is a diagram describing the outline of a process flow;

Fig. 4 is a flow chart of lot introduction;

Fig. 5 shows the data content of a process route designation table;

Fig. 6 is a flowchart for transportation determination selection;

Fig. 7 is a flow chart for lot selection;

Fig. 8 beauty the data content of a Steuerungsschrittta;

Fig. 9 shows the data contents of a table in terms of passing a Losdatensammlung;

FIG. 10 is rod-elle the data content of a device state;

Fig. 11 shows the data content of an FA port input table;

Fig. 12 is a flowchart for processing / test condition determination;

Fig. 13 shows the data content of a chip group;

Fig. 14 shows the data content of a control condition selection table;

FIG. 15 is a flowchart of a machining tung / Prüfstartanweisung;

FIG. 16 is a flowchart of the lung Qualitätsdatensamm;

Fig. 17 shows the data content of a table regarding the transfer of a facility data collection;

FIG. 18 is a flowchart of a Qualitätsüberprü Fung;

FIG. 19 is a flowchart of a process step completion;

Fig. 20 three reference examples if the process condition is changed;

FIG. 21A to 21D, a concept of a Prozeßbedingungseinstel lung Zonal, and Fig. 21A shows an area division of a semiconducting terwafers, Fig. 21B shows the type and Wei se the setting of a process to Be rich base, Fig. 21C shows a vorherge Promised Result of a process and Fig. 21D shows the area-based performance of a processing device whose process condition cannot be set on an area-based basis, but the device has an area-based device characteristic as shown in Fig. 21D and the selection of a lot with a characteristic as shown in Figure 21B is desirable;

Fig. 22, two process steps are shown in the examples;

FIG. 23 is each step with a Oxidfilmtrockenät wetting in a process step of the first example in the middle;

Figure 24 is a section in a phase in which the resist pattern is formed for etching.

FIG. 25 is a section after the etching;

Fig. 26 shows a relationship between the reflectivity and a negative dimension in the second example; and

Fig. 27, the reflectance and a relative negative dimension of each wafer and the variation in the second example.

Now the embodiments of the present invention described with reference to the drawings.

In Fig. 1, a processing device 80 and a test device 90 are controlled by a process control device 1 of the present invention. A production line to which the above-mentioned system control unit is applied is a semiconductor wafer processing line. Therefore, the processing device includes processing devices which carry out photolithographic, diffusion, ion implantation and etching processes or the like.

The process control device 1 comprises an FA computer 2 , a quality control server 3 connected to the FA computer, device control connections 75 , a reference information storage unit 4 , a storage unit for the recorded data 5 and a connection input device 6 . A process condition setting scheme is different in each of the processors, and is generally classified into two schemes, that is, a regulation code determination scheme and a scheme for setting the process parameters. According to the regulation code determination scheme, a series of processes in a machining device is defined and specified as a regulation. The user can perform a series of processes according to a regulation code by determining the regulation code. With the scheme for setting the process parameters, a process parameter that has a significant effect on the result of a series of processes can be set in a processing device.

In the reference information storage unit 4 , information such as a process condition relating to a process flow to be used by each processing device is stored in accordance with each of the chip names representing a product type of a lot. The information related to the process flow includes setting a process step, a process method in the process step (whether to use a product control unit, a simplified control unit, for example) and a regulation code or a process parameter according to the process condition setting scheme for each machining device. In addition, a determination of events of a plurality of previous steps or an event of a single, previous step to be used in the lot characteristic deriving unit and a determination of events which are in the range from a previous step to a subsequent step are is to be used in the processing direction evaluation unit. In addition, a device from the previous step, a process condition, a suitable device for use in a control step with respect to a characteristic area, a relationship between a lot characteristic, a device performance at the time of the process condition change, etc., is previously set and in the reference information storage unit 4 saved. Furthermore, a result of a process step to be stored in the collective data storage unit or the like is determined.

