CN87107692A - The manufacture method of semiconductor device - Google Patents

The manufacture method of semiconductor device Download PDF

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Publication number
CN87107692A
CN87107692A CN198787107692A CN87107692A CN87107692A CN 87107692 A CN87107692 A CN 87107692A CN 198787107692 A CN198787107692 A CN 198787107692A CN 87107692 A CN87107692 A CN 87107692A CN 87107692 A CN87107692 A CN 87107692A
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China
Prior art keywords
adhesive
small pieces
substrate
heated
lead frame
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Pending
Application number
CN198787107692A
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Chinese (zh)
Inventor
威廉N·博尔斯脱
斯查德利A·马库斯
林肯·耶
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M&T Chemicals Inc
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M&T Chemicals Inc
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Publication of CN87107692A publication Critical patent/CN87107692A/en
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract

The invention provides a kind of manufacture method of semiconductor device, it comprises on the platelet that at first resin binder is placed lead frame, then by heating up rapidly, makes the binder resin activation, then small pieces is placed on the adhesive of activation again.Later on common metal wire bonding and sealing process, so that required semiconductor device to be provided.

Description

The present invention relates to the assembling of semiconductor device, more specifically to using the polymer-type small pieces to link adhesive, and small pieces are connected method and apparatus on the lead frame.
The processing system that relates to the assembling stage of hybrid circuit, chip on board and other semiconductor device of using polymer type adhesive adopts following general processing sequence:
(1) is under the state of room temperature at adhesive and substrate, adhesive is applied on the substrate (for example lead frame);
(2) small pieces are placed on the adhesive;
(3) said modules is dried under 135 ℃ of-250 ℃ of temperature, so that adhesive solidifies;
(4) with metal wire small pieces are connected with point on the substrate, make to form between the two to electrically contact; With
(5) with small pieces sealings (for example it being molded in the epoxy resin), to finish encapsulation.
With following any method proof gold, billon silk or aluminium wire are welded on die pad and the lead-in wire:
(1) connects at the hot sonic soldering that is about room temperature to 300 ℃ left and right sides temperature range; Or
(2) in pressurization and about or hot pressing welding under the higher temperature up to 300 ℃.
As any pile line operation, the process velocity in each step and required space are crucial.
The adhesive that is used for small pieces are engaged with lead frame can be:
(1) conductive material;
(2) thermal conductivity material; Or
(3) non-conductive material.
If the design of semiconductor subassembly is to use the back side of small pieces as earth terminal, then need conductive adhesive, so that electric current can be drawn from lead frame.
On the other hand, available one or several pads are made earth terminal, so that electric current is drawn by lead-in wire.Under latter event, with thermal conductance or non-conductivity adhesive as small plate adhering material.
Used polymer type adhesive is epoxy resin and polyamic acid in this field at present, and the latter is cured into polyimides.
The purpose of this invention is to provide a kind of improved method, semi-conductor device manufacturing method.
Another object of the present invention provides a kind of method of saving one or more manufacturing steps.
Another purpose of the present invention provides a kind of method that shortens semiconductor device whole manufacturing process required time.
A further object of the present invention provides a kind of be used to implement described equipment of improving one's methods or device.
By further this specification of reading, other purposes of the present invention will be to show and easy rising for the skilled person in this technical field.
Disclosed a kind of method that semiconductor device is made of improving already, it comprises the steps:
(a) the polymer type adhesive composition with the bonding amount places on the substrate;
(b) heat this adhesive composition then, make the adhesive activation; With
(c) adhesive is contacted with small pieces, thus small pieces are connected on the substrate.
This method is well suited for by following step small pieces is connected on the lead frame:
(1) the polymer-type adhesive composition with bonding knot amount places position predetermined on the lead frame;
(2) make the temperature of polymer type adhesive composition be increased to the degree that said adhesive activates;
(3) making a slice contain small pieces that link pad at least contacts with said activation binding agent; With
(4) then, link with metal wire and sealing and finish assembling.
Comprise in order to the device of implementing said method:
(A) each small pieces that have backing plate and so in order to transmission are placed the substrate (as lead frame) at position, make it the conveying equipment by portable assembly belt operation;
