CN2938415Y - 一种固晶机接料装置 - Google Patents

一种固晶机接料装置 Download PDF

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Publication number
CN2938415Y
CN2938415Y CNU2006200177267U CN200620017726U CN2938415Y CN 2938415 Y CN2938415 Y CN 2938415Y CN U2006200177267 U CNU2006200177267 U CN U2006200177267U CN 200620017726 U CN200620017726 U CN 200620017726U CN 2938415 Y CN2938415 Y CN 2938415Y
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pulp
collecting box
groove
receiving device
brilliant machine
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刘义红
卢业金
刘兴根
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Yang Shaochen
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杨少辰
韩金龙
罗会才
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Paper (AREA)

Abstract

本实用新型公开了一种固晶机接料装置,该接料装置包括一升降台(1);其中升降台(1)上设置有至少两个接料盒(2),所述的两个接料盒(2)上下垂直分布。该接料装置极大地减少了收集LED支架所需的时间,明显地提高了生产效率。

Description

一种固晶机接料装置
技术领域
本实用新型涉及一种固晶机接料装置。
背景技术
固晶机是生产发光二极管过程中必不可少的设备,固晶的目的在于:利用粘接剂将晶粒(芯片)黏着于导线支架或基板表面,使其固着于基座上,利于焊线及压模。固晶机的步骤流程如下:首先在上料系统位置准备好发光二极管支架,接着运送发光二极管支架至送料系统,用自动定量点胶设备点上银浆,然后以电脑自动固晶装置固定晶粒(芯片)位置,最后将发光二极管支架输送至下料系统。
传统上采取人工固晶的方式,如图1所示,即工作人员透过显微镜在支架2的碗杯内点上银浆,然后将发光芯片1粘在支架2的碗杯内,接着工作人员将粘好芯片的支架整齐的摆放在接料盒内,接料盒内设置有多条平行的支架卡槽。这种人工接料方式的缺点如下:由于固晶机采用全自动的操作方式,粘完芯片的支架会快速稳定地从导轨送出,如果仍然用工作人员来摆放支架,那一定会浪费大量的时间,从而明显地降低工作效率。
实用新型内容
本实用新型所要解决的技术问题是提供一种固晶机接料装置,该接料装置不仅可以连续地将LED支架送入接料盒,而且也可以准确无误地将支架嵌入卡槽,从而节省了大量时间,提高了固晶机的工作效率。
为了解决上述技术问题,本实用新型采用了以下技术方案:一种固晶机接料装置包括一升降台,在升降台上设置有至少两个接料盒,所述的两个接料盒上下垂直分布。接料盒上设置有两个立板,两个立板互相平行。升降台上还设置有至少两个接料槽,两个接料槽上下垂直分布,位于上方的接料槽与上方的接料盒相套合,位于下方的接料槽与下方的接料盒相套合。在所述的两个接料槽一侧分别设置有一个光电感应器,在所述的两个接料槽另一侧分别设置有一弹簧片。在每个接料盒内设置有多条数目相等的卡槽,卡槽之间互相平行。接料盒与接料槽由铝合金材料制成。
上述技术方案中,弹簧片起着夹紧和定位接料盒的作用。如果没有设置弹簧片,当接料盒插入接料槽中准备接受支架时,由于接料槽和接料盒之间存在一间隙,那么接料盒内的第一条卡槽很可能和送料系统的导轨不在同一直线上,结果是,从送料系统导轨上输送来的LED支架很难进入接料盒中。如果接料槽上设置一长方形弹簧片,当接料盒插入接料槽中时,在弹簧的作用下,接料盒的立板顶住同侧的接料槽立板,此时接料盒内的第一条卡槽和送料系统的导轨在同一直线上,因而从送料系统导轨上输送来的LED支架能够准确地进入接料盒中。
接料盒立板的上表面设置有两个支撑柱。对应地,在接料盒立板底面亦设置有两个可容纳支撑柱的孔,当两个或两个以上的接料盒接满LED支架时,为了便于运送而把数个接料盒套合在一起,套合的方式是下面接料盒的支撑柱插入上面接料盒的孔中。
上述技术方案中,在固晶机开始工作之前,将上下两个空接料盒放入对应的接料槽内,此时,接料槽侧板上的光电感应器感应到接料盒已插入,光电感应器立即向主控制器发出信号,主控制器启动固晶机开始工作时,LED支架从上料系统落下至送料导轨上,在导轨上进行涂抹银浆和黏结芯片的操作过程,同时主控制器通过控制电机来调整接料盒的位置,使接料盒中的第一条卡槽对准送料导轨出口,当第一条LED支架从送料导轨上下来时,正好进入接料盒中的第一条卡槽,第二条LED支架从送料导轨上下来时,正好进入接料盒中的第二条卡槽,依次类推,最后一条LED支架从送料导轨上下来时,正好进入接料盒中的最后一条卡槽。然后,主控制器控制电机来调节接料盒的纵向和横向位置,使下方的接料盒第一条卡槽对准送料导轨出口,接着第一条LED支架从送料导轨上下来,正好进入接料盒中的第一条卡槽,依次类推,当下方的接料盒收集LED支架时,同时将上方已满的接料盒换成空接料盒继续收集LED支架;同理,当上方的接料盒收集LED支架时,将下方已满的接料盒换成空接料盒继续收集LED支架,如此循环往复不停地从送料导轨上收集已粘好芯片的LED支架。当有两个或两个以上载满支架的接料盒出现时,将接料盒通过支撑柱上下套合在一起,传送至下一道工序的起点。
由于这种固晶机接料装置采用了主控制器调节接料盒上下循环往复地连续接料,从而极大地减少了收集LED支架所需的时间,明显地提高了生产效率。另外,接料槽上设置有一个金属弹簧片用来夹紧接料盒,该弹簧片结构简单,成本低,重复使用率高,效果良好。
附图说明
下面结合附图和具体实施方式对本实用新型作进一步详细地说明。
图1是发光二极管的结构示意图。
图2是本实用新型实施例的后视图。
图3是本实用新型实施例的右视图。
图4是本实用新型实施例的局部视图。
图5是本实用新型实施例的等轴侧图。
具体实施方式:
参阅图2-5,一种固晶机接料装置由升降台1,接料槽4和接料盒2组成,升降台1上设置有两个接料槽4,两个接料槽4的料道内分别设置有一个接料盒2,接料盒2的宽度略小于接料槽4的宽度。两个接料盒2上下垂直分布,每个接料盒2上设置有两个立板3,两个立板3互相平行,立板3上设置有两个支撑柱5。两个接料槽4同侧分别设置有一个光电感应器,两个接料槽4的另一侧分别设置有一个弹簧片。在每个接料盒2内设置有数目相等的卡槽6,卡槽6之间互相平行,每条LED支架可以直立地放置在卡槽6内。
主控制器启动固晶机开始工作时,LED支架从上料系统落下至送料导轨上,在导轨上进行涂抹银浆和黏结芯片的操作过程,同时主控制器通过控制电机来调整接料盒2的位置,使接料盒2中的第一条卡槽对准送料导轨,当第一条LED支架从送料导轨上下来时,正好进入接料盒2中的第一条卡槽,第二条LED支架从送料导轨上下来时,正好进入接料盒2中的第二条卡槽,依次类推,最后一条LED支架从送料导轨上下来时,正好进入接料盒2中的最后一条卡槽。然后,主控制器控制电机来调节接料盒2的高度和水平位置,使下方的接料盒2第一条卡槽对准导轨出口,接着第一条LED支架从送料导轨上下来,正好进入接料盒中的第一条卡槽,依次类推,当下方的接料盒2收集LED支架时,同时将上方已满的接料盒换成空接料盒继续收集LED支架;同理,当上方的接料盒2收集LED支架时,同时将下方已满的接料盒换成空接料盒继续收集LED支架,如此循环往复不停地从送料导轨上收集已粘好芯片的LED支架。当有两个或两个载满支架的接料盒出现时,将接料盒通过支撑柱上下套合在一起,传送至下一道工序的加工点。
以上对本实用新型所提供的一种固晶机接料装置进行了详细介绍,本文中应用了特定个例对本实用新型的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本实用新型的方法及其核心思想;同时,对于本领域的一般技术依据本实用新型的思想,在特定实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本实用新型的限制。

