CN218336618U - Device for positioning and mounting components on a Printed Circuit Board (PCB) - Google Patents

Abstract

There is provided an apparatus for positioning and mounting a component on a Printed Circuit Board (PCB), comprising: an alignment device comprising a locating portion and a component placement socket, wherein the locating portion is configured to mate with a receiving structure on the PCB such that the alignment device can be secured on the PCB; the component placement socket is configured to receive the component, and the alignment device is configured to accurately position the component in a region to be mounted on the PCB in order to mount the component on the PCB.

Description

Device for positioning and mounting components on a Printed Circuit Board (PCB)

Technical Field

The present disclosure relates generally to the field of semiconductor chips and, more particularly, to an apparatus for positioning and mounting components on a Printed Circuit Board (PCB).

Background

After the semiconductor package device is manufactured, a burn-in operation is performed on the semiconductor device and a test is performed. The aging of the device means that a certain electric stress is continuously applied to the device at a certain environmental temperature for a long time, various physical and chemical reaction processes in the device are accelerated through the comprehensive action of the electric stress and the thermal stress, various potential defects hidden in the device are promoted to be exposed early, and therefore products which fail early can be removed. To perform burn-in operations, it is often necessary to plug-in and connect the device under test to a burn-in board (BIB) on which some integrated circuit devices, such as FPGAs, are mounted for burn-in and testing of the device under test.

FIG. 1 shows a burn-in board (BIB) 100. As shown in fig. 1, 18 device under test mounting locations 110 are provided on the BIB 100, and the device under test is mounted at the locations 110 through mounting holes provided at the locations 110. In addition, 18 FPGAs 120 are correspondingly disposed on the BIB 100, and the FPGAs 120 are used for burn-in and testing of the device under test disposed in the device under test mounting location 110.

However, during mass production manufacturing, once one of the FPGAs 120 on the BIB 100 fails, device testing fails, and the yield of device production is reduced, which is disadvantageous for mass production.

Therefore, it is desirable to replace FPGA components in time when the FPGA 120 on the BIB 100 fails, so as to recover the burn-in and test operations of the device as soon as possible. However, since FPGA components are typically very small-sized leadless packages, and the pads distributed over the FPGA components are very dense (e.g., typically at 7x7 mm) ² 84 pin pads) and it is often difficult for a factory performing burn-in testing to replace FPGA components and accurately solder new FPGA components to the BIB 100. Thus, in the current manufacturing process, once a failure of the FPGA 120 on the BIB 100 is detected, it is common practice to send the failed BIB back to the supplier for component replacement and repair, and then the supplier will go through repairThe BIB is then returned to the test facility.

However, the time taken to send back to the supplier for repair is often long and the repair costs are relatively high. Thus, the test facility needs to stockpile a large number of BIBs so that if one of the BIBs fails to perform FPGA component, the stocked BIBs can be used immediately to continue the test, and the failed BIBs can be shipped back to the supplier for repair. Given the high failure rate of FPGAs, the test facility needs to have a significant amount of BIB inventory stocked to maintain proper operation. However, the cost of inventory (typically costs up to tens or even millions of dollars) also places a large burden on the test plant.

In addition, after the supplier returns the repaired BIB to the testing factory, the testing factory needs to further verify, check and perform preventive maintenance on the repaired BIB to put it into testing work formally.

Therefore, there is a need for a convenient and easy to operate tool that enables a failed FPGA on a BIB to be replaced directly at the test factory without the need to be shipped back to the supplier for repair.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present disclosure provides an apparatus for positioning and mounting a component on a Printed Circuit Board (PCB), the apparatus comprising: an alignment device comprising a locating portion and a component placement socket, wherein the locating portion is configured to mate with a receiving structure on the PCB such that the alignment device can be secured on the PCB; the component placement socket is configured to receive the component, and the alignment device is configured to accurately position the component in a region to be mounted on the PCB in order to mount the component on the PCB.