The collective data storage unit 5 can collect and store product characteristic data of any process step along the entire production line. As an example of the product characteristic data, a result of the measurement obtained in one test step can be referred to. By providing storage devices such as egg ner QC (quality control) data storage unit, for example, the following data in such a unit be chert vomit or alternatively, they can be stored together with the Product characteristic data in the collected data storage unit. 5 The data such as the lot number to which the product belongs, a number of the processing device and a test device that actually carried out a process or a test during the entire process steps, a material used in the process, a process condition of a processing device and a Test conditions of a test device are stored in the collective data storage unit 5 according to the embodiment of the present invention. As described above, a regulation code or a process parameter is provided as the process condition in accordance with the condition setting scheme of each of the processing devices.

The terminal input device 6 is used to supply data relating to the performance of the processing device, based on the measured data and the empirical data which will be maintained during the performance update of the processing device during regular maintenance or the like.

The device control port 75 is provided to enable integrated processing of various signals, which are different in each processing device, and to use many processing devices from different manufacturers in an integrated manner. In this embodiment, although the process control device does not include transportation determination devices, the process control device may include the transport determination devices.

With reference to FIG. 2, the Loseinführungseinheit 11 allows a lot, a lot number (Prozeßroutenkennzeichung) and data relating to the process flow of the Referenzinformationsspei chereinheit 4 to accept based on a Produktsortenna men (Chip name) of the imported batch. The transport determination unit 12 determines a facility in which the lot is to be processed based on the lot number and the process flow, and searches and identifies a storage cabinet (rack) for the facility which is the same as the transportation destination. The lot characteristic deriving unit 13 reads out a valid previous event (characteristic) from the collective data storage unit 5 for a particular control step based on a file that determines an instruction stored in the reference information storage unit 4 regarding a control step and derives a final value by performing a necessary calculation which is equal to a lot characteristic. Furthermore, if a simplified control device (not shown) is to be used, although not shown in the figures, the simplified control device may include a process condition (including a kind of material) in the previous step or a processing device number from the collective data storage unit 5 recall. In addition, the processing device evaluation unit 14 reads out characteristics of the results of the previous and subsequent processes of the process step from the collective data storage unit 5 based on a file name stored in the reference information storage unit, and calculates and derives an instrument deviation coefficient which is the performance of the device at the beginning of the process. The optimal lot selection unit 15 calculates a facility selection coefficient based on the lot characteristic and facility performance as described above, and selects a lot that is most suitable for the machining device at the time of processing to obtain a target process result. In addition, the process condition changing unit 16 changes the process condition based on the numerical values as described above when the change in the process condition stored in the reference information storage unit 4 is needed. The processing / test control unit 17 controls the process of the device and tests and evaluates the process result based on the process condition. When the process and the test are finished, the quality data collection unit 18 stores a test result, etc. in the collective data storage unit 5 based on the designation in the reference information. Furthermore, the changed process condition is collected and stored in the collective data storage unit 5 . Even if the change is not made, the actually used process condition is stored in the collective data storage unit 5 .

Then the method for controlling the process step according to the lot flow is described. According to the process control device of the present invention, an optional step can be selected as an object step of the controller. With reference to Fig. 3, a product type (name of the product) is designated at the batch introduction (M1). Thereafter, while the determination is being carried out, the control is performed on (a) whether the control is to be carried out, (b) what kind of control is to be carried out and (c) whether an event collection is to be carried out, etc. according to a control method at each step of the Process flow, which was set when the lot was introduced. If the control is to be carried out in the step, the control is carried out according to each of the steps M1-M8 shown in FIG. 3.

