CN201374873Y - Mould structure for ball mounting machine - Google Patents
Mould structure for ball mounting machine Download PDFInfo
- Publication number
- CN201374873Y CN201374873Y CN200920002046U CN200920002046U CN201374873Y CN 201374873 Y CN201374873 Y CN 201374873Y CN 200920002046 U CN200920002046 U CN 200920002046U CN 200920002046 U CN200920002046 U CN 200920002046U CN 201374873 Y CN201374873 Y CN 201374873Y
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- Prior art keywords
- mould
- hole
- baffle plate
- attachment machine
- district
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Abstract
The utility model relates to a mould structure for a ball mounting machine, which is characterized in that a baffle plate is arranged between a ball mounting machine and a mould and corresponds to the mould, wherein the baffle plate is provided with an air-hole area corresponding to an aperture area of the mould, and the air-hole area is provided with air holes which are matched with each other and correspond to the positions of different ICs, on which different pins of a tin ball are arranged, and the air holes form a perforation-conduction state with apertures of the aperture area on the mould, and the position of the IC, on which no pin of the tin ball is arranged, is free from having an air hole, so that the corresponding aperture of the aperture area on the mould is obstructed by the baffle plate to form a closed state; when a vacuum absorption device sucks air, the tin ball inside the aperture which corresponds to, perforates and is communicated with air holes of the air-hole area of the baffle plate can be absorbed, and the aperture which stays at the closed state is free from absorbing the tin ball, so that the tin ball is mounted on a position which is correspondently required to fix the pins of the tin ball on circuit substrate; therefore, the mould for the ball mounting machine is applicable to different application requirements and is free from being replaced for different requirements, thereby greatly reducing the cost burden of the user.
Description
Technical field
The utility model relates to a kind of ball attachment machine mould structure, refer in particular to a kind of like this ball attachment machine mould structure, it can make this ball attachment machine mould be applicable to different demands uses, do not need when different demand, to change different moulds, significantly reducing dealer's cost burden, and its whole implement to use more increase practical value.
Background technology
Increase along with the various calculation functions of various IC, the circuit that its structure dress is formed is also more relatively, simultaneously the required pin count of each IC is also more relatively, the structure dress of the high density of can be applicable to, high collection radix, enough heat radiation approach, electrically more good, tin ball height are low can to reach advantages such as slimming structure dress, tin ball be not yielding because ball form structure dress (BGA) has, therefore, the structure of ball form dress (BGA) becomes the main flow of present multiway IC structure dress.
Wherein, with regard to general ball attachment machine, it mainly is that several hole district is set on a mould, each hole district forms by many holes are regularly arranged, the hole in each hole district is then all corresponding to the pin place of each circuit substrate, outer end, hole in the district of hole is arranged with and is formed with tank and can makes the tin ball implant being installed with, correspondence is provided with vacuum suction device above this mould in addition, when the suction leading-in device of taking seriously carries out aspiratory action, the tin ball of position in the hole in corresponding hole district with it can be adsorbed, and and then be implanted the pin place of being fixed on the circuit substrate.
Yet, though above-mentioned ball attachment machine can reach for the tin ball being implanted the expection effect that is fixed on circuit substrate pin place, but implement discovery in the use in its practical operation, because corresponding different IC, pin on circuit substrate has different pin positions, be not all need be provided with the tin ball for all pins, make the mould of this ball attachment machine need different arrays to be set respectively in response to different pin position, to change different moulds when the different demand, not only cause to use and go up inconvenience greatly, and also can cause the cost of dealer in Mold Making to increase relatively, be a great cost burden for the dealer, causes to make its integral body still have improved space on execution is used.
So in view of this designer adheres to for many years the abundant of these relevant industries and designs and develops and the actual fabrication experience, is studied improvement at existing structure and disappearance, provides a kind of ball attachment machine mould structure, in the hope of reaching the purpose of better practical value.
The utility model content
The purpose of this utility model provides a kind of ball attachment machine mould structure.
The ball attachment machine mould structure that the utility model provides is to be provided with baffle plate between ball attachment machine and mould; Wherein:
This ball attachment machine bottom is provided with mould, this mould is provided with several hole district, and all arrange in each hole district and to offer many holes, corresponding mould is provided with baffle plate, the hole district of corresponding mould is provided with the pore district on this baffle plate, the demand that corresponding different IC is provided with the different pin pin position of tin ball in this pore district offers the pore that matches, form with the corresponding hole in the hole district on the pore that makes baffle plate pore district and the mould and to run through conducting state, Yu Buxu is provided with tin ball part then makes the corresponding hole in the hole district on this mould suffer baffle plate to block the formation closed state.