In an embodiment, the apparatus further comprises a solder applying device configured to accurately apply a predetermined amount of solder to the component, and comprising: a backplane comprising at least one slot configured to receive the component; the welding material plate is provided with a plurality of holes, and the distribution of the holes corresponds to the distribution of the welding pads of the component; a magnetic cover plate configured to fix both sides of the solder plate, and a central cover plate configured to fix a center of the solder plate and having at least one hollow area corresponding to the at least one socket.

The present disclosure also provides an apparatus for applying solder to a component, which is configured to accurately apply a predetermined amount of solder to a component and prevent excessive solder from causing a short circuit of a pad of the component, the apparatus including: a backplane comprising at least one slot configured to receive the component; the welding material plate is provided with a plurality of holes, and the distribution of the holes corresponds to the distribution of the welding pads of the component; a magnetic cover plate configured to fix both sides of the solder plate, and a central cover plate configured to fix a center of the solder plate and having at least one hollow area corresponding to the at least one socket.

The present disclosure also provides a method of operating an apparatus for positioning and mounting a component on a PCB, the apparatus comprising an alignment apparatus including a positioning portion and a component placement socket, and a solder application apparatus including a base plate, a solder plate, a magnetic cover plate, and a central cover plate, the method comprising: placing the component into a socket in the backplane of the solder application apparatus; covering the solder plate of the solder applying device on the base plate; covering the magnetic cover plates of the solder applying device on both sides of the solder plate; applying solder to the holes on the solder plate and removing excess solder from the solder plate; covering the center cover plate of the solder applying device at the center of the solder plate; heating the solder applying device to completely melt the solder to form a solder ball; positioning the aligning apparatus to a proper position on the PCB by the positioning part, placing the component to which the solder has been applied in the component placing socket of the aligning apparatus, and reflowing the component to solder the component on the PCB.

Drawings

The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the disclosure and to enable a person skilled in the pertinent art to make and use the disclosure.

Fig. 1 shows a conventional burn-in board.

Fig. 2A-2D illustrate block diagrams of alignment devices for positioning components onto a PCB according to embodiments of the present disclosure.

Fig. 3A-3C illustrate a block diagram of an apparatus for applying a predetermined amount of solder to a component according to an embodiment of the present disclosure.

Embodiments will be described with reference to the accompanying drawings.

Detailed Description

The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and thereby implement the subject matter described herein, and are not intended to limit the scope, applicability, or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as needed. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. In addition, features described with respect to some examples may also be combined in other examples.

It is noted that references in the specification to "one embodiment," "an embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

The device provided by the present disclosure can be used not only to replace a failed FPGA on a BIB, but also to any Printed Circuit Board (PCB) that requires replacement of a component, so that a new component can be conveniently and accurately positioned and mounted on the PCB. The following embodiments take a PCB as an example, and specifically describe an apparatus for positioning and mounting a component on the PCB.

Fig. 2A-2D illustrate block diagrams of alignment devices for positioning components onto a PCB according to embodiments of the present disclosure. Fig. 2A is a perspective view showing the alignment apparatus 200. As shown in fig. 2A, the alignment apparatus 200 includes a positioning portion 210, a component placement socket 220, a support portion 230, and an operating head 240. In the embodiment, the positioning portion 210 is connected with the component placement socket 220, the support portion 230 is used to fix the operating head 240, and the operating head 240 is connected to the positioning portion 210 through the support portion 230.

Fig. 2B is a back view of the alignment appliance 200, which specifically shows a specific configuration of the positioning portion 210 of the alignment appliance 200. As shown in fig. 2B, the positional relationship of the positioning portion 210, the support portion 230, and the operating head 240 is shown from the back. As shown in fig. 2B, the positioning portion 210 includes a positioning plate 211 and a positioning pin 212. In an embodiment, the positioning portion 210 includes one positioning plate 211 and two positioning pins 212 connected to the positioning plate 211, thereby limiting the degree of freedom of the aligning apparatus 200 and facilitating accurate positioning.

