CN87211969U - Continuous electroplating device for gold-plating tungsten filament - Google Patents
Continuous electroplating device for gold-plating tungsten filament Download PDFInfo
- Publication number
- CN87211969U CN87211969U CN 87211969 CN87211969U CN87211969U CN 87211969 U CN87211969 U CN 87211969U CN 87211969 CN87211969 CN 87211969 CN 87211969 U CN87211969 U CN 87211969U CN 87211969 U CN87211969 U CN 87211969U
- Authority
- CN
- China
- Prior art keywords
- gold
- tungsten filament
- nozzle
- electroplate liquid
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model designs a continuous electroplating device for gold-plating tungsten filament, comprising an electroplating tank (3), an injecting nozzle (2), a water pump (6), a conduit pipe (7) and an anode (1). The device can continuously plate gold for tungsten filament in circulating flow electroplating solution, the gotten plating layer is uniform, and the tungsten filament is combined firmly. The device is provided with an upper water tank (4), a lower water tank (5) and a valve (8), thus further increasing and accommodating the circulation amount and the circulation velocity of the electroplating solution, and getting the high quality gold-plating layer.
Description
The utility model relates to the gold-plated continuous electroplating apparatus of using of tungsten filament, relates in particular to the gold-plated device of tungsten filament that uses in giving the plating operation.
Gold-plated tungsten filament is an indispensable material in the duplicating machine, requires line footpath thin (about 0.1 millimeter), and coating is thin, ductility is good, even, and coating combines firmly with tungsten filament.For obtaining desirable material, different plating (being coated with) layer process is arranged, and use corresponding distinct device.As continuous hot dipping method is to make tungsten filament continuously by the molten bath of gold, is coated with the surface that the last layer gold obtains having gold plating at the tungsten filament surface heat; Adopt electroplating technology, then can under cold state, obtain one deck Gold plated Layer on the tungsten filament surface.The metal-coated tungsten filament performance of heat can not satisfy the requirement of use aspect a lot, though gold-plated tungsten wire has good performance since the electrode potential difference of tungsten and gold too Da Yi produce displacement layer and in electroplating process quality wayward.The equipment that continuous electroplating technology is used in static electroplate liquid generally is made up of plating tank, electrode, guide wheel.The tungsten filament of transmission is finished plating by the guide wheel that is immersed in the electroplate liquid continuously.In such device, electroplate the shortcoming below existing.Therefore (1) electroplate liquid can not flow, and is easy to generate concentration polarization and can not obtains uniform coating.(2) tungsten filament is to enter plating tank and finish galvanized by the guide wheel that is immersed in the electroplate liquid, this silk length in electroplate liquid that not only extended, and the inner meeting of guide wheel groove is adsorbed certain electric charge and silk is not plated, even or plate, coating is also insecure with combining of silk, very easily peels off, and the resistance between guide wheel and the silk also makes silk break easily in addition, thereby make the silk footpath be subjected to certain restriction, electroplating silk should not be too thin.
The purpose of this utility model is to design the continuous electroplating apparatus of the gold-plated usefulness of a kind of tungsten filament, electroplate liquid in this device is continuous round-robin, tungsten filament is in the continuous electroplating process, do not need to enter electroplate liquid by guide wheel, only in the length range of determining, contact and finish plating with electroplate liquid, gained coating is even, combines firmly with tungsten filament.
The continuous electroplating apparatus of the gold-plated usefulness of tungsten filament that the utility model proposes is made up of plating tank (3), nozzle (2), water pump (6), conduit (7), anode (1) etc.The entrance end of water pump (6) is connected with plating tank (3) by conduit (7); The exit end of water pump (6) links to each other with nozzle (2) by conduit (7).Nozzle (2) position and exceeds the position of plating tank upper surface in the plating tank scope.It is the open slot of a level, and preferably 2～10 centimetres of the length of groove are made with insulating material.Anode (1) is placed on nozzle (2) can be by on the electroplate liquid buried position.
In order to reduce the volume of plating tank (3), or the internal circulating load of control electroplate liquid, seal in bucket (4) and following bucket (5) at the import and export end of water pump (6).
Between last bucket (4) and plating tank (3), adorn a valve (8) and can control electroplate liquid round-robin speed on demand.
In the connection electroplanting device of the gold-plated usefulness of tungsten filament of the utility model design, electroplate liquid is contained in the plating tank (3), start water pump (6), electroplate liquid enters in the water pump (6) and by water pump (6) pump by conduit and enters nozzle (2) through conduit (7), is overflowed by nozzle (2) two ends and gets back to the circulation that realizes electroplate liquid in the plating tank (3).On the correct position of nozzle (2), place anode (1).Anode (1) can be metals such as platinum or gold, should be able to be by the electroplate liquid submergence.The spun gold that quilt is plated passes through nozzle (2) through guide wheel with certain speed as the negative electrode in electroplating, and contacts and anode (1) formation plating loop with electroplate liquid in nozzle (2), realizes the gold-plated process of tungsten filament.