In the utility model, this ball attachment machine is provided with air flue in its inside, makes the air flue setting of the corresponding ball attachment machine in hole district of mould.
In the utility model, this ball attachment machine is provided with several buckling pieces in the outside, and is provided with the portion of button in the buckling piece of the corresponding ball attachment machine in the mould outside.
In the utility model, this mould is arranged with in the outer end, hole in hole district and is formed with tank.
In the utility model, this baffle plate offers several location holes, and on mould the corresponding keeper that is provided with, for mutual inlay card location.
In sum, ball attachment machine mould structure of the present utility model mainly is that the mould in ball attachment machine is provided with several hole district, and all arrange in each hole district and to offer many holes, in between this ball attachment machine and mould in addition corresponding mould be provided with baffle plate, the hole district of corresponding mould is provided with the pore district on this baffle plate, the demand that corresponding different IC is provided with the different pin pin position of tin ball in this pore district offers the pore that matches, the corresponding hole in the hole district on this pore and the mould forms runs through conducting state, the pin place of tin ball need be set then because of not offering pore in IC, make the corresponding hole in the hole district on mould suffer baffle plate to block the formation closed state, when the suction leading-in device of taking seriously carries out aspiratory action, can will correspondingly with the pore in baffle plate pore district run through tin ball in the hole in hole district of conducting adsorbed, then be not adsorbed with the tin ball in the hole that forms closed state, and then the fixing pin place of tin ball of corresponding need on the implantation circuit substrate; Whereby, can make this ball attachment machine mould be applicable to that different demands use, not need when different demand, to change different moulds, significantly reducing dealer's cost burden, and its whole implement to use more increase practical value.
Description of drawings
Fig. 1: three-dimensional exploded view of the present utility model;
Fig. 2: side-looking exploded view of the present utility model;
Fig. 3: side-looking assembled sectional view of the present utility model;
Fig. 4: the local assembled sectional view that amplifies of the present utility model.
The main element label declaration
1: ball attachment machine 11: air flue
12: buckling piece 2: mould
21: hole 211: hole
212: tank 22: button portion
23: keeper 3: baffle plate
31: location hole 32: the pore district
321: pore 4: the tin ball
Embodiment
For the technology contents, the purpose that make the utility model use and the effect reached thereof have more complete and clearly disclose, now under describe it in detail, and see also the accompanying drawing and the figure number of being taken off:
At first, see also Fig. 1 three-dimensional exploded view of the present utility model, Fig. 2 side-looking exploded view of the present utility model, Fig. 3 side-looking assembled sectional view of the present utility model and Fig. 4 local amplification shown in the assembled sectional view of the present utility model, the utility model mainly is to be provided with baffle plate 3 in ball attachment machine 1 and 2 on mould; Wherein:
This ball attachment machine 1 is provided with air flue 11 in its inside, and be provided with several buckling pieces 12 in ball attachment machine 1 outside, be provided with mould 2 in this ball attachment machine 1 bottom, the air flue 11 of these mould 2 corresponding ball attachment machines 1 is provided with several hole district 21, and all arrange in each hole district 21 and to offer many holes 211, these 211 outer ends, hole are arranged with and are formed with tank 212, and the buckling piece 12 of corresponding ball attachment machine 1 all is provided with the portion of button 22 in mould 2 outsides in addition;
3 corresponding moulds 2 of this baffle plate are provided with, offering several location holes 31 in baffle plate 3 supplies the keeper 23 of mould 2 to give the inlay card location, the hole district 21 of corresponding mould 2 is provided with pore district 32 on this baffle plate 3, and the demand that corresponding different IC is provided with the different pin pin position of tin ball 4 in this pore district 32 offers the pore 321 that matches.
Thus, make when the keeper 23 mutual inlay cards location of this baffle plate 3 with its location hole 31 and mould 2, and make this mould 2 be mounted on ball attachment machine 1 lower end, the buckling piece 12 that utilizes ball attachment machine 1 outside and mould 2 outsides are corresponding buckle portion's 22 mutual inlay cards and combine after, the pore 321 in these baffle plate 3 pore districts 32 just with mould 2 on corresponding hole 211 formation in hole district 21 run through conducting state, Yu Buxu is provided with 211 rounds baffle plate 3 formation closed states that block in corresponding hole that tin ball 4 parts then make the hole district 21 on this mould 2, when the suction leading-in device (not shown in the figures) of taking seriously carries out aspiratory action, the tin ball 4 that can correspondingly with the pore 321 in baffle plate 3 pore districts 32 run through in the hole 211 in hole district 21 of conducting is adsorbed in the tank 212, be not adsorbed with tin ball 4 in 211 in the hole that forms closed state, and be convenient to carry out next action.
