CS200008B1 - Equipment for soldering out of electrocomponents - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for brazing electrical components, in particular integrated circuits from circuit boards for mechanical attachment and electrical interconnection.

In many electrical equipment, especially radio engineering, automation and computer equipment, it is an advantageous design solution to place electronic circuits composed of individual electrical components on boards for mechanical and electrical interconnection of components or printed wires and other. The ever increasing intrinsic complexity of the active electronic components used is manifested externally by increasing the number of outlets through which the component is inserted and connected to the board at once. Bulk connection technology, industrially used is for example wave soldering. However, it is difficult for already connected multi-terminal components to be removed from the board in the case of a defect or failure and not to damage the surrounding components and especially the supporting connecting board itself. It is not always possible, for example, to separate the terminals from the component with the pliers and then to solder the individual terminals from the board in the manner that has been usual until now. From the technological point of view of industrial production, such a method is unbearable. In addition, there may be a case of defective board and good parts that could be reused. There are foreign extraction beacons using direct electric heating of soldered places and subsequent suction by liquid solder pump, working cell by point, or for all -projects of one component at a time, but are labor intensive to avoid odtr200 008

200 008 solder throws of electrical connections from the board even for high temperature of the heating element, long time effect of temperature, too powerful suction. Much more environmentally friendly to circuit boards, components, and less demanding to operate, is a method that uses a hot air jet to operate without melting the circuit board or component outlets to melt the solder and remove it from the solder locations.

Productive industrial use requires a device that drains all of the component outlets at once, which means either replacing the nozzle heads in one device, or having to have several devices with different heads.

An economical solution to this problem is to provide a brewing device according to the invention in that the hot-air nozzle heads are distributed around the circumference of the rotary carousel allowing easy and quick replacement by simply twisting multiple heads without disassembling the equipment. a device for repeating the exact positioning of the working head against the fixture and hence the hot air nozzles relative to the outlets of the soldered electrical component from the plate. One head is always working, while the others have nozzles spaced to match components with different outlets.

In the accompanying drawings two exemplary embodiments of the beacon according to the invention are shown, in which Fig. 1 is a side view of a carousel device with four different heads, Fig. 2 is a front view of a carousel with six heads and partially sectioned carousel showing one possible embodiment equipment.

The device for soldering electrical components from the plates consists of a base plate 1, an electric component clamp 2, a stand 3, to which the arm 4 with a heater for preheating compressed air operated by a lever 5 and terminated by a carousel 6 is rotatably mounted. 7 with hot air nozzles. The carousel is equipped with a stepping device 8,

On the base plate 1, in a mutually defined position, a clamp 2 of the removed electrical components from the support and interconnecting plate and a stand 3 with a hinged up arm 4 containing a preheating device for compressed air supplied to the device by an external source hose are located. The control of the movement of the arm 4 is carried out by the operator by means of a lever 5. The arm is terminated by heads 7 distributed around the circumference of the carousel 6. Accurate, quick and repeatable adjustment of the heads 7 of the carousel 6 to working position is enabled by the stepping device 8. the arm 4 is lowered into the grooves of the clamping device 2, the arm 4 with the adjusted clamp is lowered to a horizontal position by the lever 5 and the solder melts on the connection terminals of the part to be removed with a hot air stream. the spring in the fixture 2 pulls the part out of the plate.

The device is intended for use in soldering and replacement of components from electrical equipment boards.

200 000

SUBJECT OF THE INVENTION

Claims (3)

SUBJECT OF THE INVENTION 1. A device for soldering electrical components, in particular integrated circuits, from boards serving for their meohanic attachment and electrical interconnection, comprising a base plate on which a clamp of removed electrical components and a stand with a hinged compressed air preheater are placed in a mutually defined position. Nozzles with nozzles are provided for directing the hot air flow to the outlets of the brazed electrical components, characterized in that the heads (7) are distributed around the circumference of the rotary carousel (6) with the walking device (8). Device according to claim 1, characterized in that the carousel (6) comprises at least two heads (7). Device according to rolls 1 and 2, characterized in that the heads (7) are interchangeable by the rotation mechanism of the carousel.