For making tungsten filament can obtain firm coating in electroplating process, nozzle (2) should be made the open slot of a level, and the both ends open of groove can just overflow the electroplate liquid in the groove from both ends open after suitable capacity, guarantee that tungsten filament can fully contact with electroplate liquid.Nozzle application insulating material such as organic glass, various plastics are made.The length of nozzle should be within the specific limits, and length is too short, and then the electroplating time of tungsten filament is not enough, can not form the surface that covers whole tungsten filament; The oversize then tungsten filament of nozzle and electroplate liquid duration of contact be oversize does not plate on the contrary, should be controlled between 2～10 centimetres.The cross section of nozzle can be the garden shape of opening, square and various special crosssection.
Between the entrance end and plating tank of water pump (6), the internal circulating load that bucket (5) and last bucket (4) can dwindle the capacity or the control electroplate liquid of plating tank (3) is set down, between exit end and the nozzle respectively to save electroplate liquid and step-down concentration polarization.In addition, will go up bucket (4) and be placed on the correct position that is higher than plating tank (3), following bucket (5) is placed on the position that is lower than plating tank (3), and under then inscribing before keeping the electroplate liquid round-robin, water pump (6) can be interrupted work, thereby saves electric power.
For further controlling the quality of the Gold plated Layer of tungsten filament, should further can control the speed of circulation of electroplate liquid on demand.Speed of circulation is fast more, help more obtaining uniform coating, but speed of circulation is fast more, requires the amount of electroplate liquid also many more, want under the situation of an amount of electroplate liquid, realize that the speed of circulation of controlling electroplate liquid on demand can add a valve (8) between last bucket (4) and nozzle (2).
This continuous electroplating apparatus that uses the utility model to design can overcome the gold-plated middle deficiency that exists of tungsten filament in the prior art.Can be implemented in the technology of tungsten filament continuous gold-plating in the circulation electroplate liquid.Because tungsten filament only contacts with electroplate liquid in finite length in electroplating process, do not contact with electroplate liquid material in addition, therefore can eliminate the interference that is adsorbed on the electric charge in the guide wheel groove when using guide wheel, and obtain firm gold plate, electroplate liquid is again with certain speed circulation, can reduce and eliminate concentration polarization, the tungsten filament surface is contacted with new electroplate liquid always, security deposit's ion can constantly feed to the tungsten filament surface, thereby being under the condition than homogeneous all the time, electroplates by the tungsten filament in making dynamically, thereby the coating uniformity.Use different gold plating liquids and corresponding technology, the device of the utility model design both can be used for tungsten filament and had given gold-plated process, can be used for the operation of plating eventually of gold-plated tungsten wire again, obtained thin respectively and needed the Gold plated Layer of thickness.This device is applicable to the plating of the metal of various easy generation displacement layer.Simple, easy to operate being convenient to again of designed apparatus structure observed, and is fit to suitability for industrialized production.
Fig. 1 is a kind of tungsten filament continuous gold-plating device of the utility model design.
Fig. 2 is another tungsten filament continuous gold-plating device of the utility model design.
Fig. 3 is a kind of form of nozzle in the utility model design apparatus.
Fig. 4 is another form of nozzle in the utility model design apparatus.
Further specify embodiment of the present utility model with the following example:
Example 1. tungsten filament continuous gold-plating device as shown in Figure 1.Form by the plating tank (3), water pump (6), nozzle (2), the anode (1) that connect with conduit successively.Water pump (6) is that model is the magnetic drive pump of FCB-01; Use the rubber conduit.Nozzle is the opening level trough in cross section shown in Figure 3, and 3 centimetres of horizontal lengths are made with synthetic glass, and the anode of platinum plate system is placed on nozzle bottom, can be by electroplate liquid buried position, and electroplate liquid is the sulphite gold plating liquid, adopts the corresponding electroplating technology of this gold plating liquid.
Handle the rear surface cleaning through giving, the tungsten filament that diameter is 0.06 millimeter is as negative electrode, with the speed of 6 meters of per seconds by nozzle (2).In electroplating process, the electroplate liquid that startup water pump (6) will be contained in the plating tank (3) pumps into nozzle (2), electroplate liquid is contacted with tungsten filament in the length range of nozzle (2), in certain electric field, finish gold-plated process, tungsten filament is again through the subsequent handling of necessity, so that coating has desired every performance then.
Example 2. tungsten filament continuous gold-plating device as shown in Figure 2.Form by the plating tank (3) that connects with conduit successively, time bucket (5), water pump (6), last bucket (4), valve (8), nozzle (2), anode (1).Nozzle is the opening level trough in cross section shown in Figure 4, and 10 centimetres of horizontal lengths, anode are golden plates.Can be on demand in electroplating process regulated valve at any time, make electroplate liquid with the proper speed flow nozzle.
Claims (3)
1, the continuous electroplating apparatus of the gold-plated usefulness of a kind of tungsten filament, by plating tank, electrode is formed, and it is characterized in that:
(1) also comprises nozzle (2), water pump (6), conduit (7) in the said device, the entrance end of said water pump (6) is connected with plating tank (3) by conduit (7), the exit end of water pump (6) links to each other with nozzle (2) by conduit (7), nozzle (2) position is in the plating tank scope, and exceed on the position of plating tank upper surface, the anode in the said electrode (1) is placed on nozzle (2) can be by on the electroplate liquid buried position.