With reference to FIG. 4, a chip name (product type) is determined and a lot is introduced (S1), and an SPW (process route identifier T1) is recorded in accordance with the chip name (S2). The chip name and the number of the process route identification are shown on the SPW (process route identification). In the flowcharts described below, the data content to be processed is shown for each step next to the process description. Next, a process route designation table T2 corresponding to this process route designation number is read, and information regarding the next step is recorded (S3). Then, based on the information regarding the next step, a destination of the lot is selected (S4). Referring to Fig. 5, a group of devices used for the relay control step, a method of calculating the characteristics of the devices, and a data collection step necessary for the calculation are shown. The process route identification number and a serial number are not shown. Referring to Fig. 6, after starting the transportation destination search (S5), searching for the next step (S6), the group of facilities shown in the process route designation table is identified. Although in the first embodiment the transport designation devices are installed in another device, they can of course also be included in this process control device. The lot is not transported directly to the group of facilities. The lot is temporarily stored in a standby state in the rack (storage cabinet) which is arranged in a furnishing area. After the group of devices for the next step has been identified, the storage cabinet for the next step is sought (S7). First, a facility group table T3, which is a sub-table of the process route designation table, is selected as a search object. After the device to be processed is identified, a device table T4 is searched for this device and a storage cabinet is identified for this device. Thereafter, the process proceeds from a device S8 to a lot selection. Lot selection from the facility is a control mode to increase the facility's clock rate. In addition, there is another control mode, a lot priority mode, in which a machining device is preferably selected based on the lot characteristic. Information as to whether the lot selection is to be carried out by a processing device or not is contained in the reference information beforehand.

Referring to Fig. 7, a plurality of lots are placed in a standby state in the storage cabinet when the lot selection is to be carried out. First, the process route designation table is read and it is determined whether the further taxation is to be carried out (S9). When the relaying control is ready for execution, the facility performance is derived from a current lot (previous lot) (S12). During the derivation, a chip group name is first identified by a chip group T9. Based on this chip group name, a control step table T5, a forwarding lot data collection table T6 and a standard parameter table T7 are read. In the transfer lot data collection table as described above, product characteristics or final values of a plurality of lots waiting to be processed are also stored. In FIGS. 8 to 10 are shown the data contents Steuerungsschrittabelle T5, T6 of the Weitergabelosdatensammeltabel le and a device status table T8. In the control step table of Fig. 8, an expression for calculating the final value, which is a specific numerical value and represents the lot characteristic, an expression for updating and calculating the facility condition, a relationship expression for predicting the facility condition from the number of previous lots whose data have not been saved are saved. In addition, as shown in Fig. 9, in the transfer lot data collection table, a name of the step in which the collection is performed, a device that executed the process, a kind of event data, a registration date for the collection data storage unit are shown. Furthermore, in the facility status table, a name of a facility to be used in the control step, a method of calculating an instrument deviation coefficient, which is a specific example and shows the state of the facility, are stored while the influence of the previous lot, the Data that has not been saved is taken into account. Furthermore, as shown in Fig. 10, a date for the update is set and stored while the data is updated and a new event is stored. In Fig. 7, if there is no previous current lot, the setup state is derived from a measurement such as a dummy (S13). The measurement data can be manually entered into a FA port input table T8 from a port input device 6 . As shown in Fig. 11, an etching rate, etc. of the machining device can be manually entered in the FA port input table. With reference to FIG. 7, the facility state and the lot characteristic (final value) are then compared, and an optimal lot for the facility is selected from lots that are in the standby state in the storage cabinet (S14). In the lot selection, data stored in the facility status table and the relay lot data collection table is read. With this selection, the standby time and the lot are not taken into account. A lot that is optimal for the set-up state at that time is processed in turn, and each of the remaining lots is selected and processed according to its suitability for the standby state, which changes as the process progresses. While the process is being carried out for all lots, the process condition is changed for a lot whose processing requires a change in the process condition and the process is carried out. In a mode in which a machining device is selected based on the lot, the process is ended at a certain step. A characteristic of a process result is determined by a check, and the process device is selected if the characteristic is within a predetermined area determined by the reference information, and is transported to a processing device identified by the characteristic in the area is, and the process is carried out in the processing device. In one step, if the goal is a device selection, in most cases, the change in the device state with time of each of the machining devices is insignificant and fluctuations in the device states of the machining devices are large. If the facility selection is not made based on the lot and the lot is processed in a processing facility without the handover control determined by the process route designation table, the lot selection is performed according to the priority of the lot (S10) and the process proceeds to processing - / determination of test conditions (S15).

