DD106527A5 - - Google Patents

Info

Publication number
DD106527A5
DD106527A5 DD173676A DD17367673A DD106527A5 DD 106527 A5 DD106527 A5 DD 106527A5 DD 173676 A DD173676 A DD 173676A DD 17367673 A DD17367673 A DD 17367673A DD 106527 A5 DD106527 A5 DD 106527A5
Authority
DD
German Democratic Republic
Application number
DD173676A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DD106527A5 publication Critical patent/DD106527A5/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Multi-Conductor Connections (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DD173676A 1972-09-27 1973-09-25 DD106527A5 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722247279 DE2247279A1 (de) 1972-09-27 1972-09-27 Verfahren zur kontaktierung und/oder verdrahtung von elektrischen bauelementen

Publications (1)

Publication Number Publication Date
DD106527A5 true DD106527A5 (https=) 1974-06-12

Family

ID=5857468

Family Applications (1)

Application Number Title Priority Date Filing Date
DD173676A DD106527A5 (https=) 1972-09-27 1973-09-25

Country Status (13)

Country Link
US (1) US3913224A (https=)
JP (1) JPS4971456A (https=)
BE (1) BE805404A (https=)
BR (1) BR7307491D0 (https=)
DD (1) DD106527A5 (https=)
DE (1) DE2247279A1 (https=)
ES (1) ES419104A1 (https=)
FR (1) FR2200592A1 (https=)
GB (1) GB1439657A (https=)
IT (1) IT993279B (https=)
LU (1) LU67590A1 (https=)
NL (1) NL7311105A (https=)
ZA (1) ZA735189B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2622324C3 (de) * 1976-05-19 1980-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines genau abgeglichenen elektrischen Netzwerkes
JPS53107141U (https=) * 1977-02-03 1978-08-28
US4183074A (en) * 1977-04-16 1980-01-08 Wallace Clarence L Manufacture of multi-layered electrical assemblies
DE2916329C3 (de) * 1979-04-23 1982-03-11 Siemens AG, 1000 Berlin und 8000 München Elektrisches Netzwerk
DE3035668C2 (de) * 1980-09-22 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Elektrisches Netzwerk mit zumindest einer Widerstandsschicht und Herstellungsverfahren dafür
DE3040930C2 (de) * 1980-10-30 1983-12-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zur serienmäßigen Herstellung von elektrischen Bauelementen oder Netzwerken in Chip-Bauweise
DE3301673A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisches bzw. elektronisches mehrschichtbauelement
US5306874A (en) * 1991-07-12 1994-04-26 W.I.T. Inc. Electrical interconnect and method of its manufacture
US7157314B2 (en) 1998-11-16 2007-01-02 Sandisk Corporation Vertically stacked field programmable nonvolatile memory and method of fabrication
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
US8575719B2 (en) 2000-04-28 2013-11-05 Sandisk 3D Llc Silicon nitride antifuse for use in diode-antifuse memory arrays
AU2001262953A1 (en) 2000-04-28 2001-11-12 Matrix Semiconductor, Inc. Three-dimensional memory array and method of fabrication
US6420215B1 (en) * 2000-04-28 2002-07-16 Matrix Semiconductor, Inc. Three-dimensional memory array and method of fabrication
GB2388420B (en) * 2001-11-27 2004-05-12 Schlumberger Holdings Integrated activating device for explosives
US8091477B2 (en) * 2001-11-27 2012-01-10 Schlumberger Technology Corporation Integrated detonators for use with explosive devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958120A (en) * 1956-05-01 1960-11-01 Ibm Method of flush circuit manufacture
US3079672A (en) * 1956-08-17 1963-03-05 Western Electric Co Methods of making electrical circuit boards
US3102213A (en) * 1960-05-13 1963-08-27 Hazeltine Research Inc Multiplanar printed circuits and methods for their manufacture
US3371249A (en) * 1962-03-19 1968-02-27 Sperry Rand Corp Laminar circuit assmebly
US3290757A (en) * 1963-03-26 1966-12-13 Eastman Kodak Co Method of assembling circuitry
US3155809A (en) * 1964-04-21 1964-11-03 Digital Sensors Inc Means and techniques for making electrical connections
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3541223A (en) * 1966-09-23 1970-11-17 Texas Instruments Inc Interconnections between layers of a multilayer printed circuit board
US3516156A (en) * 1967-12-11 1970-06-23 Ibm Circuit package assembly process

Also Published As

Publication number Publication date
NL7311105A (https=) 1974-03-29
LU67590A1 (https=) 1973-07-24
BR7307491D0 (pt) 1974-08-22
BE805404A (fr) 1974-01-16
DE2247279A1 (de) 1974-04-04
ZA735189B (en) 1974-11-27
GB1439657A (en) 1976-06-16
AU5889173A (en) 1975-02-06
IT993279B (it) 1975-09-30
FR2200592A1 (https=) 1974-04-19
JPS4971456A (https=) 1974-07-10
US3913224A (en) 1975-10-21
ES419104A1 (es) 1976-03-16

Similar Documents

Publication Publication Date Title
FR2200592A1 (https=)
JPS491429U (https=)
CS166174B2 (https=)
JPS4930308U (https=)
JPS5234710Y2 (https=)
JPS4969804A (https=)
JPS4930359A (https=)
JPS534029Y2 (https=)
JPS5135044Y2 (https=)
JPS5239688Y2 (https=)
JPS5250588Y2 (https=)
CS153172B1 (https=)
JPS4951553A (https=)
CS166905B1 (https=)
CS163973B1 (https=)
CS163458B1 (https=)
CS160304B1 (https=)
CS159926B1 (https=)
CS158015B1 (https=)
CS153946B1 (https=)
CS158009B1 (https=)
CS156348B1 (https=)
CH562655A5 (https=)
CH606255A5 (https=)
CH605834A5 (https=)