CN2899107Y

CN2899107Y - Radiating module structure

Info

Publication number: CN2899107Y
Application number: CN 200520144743
Authority: CN
Inventors: 王锋谷; 杨智凯
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2005-12-20
Filing date: 2005-12-20
Publication date: 2007-05-09
Anticipated expiration: 2015-12-20

Abstract

A radiating module structure is used for assembling duct heater to conduct heat, which comprises a heat conducting baseplate, an embedded part, a duct heater and an interface material, wherein, the heat conducting baseplate contacts a heat source; the embedded part is correspondingly erected on the heat conducting baseplate to form a containing space; in addition, the embedded part is also provided with a flange part extending relative to it so as to reduce the assembly error of the duct heater and the heat conducting baseplate when the duct heater is arranged in the containing space, and to fix the duct heater on the heat conducting baseplate through disposing the interface material at the containing space, thereby increasing fixing capability and heat conducting area to realize effective mutual heat transmission between the duct heater and the heat conducting baseplate.

Description

A kind of radiating module structure

Technical field

The utility model designs about a kind of radiating module structure, is meant a kind of radiating module in order to the heat supply catheter abutment especially.

Background technology

Electronic building brick in the computer equipment can produce heat when carrying out calculating process, as CPU chip and power integrated circuit etc., and the consumption of CPU chip wattage heal come high more, the high aggregation degree that adds integrated circuit makes thermal source concentrate, when operating, not only produce high heat, and the speed of running is fast more, the temperature that is produced is higher, because whether operational temperature is very big when the influence of machine for computer equipment, controls the stable running that can make computer equipment have than high-reliability and keep the electronic building brick that generates heat so handle temperature well.

For reducing the working temperature and the running of remaining valid of heating electronic building brick, see through heat dissipation design and design various radiating module; Consult shown in Figure 1, radiating module generally cooperates the design of heat pipe 20a and radiating fin 22a to conduct CPU chip 30a with heat-conducting substrate 10a, and loose and remove the heat of CPU chip 30a, cause radiating effect to reach, CPU chip 30a is directed to heat-conducting substrate 10a by the encapsulation top layer earlier with heat, so that heat-conducting substrate 10a up conducts to heat pipe 20a with heat, the phase change effect that sees through working fluid in the heat pipe 20a conducts to radiating area with it, to get the good heat radiating effect.

In the above-mentioned known technology, heat-conducting substrate is offered accommodation space to engage heat pipe with the combination of heat pipe on heat-conducting substrate, can strengthen the thermally conductive pathways of effective contact area with shortening heat conduit and CPU chip, also can make heat pipe abutting end and heat-conducting substrate present fluid-tight engagement state more, after the heat pipe group is gone into accommodation space, utilize and form on relative two sidewalls of accommodation space toward the build-in portion of heat pipe direction extruding, and filling heat-conductive glue or tin cream to be filling up the slot between heat pipe combination end and the accommodation space, just can fluid-tight engagement between heat pipe and the heat-conducting substrate and reach predetermined heat-conducting effect.

See also Fig. 1, shown in Figure 2, when the flat tube 21a that heat pipe 20a one end forms goes into accommodation space 11a in group, because of the size precision is grasped not enough, heat pipe 20a and accommodation space 11a produce tolerance nargin 18a, cause in the injection process of heat-conducting glue or tin cream, its consumption quite is difficult to accurate control, the inequality of filling up is arranged, and the deficiency of heat-conducting glue or tin cream also makes flat tube 21a adhesion be difficult for, reduce the effect of the heat transmission between heat pipe 20a and heat-conducting substrate 10a, spillover too much easily takes place again in heat-conducting glue or tin cream, cause the binding site of flat tube 21a and accommodation space 11a to present not carefully and neatly done phenomenon, make flat tube 21a can meet with bigger resistance when organizing, thereby the stability of processing procedure is comparatively not enough into accommodation space 11a, and the cost of labor of making is higher, also influences end product quality.

Summary of the invention

In the above-mentioned disclosed known technology, and the tolerance nargin when reckoning without the heat pipe group and going into heat-conducting substrate, cause filling up of heat-conducting glue or tin cream uneven, and can't close heat pipe fully admittedly on heat-conducting substrate, and the effective contact area deficiency between heat-conducting substrate and heat pipe, the usefulness of the influence heat radiations such as heat transfer circuit path length between heating electronic building brick and the heat pipe, but thereby the utility model a kind of radiating module structure design of going into applicable to the heat supply conduit set is provided.

According to radiating module structure disclosed in the utility model, it includes heat-conducting substrate, build-in portion, heat pipe and interface material, the heat-conducting substrate contact has the heating electronic building brick, build-in portion correspondence is erected in heat-conducting substrate, and the formation accommodation space, build-in portion and have the flange part of relative extension with it, heat pipe then is located at accommodation space, to constitute first fill area, second fill area and tolerance nargin jointly with build-in portion, put by boundary material and to be distributed in first fill area, second fill area and tolerance nargin, and can close heat pipe admittedly on heat-conducting substrate.

Radiating module structure disclosed in the utility model, can reduce heat pipe and the heat-conducting substrate tolerance nargin when assembly, then dwindle the heat pipe group and go into slot that heat-conducting substrate produces to increase heat-conducting area, make heat pipe and heat-conducting substrate can effectively carry out heat transmission mutually, can limit simultaneously the displacement of heat pipe after group is gone into and produce, guarantee heat-conducting effect.

For allowing above-mentioned and further feature of the present utility model and advantage become apparent, embodiment cited below particularly, and conjunction with figs. elaborate.

