CN2891279Y

CN2891279Y - CPU radiator structure

Info

Publication number: CN2891279Y
Application number: CN 200620002347
Authority: CN
Inventors: 蔡明坤
Original assignee: Individual
Current assignee: Individual
Priority date: 2006-02-15
Filing date: 2006-02-15
Publication date: 2007-04-18
Anticipated expiration: 2016-02-15

Abstract

The utility model relates to a CPU radiator structure, which substantially provides a radiator on a CPU, the radiator comprises a heat conduction unit and a heat dissipation unit, wherein the heat conduction unit comprises a heat conduction block, a heat pipe line, an inflow pipe, and an outflow pipe, and the bottom of the heat conduction block is attached to the CPU, the heat pipe line is provided in the internal portion of the heat conduction block to make actuating liquid circulate, the inflow port of the heat pipe line is connected with the inflow pipe, and the outflow port is connected with the outflow pipe, the position of the inflow port is lower than that of the outflow port, one end of the heat dissipation unit is connected with the outflow pipe and the other end is connected with the inflow pipe to make the actuating the liquid to dissipate heat and cool-down, thereby, when flowing through the heat conduction block, the actuating liquid is vaporized as heated and obliquely flows into the heat pipe line, and flows back to the heat conduction unit after cooled to liquid by the heat dissipation unit, and then cycles continuously to dissipate the heat and reduce the temperature.

Description

The cpu heat structure

Technical field

The utility model refers to a kind of cpu heat structure that comprises heat transmission unit and heat-sink unit especially about a kind of cpu heat structure.

Background technology

Central processing unit (Central Processing Unit, be called for short CPU) be that whole computer can be operated is most crucial, most important element, when computer system comes into operation, CPU reads the instruction and the data of various softwares in the internal memory, by after logic and the mathematical operation result being deposited back internal memory, link up by motherboard and ancillary equipment simultaneously, reach the purpose of data processing, so work that host computer is inner big and small, all must handle and just can reach through CPU, and the processing speed of CPU is fast more, and the whole efficiency of computer is high relatively more, and incident is the increase of heat energy, especially speed is fast more, the temperature of CPU is high more, if temperature continues the processing speed that rising will influence CPU, operating efficiency reduces and causes deadlock on the contrary, even generation CPU burns, therefore the high temperature efficiently radiates heat for CPU is produced then will set firmly a radiator with radiating effect CPU on, make the high temperature of CPU generation conduct to radiator and lower the temperature.

See also shown in Figure 1, it is existing cpu heat structure, these radiator 91 smooth being arranged on the CPU92, this radiator 91 mainly is the radiating fin 912 that is provided with equidistant arrangement in flat board 911, and these radiator 91 tops further are provided with fan 93, and the high temperature that CPU92 produces conducts to radiating fin 912 through dull and stereotyped 911, make surrounding air produce convection current by fan 93 again, so that hot gas dissipation to reach cooling-down effect, avoids CPU92 because of too high fault of temperature or damage, keep the CPU92 normal operation.

Yet, fan 93 drives the radiating mode of surrounding air convection current, though can take away hot gas, if ambient air temperature is higher, radiating efficiency is with variation, and air is not good heat-conduction medium, and radiating effect is not good, so since general, the computer player is all not satisfied for the radiating effect of existing radiator 91, when CPU92 temperature hurricane height and heat dissipation when not good, the data loss that computer crash causes, time waste or psychological discomfort are all pain of computer user.

Summary of the invention

Main purpose of the present utility model is to provide a kind of cpu heat structure that effectively makes heat energy dissipation, reduces cpu temperature, this radiator replaces the transmitting medium of air as heat energy to make hydrodynamic, promote radiating effect, avoid the CPU working temperature to improve, create good computer environment for use.