(B) when substrate moves through assembly process, place the equipment at position in order to adhesive is applied to said small pieces;
(C) the selectivity pre-heating device in order to selectively mobile substrate is heated;
(D) in order to the firing equipment of binding agent on the heated substrate;
(E) in order to select and small pieces placed the equipment on the heated binding agent on the substrate; With
(F) when substrate is mobile below assembly line, in order to selectively to the rearmounted firing equipment of the selectivity that heats of substrate assembly of bonding small pieces.
The structural material of substrate is unimportant.Therefore, said substrate can be a die-attach area, ceramic substrate or ceramic shell, ceramic mixture or materials similar.
The firing equipment of binding agent heating usefulness can be the known any suitable heater of this technical field skilled person, for example heating plate, heated air or nitrogen current, laser beam and infrared lamp etc.Equally, rearmounted firing equipment is not limited to any specific equipment, also can be heating plate, infrared heater, heated air or nitrogen, microwave or induction heater etc.
Figure is 1 to be perspective view, approximate adopt the procedure of processing of a kind of variant of the present invention of bonding paste.
Fig. 2 is the perspective view that adopts another variant of the present invention of adhesive tape.
Be used for implementing that the pipelining equipment of common assembling stage operation can buy on market, and be that these those skilled in the art are known. Can be reequiped this kind equipment, in order to be used for implementing the present invention.
The adhesive that enforcement the present invention uses is a kind of composition take polymer as active principle. Cause This, this class adhesive not only can adopt curable or hardenable thermosetting resin, also can adopt thermoplastic resin. Adhesive can be pasty state, film, adhesive tape, paper tinsel or belt form.
The used optimum resin adhesive of the present invention is thermoplastic pasty state or banded resin binder, because the residual stress that this class adhesive produces at chip or small pieces is little than the residual stress that the thermosetting that chemical reaction during heating takes place or curable product cause.
Paste (being paste adhesive) is the non-solid mixt that is dispersed in formed very thickness in liquid suspension medium or the solvent by solid particle.
Film, adhesive tape, paper tinsel and belt can come with the paste difference according to the rheological characteristic of its non-thickness. The supporting of adhesive tape, paper tinsel and belt is not essential, but can use with interleaving agent, clings when transmitter winds off to prevent it.
Be used for implementing thermoplastic resin component of the present invention and should possess following character: but stable under the room temperature, flexible hot activation and heat resistance. They should not lose its rheological equationm of state at low temperatures, also should be along with the time, embrittlement took place. Preferably they should be able to be dissolved in the organic solvent, and easily desolventizing and the unlikely trace solvent that stays is attached on the resin or and resin complexation. Simultaneously, these resins should have a water resisting property, and metal and small pieces are demonstrated fabulous tack, can bear higher conductive filler load, and have lower specific insulation value.
Suitable thermoplastic resin comprises United States Patent (USP) 3,177,090 and 3, thermoplastic poly hydroxy ether (phenoxy resin) described in 395,118, United States Patent (USP) 3,410,875 and 3,615, polyimides described in 913, United States Patent (USP) 3,933, the poly (arylene ether)-polyethers described in 764-polysulfones resin, and polyphenylene oxygen and other low stresses that are referred to as for building or function admirable binder resin, high temperature thermoplasticity multi-aryl-resin.
Also can use for metal commonly used in the semiconductor devices non-corrosively, comprise polymerized alpha, the thermoplastic resin of β-alkene unsaturated alkyl, but the enough height of its second order change temperature prevents that with activation the small pieces that are bonded on the substrate are moved.
Because corrosion is a key factor in semiconductor devices, thereby many thermoplastic resins commonly used all can not be applied. For instance, such as polyvinyl chloride, polyvinylidene chloride, chlorine The vinyl halide polymers of ethene-alpha-olefin copolymer and so on, acrylate or methacrylate copolymer, chlorobutadiene, acrylonitrile polymer etc. are all unsatisfactory.
Preferably select United States Patent (USP) 3,440,527,3,575,923,3,875,116 and 4, method described in 395,527 and siloxanes-modified polyimide of preparing (is quoted above-mentioned patented technology herein, for your guidance) as thermoplastic resin used in the adhesive composition of the present invention.
Bonding paste comprises:
(a) be about 5%-75%(by weight) thermoplastic resin, but take 5%-85%(by weight) as good;
