DD106527A5 - - Google Patents
Info
- Publication number
- DD106527A5 DD106527A5 DD173676A DD17367673A DD106527A5 DD 106527 A5 DD106527 A5 DD 106527A5 DD 173676 A DD173676 A DD 173676A DD 17367673 A DD17367673 A DD 17367673A DD 106527 A5 DD106527 A5 DD 106527A5
- Authority
- DD
- German Democratic Republic
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Multi-Conductor Connections (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722247279 DE2247279A1 (de) | 1972-09-27 | 1972-09-27 | Verfahren zur kontaktierung und/oder verdrahtung von elektrischen bauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DD106527A5 true DD106527A5 (pt) | 1974-06-12 |
Family
ID=5857468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DD173676A DD106527A5 (pt) | 1972-09-27 | 1973-09-25 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US3913224A (pt) |
| JP (1) | JPS4971456A (pt) |
| BE (1) | BE805404A (pt) |
| BR (1) | BR7307491D0 (pt) |
| DD (1) | DD106527A5 (pt) |
| DE (1) | DE2247279A1 (pt) |
| ES (1) | ES419104A1 (pt) |
| FR (1) | FR2200592A1 (pt) |
| GB (1) | GB1439657A (pt) |
| IT (1) | IT993279B (pt) |
| LU (1) | LU67590A1 (pt) |
| NL (1) | NL7311105A (pt) |
| ZA (1) | ZA735189B (pt) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2622324C3 (de) * | 1976-05-19 | 1980-10-02 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung eines genau abgeglichenen elektrischen Netzwerkes |
| JPS53107141U (pt) * | 1977-02-03 | 1978-08-28 | ||
| US4183074A (en) * | 1977-04-16 | 1980-01-08 | Wallace Clarence L | Manufacture of multi-layered electrical assemblies |
| DE2916329C3 (de) * | 1979-04-23 | 1982-03-11 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches Netzwerk |
| DE3035668C2 (de) * | 1980-09-22 | 1983-10-27 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches Netzwerk mit zumindest einer Widerstandsschicht und Herstellungsverfahren dafür |
| DE3040930C2 (de) * | 1980-10-30 | 1983-12-08 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur serienmäßigen Herstellung von elektrischen Bauelementen oder Netzwerken in Chip-Bauweise |
| DE3301673A1 (de) * | 1983-01-20 | 1984-07-26 | Brown, Boveri & Cie Ag, 6800 Mannheim | Elektrisches bzw. elektronisches mehrschichtbauelement |
| US5306874A (en) * | 1991-07-12 | 1994-04-26 | W.I.T. Inc. | Electrical interconnect and method of its manufacture |
| US7157314B2 (en) | 1998-11-16 | 2007-01-02 | Sandisk Corporation | Vertically stacked field programmable nonvolatile memory and method of fabrication |
| US6356455B1 (en) * | 1999-09-23 | 2002-03-12 | Morton International, Inc. | Thin integral resistor/capacitor/inductor package, method of manufacture |
| US6420215B1 (en) * | 2000-04-28 | 2002-07-16 | Matrix Semiconductor, Inc. | Three-dimensional memory array and method of fabrication |
| US8575719B2 (en) | 2000-04-28 | 2013-11-05 | Sandisk 3D Llc | Silicon nitride antifuse for use in diode-antifuse memory arrays |
| AU2001262953A1 (en) | 2000-04-28 | 2001-11-12 | Matrix Semiconductor, Inc. | Three-dimensional memory array and method of fabrication |
| GB2388420B (en) * | 2001-11-27 | 2004-05-12 | Schlumberger Holdings | Integrated activating device for explosives |
| US8091477B2 (en) * | 2001-11-27 | 2012-01-10 | Schlumberger Technology Corporation | Integrated detonators for use with explosive devices |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2958120A (en) * | 1956-05-01 | 1960-11-01 | Ibm | Method of flush circuit manufacture |
| US3079672A (en) * | 1956-08-17 | 1963-03-05 | Western Electric Co | Methods of making electrical circuit boards |
| US3102213A (en) * | 1960-05-13 | 1963-08-27 | Hazeltine Research Inc | Multiplanar printed circuits and methods for their manufacture |
| US3371249A (en) * | 1962-03-19 | 1968-02-27 | Sperry Rand Corp | Laminar circuit assmebly |
| US3290757A (en) * | 1963-03-26 | 1966-12-13 | Eastman Kodak Co | Method of assembling circuitry |
| US3155809A (en) * | 1964-04-21 | 1964-11-03 | Digital Sensors Inc | Means and techniques for making electrical connections |
| US3353263A (en) * | 1964-08-17 | 1967-11-21 | Texas Instruments Inc | Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor |
| US3541223A (en) * | 1966-09-23 | 1970-11-17 | Texas Instruments Inc | Interconnections between layers of a multilayer printed circuit board |
| US3516156A (en) * | 1967-12-11 | 1970-06-23 | Ibm | Circuit package assembly process |
-
1972
- 1972-09-27 DE DE19722247279 patent/DE2247279A1/de not_active Withdrawn
-
1973
- 1973-05-14 LU LU67590A patent/LU67590A1/xx unknown
- 1973-07-10 GB GB3275473A patent/GB1439657A/en not_active Expired
- 1973-07-31 ZA ZA735189A patent/ZA735189B/xx unknown
- 1973-08-10 NL NL7311105A patent/NL7311105A/xx unknown
- 1973-09-18 IT IT29029/73A patent/IT993279B/it active
- 1973-09-19 US US398863A patent/US3913224A/en not_active Expired - Lifetime
- 1973-09-25 DD DD173676A patent/DD106527A5/xx unknown
- 1973-09-26 FR FR7334487A patent/FR2200592A1/fr not_active Withdrawn
- 1973-09-26 ES ES419104A patent/ES419104A1/es not_active Expired
- 1973-09-26 JP JP48108307A patent/JPS4971456A/ja active Pending
- 1973-09-26 BR BR7491/73A patent/BR7307491D0/pt unknown
- 1973-09-27 BE BE136120A patent/BE805404A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1439657A (en) | 1976-06-16 |
| AU5889173A (en) | 1975-02-06 |
| BR7307491D0 (pt) | 1974-08-22 |
| BE805404A (fr) | 1974-01-16 |
| US3913224A (en) | 1975-10-21 |
| IT993279B (it) | 1975-09-30 |
| JPS4971456A (pt) | 1974-07-10 |
| LU67590A1 (pt) | 1973-07-24 |
| FR2200592A1 (pt) | 1974-04-19 |
| ZA735189B (en) | 1974-11-27 |
| NL7311105A (pt) | 1974-03-29 |
| DE2247279A1 (de) | 1974-04-04 |
| ES419104A1 (es) | 1976-03-16 |