In order to achieve the above object, cpu heat structure of the present utility model, mainly make radiator be arranged on the CPU, this radiator comprises heat transmission unit and heat-sink unit, this heat transmission unit comprises heat exchange block, the thermal conductance pipeline, inflow pipe and outflow tube, this heat exchange block bottom is attached at CPU, the thermal conductance pipeline is arranged at heat exchange block inside and is made for the hydrodynamic circulation, the thermal conductance pipeline go into head piece and inflow pipe joins and it goes out head piece and outflow tube joins, going into the head piece position, to go out head piece low, and heat-sink unit one end communicates with outflow tube, the other end communicates with inflow pipe so that make the hydrodynamic radiating and cooling; Thus, when flowing through heat exchange block as hydrodynamic, be heated vaporization and obliquely flow are flowed back to heat transmission unit in the thermal conductance pipeline after heat-sink unit heat radiation is cooled to liquid state, and constantly circulation is so that heat dissipation, reduction temperature.

By said structure as can be known, advantage of the present utility model is:

1. utilize the hydrodynamic of doing of heat transmission unit and heat-sink unit perfusion, cooperate the high-efficiency thermal exchange capacity of making hydrodynamic, the heat energy that CPU is produced is conducted and dissipation efficiently, keep the CPU normal working temperature, make the computer running normal, even, still reach good processing speed and efficient at the operating environment of high temperature or overclocking.

2. the geometry of heat-sink unit and configuration, what can make vaporization does hydrodynamic heat extraction and reduce temperature efficiently, making hydrodynamic returns back to liquid state and is back to the thermal conductance pipeline because of cooling, again and again heat energy is drained, need not add electric power heat radiation is carried out, can take place so needn't worry the problem of circuit abnormality.

The geometric modeling of the heat dissipation pipeline of heat-sink unit and configuration can be effectively and the heat energy that will make hydrodynamic apace drain, make the hydrodynamic of doing of vaporization successfully convert liquid to, make whole heat extraction usefulness stable and respond well.

Description of drawings

Fig. 1: existing structure schematic diagram.

Fig. 2: the schematic perspective view of the utility model first embodiment.

Fig. 3: the cutaway view of the utility model first embodiment.

Fig. 4: the schematic perspective view of the utility model first embodiment heat transmission unit.

Fig. 5: the schematic perspective view of the utility model second embodiment.

Fig. 6: the cutaway view of the utility model second embodiment.

Fig. 7: the schematic perspective view of the utility model the 3rd embodiment.

Fig. 8: the cutaway view of the utility model the 3rd embodiment.

Drawing reference numeral:

1 radiator, 2 heat transmission unit

21 heat exchange blocks 211 are gone into head piece

212 go out head piece 22 thermal conductance pipelines

221 vertically manage 222 transverse pipe

223 obstruction piece, 23 inflow pipes

24 outflow tubes, 3 heat-sink units

31 heat dissipation pipelines, 32 radiating fins

4 heat-sink units, 41 heat dissipation pipelines

42 radiating fins, 5 heat-sink units

51 heat dissipation pipelines 511 are vertically managed

512 transverse pipe, 52 radiating fins

91 radiators, 911 flat boards

912 radiating fin 92CPU

93 fans

Embodiment

Extremely shown in Figure 4 as Fig. 2, first embodiment for the utility model cpu heat structure, it mainly is that radiator 1 is arranged on the CPU (not shown), this radiator 1 comprises heat transmission unit 2 and heat-sink unit 3, this heat transmission unit 2 comprises heat exchange block 21, thermal conductance pipeline 22, inflow pipe 23 and outflow tube 24, these heat exchange block 21 bottoms are attached at CPU, thermal conductance pipeline 22 is arranged at heat exchange block 21 inside and is made for the hydrodynamic circulation, the going into that head piece 211 joins with inflow pipe 23 of thermal conductance pipeline 22 and its go out head piece 212 and join with outflow tube 24, going into head piece 211 positions, to go out head piece 212 low, and the caliber of inflow pipe 23 is less than the caliber of outflow tube 24.