(b) be about 25%-95%(by weight) thermal conductance or electroconductive stuffing, but take 5%-75%(by weight) as good; With
(c) be about 0%-50%(by weight) organic solvent, but take 20%-50% as good (by weight).
As required, also can comprise some other additives in the preparation, regulating viscosity, rheological characteristic, the viscosity of wet paste or dry adhesives, and other physical propertys.
Electroconductive stuffing can be any metal for this field, such as silver, gold, platinum, palladium, iridium, mercury, ruthenium and osmium. Also can use mixture or the alloy of these metals. Yet best metal is silver, can use with fine silver or with the form of platinum or palladium formation alloy. Electroconductive stuffing also can be painted on glass or the ceramic substrate, reducing cost, or changes the character of adhesive.
The thermal conductance filler can be the oxide of beryllium oxide, aluminium oxide, silica and antimony, magnesium or zinc etc.
If wish uses thermosetting resin as polymer type adhesive, then can from the commercially available material of epoxy resin, polyamic acid, maleimide and so on, select.
The organic solvent that is used for this class adhesive should be able to dissolving resin, and enough volatility will be arranged, easily remove with activation, and unlikely being attached on the resin. Suitable solvent comprises all Such as triglyme, diethylene glycol dimethyl ether and 1,1 of 2-ethylene diethylene glycol dimethyl ether (glyme) and so on, the monoalkyl of the pure and mild condensation polyethylene glycol of 2-ethylene and/or the derivative of dialkyl ether and/or comprise the cyclic ether derivative of the ring of at least one 5 atomicity; And METHYLPYRROLIDONE, r-butyrolactone, 2-(2-ethyoxyl) ethyl acetate (Carbitol acetate) and 2-butoxy acetic acid ethyl ester (butyl Cellosolve) etc. Best solvent is diethylene glycol dimethyl ether, and is especially all the more so when being siloxanes-modified polyimide at resin. After the solvent evaporates, adhesive itself comprises about 5-50%(by weight) resin, be preferably 8-30%, and 40-95%(is by weight) metal, be preferably 65-90%.
As required, also can add unclassified stores in adhesive, this comprises rheology modifier, inert filler, colouring agent and colloidal silica gel.
The feature that is applicable to the thermoplastic resin of preparation adhesive composition also is its second level glass transformation temperature. It is 100 ℃ that this class preparation should have a minimum of a value, and maximum is 285 ℃, and take 150 °-250 ℃ scope as good.
The molecular weight of siloxanes-modified polyimide resin (mean value) is about 50,000-200, in 000 scope.
These thermoplastic resins have higher elasticity and flexibility, thereby small pieces can be bonded on the lead frame when enforcement is of the present invention, and the danger of small pieces stress cracking can not occur. Stress can be regarded as with the crosslinked volume contraction that causes and change, and volume contraction then is delivered to stress on the chip. Creep mechanism relaxes thermoplastic and eliminates stress. This than before used resin, such as epoxy resin, two maleimide resin and polyamic acid resin etc. major improvement has been arranged, these in the past contractions of taking place when solidifying of used resin also impel the generation of stress.
By using web plate die, syringe or imprinting apparatus (being similar to offset printing) adhesive can be applied to the appointed part in advance of lead frame, a motion arm of described imprinting apparatus takes out adhesive from jar or reservoir vessel, move then, adhesive is applied on the lead frame by the impression mode.Employing Automatic Program distribution technique has solved the mechanical problem such as space or excess binder.
First variant of the present invention is to have saved the time owing to cold adhesive is applied in the cold pin frame than beyond thought advantage of prior art method.Firing equipment can make bonding paste temperature raise at 0.5-2.5 in time second, remove solvent, the thermoplastic adhesives point that stays the next one to be clamminess, the in place and bonding for small pieces.Of short duration postposition heating can make removal of solvents reach the optimization degree.Then, the lead frame that has the small pieces that bond has pending final procedure of processing, and promptly metal wire welds, seals and be separated into semiconductor device.
Term used herein " activation " means under this state, and the resin in the adhesive possesses small pieces are bonded to effect in the lead frame.Therefore, containing or be under the situation of binder resin paste of active ingredient with the thermoplastic resin, by making the temperature that organic solvent fully removed and the thermoplastic resin of thermotropism provides enough viscosity, be enough to small pieces are bonded in adhesive property on the lead frame to make it to demonstrate.After the activation, these pastel are essentially solid-state.When solvent was diethylene glycol dimethyl ether, effectively activation temperature was about 200 ℃.
With regard to thermosetting resin, activation in the present invention is meant a kind of like this state, be that they are cured or are cross-linked to a certain degree, play the adhesive effect of small pieces bondings usefulness with activation, meanwhile discharge or not release solvent or volatile liquid (for example water generates being arranged) at the polyamic acid setting up period.Activation temperature can be in about 175 ℃ to 350 ℃ scope.
Above-mentioned definition is applicable to that also with thermoplasticity or thermosetting resin be the band of adhesive of main component.
The present invention not only is fit to participate in the assembling of hybrid circuit and chip on board, also is fit to participate in " jelly beans " (" jelly lean ") IC technology of assembly line full-speed operation at full throttle.
The present invention will be further described in following examples.Unless otherwise specified, all umber and percentage number average are by weight.
Embodiment 1
With reference to Fig. 1, lead frame 2 as a conveyer belt feeding device part passes through near adhesive application devices 4, and described application devices 4 can be screen printing, syringe or marking press, and it is that the bonding paste 6 of active principle is added on the backing plate 8 on the lead frame with the polymer with a small amount of metering in advance under the room temperature.Have with the lead frame of paste 6 by behind the selectivity pre-heating device 10, arrive preheating table 12, here, the temperature of paste 6 rises to the degree that is enough to make the adhesive activation rapidly.Solvent herein is a diethylene glycol dimethyl ether, and temperature can be from about about 50 ℃ to 200 ℃.At this moment, the transferring arm of small pieces transmitting apparatus 14 is placed on small pieces 16 on the heat adhesive 6, on the platelet 8 that sticks to lead frame.Be bonded on the backing plate 8 of lead frame 2 small pieces 16 along with lead frame by selectivity firing equipment 18, or without this equipment 18, and directly arrive the suitable loading head such as hopper 20 that leads to the metal wire welding sequence.
According to the method for present embodiment, with having filled the preparation of thermoplastic polyimide (as United States Patent (USP) 4,395,527 is described, quoted, for your guidance) the small pieces shear strength of resulting small pieces coherent mass has surpassed the desired numerical value of MLI-STD-883C standard as shown below herein
Test bit (kilogram)
Initial small pieces shear strength 8.0
Small pieces under 150 ℃ after 1000 hours
Shear strength 5.0
Autoclave pressure (121 ℃, 15 pounds/inch 2Gauge pressure)
In small pieces shear strength 7.5 after 250 hours
1000 hours (85 ℃, 85% relative humidity)
After small pieces shear strength 6.0
The thermal property of the small pieces coherent mass that is obtained by this method is as follows:
Test bit
400 ℃ of airborne hot weight fraction
Analyse, weightlessness, % 3.8
Mistake in 250 ℃ of air after 16 hours
Heavy, % 2.5
By the residual stress that IC obtains, rice＞15
A SM E* thermal conductivity, British thermal unit (Btu)/hour-inch 2
(/foot) 0.47
The highest metal wire sticking temperature, ℃ 225
* A SM E-American Society of Mechanical Engineers (AMSE)
The electrical property of the small pieces coherent mass that is produced is as follows:
Test bit
Specific volume resistance after the oven dry, ohm-9.0 * 10 -5
Centimetre
At the volume after 1,000 hour under 150 ℃
Resistance coefficient, ohm-cm 8.3 * 10 -5
Autoclave pressure (121 ℃, 15 pounds/inch 2Table
Pressure) volume in after 250 hours
The resistance coefficient, ohm-cm 9.0 * 10 -5
Warp under 85 ℃ and 85% relative humidity
Specific volume resistance after 1000 hours,
Ohm-cm 9.0 * 10 -5
Embodiment 2
Join bright Fig. 2, be transmitted through selectivity firing equipment 26 as the lead frame 22 of conveyer belt feeding device 24 parts, arrive and heating plate 28 contacted positions, herein, the temperature of platelet 30 rises to the degree that is enough to make used special adhesive activation rapidly.For being the adhesive of active princlple with the thermoplastic resin, this temperature is about 250 ℃ to 350 ℃.The application devices 32 of being furnished with the adhesive tape of cutter and applicator 34 cuts off adhesive tape, and the thin slice 35 that will bond places and is heated on the backing plate 30.And then the transferring arm of small pieces transmitting apparatus 36 is placed on small pieces 37 on the bonding thin slice that is heated and activates that is attached on the backing plate 30.Be bonded on the backing plate 30 of lead frame 22 small pieces 37 in company with lead frame 22 on conveyer belt feeding device 24 by selectivity heater 38(or this heater 38 of bypass) arrive loading head or hopper 40, to treat the processing of metal wire bonding operation.
Invention described herein is preferably carried out in a continuous manner, but as required, also can realize by intermittent mode.
Though above optimised form of the present invention has been done comparatively detailed description, should be pointed out that what announcement of the present invention was only made by the mode of embodiment, and under prerequisite without departing from the spirit and scope of the present invention, can make many kinds of variations.

