CN2896520Y - Integrated circuit-board enclosed super-thin radiating structure - Google Patents
Integrated circuit-board enclosed super-thin radiating structure Download PDFInfo
- Publication number
- CN2896520Y CN2896520Y CN 200520048168 CN200520048168U CN2896520Y CN 2896520 Y CN2896520 Y CN 2896520Y CN 200520048168 CN200520048168 CN 200520048168 CN 200520048168 U CN200520048168 U CN 200520048168U CN 2896520 Y CN2896520 Y CN 2896520Y
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- integrated circuit
- heat
- mounted integrated
- extracting
- radiator structure
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an enclosed super-slim heat-extraction structure of an integrated circuit plate, which includes a plurality of heat-extracting pipes that vertically penetrate the integrated circuit plate, a set of frontal heat-extracting components and backside heat-extracting components of the integrated circuit. Wherein, the frontal heat-extracting components include dilation heat-conducting cushions and heat-extracting strips covered in sequence on the frontal integrated circuit and penetrated at the heat-extracting pipes. And the dilation heat-conducting cushions and heat-extracting strips are fixed by various press-to-close devices at the frontal terminal of the heat extracting pipes. The backside heat-extracting components include insulated strips and extracting strips coated in sequence on the backside of the integrated circuit and penetrated on the heat-extracting pipes. And the insulated strips and heat-extracting strips are fixed by various press-to-close devices at the backside terminal of the heat extracting pipes. Adoption of the enclosed super-slim heat-extracting structure of the integrated circuit plate of this structure has the advantages of super-slim and stable design, faster heat extraction, lower noise and simpler structure, which facilitates the industrial production, deduces the cost of heat-extracting device, protects the circuit from environmental and man-induced damages and safeguard the personnel security, thereby enjoying a wide appliance field.
Description
Technical field
The utility model relates to the surface-mounted integrated circuit field, and particularly surface-mounted integrated circuit heat radiation field specifically is meant the closed ultra-thin radiator structure of a kind of surface-mounted integrated circuit.
Background technology
In the modern society, integrated circuit uses more and morely, and always is that for the heat dissipation problem of the surface-mounted integrated circuit in the electronic equipment is difficult to a perfect problem that solves.Present heat dissipation technology on the market generally is to adopt fan or heat pipe technology, and not totally-enclosed, because flowing of air often makes the circuit version gather a large amount of dusts, causes circuit abnormality, perhaps carry a large amount of aqueous vapor erosion circuit units because there was dampness in the air.Simultaneously, the technology of all kinds of mainboards and chip is quite ripe, but the integral heat sink technology does not break through; Though all kinds of heat dissipation technology development, noise is big, volume is big, power is big, heat radiation is unilateral, lacks to integrate; The environmental condition complexity (air humidity artificially contact static water), circuit and mainboard all do not have well protection, cause fault to take place again and again.
The utility model content
The purpose of this utility model is to have overcome above-mentioned shortcoming of the prior art, provide that a kind of closure is better, area of dissipation is big, volume is thin, noise is less, working stability safety, simple in structure, cost is lower, the applicable surface closed ultra-thin radiator structure of surface-mounted integrated circuit comparatively widely.
In order to realize above-mentioned purpose, the closed ultra-thin radiator structure of surface-mounted integrated circuit of the present utility model has following formation:
The closed ultra-thin radiator structure of this surface-mounted integrated circuit, its main feature is, described radiator structure comprises the several radiating tubes that vertically run through this surface-mounted integrated circuit, surface-mounted integrated circuit front radiating subassembly and reverse side radiating subassembly, described front radiating subassembly comprises that to be covered in surface-mounted integrated circuit successively positive and be arranged in expansion heat conductive pad and fin on the described radiating tube, and should the expansion heat conductive pad and fin fix by the positive terminal press fit device of each radiating tube, described reverse side radiating subassembly comprises and is covered in the surface-mounted integrated circuit reverse side successively and is arranged in insulating trip and fin on the described radiating tube, and this insulating trip and fin are fixed by the press fit device of each radiating tube reverse side end.
