CN2920504Y - Improved tin ball suction embedding mechanism of ball implantation machine - Google Patents
Improved tin ball suction embedding mechanism of ball implantation machine Download PDFInfo
- Publication number
- CN2920504Y CN2920504Y CN 200620122222 CN200620122222U CN2920504Y CN 2920504 Y CN2920504 Y CN 2920504Y CN 200620122222 CN200620122222 CN 200620122222 CN 200620122222 U CN200620122222 U CN 200620122222U CN 2920504 Y CN2920504 Y CN 2920504Y
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- district
- vacuum suction
- ball
- tin ball
- hole
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Abstract
The utility model is an improved tin ball suction embedding mechanism of ball implantation machine, which is essentially characterized in that each vacuum suction area of a vacuum suction device has a vacuum sucker so that the movement of tin ball suction of each vacuum suction area can be controlled individually; meanwhile, the vacuum suction device is connected with a defective product detecting device, which, when discovering a defective product, will order the vacuum sucker corresponding to the product to stop sucking so that the tin ball in the corresponding defective product hole in the mould will not be sucked and implanted in the circuit board corresponding to the defective product, lowering the waste of tin balls and thereby reducing the cost of production.
Description
Technical field
The tin ball that the utility model relates to a kind of improved ball attachment machine attracts to implant mechanism, refer in particular to a kind of position and do not implant the tin ball at correspondence difference product, with the waste of minimizing tin ball, and then the tin ball attraction implantation mechanism that reduces the ball attachment machine of the cost of manufacturing.
Background technology
Increase along with the IC calculation function, the circuit of its structure dress is also more relatively, and the required pin count of each IC is also more relatively, because ball form structure dress (BGA) has advantages such as low purpose, the tin ball that can reach slimming structure dress of the structure dress of the high density of can be applicable to, high collection radix, enough heat radiation approach, electrically more good, tin ball height be not yielding, therefore, the structure of ball form dress (BGA) becomes the main flow of present multiway IC structure dress.
And the planting the ball action and can consult shown in Fig. 1,2 of general ball attachment machine just, it is that a plurality of hole district 11 is set on a mould 1, each hole district 11 is by number porous cave 111 regularly arranged forming, and the pin place of all corresponding each the IC circuit board A in the hole 111 in each hole district 11, tin ball B then are implanted in the hole 111 in the hole district 11; Locating correspondence above mould 1 is provided with vacuum suction device 2 in addition, this vacuum suction device 2 is by single vacuum attractor 21 control vacuum attraction opportunity, simultaneously be provided with vacsorb district 22 in vacuum suction device 2 corresponding aforementioned hole district 11 parts, and have the many air entries 221 of number in each vacsorb district 22, and corresponding aforesaid each hole 111; In view of the above, when the suction leading-in device 2 of taking seriously carries out aspiratory action, can the tin ball B in the hole 111 of position in corresponding hole district 11 with it be adsorbed from each air entry 221 at its 22 places, vacsorb district, and and then implantation be fixed in pin place on the IC circuit board A.
Yet, IC is in the middle of the process of manufacturing, can form difference product because of various factors with flaw, but because of general ball attachment machine is by whether only having implantation that the vacuum suction device 2 of single vacuum attractor 21 controls tin ball B, when the suction leading-in device 2 of promptly taking seriously carries out aspiratory action, all can adsorb a tin ball B in each air entry 221 place, and the tin ball B that it is adsorbed implants on the corresponding with it IC circuit board A; Even if therefore this corresponding with it IC circuit board A is the poor product that belong to a flaw and must eliminate, it still can be implanted tin ball B and be affixed with it, and causes the situation of waste tin ball B, and increases the manufacturing production cost.
The design people promptly is in view of the disappearance part of above-mentioned ball attachment machine on reality is implemented to use, and revised, improve, simultaneously in line with spirit of asking and theory, and assisting by professional knowledge, experience, and after clever thought in many ways, test, the side creates the utility model.
Summary of the invention
The tin ball that the purpose of this utility model provides a kind of improved ball attachment machine attracts to implant mechanism, and the tin ball is not implanted in its position at correspondence difference product, with the waste of minimizing tin ball, and then reduces the cost of manufacturing.
For this reason, the tin ball that the utility model proposes a kind of improved ball attachment machine attracts to implant mechanism, and it comprises:
At least more than one mould which is provided with at least more than one hole district, and each hole district arranged by a plurality of holes and form, and each hole in this hole district is the pin place in each IC district of corresponding IC circuit board simultaneously;
The vacuum suction device of at least more than one and corresponding setting with mould, the vacsorb district that has at least more than one on it, corresponding the setting up in hole district of this vacsorb district and mould, and this vacsorb district is provided with the air entry in the aforementioned hole of a plurality of correspondences, sets up a vacuum suction in each equal correspondence in vacsorb district simultaneously;
One difference product arrangement for detecting, it is the place ahead that is built up in this mould and vacuum suction device, and be connected with the vacuum suction of vacuum suction device, for detecting on the IC circuit board a certain IC district when having poor product mark, control the vacuum suction that distinguish is not made aspiratory action.