Claims (6)

1、一种固晶机接料装置包括一升降台(1),其特征在于:升降台(1)上设置有至少两个接料盒(2),所述的两个接料盒(2)上下垂直分布。
2、如权利要求1所述的固晶机接料装置,其特征在于:所述的接料盒(2)上设置有两个立板(3),两个立板(3)互相平行。
3、如权利要求1所述的固晶机接料装置,其特征在于:所述的升降台(1)上还设置有至少两个接料槽(4),所述的两个接料槽(4)上下垂直分布,在所述的接料槽(4)一侧各设置一个光电感应器,在另一侧各设置一弹簧片。
4、如权利要求3所述的固晶机接料装置,其特征在于:位于上方的接料槽与上方的接料盒相套合,位于下方的接料槽与下方的接料盒相套合。
5、如权利要求2所述的固晶机接料装置,其特征在于:所述的立板(3)上设置有两个支撑柱(5)。
6、如权利要求3所述的固晶机接料装置,其特征在于:接料盒(2)与接料槽(4)由铝合金材料制成。
CNU2006200177267U 2006-08-11 2006-08-11 一种固晶机接料装置 Expired - Fee Related CN2938415Y (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101640244B (zh) * 2009-08-20 2011-01-05 张九六 一种联排片状LED自动剥料分Bin设备
CN105417085A (zh) * 2015-12-10 2016-03-23 江阴乐圩光电股份有限公司 一种新型进料装置
CN106997863A (zh) * 2017-05-18 2017-08-01 深圳市新益昌自动化设备有限公司 一种用于led固晶机的支架自动供料系统及其运行方法
CN109550873A (zh) * 2018-12-28 2019-04-02 杭州易正科技有限公司 一种电容器切脚的回收料盒装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101640244B (zh) * 2009-08-20 2011-01-05 张九六 一种联排片状LED自动剥料分Bin设备
CN105417085A (zh) * 2015-12-10 2016-03-23 江阴乐圩光电股份有限公司 一种新型进料装置
CN106997863A (zh) * 2017-05-18 2017-08-01 深圳市新益昌自动化设备有限公司 一种用于led固晶机的支架自动供料系统及其运行方法
CN106997863B (zh) * 2017-05-18 2023-11-10 深圳新益昌科技股份有限公司 一种用于led固晶机的支架自动供料系统及其运行方法
CN109550873A (zh) * 2018-12-28 2019-04-02 杭州易正科技有限公司 一种电容器切脚的回收料盒装置

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Address after: Guangdong city of Shenzhen province Baoan District Fuyong new streets and community Fuyuan Road HUAFA Industrial Park, building A11, zip code: 518103

Patentee after: Yang Shaochen

Address before: Guangdong city of Shenzhen province Baoan District Fuyong new streets and community Fuyuan Road HUAFA Industrial Park, building A11, zip code: 518103

Patentee before: Daying NC Equipment(Shenzhen) Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070822

Termination date: 20100811