The front fin of the surface-mounted integrated circuit of the closed ultra-thin radiator structure of this surface-mounted integrated circuit is rotary heat radiation flow deflector, wherein feels at ease to be provided with a ultra-thin breadth electric fan.
The reverse side fin of the surface-mounted integrated circuit of the closed ultra-thin radiator structure of this surface-mounted integrated circuit is rotary heat radiation flow deflector, wherein feels at ease to be provided with a ultra-thin breadth electric fan.
The rotary heat radiation flow deflector of the closed ultra-thin radiator structure of this surface-mounted integrated circuit can be copper or aluminium matter.
The thickness of the expansion heat conductive pad in the surface-mounted integrated circuit front of the closed ultra-thin radiator structure of this surface-mounted integrated circuit is 1 millimeter～2.5 millimeters, and its expansion amplitude is 2 millimeters～4 millimeters.
The expansion heat conductive pad of the closed ultra-thin radiator structure of this surface-mounted integrated circuit is heat conductive silica gel or silicone grease composite material.
Go back heat conduction between the front fin of the surface-mounted integrated circuit of the closed ultra-thin radiator structure of this surface-mounted integrated circuit and the reverse side fin and be connected with copper sheet or aluminium flake.
The heat conduction connected mode of the closed ultra-thin radiator structure of this surface-mounted integrated circuit is welding or bolt connection.
The radiating tube of the closed ultra-thin radiator structure of this surface-mounted integrated circuit is a vacuum heat-pipe, and the press fit device on it is nut and the spring of installing on this radiating tube.
There is not the zone of circuit element also to be equipped with the heat conduction cotton between the surface-mounted integrated circuit front of the closed ultra-thin radiator structure of this surface-mounted integrated circuit and the expansion heat conductive pad.
Adopted the closed ultra-thin radiator structure of surface-mounted integrated circuit of this utility model,, satisfied demand green product because it is a totally enclosed structure, thereby does not have environmental pollution; This radiator structure area of dissipation is big, and active heat removal, circuit board and air insulated are left, thereby ultra-thin stable, elegant in appearance, and rapid heat dissipation, and all can dispel the heat to all component in the circuit, noise is less simultaneously; Because this radiator structure is very simple, thereby is convenient to industrial production, reduce the cost of heat abstractor; Moreover, this radiator structure is covered on the circuit board, has not only protected circuit not to be subjected to environment and artificial infringement, and has protected circuit and people's safety, and application is extensive simultaneously, is applicable to all kinds of circuit boards and family expenses, industrial calculator etc.
Description of drawings
Fig. 1 is the surface structure schematic diagram of the closed ultra-thin radiator structure of surface-mounted integrated circuit of the present utility model.
Fig. 2 is the hardware module block diagram of the closed ultra-thin radiator structure of surface-mounted integrated circuit of the present utility model.
Fig. 3 is the rotary heat radiation flow deflector and the fan structure vertical view of the closed ultra-thin radiator structure of surface-mounted integrated circuit of the present utility model.
Fig. 4 is the rotary heat radiation flow deflector and the fan structure side sectional view of the closed ultra-thin radiator structure of surface-mounted integrated circuit of the present utility model.
Embodiment
In order more to be expressly understood technology contents of the present utility model, describe in detail especially exemplified by following examples.See also Fig. 1 to shown in Figure 4, the closed ultra-thin radiator structure of this surface-mounted integrated circuit, comprise the several radiating tubes 5 that vertically run through this surface-mounted integrated circuit 8, the front radiating subassembly of surface-mounted integrated circuit 8 and reverse side radiating subassembly, also has circuit element 3 on the front of this surface-mounted integrated circuit 8, described front radiating subassembly comprises that to be covered in surface-mounted integrated circuit 8 successively positive and be arranged in expansion heat conductive pad 7 and fin 6 on the described radiating tube 5, and should expansion heat conductive pad 7 and fin 6 fix by each radiating tube 5 positive terminal press fit devices, the thickness of this expansion heat conductive pad 7 is 1 millimeter～2.5 millimeters, its expansion amplitude is 2 millimeters～4 millimeters, this expansion heat conductive pad 7 is heat conductive silica gel or silicone grease composite material, simultaneously, there is not the zone of circuit element also to be equipped with the heat conduction cotton between these surface-mounted integrated circuit 8 fronts and the expansion heat conductive pad 7; Described reverse side radiating subassembly comprises and is covered in surface-mounted integrated circuit 8 reverse side successively and is arranged in insulating trip 9 and fin 6 on the described radiating tube 5, and this insulating trip 9 and fin 6 are fixed by the press fit device of each radiating tube 5 reverse side ends, wherein, this radiating tube 5 is a vacuum heat-pipe, its heat-transfer rate is 1000 times of silver, and the press fit device on it is nut 1 and the spring of installing on this radiating tube 52.