The utlity model has following technique effect:
The utility model mainly is that each the vacsorb district on vacuum suction device all sets up a vacuum suction, the action of whether drawing the tin ball with each vacsorb district of indivedual controls, this vacuum suction and a difference product arrangement for detecting are connected with simultaneously, when detecting the difference product with the product arrangement for detecting of being on duty, order is not made aspiratory action to the vacuum suction that should differ from the product place, and can't be with the tin ball absorption in the hole district of corresponding difference product in the mould, make the circuit board place of can the be not implanted not corresponding difference product of this regional tin ball, with the waste of minimizing tin ball, and then reach the purpose that reduces manufacturing cost.
Description of drawings
Fig. 1: the tin ball that is existing ball attachment machine is implanted structural scheme of mechanism.
Fig. 2: be to indicate the circuit board schematic diagram that poor product mark is arranged but still implant the tin ball.
Fig. 3: be the utility model ball attachment machine schematic diagram.
Fig. 4: the tin ball that is the utility model ball attachment machine is implanted structural scheme of mechanism.
Fig. 5: be the circuit board schematic diagram that does not indicate difference product mark and implant the tin ball.
Fig. 6: be to indicate the circuit board schematic diagram that poor product mark is arranged.
Fig. 7: the tin ball that is the utility model ball attachment machine is implanted mechanism in indicate the schematic diagram () that the circuit board that poor product mark is arranged carries out the action of tin ball implantation at Fig. 6.
Fig. 8: the tin ball that is the utility model ball attachment machine is implanted mechanism in indicate the schematic diagram (two) that the circuit board that poor product mark is arranged carries out the action of tin ball implantation at Fig. 6.
Fig. 9: be the circuit board schematic diagram after implanting the tin ball.
Description of reference numerals:
＜existing
1 mould, 11 hole district
111 holes, 2 vacuum suction devices
21 vacuum suctions, 22 vacsorb districts
221 air entry A IC circuit boards
B tin ball
＜the utility model 〉
3 moulds, 31 hole district
311 holes, 4 vacuum suction devices
41 vacsorb districts, 411 air entries
42 vacuum suctions, 5 difference product arrangement for detecting
6 IC circuit boards, 61 IC districts
62 difference product marks
The specific embodiment
For the technology contents, the goal of the invention that make the utility model use and the effect reached thereof have more complete and clearly disclose,, and see also the graphic and figure number of being taken off now in describing in detail down:
At first, see also shown in Fig. 3～6, the tin ball of ball attachment machine of the present utility model attracts to implant mechanism and mainly includes: at least more than one mould 3, at least more than one and differ from product arrangement for detecting 5 with the vacuum suction device 4 and of mould 3 corresponding settings; Wherein:
This mould 3 is provided with at least more than one hole district 31, and each hole district 31 is by number porous cave 311 regularly arranged forming, and each hole 311 in this hole district 31 is the pin places in corresponding IC circuit board 6 each IC district 61 simultaneously;
This vacuum suction device 4 has at least more than one vacsorb district 41, this vacsorb district 41 and with hole district 31 corresponding the setting up of mould 3, and this vacsorb district 41 is provided with the air entry 411 in the aforementioned hole 311 of a plurality of correspondences, sets up a vacuum suction 42 in each vacsorb district 41 equal correspondence simultaneously;
This difference product arrangement for detecting 5 is built up in the place ahead of this mould 3 and vacuum suction device 4, and be connected with the vacuum suction 42 of vacuum suction device 4, when this difference product arrangement for detecting 5 detects on the IC circuit board 6 a certain IC district 61 when having poor product mark 62, control is not made aspiratory action to the vacuum suction 42 that should distinguish.Described difference product arrangement for detecting can be that a CCD (digital camera) or other can detect the device that differs from the product mark.
