CN2906933Y - 白光led封装导散热结构 - Google Patents

白光led封装导散热结构 Download PDF

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CN2906933Y
CN2906933Y CNU2005200657096U CN200520065709U CN2906933Y CN 2906933 Y CN2906933 Y CN 2906933Y CN U2005200657096 U CNU2005200657096 U CN U2005200657096U CN 200520065709 U CN200520065709 U CN 200520065709U CN 2906933 Y CN2906933 Y CN 2906933Y
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李学霖
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型公开了一种白光LED封装导散热结构。其包括两个金属引脚架，其中一引脚架的上端部为支架杯，杯内设有蓝色发光晶体及荧光粉胶层，蓝色发光晶体引出两导线分别与两引脚架连接，两引脚架的上端部包封无色透明树脂；蓝色发光晶体的上、下面分别设有一导散热胶层，两导散热胶层将蓝色发光晶体包封，及荧光粉胶层设在上导散热胶层的上面。本实用新型通过采用上述结构，白光LED工作时发出的热量得以经两个导散热胶层迅速地导散至引脚架上，再经由引脚架的脚部导散出去，使白光LED的工作温度控制在65℃以下，进而使荧光粉的使用寿命达到40000小时以上，有效解决了白光LED的荧光粉使用寿命问题。

Description

白光LED封装导散热结构
技术领域
本实用新型涉及LED封装结构，具体涉及一种白光LED封装导散热结构。
背景技术
LED作为一种发光光源，具有能耗低、发热量较低、使用寿命长等诸多优点，已经越来越广泛地应用于照明和装饰灯具中。其中，白光LED的出现，更使高亮度LED应用领域跨足至高效率照明光源市场。
现有的白光LED是采用蓝色发光晶体和荧光粉两者配合再利用透镜原理来发出肉眼所需的白光的。但是，目前的白光LED灯具多采用白光LED阵列的结构形式来提供灯具的总体发光亮度，因此单个白光LED的发热量虽然较低，但数量较多的白光LED装置在相对密封且空间有限的灯具内腔里，其工作时产生的热量仍因难以有效导散而形成积聚，进而不可避免地出现灯具整体发热量较大的问题。按照目前的白光LED封装技术，其工作温度一旦超过65℃，则会造成白光LED发光体上的荧光粉烧废，进而影响到灯具的使用效果和寿命。还有，由于现有的荧光粉调配技术原因，目前市面上生产封装的白光LED寿命非常短，一般在600～800小时就出现衰减或变色问题。目前，尚没有行之有效的方法来解决白光LED的导散热问题。
发明内容
本实用新型的目的在于针对上述问题，提供一种结构简单的白光LED封装导散热结构，其可有效解决LED白光二极管工作时产生热量的导散热问题。
为达到上述目的，本实用新型的技术方案如下：白光LED封装导散热结构，包括两个金属引脚架，其中一引脚架的上端部为支架杯，杯内设有蓝色发光晶体及荧光粉胶层，蓝色发光晶体引出两导线分别与两引脚架连接，两引脚架的上端部包封无色透明树脂；蓝色发光晶体的上、下面分别设有一导散热胶层，两导散热胶层将蓝色发光晶体包封，及荧光粉胶层设在上导散热胶层的上面。
上述导散热胶层由橡硅胶及树脂混合搅拌而成，橡硅胶与树脂的重量配比为1∶0.001～1。
为进一步延长荧光粉的衰减周期和改善其变色问题，上述荧光粉胶层由树脂、荧光粉、黄色色粉、漂白粉混合搅拌而成，树脂、荧光粉、黄色色粉和漂白粉的重量配比为1∶0.001～1∶0.00 1～1∶0.001～1。
上述导散热胶层的厚度在0.001毫米～3毫米之间。
上述荧光粉胶层的厚度在0.001毫米～5毫米之间。
本实用新型通过采用上述结构，白光LED工作时发出的热量得以经两个导散热胶层迅速地导散至引脚架上，再经由引脚架的脚部导散出去，使白光LED的工作温度控制在65℃以下，进而使荧光粉的使用寿命达到40000小时以上，有效解决了白光LED的荧光粉使用寿命问题。
附图说明
图1是本实用新型的结构示意图；
图2是本实用新型的结构分解图。
现结合附图和实施例对本实用新型作进一步说明：
具体实施方式
如图1、图2所示，本实用新型所述的白光LED封装导散热结构，有两个金属引脚架1，其中一引脚架的上端部为支架杯11，杯内设有蓝色发光晶体2及荧光粉胶层3，蓝色发光晶体2引出两导线21分别与两引脚架1连接；蓝色发光晶体的上、下面分别设有一导散热胶层5，两导散热胶层5将蓝色发光晶体2包封，及荧光粉胶层3设在上导散热胶层的上面。两引脚架的上端部包封无色透明树脂4。
本实用新型的封装工艺步骤为：首先在支架杯的杯底注入一层导散热胶，然后在该层导散热胶上面固上蓝色发光晶体，焊上导线，再在蓝色发光晶体上面注入第二层导散热胶，第二层导散热胶上面注入调配好的莹光粉胶层后整体封上环氧树脂。
上述导散热胶是由橡硅胶和树脂混合搅拌而成，根据不同的要求，橡硅胶与树脂的重量配比为1∶0.001～1。
上述荧光粉胶层的调配是由树脂、荧光粉、黄色色粉、漂白粉混合搅拌而成，根据不同的要求，树脂、荧光粉、黄色色粉、漂白粉的重量配比为1∶0.001～1∶0.001～1∶0.001～1。
上述导散热胶层的厚度在0.001毫米～3毫米之间。
上述荧光粉粉胶层的厚度在0.001毫米～5毫米之间。
本实用新型工作时，蓝色发光晶体发出的热量经由两个导散热胶层导散到支架杯和引脚架上，再经引脚架的脚部导散出去，因此，白光LED整体发出的热量得以迅速有效地导散出去，保证了荧光粉胶层不会烧废和变色，确保了白光LED的莹光粉寿命达40000小时以上。