Aforesaid embodiment or accompanying drawing and non-limiting structure sample attitude of the present utility model or size, any those of ordinary skills' suitable variation or modification all should be considered as not breaking away from patent category of the present utility model.
By the above, the composition of this element and use implementation are as can be known, the utility model and existing structure are in comparison, the utility model is owing to the hole district that is corresponding mould on baffle plate is provided with the pore district, the demand that corresponding different IC is provided with the different pin pin position of tin ball in this pore district offers the pore that matches, the corresponding hole in the hole district on this pore and the mould forms runs through conducting state, the pin place of tin ball need be set then because of not offering pore in IC, make the corresponding hole in the hole district on mould suffer baffle plate to block the formation closed state, when the suction leading-in device of taking seriously carries out aspiratory action, can will correspondingly with the pore in baffle plate pore district run through tin ball in the hole in hole district of conducting adsorbed, then be not adsorbed with the tin ball in the hole that forms closed state, and then the fixing pin place of tin ball of corresponding need on the implantation circuit substrate, can make this ball attachment machine mould be applicable to different demands uses, do not need when different demand, to change different moulds, significantly reducing dealer's cost burden, and its whole implement to use more increase practical value.
In sum, embodiment of the present utility model really can reach desired use effect, its disclosed concrete structure again, not only do not seen in the like product, before also not being disclosed in application, really meet the regulation and the requirement of Patent Law fully, so, propose the application of novel patent in accordance with the law, earnestly ask and give examination.
Claims (5)
1, a kind of ball attachment machine mould structure is characterized in that, is provided with baffle plate between ball attachment machine and mould; Wherein:
Described ball attachment machine bottom is provided with described mould, described mould is provided with several hole district, and all arrange in each hole district and to offer many holes, corresponding described mould is provided with described baffle plate, the hole district of corresponding described mould is provided with the pore district on described baffle plate, the demand that corresponding different IC is provided with the different pin pin position of tin ball in described pore district offers the pore that matches, the corresponding hole in the hole district on the pore in described baffle plate pore district and the described mould forms runs through conducting state, and the pin place of tin ball need be set in IC, the corresponding hole in the hole district on the described mould suffers described baffle plate to block the formation closed state.
2, ball attachment machine mould structure as claimed in claim 1 is characterized in that, described ball attachment machine is provided with air flue in its inside, the air flue setting of the corresponding described ball attachment machine in the hole district of described mould.
3, ball attachment machine mould structure as claimed in claim 1 is characterized in that, described ball attachment machine is provided with several buckling pieces in the outside, and is provided with the portion of button in the buckling piece of the corresponding described ball attachment machine in the described mould outside.
4, ball attachment machine mould structure as claimed in claim 1 is characterized in that, described mould is arranged with in the outer end, hole in hole district and is formed with tank.
5, ball attachment machine mould structure as claimed in claim 1 is characterized in that, described baffle plate offers several location holes, and on described mould corresponding being provided with for the mutual keeper of inlay card location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920002046U CN201374873Y (en) | 2009-01-08 | 2009-01-08 | Mould structure for ball mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920002046U CN201374873Y (en) | 2009-01-08 | 2009-01-08 | Mould structure for ball mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201374873Y true CN201374873Y (en) | 2009-12-30 |
Family
ID=41500955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920002046U Expired - Lifetime CN201374873Y (en) | 2009-01-08 | 2009-01-08 | Mould structure for ball mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201374873Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664156A (en) * | 2012-05-15 | 2012-09-12 | 日月光半导体制造股份有限公司 | Suction head for sucking solder ball, device and semiconductor process |
| CN109935525A (en) * | 2017-12-15 | 2019-06-25 | 中芯国际集成电路制造(上海)有限公司 | Plant ball technique and packaging technology |
-
2009
- 2009-01-08 CN CN200920002046U patent/CN201374873Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664156A (en) * | 2012-05-15 | 2012-09-12 | 日月光半导体制造股份有限公司 | Suction head for sucking solder ball, device and semiconductor process |
| CN102664156B (en) * | 2012-05-15 | 2015-05-06 | 日月光半导体制造股份有限公司 | Suction head for sucking solder ball, device and semiconductor process |
| CN109935525A (en) * | 2017-12-15 | 2019-06-25 | 中芯国际集成电路制造(上海)有限公司 | Plant ball technique and packaging technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181229 Address after: No. 22 Xingshun Road, Zhongyi Ningbo Ecological Park, Yuyao City, Ningbo City, Zhejiang Province Patentee after: Ningbo silicon electronics (Ningbo) Limited by Share Ltd Address before: Taiwan County, Kaohsiung, China Patentee before: Wei Xurong |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091230 |
|
| CX01 | Expiry of patent term |