In the present embodiment, the fin 6 of the obverse and reverse of this surface-mounted integrated circuit 8 is rotary heat radiation flow deflector 6, wherein feels at ease to be provided with a ultra-thin breadth electric fan 10, and this rotary heat radiation flow deflector 6 can be copper or aluminium matter.
Simultaneously, go back heat conduction between the obverse and reverse fin 6 of this surface-mounted integrated circuit 8 and be connected with copper sheet/aluminium flake 4, its heat conduction connected mode is welding or bolt connection.
In the middle of practical application, the utility model is mainly used in solving on the problem of circuit board and the heat radiation of high-power euthermic chip.Because the height of circuit element 3 generally is uneven, in order to make heat radiation evenly, can be on circuit element 3 some expansion heat conductive pads 7 of pad, select some heat conduction cottons of pad in the place that is not having circuit element.Spring 2 on radiating tube 5 can be reinforced fin 6, fixes with nut 1, and that works compresses fin 6, and thickness is reduced.If heat radiation needs, radiator fan 10 that also can an embedded ultra-thin breadth on the fin 6 on top also can all add the radiator fan 10 of ultra-thin widescreen according to the heat radiation needs at positive and negative.
What fin 6 adopted is rotary heat radiation flow deflector, is convenient to water conservancy diversion, increases area of dissipation.The center of fin is an embedded ultra-thin breadth fan 10 that adopts, this radiator fan 10 is embedded in the middle of the fin 6, it mainly acts on is wind-guiding stream, the helical buckling degree of the Blade Design of fan 10 and fin will coincide, make fan 10 play radiating effect, the height of whole fin 6 is extra small simultaneously.
Casing is used to protect inner circuit board 8 and electronic component 3 thereof, is used to isolate electromagnetic radiation and external disturbance simultaneously.Because electronic component 3 is uneven above the circuit board 8, therefore in order to dispel the heat better, can on main electronic component 3, level up with expansion heat conductive pad 7, whole thereon again pad one deck has the heat conductive pad 7 of 2～4 millimeters the coefficient of expansion, add the ultra-thin revolving flow-guiding radiation sheet 6 of one deck again on heat conductive pad 7,6 the center of dispelling the heat is the wide-coverage fan 10 of an embedding.In order to prevent conduction, design has one deck insulation board 9 in the lower floor of circuit board 8, and the ultra-thin fin 6 of design one deck below insulation board 9 is same if heat radiation needs to embed a fan 10 more again.In addition, on four angles of two fin 6, use four radiating tubes 5 and support, in order to reduce thickness, also can be at radiating tube 5 add upper spring 2 and nut 1 up and down.That works compresses fin 6, and for below the temperature that makes top fin 6 propagates into better, therefore uses between two fin 6 by solder technology, bolt connects or other heat conduction interconnection technique connects ultra-thin aluminium flake/copper sheet 4.
By radiator structure of the present utility model, around circuit board 8, be distributed with 5 kinds of heat dissipation equipments:
(1) expansion heat conductive pad;
(2) fin;
(3) radiating tube;
(4) fan;
(5) aluminium flake or the copper sheet that connects by solder technology.
Therefore be useful for large-area quick heat radiating, and totally-enclosed, and noise is low, can be used for complicated severe environment.The integral heat sink cost is little, is fit to the heat radiation of electronic product.