Structural design (ginseng Fig. 3 and Fig. 6～9) in view of the above, when this ball attachment machine in implantation when action of carrying out tin ball B, this ball attachment machine just can be inserted tin ball B in each hole 311 in the hole district 31 of mould 3, this difference product arrangement for detecting 5 and whether carry out on the IC circuit board 6 in each IC district 61 underlined difference product mark 62 simultaneously, suppose that IC district 61 signs that difference product arrangement for detecting 5 detects the 3rd position on the IC circuit board 6 have poor product mark 62, this moment, this difference product arrangement for detecting 5 just made the 3rd group vacuum suction 42 not make aspiratory action, and make the vacuum suction 42 of other each group do air-breathing action, when the suction leading-in device 4 of then taking seriously corresponds to mould 3 tops, just can utilize the vacuum suction 42 that carries out aspiratory action with the tin ball B absorption of position in the hole 311 in the mould 3 hole district 31 corresponding, and it is implanted the pin place in each the IC district 61 on the corresponding with it IC circuit board 6 with its air entry 411; And because the 3rd group vacuum suction 42 is not made aspiratory action, therefore can't will take out the tin ball B absorption in the hole 311 in the 3rd group of hole district 31 that locates that should vacuum suction 42, make the tin ball B at this place can't implantedly be fixed in 61 places, IC district that sign has poor product mark 62, and wait for that tin ball B next time implants action, to reach the effect of not wasting tin ball B.
Via above implementation, the tin ball of ball attachment machine of the present utility model attracts implantation mechanism all to set up a vacuum suction because of each the vacsorb district on vacuum suction device as can be known, the action of whether drawing the tin ball with each vacsorb district of indivedual controls, this vacuum suction and be connected with simultaneously with a difference product arrangement for detecting, when detecting difference product mark with the product arrangement for detecting of being on duty, order is not made aspiratory action to the vacuum suction that should differ from the product place, and can't be with the tin ball absorption in the hole district of corresponding difference product in the mould, make the circuit board place of can the be not implanted not corresponding difference product of this regional tin ball, reach the situation that reduces the waste of tin ball, and then reduce the purpose of manufacturing cost.
Claims (1)
1, a kind of tin ball of improved ball attachment machine attracts to implant mechanism, it is characterized in that, comprising:
At least more than one mould which is provided with at least more than one hole district, and each hole district arranged by a plurality of holes and form, and each hole in this hole district is the pin place in each IC district of corresponding IC circuit board simultaneously;
The vacuum suction device of at least more than one and corresponding setting with mould, the vacsorb district that has at least more than one on it, corresponding the setting up in hole district of this vacsorb district and mould, and this vacsorb district is provided with the air entry in the aforementioned hole of a plurality of correspondences, sets up a vacuum suction in each equal correspondence in vacsorb district simultaneously;
One for detecting a certain IC district on the IC circuit board when having poor product mark, controlling and differ from the product arrangement for detecting to what the vacuum suction that should distinguish was not made aspiratory action, be the place ahead that is built up in this mould and vacuum suction device, and be connected with the vacuum suction of vacuum suction device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620122222 CN2920504Y (en) | 2006-07-07 | 2006-07-07 | Improved tin ball suction embedding mechanism of ball implantation machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620122222 CN2920504Y (en) | 2006-07-07 | 2006-07-07 | Improved tin ball suction embedding mechanism of ball implantation machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2920504Y true CN2920504Y (en) | 2007-07-11 |
Family
ID=38252983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620122222 Expired - Fee Related CN2920504Y (en) | 2006-07-07 | 2006-07-07 | Improved tin ball suction embedding mechanism of ball implantation machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2920504Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522345A (en) * | 2011-12-15 | 2012-06-27 | 三星半导体(中国)研究开发有限公司 | Ball mounting device and ball mounting method utilizing same |
| CN104384656A (en) * | 2014-10-22 | 2015-03-04 | 苏州大学 | Manipulator for laying diode soldering tin sheets |
| CN108966525A (en) * | 2018-07-03 | 2018-12-07 | 郑州云海信息技术有限公司 | A kind of BGA ball-planting device and method |
| CN109935525A (en) * | 2017-12-15 | 2019-06-25 | 中芯国际集成电路制造(上海)有限公司 | Plant ball technique and packaging technology |
-
2006
- 2006-07-07 CN CN 200620122222 patent/CN2920504Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522345A (en) * | 2011-12-15 | 2012-06-27 | 三星半导体(中国)研究开发有限公司 | Ball mounting device and ball mounting method utilizing same |
| CN102522345B (en) * | 2011-12-15 | 2014-06-18 | 三星半导体(中国)研究开发有限公司 | Ball mounting device and ball mounting method utilizing same |
| CN104384656A (en) * | 2014-10-22 | 2015-03-04 | 苏州大学 | Manipulator for laying diode soldering tin sheets |
| CN109935525A (en) * | 2017-12-15 | 2019-06-25 | 中芯国际集成电路制造(上海)有限公司 | Plant ball technique and packaging technology |
| CN108966525A (en) * | 2018-07-03 | 2018-12-07 | 郑州云海信息技术有限公司 | A kind of BGA ball-planting device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070711 Termination date: 20100707 |