Thermal conductance pipeline 22 is formed by several vertical pipes 221 and transverse pipe 222 staggered being connected, make in the start perfusion is filled in, this can be refrigerant or other suitable heat eliminating medium of cooling usefulness as hydrodynamic, especially will be after being subjected to the uniform temperature heating as hydrodynamic directly from vaporizing liquid, because of the long-pending expansion of back start liquid of vaporizing, so the caliber of thermal conductance pipeline 22 enlarges to going out head piece 212 gradually from going into head piece 211.

For the vertical pipe 221 and transverse pipe 222 of making thermal conductance pipeline 22, earlier heat exchange block 21 is penetrated passage is set, with obstruction piece 223 passage is sealed in addition again, thereby in heat exchange block 21 in, form the thermal conductance pipeline 22 that seals.

Heat-sink unit 3 one ends communicate with outflow tube 24, the other end communicates with inflow pipe 23 so that make the hydrodynamic radiating and cooling, this heat-sink unit 3 comprises heat dissipation pipeline 31 and several radiating fins 32, the equidistant arrangement of radiating fin 32 and be incorporated into heat dissipation pipeline 31 sides, this heat dissipation pipeline 31 is a room, these heat dissipation pipeline 31 1 ends and outflow tube 24 join, the other end and inflow pipe 23 join, the sectional area of heat dissipation pipeline 31 is greater than outflow tube 24 and inflow pipe 23, after the making hydrodynamic and enter heat dissipation pipeline 31 of vaporization from outflow tube 24, make hydrodynamic and radiating fin 32 contacts area heighten, the heat energy of making hydrodynamic promptly is pulled away, after reducing to proper temperature, return back to liquid state and flow back to heat transmission unit 2 as hydrodynamic.

By said structure, after being used as hydrodynamic and entering heat exchange block 21 from the less inflow pipe 23 of caliber, the high temperature of CPU makes to be heated as hydrodynamic and is vaporized into gas, and then pass thermal conductance pipeline 22 obliquely and flow to outflow tube 24, the hydrodynamic of doing that the thermal conductance pipeline 22 of oblique configuration helps to vaporize rises, and do to understand volumetric expansion after the hydrodynamic vaporization, outflow tube 24 calibers mobile have positive a help greater than inflow pipe 23 calibers for what make hydrodynamic, through heat-sink unit 3 heat radiation cooling and condense into drop and be attached to heat dissipation pipeline 31 inwalls, drip inflow pipe 23 gradually again and flow back to heat transmission unit 2, vaporization so in regular turn, cooling, the step of condensing constantly circulates so that heat dissipation, reduce temperature, need not supply electric power, and formed cooling effect is good.

See also Fig. 5 and shown in Figure 6, be second embodiment of the present utility model, be heat-sink unit 4 with the first embodiment difference, this heat-sink unit 4 comprises heat dissipation pipeline 41 and radiating fin 42, this heat dissipation pipeline 41 is the passage of tool tapering, one end and the outflow tube 24 of this heat dissipation pipeline 41 joins, the other end and inflow pipe 23 join, so the caliber of heat dissipation pipeline 41 dwindles radiating fin 42 equidistant arrangements and be incorporated into heat dissipation pipeline 41 sides gradually to inflow pipe 23 sides from outflow tube 24 sides; Thus, the hydrodynamic of doing of vaporization is drained heat energy because of radiating fin 42 and is formed drop gradually and be attached to heat dissipation pipeline 41 inwalls, flows back to heat transmission unit 2 by inflow pipe 23 again.

See also Fig. 7 and shown in Figure 8, be the 3rd embodiment of the present utility model, be heat-sink unit 5 with first and second embodiment difference, this heat-sink unit 5 comprises heat dissipation pipeline 51 and radiating fin 52, this heat dissipation pipeline 51 is formed by several vertical pipes 511 and transverse pipe 512 staggered being connected, be similar to the arrangement of the thermal conductance pipeline 22 of heat transmission unit 2, and the caliber of heat dissipation pipeline 51 dwindles gradually from outflow tube 24 sides to inflow pipe 23 sides, radiating fin 52 equidistant arrangements are incorporated into heat dissipation pipeline 51 sides, can reach effect of the present utility model equally.

As from the foregoing, compare with existing cpu heat structure, advantage of the present utility model is:

1. the utility model utilizes the hydrodynamic of doing of heat transmission unit and heat-sink unit perfusion, cooperate the high-efficiency thermal exchange capacity of making hydrodynamic, the heat energy that CPU is produced is conducted and dissipation efficiently, keep the CPU normal working temperature, make the computer running normal, even, still reach good processing speed and efficient at the operating environment of high temperature or overclocking.

2. the geometry of heat-sink unit of the present utility model and configuration, what can make vaporization does hydrodynamic heat extraction and reduce temperature efficiently, making hydrodynamic returns back to liquid state and is back to the thermal conductance pipeline because of cooling, again and again heat energy is drained, need not add electric power heat radiation is carried out, can take place so needn't worry the problem of circuit abnormality.

The geometric modeling of the heat dissipation pipeline of the utility model heat-sink unit and configuration can be effectively and the heat energy that will make hydrodynamic apace drain, make the hydrodynamic of doing of vaporization successfully convert liquid to, make whole heat extraction usefulness stable and respond well.

Though the utility model discloses with specific embodiment; but it is not in order to limit the utility model; any those skilled in the art; the displacement of the equivalent assemblies of under the prerequisite that does not break away from design of the present utility model and scope, having done; or, all should still belong to the category that this patent is contained according to equivalent variations and modification that the utility model scope of patent protection is done.

Claims

1. cpu heat structure, this radiator is arranged on the CPU, it is characterized in that: described radiator comprises heat transmission unit and heat-sink unit, this heat transmission unit includes heat exchange block, thermal conductance pipeline, inflow pipe and outflow tube, the thermal conductance pipeline is arranged at heat exchange block inside, the thermal conductance pipeline is provided with inflow pipe joins to go into head piece and go out head piece with outflow tube joins, describedly goes into the head piece position and is lower than head piece, and heat-sink unit one end communicates with outflow tube, the other end communicates with inflow pipe; One can be heated the vaporization do the hydrodynamic obliquely flow in the thermal conductance pipeline.

2. cpu heat structure as claimed in claim 1 is characterized in that: several vertical pipes of heat pipe route and staggered being connected of transverse pipe form.

3. cpu heat structure as claimed in claim 2 is characterized in that: vertically pipe and transverse pipe are to be sealed and constituted by the passage that obstruction piece will be arranged in heat exchange block.

4. cpu heat structure as claimed in claim 1 is characterized in that: the caliber of inflow pipe is less than the caliber of outflow tube.

5. cpu heat structure as claimed in claim 1 is characterized in that: heat-sink unit comprises heat dissipation pipeline and several radiating fins, and equidistant arrangement of radiating fin is incorporated into the heat dissipation pipeline side.

6. cpu heat structure as claimed in claim 5 is characterized in that: this heat dissipation pipeline is a room, this room one end and outflow tube joins, the other end and inflow pipe join, and the sectional area of heat dissipation pipeline is greater than outflow tube and inflow pipe.

7. cpu heat structure as claimed in claim 5 is characterized in that: this heat dissipation pipeline is the passage with tapering, and one end and outflow tube join, the other end and inflow pipe join.

8. cpu heat structure as claimed in claim 5 is characterized in that: this heat dissipation pipeline is vertically managed by several and staggered being connected of transverse pipe forms, and the caliber of heat dissipation pipeline dwindles gradually from outflow tube side to inflow pipe side.