Adopted the closed ultra-thin radiator structure of above-mentioned surface-mounted integrated circuit,, satisfied demand green product because it is a totally enclosed structure, thereby does not have environmental pollution; This radiator structure area of dissipation is big, and active heat removal, circuit board 8 and air insulated are left, thereby ultra-thin stable, elegant in appearance, and rapid heat dissipation, and all can dispel the heat to all circuit elements 3 in the circuit, noise is less simultaneously; Because this radiator structure is very simple, thereby is convenient to industrial production, reduce the cost of heat abstractor; Moreover, this radiator structure is covered on the circuit board 8, has not only protected circuit not to be subjected to environment and artificial infringement, and has protected circuit and people's safety, and application is extensive simultaneously, is applicable to all kinds of circuit boards and family expenses, industrial calculator etc.
In this specification, the utility model is described with reference to its certain embodiments.But, still can make various modifications and conversion obviously and not deviate from spirit and scope of the present utility model.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (10)
1, the closed ultra-thin radiator structure of a kind of surface-mounted integrated circuit, it is characterized in that, described radiator structure comprises the several radiating tubes that vertically run through this surface-mounted integrated circuit, surface-mounted integrated circuit front radiating subassembly and reverse side radiating subassembly, described front radiating subassembly comprises that to be covered in surface-mounted integrated circuit successively positive and be arranged in expansion heat conductive pad and fin on the described radiating tube, and should the expansion heat conductive pad and fin fix by the positive terminal press fit device of each radiating tube, described reverse side radiating subassembly comprises and is covered in the surface-mounted integrated circuit reverse side successively and is arranged in insulating trip and fin on the described radiating tube, and this insulating trip and fin are fixed by the press fit device of each radiating tube reverse side end.
2, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 1 is characterized in that, the front fin of described surface-mounted integrated circuit is rotary heat radiation flow deflector, wherein feels at ease to be provided with a ultra-thin breadth electric fan.
3, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 1 and 2 is characterized in that, the reverse side fin of described surface-mounted integrated circuit is rotary heat radiation flow deflector, wherein feels at ease to be provided with a ultra-thin breadth electric fan.
4, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 3 is characterized in that, described rotary heat radiation flow deflector is copper or aluminium matter.
5, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 1 and 2 is characterized in that, the thickness of the expansion heat conductive pad in described surface-mounted integrated circuit front is 1 millimeter～2.5 millimeters, and its expansion amplitude is 2 millimeters～4 millimeters.
6, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 5 is characterized in that, described expansion heat conductive pad is heat conductive silica gel or silicone grease composite material.
7, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 1 and 2 is characterized in that, goes back heat conduction between the front fin of described surface-mounted integrated circuit and the reverse side fin and is connected with copper sheet or aluminium flake.
8, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 7 is characterized in that, described heat conduction connected mode is welding or bolt connection.
9, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 1 and 2 is characterized in that described radiating tube is a vacuum heat-pipe, and the press fit device on it is nut and the spring of installing on this radiating tube.
10, the closed ultra-thin radiator structure of surface-mounted integrated circuit according to claim 1 and 2 is characterized in that, does not have the zone of circuit element also to be equipped with the heat conduction cotton between described surface-mounted integrated circuit front and the expansion heat conductive pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520048168 CN2896520Y (en) | 2005-12-28 | 2005-12-28 | Integrated circuit-board enclosed super-thin radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520048168 CN2896520Y (en) | 2005-12-28 | 2005-12-28 | Integrated circuit-board enclosed super-thin radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2896520Y true CN2896520Y (en) | 2007-05-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520048168 Expired - Fee Related CN2896520Y (en) | 2005-12-28 | 2005-12-28 | Integrated circuit-board enclosed super-thin radiating structure |
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| Country | Link |
|---|---|
| CN (1) | CN2896520Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108702853A (en) * | 2015-12-31 | 2018-10-23 | 迪讯技术有限责任公司 | Self-adjusting heat sink system for set-top box assembly |
-
2005
- 2005-12-28 CN CN 200520048168 patent/CN2896520Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108702853A (en) * | 2015-12-31 | 2018-10-23 | 迪讯技术有限责任公司 | Self-adjusting heat sink system for set-top box assembly |
| CN108702853B (en) * | 2015-12-31 | 2020-06-02 | 迪讯技术有限责任公司 | Self-adjusting heat sink system, electronic device and assembling method thereof |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |