CN2935467Y - 具有多层涂层的抗腐蚀铝元件 - Google Patents
具有多层涂层的抗腐蚀铝元件 Download PDFInfo
- Publication number
- CN2935467Y CN2935467Y CNU200620000359XU CN200620000359U CN2935467Y CN 2935467 Y CN2935467 Y CN 2935467Y CN U200620000359X U CNU200620000359X U CN U200620000359XU CN 200620000359 U CN200620000359 U CN 200620000359U CN 2935467 Y CN2935467 Y CN 2935467Y
- Authority
- CN
- China
- Prior art keywords
- gas
- aluminium
- process chamber
- substrate
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/037,633 US7732056B2 (en) | 2005-01-18 | 2005-01-18 | Corrosion-resistant aluminum component having multi-layer coating |
| US11/037,633 | 2005-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2935467Y true CN2935467Y (zh) | 2007-08-15 |
Family
ID=36684247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200620000359XU Expired - Lifetime CN2935467Y (zh) | 2005-01-18 | 2006-01-18 | 具有多层涂层的抗腐蚀铝元件 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7732056B2 (enExample) |
| JP (1) | JP4881015B2 (enExample) |
| CN (1) | CN2935467Y (enExample) |
| TW (1) | TWM310107U (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102061472A (zh) * | 2011-01-26 | 2011-05-18 | 巨科集团有限公司 | 一种镜面铝表面氧化镀膜方法 |
| CN102400091A (zh) * | 2010-09-10 | 2012-04-04 | 鸿富锦精密工业(深圳)有限公司 | 铝合金的表面处理方法及由铝合金制得的壳体 |
| CN102458068A (zh) * | 2010-11-03 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 壳体及其制作方法 |
| CN103866322A (zh) * | 2014-03-21 | 2014-06-18 | 佛山市红利建材有限公司 | 铝材真空镀膜工艺 |
| CN104213173A (zh) * | 2014-09-01 | 2014-12-17 | 吴啟良 | 一种铝及铝合金的混酸型硬质阳极氧化方法 |
| CN105990081A (zh) * | 2015-02-09 | 2016-10-05 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其制作方法 |
| CN108884585A (zh) * | 2016-03-31 | 2018-11-23 | Abm股份有限公司 | 金属构件、其制造方法及装备有上述金属构件的处理腔室 |
| WO2019169912A1 (zh) * | 2018-03-08 | 2019-09-12 | 北京北方华创微电子装备有限公司 | 反应腔室部件及其制备方法、反应腔室 |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040221959A1 (en) * | 2003-05-09 | 2004-11-11 | Applied Materials, Inc. | Anodized substrate support |
| US8372205B2 (en) * | 2003-05-09 | 2013-02-12 | Applied Materials, Inc. | Reducing electrostatic charge by roughening the susceptor |
| US20090194233A1 (en) * | 2005-06-23 | 2009-08-06 | Tokyo Electron Limited | Component for semicondutor processing apparatus and manufacturing method thereof |
| DE102005058324A1 (de) * | 2005-12-07 | 2007-06-14 | Mtu Aero Engines Gmbh | Verfahren zum Herstellen eines Einlaufbelags |
| US8173228B2 (en) * | 2006-01-27 | 2012-05-08 | Applied Materials, Inc. | Particle reduction on surfaces of chemical vapor deposition processing apparatus |
| US8282807B2 (en) * | 2006-12-28 | 2012-10-09 | National University Corporation Tohoku University | Metal member having a metal oxide film and method of manufacturing the same |
| JP5162148B2 (ja) * | 2007-03-26 | 2013-03-13 | 株式会社アルバック | 複合体およびその製造方法 |
| JP4774014B2 (ja) * | 2007-05-21 | 2011-09-14 | 株式会社神戸製鋼所 | AlまたはAl合金 |
| DE102010060143A1 (de) * | 2009-11-05 | 2011-06-09 | Oerlikon Solar Ag, Trübbach | Vakuumverarbeitungskammer hergestellt durch Aluminiumguss |
| US8512872B2 (en) * | 2010-05-19 | 2013-08-20 | Dupalectpa-CHN, LLC | Sealed anodic coatings |
| TWI467042B (zh) * | 2010-08-31 | 2015-01-01 | Hon Hai Prec Ind Co Ltd | 鋁合金表面防腐處理方法及其製品 |
| JP5666248B2 (ja) * | 2010-11-02 | 2015-02-12 | キヤノンアネルバ株式会社 | 磁気記録媒体の製造装置 |
| TWI471444B (zh) * | 2010-11-16 | 2015-02-01 | Hon Hai Prec Ind Co Ltd | 殼體及其製作方法 |
| TWI467038B (zh) * | 2010-12-09 | 2015-01-01 | Hon Hai Prec Ind Co Ltd | 殼體及其製作方法 |
| CN102691062A (zh) * | 2011-03-23 | 2012-09-26 | 鸿富锦精密工业(深圳)有限公司 | 壳体及其制造方法 |
| CN105308220A (zh) * | 2013-02-19 | 2016-02-03 | 铝镀公司 | 改善铝薄膜粘附的方法 |
| WO2014158767A1 (en) | 2013-03-14 | 2014-10-02 | Applied Materials, Inc. | High purity aluminum top coat on substrate |
| US9663870B2 (en) | 2013-11-13 | 2017-05-30 | Applied Materials, Inc. | High purity metallic top coat for semiconductor manufacturing components |
| US20160251749A1 (en) * | 2013-11-21 | 2016-09-01 | Hewlett Packard Development Company, L.P. | Oxidized Layer and Light Metal Layer on Substrate |
| US9804058B2 (en) | 2014-02-27 | 2017-10-31 | Pratt & Whitney Canada Corp. | Method of facilitating visual detection of a crack in a component of a gas turbine engine |
| US9869030B2 (en) * | 2014-08-29 | 2018-01-16 | Apple Inc. | Process to mitigate spallation of anodic oxide coatings from high strength substrate alloys |
| US10077717B2 (en) | 2014-10-01 | 2018-09-18 | Rolls-Royce Corporation | Corrosion and abrasion resistant coating |
| WO2016111693A1 (en) | 2015-01-09 | 2016-07-14 | Apple Inc. | Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys |
| WO2022117746A1 (en) | 2020-12-02 | 2022-06-09 | Oerlikon Surface Solutions Ag, Pfäffikon | Improved plasma resistant coatings for electrostatic chucks |
| WO2016160036A1 (en) | 2015-04-03 | 2016-10-06 | Apple Inc. | Process for evaluation of delamination-resistance of hard coatings on metal substrates |
| US12281385B2 (en) * | 2015-06-15 | 2025-04-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gas dispenser and deposition apparatus using the same |
| US10760176B2 (en) | 2015-07-09 | 2020-09-01 | Apple Inc. | Process for reducing nickel leach rates for nickel acetate sealed anodic oxide coatings |
| US10711363B2 (en) | 2015-09-24 | 2020-07-14 | Apple Inc. | Anodic oxide based composite coatings of augmented thermal expansivity to eliminate thermally induced crazing |
| US9970080B2 (en) | 2015-09-24 | 2018-05-15 | Apple Inc. | Micro-alloying to mitigate the slight discoloration resulting from entrained metal in anodized aluminum surface finishes |
| US10174436B2 (en) | 2016-04-06 | 2019-01-08 | Apple Inc. | Process for enhanced corrosion protection of anodized aluminum |
| US20170335459A1 (en) * | 2016-05-17 | 2017-11-23 | Applied Materials, Inc. | Non-shadow frame plasma processing chamber |
| US11352708B2 (en) | 2016-08-10 | 2022-06-07 | Apple Inc. | Colored multilayer oxide coatings |
| US11242614B2 (en) | 2017-02-17 | 2022-02-08 | Apple Inc. | Oxide coatings for providing corrosion resistance on parts with edges and convex features |
| US20180240649A1 (en) * | 2017-02-17 | 2018-08-23 | Lam Research Corporation | Surface coating for plasma processing chamber components |
| KR102659394B1 (ko) * | 2018-07-03 | 2024-04-19 | 램 리써치 코포레이션 | 세라믹 코팅을 컨디셔닝하기 위한 방법 |
| KR102737117B1 (ko) * | 2018-07-26 | 2024-11-29 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버 컴포넌트들을 위한 표면 코팅 |
| US11549191B2 (en) | 2018-09-10 | 2023-01-10 | Apple Inc. | Corrosion resistance for anodized parts having convex surface features |
| KR20210142205A (ko) * | 2019-04-16 | 2021-11-24 | 램 리써치 코포레이션 | 표면 코팅 처리 |
| CN115135812A (zh) * | 2020-02-19 | 2022-09-30 | 朗姆研究公司 | 用于调整半导体处理室部件的方法 |
| US11555250B2 (en) * | 2020-04-29 | 2023-01-17 | Applied Materials, Inc. | Organic contamination free surface machining |
| JP2023092365A (ja) * | 2021-12-21 | 2023-07-03 | 日本発條株式会社 | 積層構造体、半導体製造装置および積層構造体の製造方法 |
| US20240153745A1 (en) * | 2022-11-05 | 2024-05-09 | Applied Materials, Inc. | Protection treatments for surfaces of semiconductor fabrication equipment |
| US20250092491A1 (en) * | 2023-09-20 | 2025-03-20 | Applied Materials, Inc. | Alloy composition for corrosion resistance |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616310A (en) | 1969-03-10 | 1971-10-26 | Kaiser Aluminium Chem Corp | Aluminum-anodizing process |
| JPS59117675U (ja) | 1983-01-24 | 1984-08-08 | 旭可鍛鉄株式会社 | アルミニウム又はその合金における陽極酸化皮膜の構造 |
| US4862799A (en) | 1987-11-13 | 1989-09-05 | Rockwell International Corporation | Copper coated anodized aluminum ink metering roller |
| US5314601A (en) | 1989-06-30 | 1994-05-24 | Eltech Systems Corporation | Electrodes of improved service life |
| US5104514A (en) * | 1991-05-16 | 1992-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Protective coating system for aluminum |
| US5290424A (en) | 1992-01-31 | 1994-03-01 | Aluminum Company Of America | Method of making a shaped reflective aluminum strip, doubly-protected with oxide and fluoropolymer coatings |
| US5401573A (en) * | 1992-11-30 | 1995-03-28 | Mcdonnell Douglas Corporation | Protection of thermal control coatings from ultraviolet radiation |
| US5366585A (en) * | 1993-01-28 | 1994-11-22 | Applied Materials, Inc. | Method and apparatus for protection of conductive surfaces in a plasma processing reactor |
| US20020148941A1 (en) * | 1994-02-17 | 2002-10-17 | Boris Sorokov | Sputtering method and apparatus for depositing a coating onto substrate |
| US5756222A (en) * | 1994-08-15 | 1998-05-26 | Applied Materials, Inc. | Corrosion-resistant aluminum article for semiconductor processing equipment |
| US5804253A (en) * | 1995-07-17 | 1998-09-08 | Kanegafuchi Chemical Ind. Co., Ltd. | Method for adhering or sealing |
| US6355554B1 (en) | 1995-07-20 | 2002-03-12 | Samsung Electronics Co., Ltd. | Methods of forming filled interconnections in microelectronic devices |
| US6077781A (en) | 1995-11-21 | 2000-06-20 | Applied Materials, Inc. | Single step process for blanket-selective CVD aluminum deposition |
| US5856236A (en) | 1996-06-14 | 1999-01-05 | Micron Technology, Inc. | Method of depositing a smooth conformal aluminum film on a refractory metal nitride layer |
| US6537905B1 (en) | 1996-12-30 | 2003-03-25 | Applied Materials, Inc. | Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug |
| US5858464A (en) | 1997-02-13 | 1999-01-12 | Applied Materials, Inc. | Methods and apparatus for minimizing excess aluminum accumulation in CVD chambers |
| FR2764310B1 (fr) * | 1997-06-10 | 1999-07-09 | Commissariat Energie Atomique | Materiau multicouches a revetement anti-erosion, anti-abrasion, et anti-usure sur substrat en aluminium, en magnesium ou en leurs alliages |
| US6117772A (en) | 1998-07-10 | 2000-09-12 | Ball Semiconductor, Inc. | Method and apparatus for blanket aluminum CVD on spherical integrated circuits |
| US6726304B2 (en) * | 1998-10-09 | 2004-04-27 | Eastman Kodak Company | Cleaning and repairing fluid for printhead cleaning |
| JP4194143B2 (ja) * | 1998-10-09 | 2008-12-10 | 株式会社神戸製鋼所 | ガス耐食性とプラズマ耐食性に優れたアルミニウム合金材 |
| TW465017B (en) | 1999-04-13 | 2001-11-21 | Applied Materials Inc | A corrosion-resistant protective coating for an apparatus and method for processing a substrate |
| JP3911902B2 (ja) * | 1999-04-16 | 2007-05-09 | 東京エレクトロン株式会社 | 処理装置及び金属部品の表面処理方法 |
| US6322712B1 (en) | 1999-09-01 | 2001-11-27 | Micron Technology, Inc. | Buffer layer in flat panel display |
| US6649031B1 (en) | 1999-10-08 | 2003-11-18 | Hybrid Power Generation Systems, Llc | Corrosion resistant coated fuel cell bipolar plate with filled-in fine scale porosities and method of making the same |
| US6207558B1 (en) | 1999-10-21 | 2001-03-27 | Applied Materials, Inc. | Barrier applications for aluminum planarization |
| US6775873B2 (en) * | 2000-02-09 | 2004-08-17 | Eugene H. Luoma | Apparatus for removing hair from a drain |
| JP4359001B2 (ja) | 2001-03-02 | 2009-11-04 | 本田技研工業株式会社 | 陽極酸化膜改質方法、陽極酸化膜構造及びアルミニウム合金製船外機 |
| US6458683B1 (en) | 2001-03-30 | 2002-10-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for forming aluminum bumps by CVD and wet etch |
| DE10135067A1 (de) * | 2001-07-18 | 2003-02-06 | Vb Autobatterie Gmbh | Elektrischer Akkumulator mit in dem Akkumulatorenbehälter integrierter elektronischer Schaltung |
| US20030047464A1 (en) * | 2001-07-27 | 2003-03-13 | Applied Materials, Inc. | Electrochemically roughened aluminum semiconductor processing apparatus surfaces |
| TW589401B (en) | 2001-10-24 | 2004-06-01 | Hon Hai Prec Ind Co Ltd | The surface treatment of aluminum article |
| US7033447B2 (en) | 2002-02-08 | 2006-04-25 | Applied Materials, Inc. | Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus |
| US7048814B2 (en) * | 2002-02-08 | 2006-05-23 | Applied Materials, Inc. | Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus |
| US6776873B1 (en) * | 2002-02-14 | 2004-08-17 | Jennifer Y Sun | Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers |
| US8067067B2 (en) * | 2002-02-14 | 2011-11-29 | Applied Materials, Inc. | Clean, dense yttrium oxide coating protecting semiconductor processing apparatus |
| US6659331B2 (en) | 2002-02-26 | 2003-12-09 | Applied Materials, Inc | Plasma-resistant, welded aluminum structures for use in semiconductor apparatus |
| US6565984B1 (en) | 2002-05-28 | 2003-05-20 | Applied Materials Inc. | Clean aluminum alloy for semiconductor processing equipment |
| US6884336B2 (en) * | 2003-01-06 | 2005-04-26 | General Motors Corporation | Color finishing method |
| US20040221959A1 (en) * | 2003-05-09 | 2004-11-11 | Applied Materials, Inc. | Anodized substrate support |
-
2005
- 2005-01-18 US US11/037,633 patent/US7732056B2/en not_active Expired - Fee Related
-
2006
- 2006-01-13 TW TW095200874U patent/TWM310107U/zh not_active IP Right Cessation
- 2006-01-18 JP JP2006010308A patent/JP4881015B2/ja not_active Expired - Fee Related
- 2006-01-18 CN CNU200620000359XU patent/CN2935467Y/zh not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102400091A (zh) * | 2010-09-10 | 2012-04-04 | 鸿富锦精密工业(深圳)有限公司 | 铝合金的表面处理方法及由铝合金制得的壳体 |
| CN102458068A (zh) * | 2010-11-03 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 壳体及其制作方法 |
| CN102061472A (zh) * | 2011-01-26 | 2011-05-18 | 巨科集团有限公司 | 一种镜面铝表面氧化镀膜方法 |
| CN103866322A (zh) * | 2014-03-21 | 2014-06-18 | 佛山市红利建材有限公司 | 铝材真空镀膜工艺 |
| CN103866322B (zh) * | 2014-03-21 | 2016-09-07 | 恩平建高实业有限公司 | 铝材真空镀膜工艺 |
| CN104213173A (zh) * | 2014-09-01 | 2014-12-17 | 吴啟良 | 一种铝及铝合金的混酸型硬质阳极氧化方法 |
| CN105990081A (zh) * | 2015-02-09 | 2016-10-05 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其制作方法 |
| CN105990081B (zh) * | 2015-02-09 | 2018-09-21 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其制作方法 |
| CN108884585A (zh) * | 2016-03-31 | 2018-11-23 | Abm股份有限公司 | 金属构件、其制造方法及装备有上述金属构件的处理腔室 |
| WO2019169912A1 (zh) * | 2018-03-08 | 2019-09-12 | 北京北方华创微电子装备有限公司 | 反应腔室部件及其制备方法、反应腔室 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7732056B2 (en) | 2010-06-08 |
| JP2006241589A (ja) | 2006-09-14 |
| US20060159940A1 (en) | 2006-07-20 |
| JP4881015B2 (ja) | 2012-02-22 |
| TWM310107U (en) | 2007-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070815 |
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| EXPY | Termination of patent right or utility model |