Claims (3)

1、白光LED封装导散热结构，包括两个金属引脚架，其中一引脚架的上端部为支架杯，杯内设有蓝色发光晶体及荧光粉胶层，蓝色发光晶体引出两导线分别与两引脚架连接，两引脚架的上端部包封无色透明树脂，其特征是：蓝色发光晶体的上、下面分别设有一导散热胶层，两导散热胶层将蓝色发光晶体包封，及荧光粉胶层设在上导散热胶层的上面。
2、根据权利要求1所述的白光LED封装导散热结构，其特征是：所述导散热胶层的厚度在0.001毫米～3毫米之间。
3、根据权利要求1所述的白光LED封装导散热结构，其特征是：所述荧光粉胶层的厚度在0.001毫米～5毫米之间。
CNU2005200657096U 2005-10-13 2005-10-13 白光led封装导散热结构 Expired - Lifetime CN2906933Y (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102102821A (zh) * 2011-03-03 2011-06-22 东莞市远大光电科技有限公司 散热良好和高显色性的led照明器件
CN102102819A (zh) * 2011-03-03 2011-06-22 东莞市远大光电科技有限公司 发光效率高的led照明器件
CN102102820A (zh) * 2011-03-03 2011-06-22 东莞市远大光电科技有限公司 散热功能良好的led照明器件
CN103271645A (zh) * 2013-06-03 2013-09-04 苏州原点工业设计有限公司 一种可以发光的饮水机

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102102821A (zh) * 2011-03-03 2011-06-22 东莞市远大光电科技有限公司 散热良好和高显色性的led照明器件
CN102102819A (zh) * 2011-03-03 2011-06-22 东莞市远大光电科技有限公司 发光效率高的led照明器件
CN102102820A (zh) * 2011-03-03 2011-06-22 东莞市远大光电科技有限公司 散热功能良好的led照明器件
CN103271645A (zh) * 2013-06-03 2013-09-04 苏州原点工业设计有限公司 一种可以发光的饮水机

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