CN2893920Y - Integrated circuit package structure - Google Patents
Integrated circuit package structure Download PDFInfo
- Publication number
- CN2893920Y CN2893920Y CN 200620112878 CN200620112878U CN2893920Y CN 2893920 Y CN2893920 Y CN 2893920Y CN 200620112878 CN200620112878 CN 200620112878 CN 200620112878 U CN200620112878 U CN 200620112878U CN 2893920 Y CN2893920 Y CN 2893920Y
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- circuit board
- integrated circuit
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- package structure
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Abstract
An integrated circuit package structure applied in the ball grid array package. The integrated circuit package structure comprises a circuit board, a base plate, a plurality of solder balls and a plurality of mats; wherein solder balls are arranged under the base plate to connect the base plate and the printed circuit board. Mats are arranged under edge of the base plate to support the base plate on the circuit board. When solder balls are melted and deform due to heating of the reflow solder and weight of the base plate, the mat supports the base plate to remain in horizontality.
Description
Technical field
The utility model relates to a kind of encapsulating structure of semiconductor integrated circuit, and is particularly related to a kind of integrated circuit package structure that is applied in the BGA Package technology.
Background technology
Along with making rapid progress of science and technology, microelectronics Packaging (Packaging) technology also improves constantly, for integrated circuit (Integrated Circuit; IC) demand, also trend towards the form of high density, multi-functional and high transmission speed, so having the demand of the integrated circuit of good heat radiating (Heat dissipating) also produces together, therefore encapsulation technology is also gradually by early stage use metal pin, develop to a large amount of modes of using tin ball structure dress today, to meet the demand of integrated circuit.
Tin ball construction method a kind of novelty and that widely use is BGA Package (Ball GridArray; BGA) technology, it forms earlier the tin ball that uses a plurality of one-tenth array format on chip, then, again with the reflow molten tin ball of heating, to be electrically connected chip and printed circuit board (PCB) (Printed CircuitBoard; PCB), and fixed chip on printed circuit board (PCB).The BGA encapsulation technology can not only increase the application area of IC effectively, also can meet the requirement that reduces cost.Yet the difficulty of BGA encapsulation technology is that when carrying out follow-up heating reflow process, the tin club of tin club melted by heat and fusion is out of shape because of the weight extruding of chip, thereby causes the highly inconsistent of tin ball, the problem that causes chip to tilt.Thus, not only short circuit can be caused and defective chip also can reduce product percent of pass.
Summary of the invention
Therefore the purpose of this utility model is providing a kind of integrated circuit package structure exactly, so that the chip of reflow heating back can be horizontally placed on the printed circuit board (PCB).
Another purpose of the present utility model is that a kind of integrated circuit package structure is being provided, to improve the qualification rate of product.
According to the above-mentioned purpose of the utility model, a kind of integrated circuit package structure is proposed, be applied in the BGA Package technology.This integrated circuit package structure comprises circuit board, substrate, a plurality of tin ball and a plurality of connection pad.Wherein, the tin ball is arranged at side under the substrate, to connect substrate and printed circuit board (PCB).And connection pad is arranged at the edge below of substrate, with supporting substrates on circuit board.Wherein, when the tin ball is heated the tin club of melted by heating and fusion when pressed down by the gravity of substrate to be out of shape because of reflow, connection pad can supporting substrates, makes substrate keep level.
According to the utility model one preferred embodiment, connection pad is arranged at the below, four corners of substrate.And above-mentioned connection pad is resistant to elevated temperatures material.Moreover the thickness of connection pad is less than the thickness of tin ball, and preferably, the ratio of the thickness of the thickness of connection pad and tin ball is between 1: 2 to 1: 3.
Therefore, by above-mentioned the utility model preferred embodiment as can be known, the utility model is to utilize a kind of high temperature resistant load-carrying unit, so that the chip of reflow heating back can be horizontally placed on the printed circuit board (PCB).Thus, the inconsistent and phenomenon that causes chip to tilt of the height of tin ball that then can improve reflow heating back, and then raising product percent of pass.
Description of drawings
State with other purpose, feature, advantage and embodiment and can become apparent on the utility model for allowing, being described in detail as follows of accompanying drawing:
Fig. 1 is the overlooking surface schematic diagram according to a kind of integrated circuit package structure of the utility model one preferred embodiment.
Fig. 2 is the generalized section of Fig. 1 along A-A ' line segment.
Fig. 3 is the generalized section of a kind of integrated circuit package structure of another preferred embodiment of the utility model.
Fig. 4 is the generalized section at the integrated circuit package structure of reflow heating back.
The main element description of symbols
100: printed circuit board (PCB) 101: substrate
102: chip 104: connection pad
106: tin ball 106a: the tin ball of fusion
h
1: thickness A-A ': line segment
Embodiment
The utility model provides a kind of integrated circuit package structure of Improvement type, in the substrate edges below a plurality of resistant to elevated temperatures load-carrying units are set, on printed circuit board (PCB), accepting substrate, so improve heat through reflow after, the highly inconsistent phenomenon that causes the chip inclination of the tin ball of distortion.Below will and describe the spirit that clearly demonstrates the utility model in detail with diagram, as the person of ordinary skill in the field after the preferred embodiment of understanding the utility model, when can be by the technology of the utility model institute teaching, change and improvement, it does not break away from the spirit and the scope of the utility model.
Please refer to Fig. 1, it is the overlooking surface schematic diagram according to a kind of integrated circuit package structure of the utility model one preferred embodiment.In Fig. 1, chip 102 is positioned on the printed circuit board (PCB) 100, and chip 102 is by a plurality of load-carrying units, and for example connection pad 104, and tin ball 106 (being shown in Fig. 2) is fixed on the printed circuit board (PCB) 100.Wherein, connection pad 104 is arranged at the below, edge of chip 102.In the preferred embodiment of one of the utility model, connection pad 104 is arranged at the below, four corners of substrate 102, but not as limit.
Please refer to Fig. 2, is the generalized section of Fig. 1 along A-A ' line segment.In Fig. 2, chip 102 is positioned on the substrate 101, and tin ball 106 is positioned at side under the substrate 101, and substrate 101 is fixed on the printed circuit board (PCB) 100 by tin ball 106.And connection pad 104 is positioned at the below, edge of substrate 101.In the preferred embodiment of one of the utility model, connection pad 104 is arranged on the printed circuit board (PCB) 100.Perhaps, more connection pad 104 can be arranged on the one side that does not contain circuit of substrate 101, as shown in Figure 3.
Wherein, the material of above-mentioned connection pad 104 is resistant to elevated temperatures materials.Moreover the thickness of connection pad 104 is less than the thickness h of tin ball 106
1, preferably, the thickness h of the thickness of connection pad 104 and tin ball 106
1Ratio between 1: 2 to 1: 3.In the preferred embodiment of the utility model, the thickness of connection pad 104 is about 0.45mm, the thickness h of tin ball 106
1Approximately between 0.6 to 0.9mm.
Please refer to Fig. 4, is the generalized section of the integrated circuit package structure of reflow heating back.When carrying out the reflow heating process, tin ball 106 can melt and the tin ball 106a of fusion can be subjected to the substrate 101 and the gravity of chip 102 to push and produce deformation.At this moment, substrate 101 can push tin ball 106 downwards with the weight of chip 102, contacts with connection pad 104 up to substrate 101.Therefore, 104 of connection pads can support the weight of substrate 101 and chip 102, so that chip 102 can be horizontally placed on the printed circuit board (PCB) 100.Thus, the inconsistent and phenomenon that causes chip to tilt of the height of tin ball that then can improve reflow heating back, and then raising product percent of pass.
Therefore, by above-mentioned the utility model preferred embodiment as can be known, the utility model is to utilize a kind of high temperature resistant load-carrying unit, to accept chip on printed circuit board (PCB), the chip of reflow heating back can be horizontally placed on the printed circuit board (PCB).Thus, the inconsistent and phenomenon that causes chip to tilt of the height of tin ball that then can improve reflow heating back, and then raising product percent of pass.
Though the utility model discloses as above with a preferred embodiment; right its is not in order to limit the utility model; any person of ordinary skill in the field; in the spirit and scope that do not break away from the utility model; when can doing various changes and improvement, so the protection range of the utility model is as the criterion when looking the claim person of defining.
Claims (11)
1. an integrated circuit package structure is applied to the BGA Package technology, it is characterized in that this integrated circuit package structure comprises:
Circuit board;
Substrate is positioned on this circuit board, and wherein this substrate has chip;
A plurality of tin balls are positioned at side under this substrate, to connect this substrate and this circuit board; And
A plurality of connection pads are arranged at the edge below of this substrate, when above-mentioned these tin balls because of heat fusion and when be out of shape by the gravity extruding of this substrate, above-mentioned these connection pads promptly support this substrate on this circuit board, make this substrate keep level of reflow.
2. the integrated circuit package structure according to claim 1, the material that it is characterized in that above-mentioned these connection pads are resistant to elevated temperatures materials.
3. the integrated circuit package structure according to claim 1 is characterized in that above-mentioned these connection pads are arranged at the below, four corners of this substrate.
4. the integrated circuit package structure according to claim 1 is characterized in that the thickness of the thickness of above-mentioned these connection pads less than the tin ball.
5. the integrated circuit package structure according to claim 4 is characterized in that the ratio of the thickness of the thickness of above-mentioned these connection pads and tin ball is 1: 2 to 1: 3.
6. a substrate hookup mechanism is applied to the BGA Package technology, so that substrate is fixed on the printed circuit board (PCB), it is characterized in that this substrate hookup mechanism comprises:
A plurality of tin balls are positioned at side under this substrate, to connect this substrate and this printed circuit board (PCB); And
A plurality of load-carrying units, be positioned at the below, edge of this substrate, when above-mentioned these tin balls because of heat fusion and when be out of shape by the gravity extruding of this substrate, above-mentioned these load-carrying units promptly support this substrate on this circuit board, make this substrate keep level of reflow.
7. the substrate hookup mechanism according to claim 6 is characterized in that above-mentioned these load-carrying units are a plurality of connection pads.
8. the substrate hookup mechanism according to claim 6 is characterized in that above-mentioned these load-carrying units are resistant to elevated temperatures materials.
9. the substrate hookup mechanism according to claim 6 is characterized in that this load-carrying unit is arranged at the below, four corners of this substrate.
10. the substrate hookup mechanism according to claim 6 is characterized in that the thickness of the thickness of this load-carrying unit less than the tin ball.
11. the substrate hookup mechanism according to claim 9 is characterized in that the ratio of the thickness of the thickness of this load-carrying unit and tin ball is 1: 2 to 1: 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620112878 CN2893920Y (en) | 2006-04-26 | 2006-04-26 | Integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620112878 CN2893920Y (en) | 2006-04-26 | 2006-04-26 | Integrated circuit package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2893920Y true CN2893920Y (en) | 2007-04-25 |
Family
ID=38062072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620112878 Expired - Fee Related CN2893920Y (en) | 2006-04-26 | 2006-04-26 | Integrated circuit package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2893920Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593067A (en) * | 2011-01-10 | 2012-07-18 | 三星半导体(中国)研究开发有限公司 | Interconnection structure for LGA (Land grid array) packaging with controllable welding spot height and manufacturing method of interconnection structure |
| CN110729254A (en) * | 2018-07-16 | 2020-01-24 | 台湾积体电路制造股份有限公司 | Bonding structure of package and manufacturing method thereof |
| CN113808988A (en) * | 2020-06-16 | 2021-12-17 | 台湾爱司帝科技股份有限公司 | Light-emitting chip bearing structure and manufacturing method thereof |
-
2006
- 2006-04-26 CN CN 200620112878 patent/CN2893920Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593067A (en) * | 2011-01-10 | 2012-07-18 | 三星半导体(中国)研究开发有限公司 | Interconnection structure for LGA (Land grid array) packaging with controllable welding spot height and manufacturing method of interconnection structure |
| CN102593067B (en) * | 2011-01-10 | 2014-09-17 | 三星半导体(中国)研究开发有限公司 | Interconnection structure for LGA (Land grid array) packaging with controllable welding spot height and manufacturing method of interconnection structure |
| CN110729254A (en) * | 2018-07-16 | 2020-01-24 | 台湾积体电路制造股份有限公司 | Bonding structure of package and manufacturing method thereof |
| US10867881B2 (en) | 2018-07-16 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package and printed circuit board attachment |
| US11610827B2 (en) | 2018-07-16 | 2023-03-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package and printed circuit board attachment |
| CN113808988A (en) * | 2020-06-16 | 2021-12-17 | 台湾爱司帝科技股份有限公司 | Light-emitting chip bearing structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070425 |