In an embodiment, the locating pins 212 can be inserted into corresponding receiving structures on the PCB, thereby securely fixing the alignment fixture 200 to the PCB, thereby limiting the freedom of the alignment fixture 200 and facilitating accurate positioning. As known to those skilled in the art, the receiving structure on the PCB may be a hole or slot structure such as a screw hole, a plug hole, a mounting hole, and the like. Accordingly, the alignment device 200 of the present disclosure can be secured in place using locating pins that mate with various receiving structures that are already present on the PCB without the need for additional auxiliary locating tools. Furthermore, the positioning by means of the various receiving structures originally on the PCB is very simple and easy to handle manually, which has significant advantages compared to time-consuming and complex machine alignment devices.

In an embodiment, the position of the locating pin 212 on the locating plate 211 is adjustable. The spacing a between the two locating pins can be arbitrarily adjusted to accommodate the spacing of various receiving structures on the PCB, depending on the position of the receiving structures on the PCB, to allow for smooth insertion into the receiving structures on the PCB, and to ensure that the tolerance for such positioning is within the range of 0.03 mm.

In the embodiment of fig. 2B, the positioning pins 212 may be arranged diagonally on the positioning plate 211, thereby limiting the freedom of the alignment device 200. In other embodiments, the number of locating pins 212 is not limited to 2, and instead, more than 2 locating pins 212 may be used to secure the alignment device 200.

Fig. 2C shows the component placement socket 220 for receiving a component to be mounted in a top view. As shown in fig. 2C, a hollow area 222 in the middle of the component placement socket 220 is used to receive a component to be mounted, and the component placement socket 220 further includes surface contact portions 221 around the hollow area 222, which are in contact with the periphery of the component received in the hollow area 222, for fixing the component.

The dimensions of the component placement socket 220 and the hollow area 222 thereon are designed according to the dimensions of the component to be mounted, with a design tolerance in the range of 0.03 mm. Therefore, in the embodiment, the component placement socket 220 and the hollow area 222 of different sizes may be designed according to different sizes of components to be mounted. In the embodiment, the component placement socket 220 is detachably coupled to the positioning portion 210, so that when it is necessary to mount components of different sizes, it is possible to conveniently select a component placement socket 220 of an appropriate size and easily fix it to the positioning portion 210.

Fig. 2D is a side view showing the alignment device 200. As shown in fig. 2D, the positional relationship of the positioning portion 210, the component placement socket 220, the support portion 230, and the operating head 240 is shown from a side view. In the embodiment of fig. 2D, the support portion 230 is configured to secure the operating head 240 to the positioning portion 210, and the operating head 240 is vertically aligned with the component placement socket 220.

As shown in fig. 2D, the operating head 240 is a spring operating head that includes a spring-tightened screw 241 and a spring 242. In an embodiment, the compression spring 242 is fixedly mounted to the support portion 230 by a spring fastening screw 241. In an embodiment, the spring 242 may be either a compression spring or an extension spring.

In performing the component mounting operation, the component to be mounted is first manually placed into the component placement socket 220, and then the spring 242 presses the surface of the component downward, pressing the component against the PCB, thereby facilitating good soldering between the component and the PCB. The spring 242 can be automatically retracted upward to a starting position after the component to be mounted has been mounted on the PCB.

Fig. 3A-3C illustrate a block diagram of an apparatus for applying a predetermined amount of solder to a component according to an embodiment of the present disclosure. Fig. 3A shows a perspective view of the structure of the solder application apparatus 300 according to an embodiment of the present disclosure, in which a view on the left side of fig. 3A shows the respective constituent parts of the solder application apparatus 300 in detail, and a view on the right side of fig. 3A shows the structure after the parts of the solder application apparatus 300 are assembled together.

