CR9913A - Sistema de inspeccion de una matriz de conectores (pga) basado en una camara con una caratula base de conectores e iluminacion de angulo bajo - Google Patents

Sistema de inspeccion de una matriz de conectores (pga) basado en una camara con una caratula base de conectores e iluminacion de angulo bajo

Info

Publication number
CR9913A
CR9913A CR9913A CR9913A CR9913A CR 9913 A CR9913 A CR 9913A CR 9913 A CR9913 A CR 9913A CR 9913 A CR9913 A CR 9913A CR 9913 A CR9913 A CR 9913A
Authority
CR
Costa Rica
Prior art keywords
connector
connectors
camera
array
angle lighting
Prior art date
Application number
CR9913A
Other languages
English (en)
Inventor
Ken Doing Kexiang
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of CR9913A publication Critical patent/CR9913A/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Un sistema de inspeccion para inspeccionar matrices de conectores sobre dispositivos de circuitos integrados incluye una caratula base de conectores configurado para recibir un dispositivo que tiene una matriz de conectores. Un sistema de iluminacion de angulo bajo en un campo oscuro, emite una luz sobre la matriz de conectores. La caratula base de conectores y un sistema de iluminacion de angulo bajo suminstrada para una imagen clara y definitiva de la matriz de conectores. Una camara captura la imagen de la matriz de conectores. Un procesador junto con la camara, analiza las imagenes capturadas por la camara. Basandose en la imagen capturada , el procesador determina si algunos de los conectores sobre la matriz de conectores estan doblados o hacen falta, o si hay presente conectores adicionales.
CR9913A 2005-10-12 2008-04-23 Sistema de inspeccion de una matriz de conectores (pga) basado en una camara con una caratula base de conectores e iluminacion de angulo bajo CR9913A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72529605P 2005-10-12 2005-10-12

Publications (1)

Publication Number Publication Date
CR9913A true CR9913A (es) 2008-07-31

Family

ID=37671237

Family Applications (1)

Application Number Title Priority Date Filing Date
CR9913A CR9913A (es) 2005-10-12 2008-04-23 Sistema de inspeccion de una matriz de conectores (pga) basado en una camara con una caratula base de conectores e iluminacion de angulo bajo

Country Status (6)

Country Link
US (1) US7755376B2 (es)
EP (1) EP1946085A1 (es)
JP (1) JP2009511908A (es)
CR (1) CR9913A (es)
TW (1) TW200730842A (es)
WO (1) WO2007047272A1 (es)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
SG138491A1 (en) * 2006-06-21 2008-01-28 Generic Power Pte Ltd Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components
DE102007041375B4 (de) * 2007-08-30 2009-12-31 Krebs, Jürgen, Dipl.-Ing. Messeinrichtung und Messverfahren für Stifte, insbesondere Steckerstifte
DE102007047596B4 (de) * 2007-10-05 2013-02-07 Multitest Elektronische Systeme Gmbh Handhabungsvorrichtung für elektronische Bauelemente, insbesondere ICs, mit einer Mehrzahl von auf einer Umlaufbahn geführten Umlaufwagen
DE102007047680B4 (de) 2007-10-05 2009-11-26 Multitest Elektronische Systeme Gmbh Handhabungsvorrichtung für elektronische Bauelemente, insbesondere IC's, mit temperierbaren Umlaufeinheiten
US7842912B2 (en) * 2008-05-23 2010-11-30 Delta Design, Inc. Camera based vision alignment with device group guiding for semiconductor device testing handlers
US8106349B2 (en) * 2008-07-16 2012-01-31 Delta Design, Inc. Vision alignment with multiple cameras and common coordinate at contactor for IC device testing handlers
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
TWI408382B (zh) * 2009-11-13 2013-09-11 成像裝置的檢測方法及系統
TWI493201B (zh) * 2012-11-09 2015-07-21 Ind Tech Res Inst 電子零件腳位判斷與插件之方法與系統
US9594111B2 (en) * 2013-02-27 2017-03-14 Infineon Technologies Ag Turret handlers and methods of operations thereof
US9251346B2 (en) * 2013-02-27 2016-02-02 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Preventing propagation of hardware viruses in a computing system
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US9703623B2 (en) * 2014-11-11 2017-07-11 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Adjusting the use of a chip/socket having a damaged pin
TW201712325A (zh) * 2015-06-30 2017-04-01 Seiko Epson Corp 電子零件搬送裝置及電子零件檢查裝置
CN106604628B (zh) * 2015-10-20 2019-07-12 泰科电子(上海)有限公司 用于确定电连接器的插脚的安装状态的系统
CN108957047B (zh) * 2018-08-24 2023-08-11 西南应用磁学研究所 微带器件测试夹具
US10794951B2 (en) 2018-09-24 2020-10-06 Winbond Electronics Corp. Electronic element inspection equipment and chip inspection method thereof
CN115266743B (zh) * 2022-05-17 2024-02-02 江苏汤谷智能科技有限公司 一种无损检测下的芯片质量的评估系统及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728195A (en) 1986-03-19 1988-03-01 Cognex Corporation Method for imaging printed circuit board component leads
BE1003136A3 (nl) 1990-03-23 1991-12-03 Icos Vision Systems Nv Werkwijze en inrichting voor het bepalen van een positie van ten minste een aansluitpen van een elektronische component.
US5648853A (en) * 1993-12-09 1997-07-15 Robotic Vision Systems, Inc. System for inspecting pin grid arrays
JP2560645B2 (ja) * 1994-08-31 1996-12-04 日本電気株式会社 半導体装置のリード曲がり検査方法
KR100314135B1 (ko) * 1999-03-08 2001-11-16 윤종용 Ｂｇａ 패키지의 전기적 검사를 위한 소켓 및 이를 이용한검사방법
JP2001013085A (ja) * 1999-06-30 2001-01-19 Nidek Co Ltd 欠陥検査装置
US6738504B1 (en) * 1999-08-27 2004-05-18 Shinko Electric Industries Co., Ltd Inspection apparatus for semiconductor device and parts mounter using same
US6388457B1 (en) * 2000-06-26 2002-05-14 Advanced Micro Devices, Inc. Automated monitoring of placement of an IC package onto a socket for proper orientation and proper alignment
TW533999U (en) 2001-12-26 2003-05-21 Zilix Technologies Pte Ltd An IC device support for a laser marker
US7193728B2 (en) * 2002-08-07 2007-03-20 Advantest Corporation Processing apparatus, processing method and position detecting device
US20070023716A1 (en) 2005-07-26 2007-02-01 Icos Vision Systems N.V. Apparatus for three dimensional measuring on an electronic component

Also Published As

Publication number Publication date
TW200730842A (en) 2007-08-16
US7755376B2 (en) 2010-07-13
EP1946085A1 (en) 2008-07-23
US20070080703A1 (en) 2007-04-12
JP2009511908A (ja) 2009-03-19
WO2007047272A1 (en) 2007-04-26

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