Description of drawings

Fig. 1 is the radiating module structure exploded view of known technology;

Fig. 2 is the heat pipe and the heat-conducting substrate combination schematic diagram of known technology;

Fig. 3 is the radiating module structure exploded view of embodiment;

Fig. 4 is heat-conducting substrate and the heat-conducting substrate combination schematic diagram of embodiment.

Wherein, Reference numeral:

10,10a heat-conducting

substrate

11,11a accommodation space

12 build-in portions, 13 abutment face

14 flange parts, 16 first fill areas

17

second fill areas

18,18a tolerance nargin

20,

20a heat pipe

21,21a flat tube

22,22a radiating fin 30,30a CPU chip

Embodiment

According to radiating module structure disclosed in the utility model, the radiating module of this indication can be applicable to carry out the CPU chip of computing purposes, so be not limited in the CPU chip, also can use technology disclosed in the utility model such as the integrated circuit that can produce heat, in following detailed description of the present utility model, will be with the CPU chip as most preferred embodiment of the present utility model.

Embodiment of the present utility model as shown in Figure 3, include heat-conducting substrate 10 in the illustrated embodiment, heat pipe 20 and CPU chip 30, wherein a side of heat-conducting substrate 10 is provided with the accommodation space 11 that is parallel to heat pipe 20 axial directions, two sides in accommodation space 11 are formed with the build-in portion 12 that protrudes in heat-conducting substrate 10 respectively, the another side of heat-conducting substrate 10 then is designed to can be for closely reclining with the abutment face 13 of heat conduction with CPU chip 30, in but the flat tube 21 of accommodation space 11 heat supply conduits 20 1 ends formation is placed in again, heat pipe 20 end in addition then is equipped with radiating fin 22, utilize heat-conducting substrate 10, the group-setting structure of heat pipe 20 and CPU chip 30, heat-conducting substrate 10 can conduct to heat pipe 20 with the heat that CPU chip 30 is sent, and the capillary structure of heat pipe 20 and workflow cognition conduct to radiating fin 22 again with heat, radiating fin 22 with heat is discharged in outside, and carry out cooling.

See also Fig. 3, shown in Figure 4, heat-conducting substrate 10 1 sides in the illustrated embodiment are provided with the accommodation space 11 that is parallel to heat pipe 20 axial directions, two sides in accommodation space 11 are formed with the build-in portion 12 that protrudes in heat-conducting substrate 10 respectively, and build-in portion 12 can be a wall rib, 11 li of accommodation spaces have the flange part 14 with the 12 relative extensions of build-in portion in addition, flange part 14 is the axial direction that is parallel to heat pipe 20, and flange part 14 can be a fin, be furnished with the interface material and between flat tube 21 and accommodation space 11, put, the interface material can be heat-conducting glue or tin cream, so that the formed flat tube 21 of heat pipe 20 1 ends is when being placed in the accommodation space 11, but interface material set heat pipe 20 is on heat-conducting substrate 10, when 20 groups of heat pipes are gone into heat-conducting substrate 10, heat pipe 20 and heat-conducting substrate 10 have the scale error in the assembly, scale error in the assembly can cause producing slot between flat tube 21 and the accommodation space 11 and can't fit closely, the structure setting that utilizes build-in portion 12 and flange part 14 is to dwindle the slot between flat tube 21 and the accommodation space 11, make between flat tube 21 and the accommodation space 11 slot thereby mitogenetic first fill area 16 arranged, second fill area 17 and tolerance nargin 18, wherein the seam of the sideshake between flat tube 21 and the accommodation space 11 can mitogeneticly have first fill area 16 and second fill area 17, the seam of sideshake in addition between flat tube 21 and the accommodation space 11 then produces tolerance nargin 18, the interface material is just borrowed the limit slot of flange part 14 and is filled up easily in first fill area 16 and second fill area 17, simultaneously also fully fill up complete, the interface material is also borrowed the limit slot of flange part 14 and is filled up easily in tolerance nargin 18 in addition, and in the accurate dimensions assembly if any can't fully filling up the facts, boundary material also can fully be filled up in the peripheral extent of tolerance nargin 18 flange portions, still can enlarge heat-conducting area with set heat pipe 20 on heat-conducting substrate 10.

Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; be familiar with those of ordinary skill in the art and work as and to make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.

Claims

1. a radiating module structure is characterized in that, includes:

One heat-conducting substrate is contacted with a thermal source;

One build-in portion, correspondence is erected in this heat-conducting substrate, and constitutes an accommodation space, this build-in portion and have the flange part of a relative extension with it;

One heat pipe is located at this accommodation space, and this heat pipe also constitutes one first fill area and one second fill area with this build-in portion is common; And

One boundary material is put and is distributed in this first fill area and this second fill area.

2. radiating module structure according to claim 1 is characterized in that, this thermal source is the CPU chip.

3. radiating module structure according to claim 1 is characterized in that this heat pipe becomes flat.

4. radiating module structure according to claim 1 is characterized in that this build-in portion is parallel to the axial direction of this heat pipe.

5. radiating module structure according to claim 1 is characterized in that this flange part is parallel to the radial direction of this heat pipe.

6. radiating module structure according to claim 1 is characterized in that this accommodation space is parallel to the axial direction of this heat pipe.

7. radiating module structure according to claim 1 is characterized in that, this build-in portion one is used to limit the wall rib of the displacement of this heat pipe.

8. radiating module structure according to claim 1 is characterized in that, this interface material can stick together this heat pipe in this heat-conducting substrate.

9. radiating module structure according to claim 1 is characterized in that, this interface material is a heat-conducting glue.

10. radiating module structure according to claim 1 is characterized in that, this interface material is a tin cream.