Claims (37)

1, a kind of small pieces is attached at method on the substrate, it is characterized in that described method, comprise the steps:
(a) the polymer type adhesive composition with the bonding amount is applied on the substrate;
(b) then said adhesive composition is heated to the degree that makes the adhesive activation; With
(c) activated adhesive is contacted with small pieces, thus said small pieces are connected on the substrate.
2, method according to claim 1 is characterized in that said adhesive composition is the pasty state form.
3, method according to claim 2 is characterized in that said adhesive composition is heated to about 175 ℃ to 350 ℃ temperature.
4, method according to claim 3 is characterized in that said paste adhesive comprises the thermosetting polymer component.
5, method according to claim 4 is characterized in that the thermosetting polymer component in the paste adhesive comprises epoxy resin or maleimide resin.
6, method according to claim 2 is characterized in that said paste adhesive comprises thermoplastic polymer components.
7, method according to claim 6 is characterized in that the thermoplastic polymer in the said paste adhesive is a thermoplastic polyimide.
8,, it is characterized in that said paste adhesive is heated to 50 ℃-200 ℃ approximately, to activate according to claim 6 or 7 described methods.
9, method according to claim 1 is characterized in that said adhesive is the form of membranaceous or belt.
10, method according to claim 9 is characterized in that said adhesive is heated to 175 ℃-350 ℃ approximately.
11, method according to claim 1 is characterized in that said substrate comprises a die-attach area.
12, method according to claim 1 is characterized in that said substrate comprises a ceramic substrate.
13, method according to claim 12 is characterized in that said substrate comprises a ceramic mixed substrates.
14, method according to claim 12 is characterized in that said substrate comprises a ceramic shell (package).
15, method according to claim 1 is characterized in that said substrate comprises a circuit board.
16, method according to claim 2 is characterized in that said adhesive composition comprises:
The 5-15% resin; The 25-95% filler; The 0-50% solvent.
17, method according to claim 6 is characterized in that said adhesive composition comprises:
The 5-85% thermoplastic resin; The 25-75% filler; The 20-50% solvent.
18, method according to claim 17 is characterized in that said filler comprises a kind of electroconductive stuffing.
19, method according to claim 18 is characterized in that said electroconductive stuffing is any metal that is selected from the classification of being made up of silver, gold, palladium, iridium, mercury, ruthenium, osmium and their mixture or alloy.
20, method according to claim 17 is characterized in that said filler comprises a kind of thermal conductance filler.
21, method according to claim 20 is characterized in that said thermal conductance filler is a beryllium oxide.
22, method according to claim 20 is characterized in that said thermal conductance filler is an aluminium oxide.
23, method according to claim 1 is characterized in that the assembly that is made of substrate, adhesive and small pieces is further heated.
24, method according to claim 1 is characterized in that said method carries out in a continuous manner.
25, a kind of small pieces are attached at method in the die-attach area, it is characterized in that said method comprises:
(a) the pasty state thermoplastic polymer type adhesive composition with the bonding amount places on the backing plate of lead frame;
(b) then adhesive composition is heated to about 50 ℃ to 200 ℃ temperature, makes the adhesive activation;
(c) small pieces are put on the adhesive of activation; With
(d) also can further heat again, small pieces are bonded on the lead frame the assembly that lead frame, adhesive and small pieces constituted.
26, method according to claim 25 is characterized in that said method carries out in a continuous manner.
27, a kind of small pieces are attached at method on the die-attach area, it is characterized in that said method comprises:
(a) the band shape of bonding amount or membranaceous thermoplastic polymer type adhesive composition are placed on the backing plate of lead frame;
(b) then adhesive composition is heated to about 250 ℃-350 ℃, makes the adhesive activation;
(c) small pieces are put on the adhesive of activation; With
(d) also can further heat the assembly that constitutes by lead frame, adhesive and small pieces again, small pieces are attached on the lead frame.
28, method according to claim 27 is characterized in that said method carries out in a continuous manner.
29, a kind ofly with polymer type adhesive small pieces are connected device on the substrate, it comprises:
(a) with so that substrate moves through this device delivery equipment;
(b) before applying adhesive, be used for the selective apparatus of heated substrate;
(c) be used for adhesive composition is applied to the equipment of selecting the position on the substrate;
(d) before placing small pieces, be used for the firing equipment of heated adhesive;
(e) select and small pieces are placed equipment on the heated adhesive; With
(f) be used for carry out the selective apparatus of rearmounted heating by substrate, assembly that adhesive and small pieces constituted.
30, device according to claim 29 is characterized in that said adhesive is the pasty state form.
31, device according to claim 29 is characterized in that said adhesive is membranaceous or the belt form.
32, device according to claim 29 is characterized in that the firing equipment of said adhesive heating usefulness comprises a heating plate.
33, device according to claim 29 is characterized in that the firing equipment of said adhesive heating usefulness comprises one thermal air current.
34, device according to claim 29 is characterized in that the firing equipment of said adhesive heating usefulness comprises laser.
35, device according to claim 29 is characterized in that the firing equipment of said adhesive heating usefulness comprises infrared lamp.
36, device according to claim 29 is characterized in that rearmounted firing equipment comprises one or more heating plate.
37, device according to claim 29 is characterized in that said rearmounted firing equipment comprises infrared heater.
CN198787107692A 1986-11-13 1987-11-06 The manufacture method of semiconductor device Pending CN87107692A (en)

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US93060086A 1986-11-13 1986-11-13
US930,600 1986-11-13

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JP (1) JPH01502868A (en)
KR (1) KR910006966B1 (en)
CN (1) CN87107692A (en)
BR (1) BR8707876A (en)
WO (1) WO1988003704A1 (en)

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WO1988003704A1 (en) 1988-05-19
BR8707876A (en) 1990-03-01
JPH01502868A (en) 1989-09-28
KR910006966B1 (en) 1991-09-14
EP0333734A1 (en) 1989-09-27
KR890700267A (en) 1989-03-10

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