Next, a process condition and a test condition for the machining device and the associated lot selected as described above are determined. In Fig. 12, a process flow for determining the process condition and the test condition is shown. After the process condition search starts, it is determined whether the relay control is to be carried out (S16). This determination is shown in the process route identification table. If the setting is already finished when the process route designation table is read, the relay control is carried out. If the setting has been made (YES), the chip group T9, which defines the product type, is read. After identifying the chip group to which the lot belongs, a control method to be applied to the chip group, which is set in a control condition selection table T10, is identified. In Figs. 13 and 14 the content of the data in the chip group and the Steuerungsbedingungauswahlta are shown beauty. The names of the chips are shown in the chip group, and information such as that of a control step, a device, and a selection ID required for changing the process condition are stored in the control condition selection table corresponding to the chip name group. After that, a control condition is selected according to each of the control methods. By selecting the selection ID, a combination of control step table T5 and another table is determined and the control condition is set (S18). In other words, by the combination of control step table T5 and one of the following, such as a control condition table T11 containing a loend value, a control condition table T12 containing a previous step control code, a control condition table T13 containing a previous step parameter, and one Control code parameter table T14 set the control condition. The process is then interrupted until the instruction that processing / testing should begin is received. On the other hand, if the relay control is not performed, the control condition is selected in accordance with a normal sequence determined in the reference information (S19). Upon selection, the control condition selection table T10 stored in the reference information storage unit is read and the control condition is selected. The process is then interrupted until the instruction is received that processing / testing should begin, as in the case of the transfer control.

Fig. 15 shows a flow chart of the processing / testing. After the start of the processing / checking instruction, the process condition determined as described above is passed to the facility (S22). After that, the processing and testing for the lot is carried out and the quality data obtained from the testing is collected. As shown in Fig. 16, in the place "process data collection from a device (S25)", a lot number, a name of a processing device, a material, a process condition, a process parameter, a test condition, etc., which is collect data in the transfer lot data collection table T6 are listed, entered. Thereafter, it is determined whether the data collection for the transfer control should be carried out (S26). If data from the processing / testing, as described above, are to be used in the transfer control, then data relating to the processing / testing, as described above, are stored in the collective data storage unit 5 . The instruction is described in the relay control section of the process route designation table which is the same as the reference information. If the data collection is to be carried out, the data collection for the transfer is carried out (S27) and the data, as described above, are stored in the transfer lot data collection table T6. The data to be stored include, for example, a step for collecting, a name of a processing device, a process condition, a process parameter corresponding to each of the lot names. Various measurement results that are obtained as process results, who added the. In addition (a), surveillance check data is recorded in a process step in which a process is not performed on every lot number basis according to the lot number. For example, one hundred wafers (composed of four lots, each containing 25 wafers) are processed as one unit as in the diffusion process step, and three dummy wafers are added to the upper, middle and lower positions, and a total of 103 wafers are processed . In the diffusion process, a batch number associated with the numbers of the four lots is assigned. The thickness measurement of the wafers is only carried out for three dummy wafers. According to the batch number in the diffusion process, the thickness dimensions of the three dummies are recorded as the process result. The dimensions of the thicknesses are also recorded according to the four lot numbers. In this way, of course, data is recorded in the process step in which the process is not carried out on the lot number basis and made available for controlling the lot selection or the like. In addition, in the case (b), data such as resume lots of the photolithography, the event of an actual process corresponding to the wafer are recorded and used for the control. If a wafer-based resumption is required as a result of the measurement of the pattern dimensions, which is preceded by the lacquer application and mask alignment, wafers to be reprocessed are collected in the photo-lithographic process and exposed to the process together. The wafers to be reprocessed are collected and a resumption lot number is assigned to them. Then the previously applied paint is removed and a new paint is applied again. The photolithographic process is carried out in this way. After reprocessing, the wafers are combined with the parental inventory (lots) and processed together with the parental lots. Regarding an event of the wafers to which the resume lot number is assigned in the photolithographic step, a process condition on the resume should be included as an event. In fact, the process condition is resumed upon resumption. Therefore, the process control for the wafers that have been processed again is performed on the basis of the process condition at the resumption.

If the process control device of the present inven on the resumption process step for the resumption melos, consisting of the products to be reprocessed, can be applied, the resumption process under Ver application of the collective data from the previous step controlled by the parental lots. The process control device of the present invention is of course applicable to a processing device that in the resumption process step for the resumption lots, consisting of the products to be reprocessed becomes.

The relay device data collection table T16 stores a process step, a process lot and a process condition corresponding to each name of the machining device. Fig. 17 shows the data content of the relay data collection table. A quality control is then carried out. If the data collection for the transfer control is not to be carried out, the quality control is carried out immediately.

As shown in Fig. 18, a standard control is performed after the start of the quality control (S29). In the standard control, a standard is read and checked from the standard table. After that, various controls are carried out and a step completion process is carried out. As shown in Fig. 19, a next step is searched after the step ending process starts (S33). In the search for the next step, a process route designation table identifying a process route designation number is read, and a serial number, a step, and a facility group are identified. Then the original data is updated and the transportation destination selection is carried out (S35).

In case 1 , as shown in Fig. 20, the regulation code, which is equal to a process condition, is changed based on the final value of the lot and the facility performance (instrument deviation coefficient). In case 2 , the regulation code is changed based only on the final value of the lot. In case 3 , the regulation of the process step is changed, based on the regulation that was used in the previous step. Each of the relationships as described above, which are noted when the process condition changes, is stored in the reference information storage unit as the reference information.

In which the process control device described above ver is applied, the transfer tax with respect to the Lot characteristics performed and the feedback is with Regarding the processing device performed. To this Ways can vary in the process of the control step be limited. In addition, a suitable machining tion process flexible according to the feature of the process step be used. As a result, control in each of the variable and complex process steps efficiently and a be carried out professionally.

As a result, the yield can be remarkably improved the manufacture of semiconductor devices such as the DRAMs. In addition, a microfabrication process at a higher level than that of the original Target levels are carried out. In other words, with the process control device described above, the microfabrication,  those for 128 Mbyte or 246 Mbyte DRANs or half managerial facilities such as future system LSIs, besides the DRAMs that are needed on the production line designed for 64 Mbyte DRAMs.

In a process control device according to the second embodiment, a structure similar to the process control device shown in FIG. 1 of the first embodiment is used. A major difference is that the measurement data of the product events are recorded for corresponding areas. If a setting of the process device is permitted that is based on areas, the process condition is set on an area basis. If the area-based setting is not permitted, the process condition is set collectively. In FIGS. 21A to 21C is a Kon concept of range condition setting Siert on areas ba is shown. In Fig. 21C, there is shown a concept for a case where a process condition setting based on ranges is not allowed, and the process condition can with the product characteristic and the tendency of the device taken into account by deriving the product characteristic on an area basis has been set, who or the lot selection can be carried out according to the facility trend. If the characteristic is different in a central area and an outer area of the semiconductor wafer as shown by a solid line in Fig. 21A, the control as shown by the broken line in Fig. 21B is performed and the result of the process will be so as shown in Fig. 21C. If the process condition of the machining device is set in accordance with the product characteristic, the product characteristic is derived on a range basis, or if the lot selection is performed in accordance with the machining device, the lot selection is performed when the device performance shows a tendency as shown in Fig. 21D. The lot selection described above can give relatively uniform process results with only small variations across the wafer. To simplify the description, the characteristics shown in the graphs of FIGS. 21A through 21D show, for simplicity, continuous values across the range, although in most cases the graphs would show discrete values instead of the continuous values.

Will the lot characteristics or the furnishing characteristics risks derived on an area basis and the lot selection and the process condition is changed or the process condition is set to Area basis changed, so the probability that the process results across the wafer into a target area fall, bigger. An improvement in yield is therefore achieved and reduced the fluctuations, with the microfabrication on higher level than the target level is made possible.

Next, two examples using the process control device described in the first embodiment will be described. FIG. 22 shows two process steps in which the process control described above is applied. One is a dry etching step of an oxide film (example 1) and the other is a photolithographic step (example 2).

In the dry etching of the first example shown in Fig. 22, a final value of the lot is calculated using the dimension obtained from the inspection after the photolithography as a lot characteristic.

In an oxide film dry etching step as shown in FIG. 23, a dimension obtained by a development test by a scanning electron microscope (SEM) is used as the lot characteristic. A dimension of the CD loss obtained by SEM photographic inspection is used as a device state. The CD loss is defined with reference to FIGS. 24 and 25.

As shown in FIGS . 24 and 25, a dimension A is measured in the development test. Dimension A is a dimension of a portion of paint covering a film that is to be etched in an area that should remain unetched in the dry etch. In the photographic test after the dry etching, a dimension B of a film section to be etched remains unetched during the dry etching and is measured. The CD loss is defined as CD loss = | dimension A in the development test - dimension B in the photographic test |. CD loss and etch rate are correlated in some cases and not in others. In the case of dry etching the oxide film as described above, the correlation between the CD loss and the etching rate has been confirmed. Therefore, CD loss is used as an index of the etch rate. The characteristics of a previous batch processed in an EK 120 facility and used in the oxide film dry etching step are shown in Table 1.

Table 1

The dimensions (in part) determined by the photographic test are obtained in Table 1 corresponding to the lot numbers KA to KG, from top to bottom according to the rows sequence of the processes are shown. The CD losses  are also shown. An average (3L) in Table 1 represents a three-point variable average of the CD Loss. Therefore, the last value is the changeable CD loss average equal to 0.0195 µm, shown in a cell at the bottom of the table. The last value is used as the setup state in lot selection. Who which normalizes the values by making the target values 1 can assume, while the target value of CD loss is equal to 0.02 µm, the performance of the EK 120 device as (0.0195 / 0.02) = 0.9759. The value is 0.9750 a current instrument deviation coefficient of the On direction EK 120.

Ten lots of OA-OJ stand by here in the ready state the process through the EK 120 facility Data from these ten lots shown.

Table 2

Table 2 shows development dimensions (in part) and averages thereof as a result of the photolithography for each lot. The target dimensions of this is equal to 0.25 µm. The average value of each lot is divided by the target value of 0.25 µm, so that the target dimension is represented by a value equal to one by normalization. The final value of each lot can then be found. The final values of the lots are distributed around the value one. The lot is selected with respect to a facility based on a value obtained by dividing the final lot value with the instrument deviation coefficient. The lot with the value closest to one is selected. Therefore, a new index, namely a device selection coefficient = | 1 - (final value / instrument deviation coefficient) | introduced. A lot with a facility selection coefficient that is closest to one is selected as a lot that is being processed by the facility at the time. As the facility states of the remaining lots change as the process progresses, the facility selection coefficients of the remaining lots are calculated each time a lot starts to be processed and the lot with the lowest facility selection coefficient is selected and processed. According to Table 2, the facility selection coefficient of the lot with lot number OA is the lowest. Therefore this lot is selected and processed. In the description of the above dimensional test, a method is described by which the device selection coefficient is derived based on a "positive dimension" measured as shown in Figs. 24 and 25. In some cases, however, the instrument deviation coefficient or the final value can be derived based on a "negative dimension", which is equal to a dimension of a portion that was removed during the etching. If the instrument deviation coefficient is derived based on the negative dimension, it is assumed that the facility selection coefficient meets the expression; Device selection coefficient = | 1 - (final value × instrument deviation coefficient) |. Then the lot with the facility selection coefficient closest to zero is selected as a lot to be processed.

An effect of applying the control described above procedure is shown in Table 3.

Table 3

In Table 3 there are three sigma (3σ) dimensions during ei nes specific period of time, which in the photographic examination after the dry etching are shown. In a Period a, for example, takes the value 3σ of 0.038 µm - this Value is obtained when the process control device present invention is not introduced - down to 0.028 µm, which shows a significant decrease of 0.01 µm. During one another period will have a similar effect, namely the Un suppression of a noticeable fluctuation, seen. In addition as a result, the yield improvement becomes an increase the economic value of the product through the improvements achieved product quality. Furthermore, a microfactory cation process enabled at a higher level.

In the second example, the photolithographic process shown in Fig. 22 is chosen as an object of the controller. In the photolithographic process, the reflectivity from the previous step is used as the lot characteristic. A negative dimension in the dimension check after the photolithography is used as the device state. Here, however, the device state is different from that of the first example and is adapted in a different way without deriving the device state coefficient in the controller. Fig. 26 shows the relationship between the reflectivity and the dimension of a portion removed in the photolithographic process. The reflectivity and the negative dimension are shown as normalized values. The low reflectivity is equivalent to a thin lacquer film. If the film is exposed with constant exposure, the negative dimension becomes large. Fig. 26 can be seen that the negative dimension decreases linearly with increasing reflectivity. Although the relationship between the reflectivity and the negative dimension changes with the change of other factors, these changes are constantly fed back as the device state and the last relationship is always saved. For example, if the last data shows that the negative dimension is larger than that known to the applicant despite a high reflectivity, the last data will be included in the data, such as the three point moving average, to adjust the exposure .

The result of exposure adjustment by the process control device of the present invention is shown in FIG. 27. The left portion in Fig. 27 represents a region with a relative reflectivity of 1.0 to 1.2. When the exposure energy Ed is 20.7 mJ, a relative dimensional average of 0.7835 is obtained. The value of each wafer shows little variation and is mostly the same. On the right side, the negative dimensions and the fluctuation of the same 3σ are shown when the reflectivity decreases with increasing thickness of a nitride film, which is a deep-lying film. If the controller of the present invention were not used with such a low relative reflectivity, the relative negative dimensions would be approximately 0.9. By the exposure control by means of the feedback of the device state as described above, the resulting relative negative dimension is approximately the same as that of a lot on the left side with a high relative reflectivity.

By inserting the process control device as described above can be written this way, even if that's reflection fortune for an obvious reason, such as a setting error, fluctuates, the problem is completely solved and a negative dimension can be the same or near height of the target value. In this way, a yield can be reduced prevention and the product value can be increased. In addition can process with higher precision with the same Machining device can be performed.

Claims (20)

1. Process control device for a processing device for processing a processing object (product), which is divided into a plurality of lots, with:
a processing device evaluation unit ( 14 ) for evaluating a performance of the processing device based on a process result of the product that is processed by the processing device; and
a lot selection unit ( 15 ) for selecting a lot to be processed from the plurality of lots, based on the performance of the processing device, which is evaluated by the processing device evaluation unit, and the characteristics of the plurality of lots. 2. Process control device according to claim 1, with an event storage unit ( 5 ) for storing an event, the event being equal to information regarding a process result of the product that is processed by the process device, and the event characteristics of the majority of the lots contains. 3. A process control device according to claim 1 or 2, further comprising a lot characteristic deriving unit ( 13 ) for deriving the characteristics of the plurality of lots from the event of a step before a step of the process. 4. Process control device according to one of claims 1 to 3 with a reference information storage unit ( 4 ), wherein the reference information storage unit information regarding a method for controlling the lots in the process, a condition for changing a process condition and whether data relating to the process in the event storage unit is to be collected, stores. 5. Process control device according to one of claims 1 to 4 further comprising a process condition changing unit ( 16 ) for changing the process condition of the processing device according to a relationship between the performance of the processing device and a characteristic of the lot. 6. Process control device according to one of claims 1 to 5 further with a product control change unit for changing a pro zeßbedingungen for the processing facility that each Pro product processed on a product basis according to a relationship between the characteristics of the product that the lot bil det, and the performance of the processing device. 7. Process control device according to one of claims 1 to 6 further with a simplified control unit to perform either a lot selection or a change in the process condition Lot basis or both in the processing facility only in Agreement with the characteristics of the lot. 8. Process control device according to one of claims 1 to 6 further with a simplified product control change unit for modification the product condition for the machining device, the each product processed, on a product basis only in accordance with the characteristics of the product. 9. Process control device according to one of claims 1 to 8 further with a facility selection unit for selecting a machining device for a plurality of arranged in parallel  Machining facilities of the same type in the process step to create a lot to be processed from the majority of the Be work facilities in accordance with the characteristics stik of the lot to be processed and the performance of the majority the processing devices arranged in parallel work. 10. Process control device according to one of claims 1 to 9, wherein the controller evaluation unit further a machining device prediction unit includes predict the performance of the machining facility with a Go, whose data is not in the event storage unit under lots already processed by the processing device have been saved, and a change in the performance of the Be work facility caused by a process of lot with unsaved data that has been taken into account. 11. Process control device according to one of claims 1 to 10 further with a processing device input unit ( 6 ) for enabling the manual input of the power of the processing device. 12. Process control device that controls a processing device that processes a processing object (product) with:
an event storage unit ( 5 ) for storing events from corresponding areas ( 35 , 36 ), the events being the same as information relating to a process result of the product being processed by the processing device;
a processing device evaluation unit ( 14 ) for evaluating a performance of the processing device in corresponding areas by means of the event of a previous product that was processed by the processing device in the process step; and
a process condition setting unit ( 16 ) for setting a process condition for the machining device according to a relationship between the performance of the machining device in respective areas and the events of the product in corresponding areas so that the process results in the process are near the target value . 13. Process control device according to claim 12, further With an area-based setting unit for setting the Process condition based on area. 14. A process control device for a processing device that processes a processing object (product) that is divided into a plurality of lots, with:
an event storage unit ( 5 ) for storing an event on an area basis, the event being equal to information regarding a process result of the product being processed by the processing means;
a processing device evaluation unit ( 14 ) for evaluating a performance of the processing device in corresponding areas by means of an event of a previous product that was processed by the processing device in the process step; and
a lot selection unit ( 15 ) for selecting a lot to be processed from the plurality of lots in accordance with a relationship between the event of the lot and a performance in the respective areas evaluated by the processing device evaluation unit before the process step. 15. Process control device according to claim 14, further With a lot characteristic deriving unit for deriving the cha characteristics of the majority of the lots in corresponding areas  of the event in the process step before the process step. 16. Process control device according to claim 12, wherein the Product is a semiconductor wafer and the semiconductor wafer in egg ne plurality of areas is divided. 17. Process control device according to claim 14, wherein the Product is a semiconductor wafer and the semiconductor wafer in egg ne plurality of areas is divided. 18. Process control device according to claim 14, with a reference information storage unit, the references z information storage unit information related to a Procedure for controlling the lots in the process, a Bedin to change the process condition and whether an event that concerns the process to be collected, stores. 19. Process control device according to claim 18, further With a process condition change unit for changing the process Condition of the processing facility for corresponding lots according to a relationship between a facility's performance in the corresponding areas and events of the lot in the corresponding areas. 20. Process control device according to claim 18, further With a product process change unit for changing the process Product-based condition according to a relationship between a Performance of the institution in the relevant areas and the events in the corresponding areas of the product, which forms the lots for the processing device which performs the process on a product basis.