As shown in fig. 3A, the solder applying apparatus 300 includes a base plate 310, a solder plate 320, a center cover plate 330, and a magnetic cover plate 340.

Fig. 3B is a plan view showing a specific configuration of the base plate 310. As shown in fig. 3B, the base plate 310 includes six slots 312, each slot 312 for receiving a component to which solder is to be applied. Therefore, the solder applying apparatus 300 of the present disclosure can apply solder to six components at a time, thereby greatly improving work efficiency.

In an embodiment, the base plate 310 may be made of metal. In an embodiment, the slot 312 for receiving the component to which solder is to be applied is sized according to the size of the component with a design tolerance in the range of 0.03 mm.

As shown in fig. 3B, the bottom plate 310 further includes two pins 314, and the two pins 314 are respectively located at two ends of the bottom plate 310 and are used for fixing the solder plate 320 and the magnetic cover plate 340 in subsequent operations.

Fig. 3C is a plan view showing details of the solder plate 320. As shown in fig. 3C, two circular holes are formed at the left and right sides of the solder plate 320, respectively, and are engaged with the pins 314 of the base plate 310, thereby aligning the solder plate 320 with the base plate 310. In the middle of the solder plate 320, six sets of hole patterns are shown, wherein each hole in each set of hole patterns corresponds to a pad distribution of the component to be mounted, in order to accurately apply solder to a predetermined position of the component.

In an embodiment, the thickness of the solder plate is determined according to the size of the pad of the component to be mounted, and the thickness of the solder plate is used to control the amount of solder applied. For example, in an embodiment, the thickness of the solder plate may be 0.13mm. With this arrangement of the solder plate 320, it is possible to accurately apply solder to each pad of the component through each hole, and since the finally applied solder exists only in the holes on the solder plate, it is possible to control the amount of solder applied, thereby avoiding occurrence of short circuits between pads due to excessive solder.

Referring back to fig. 3A, magnetic cover plates 340 are disposed on the solder plate 320, and on both sides of the solder plate 320. In an embodiment, the magnetic cover plate 340 is provided with a magnetic structure so as to be magnetically fixed with the bottom plate 310. As shown in fig. 3A, the two magnetic cover plates 340 each have a circular hole, which is engaged with the pin 314 of the base plate 310, so that the solder plate 320 can be pressed against the base plate 310.

The center cover plate 330 is disposed on the solder plate 320 and in the center of the solder plate 320. In one embodiment, the central cover 330 is also provided with a magnetic structure for magnetically attracting and fixing with the bottom plate 310. In an embodiment, the central cover plate 330 covers the positions of six slots 312 and has six hollow areas corresponding to the slots 312 so as to expose the solder plates 320 at the positions of six slots 312 after the central cover plate 330 is overlaid on the solder plates 320.

As is known in the art, the base plate 310 made of metal may be deformed by heat during the process of heating the solder application device 300 to melt the solder therein to form solder balls. However, due to such thermal deformation, a gap may occur between the solder plate 320 and the bottom plate 310, and the solder in the hole of the solder plate 320 flows out of the hole and even to the adjacent solder point, and finally the pad is short-circuited. To prevent the short circuit problem caused by such thermal deformation, the central cover plate 330 is used to limit the thermal deformation of the bottom plate 310 so that the thermal deformation of the bottom plate 310 does not affect the quality of the finally formed solder balls. Furthermore, the design of the central cover plate 330 is also such that the warpage of the components in the base plate 310 is not overly restricted, that is, the placement of the central cover plate 330 has no additional effect on the components in the solder application apparatus 300.

In the present disclosure, a method for operating the alignment device 200 shown in fig. 2A-2D and the solder applying device 300 shown in fig. 3A-3C to accurately position and mount a component in place on a PCB is also provided.

In the operating method, the solder applying device 300 is first used to solder coat the component to be mounted. In operation, the components are placed into the slots 312 in the base plate 310, and then the solder plate 320 is overlaid on the base plate 310. Next, the magnetic cover plates 340 are covered on both sides of the solder plate 320. At this time, solder is applied to each hole on the solder plate 320, and then the solder plate is cleaned to remove the excess solder on the solder plate. Subsequently, the center cover plate 330 is overlaid on the center of the solder plate 320, thereby assembling the various components of the solder applying apparatus 300 together. The solder applying apparatus 300 is placed on a heating stage and heated by using a temperature as high as about 230 c for about 2 minutes to completely melt the solder to form a hemispherical solder ball. The heating is then stopped and the solder application apparatus 300 is cooled to room temperature, thereby completing the solder application process.

The component to which the solder has been applied is then accurately positioned and mounted on the PCB using the alignment fixture 200. First, the aligning apparatus 200 is positioned to a position on the PCB where a component needs to be mounted by the positioning part 210, and the component is placed in the component placement socket 220. The components are then soldered to the PCB by heating the components with a heat gun to reflow the solder. Here, the heating temperature is usually selected to be about 385 ℃, the heating time is about 2 minutes, and the heat gun is placed at a position spaced from the component by about 1 cm.

After the component is mounted on the PCB, a verification operation is performed. In an embodiment, the PCB is placed on a verification machine to test whether it is able to function properly.

Compared with the prior art of transporting the failure board back to the supplier for maintenance, the device for positioning and mounting the component on the PCB according to the embodiment of the disclosure can very conveniently position and mount the component on the PCB quickly and accurately through manual operation, so that various components on the PCB can be replaced simply and conveniently without the assistance of a mechanical positioning device such as a microscope or using other machine positioning devices which are relatively time-consuming and troublesome in operation, thereby solving the problem that the component on the PCB is not easy to replace, greatly reducing the cost of component maintenance and replacement, and having high installation efficiency.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. An apparatus for positioning and mounting a component on a Printed Circuit Board (PCB), comprising:

an alignment device comprising a positioning portion and a component placement socket, wherein,

the locating portion is configured to cooperate with a receiving structure on the PCB such that the alignment device can be secured on the PCB;

the component placement socket is configured to receive the component, and

the alignment device is configured to accurately position the component in a region to be mounted on the PCB in order to mount the component on the PCB.

2. The apparatus of claim 1, wherein the positioning portion comprises a positioning plate and at least two pins secured to the positioning plate, the pins configured to be inserted into receiving structures on the PCB, and wherein the positions of the pins are adjustable.

3. The device of claim 1, wherein the alignment device further comprises an operating head vertically aligned with the component placement socket, the operating head comprising a spring and a spring tightening screw, the operating head configured to press the component down onto the PCB when the component is mounted and to automatically retract to a starting position after the component is mounted on the PCB.

4. An apparatus according to claim 3, wherein the alignment apparatus further comprises a support portion for securing the operating head and connecting the operating head with the positioning portion.

5. The apparatus of claim 1, wherein the component placement socket is removably connected with the positioning portion.

6. The apparatus of any of claims 1-5, further comprising a solder application device configured to accurately apply a predetermined amount of solder to the component.

7. The apparatus of claim 6, wherein the solder applying means comprises:

a backplane comprising at least one slot configured to receive the component;

the solder plate is arranged on the bottom plate and provided with a plurality of holes for accommodating solder;

a magnetic cover plate disposed on the solder plate, the magnetic cover plate configured to fix both sides of the solder plate, an

A central cover plate disposed on the solder plate, the central cover plate configured to secure a center of the solder plate, and the central cover plate having at least one hollow area corresponding to the at least one slot.

8. The apparatus of claim 7, wherein the thickness of the solder plate is determined according to a pad size of the component.

9. The apparatus of claim 7, wherein a distribution of the plurality of holes corresponds to a distribution of pads of the component.

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