(2) said nozzle (2) is the open slot made from insulating material of a level, and the horizontal length of groove is 2～10 centimetres.
2,, it is characterized in that sealing in bucket (5) and last bucket (4) down respectively at the import and export end of said water pump (6) according to the continuous electroplating apparatus of the gold-plated usefulness of the said tungsten filament of claim 1.
3,, it is characterized in that a valve (8) is arranged between last bucket (4) and plating tank according to the continuous electroplating apparatus of the gold-plated usefulness of the said tungsten filament of claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87211969 CN87211969U (en) | 1987-08-22 | 1987-08-22 | Continuous electroplating device for gold-plating tungsten filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87211969 CN87211969U (en) | 1987-08-22 | 1987-08-22 | Continuous electroplating device for gold-plating tungsten filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN87211969U true CN87211969U (en) | 1988-07-20 |
Family
ID=4826693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 87211969 Withdrawn CN87211969U (en) | 1987-08-22 | 1987-08-22 | Continuous electroplating device for gold-plating tungsten filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN87211969U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102168294A (en) * | 2011-05-19 | 2011-08-31 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN102226289A (en) * | 2011-06-14 | 2011-10-26 | 淮海工学院 | Liquid phase plasma enhanced nano composite coating apparatus and its application method |
| CN103741186A (en) * | 2014-01-21 | 2014-04-23 | 广东保迪环保电镀设备有限公司 | Automatic production line for continuous electroplating of ultrafine metal wire |
| CN104685112A (en) * | 2012-12-18 | 2015-06-03 | 尼霍夫机械制造公司 | Device and method for electrolytically coating object |
-
1987
- 1987-08-22 CN CN 87211969 patent/CN87211969U/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102168294A (en) * | 2011-05-19 | 2011-08-31 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN102168294B (en) * | 2011-05-19 | 2012-07-04 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN102226289A (en) * | 2011-06-14 | 2011-10-26 | 淮海工学院 | Liquid phase plasma enhanced nano composite coating apparatus and its application method |
| CN104685112A (en) * | 2012-12-18 | 2015-06-03 | 尼霍夫机械制造公司 | Device and method for electrolytically coating object |
| US10047449B2 (en) | 2012-12-18 | 2018-08-14 | Maschinenfabrik Niehoff Gmbh & Co. Kg | Device and method for electrolytically coating an object |
| CN103741186A (en) * | 2014-01-21 | 2014-04-23 | 广东保迪环保电镀设备有限公司 | Automatic production line for continuous electroplating of ultrafine metal wire |
| CN103741186B (en) * | 2014-01-21 | 2016-04-20 | 广东保迪环保电镀设备有限公司 | Gas in Ultra-thin Metal Wires continuous electroplating automatic production line |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100564606C (en) | Apparatus for continuous electrodepositing of metallic film and method thereof | |
| CN101147238B (en) | Conductive trace formation via wicking action | |
| US4360410A (en) | Electroplating processes and equipment utilizing a foam electrolyte | |
| Johnson et al. | The effect of some addition agents on the kinetics of copper electrodeposition from a sulfate solution: II. Rotating disk electrode experiments | |
| CN104005077A (en) | Electroplating device with optimized temperature field distribution and electroplating method thereof | |
| US4935109A (en) | Double-cell electroplating apparatus and method | |
| US3884772A (en) | Method for producing a heat exchanger element | |
| CN87211969U (en) | Continuous electroplating device for gold-plating tungsten filament | |
| CN1446946A (en) | Technique method for electroplating inner surfaces of gear wheel holes and dedicated equipments | |
| US5342503A (en) | Method for high speed continuous wire plating | |
| CN210048863U (en) | Zipper puller electroplating device | |
| CN109735894A (en) | The electroplanting device of the ion concentration of electrolyte can be improved | |
| CN210458419U (en) | Electroplating device capable of improving ion concentration of electrolyte | |
| CN1285419C (en) | Internal heat spreader plating methods and devices | |
| CN207002846U (en) | A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field | |
| CN101570876B (en) | Electroplating device and electroplating method for electroplating drills | |
| CN206447959U (en) | A kind of diamond wire nickel plating apparatus | |
| CN214881900U (en) | Manufacturing device for electroplated diamond wire with uniformly distributed micro powder and sectionally distributed micro powder | |
| CA1047437A (en) | Method of and apparatus for, local electroplating of strip material | |
| CN1117178C (en) | Technology process and equiment for depositing permalloy film electrically | |
| CN2414080Y (en) | High-speed electroplating equipment | |
| CN2123537U (en) | Multiple-hole side-in-and side-out electrolytic deposition cell | |
| CN220846319U (en) | Jet flow combined anode box device for battery piece electroplating and electroplating device | |
| CN220952133U (en) | Electroplating equipment | |
| CN114264708B (en) | Method for rapidly analyzing potential influence in chemical deposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |