CN2881651Y - Testing socket for electrical property of electric package - Google Patents
Testing socket for electrical property of electric package Download PDFInfo
- Publication number
- CN2881651Y CN2881651Y CN 200520106284 CN200520106284U CN2881651Y CN 2881651 Y CN2881651 Y CN 2881651Y CN 200520106284 CN200520106284 CN 200520106284 CN 200520106284 U CN200520106284 U CN 200520106284U CN 2881651 Y CN2881651 Y CN 2881651Y
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- Prior art keywords
- probes
- test jack
- contacts
- package unit
- those
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Abstract
A test socket is applicable to be assembled on a test circuit board for the electrical property of the electric package, wherein the testing circuit board is provided with a plurality of test pads, the electric package has a contact surface, which a plurality of contacts are at the electric package, these contacts are lined up with a pair of alignment lines, a test socket includes an insulation body and a plurality of probes. The insulation body is provided with a support surface to support the contact surface of the electric package. A plurality of probes are passed and arranged in the insulating body respectively as the electrical channel between these contacts and test pads, these probes are applicable to respectively contact these contacts, at least neighboring three of these probes respond to the alignment line and are the staggered lined up.
Description
Technical field
The utility model relates to a kind of test jack, and particularly relevant for a kind of test jack that is applied to the testing electrical property of electric package unit.
Background technology
After integrated circuit (IC) Chip Packaging forms packaging body, all can carry out the test of element stage usually to test suite, to reject bad packaging body, guarantee the shipment quality of packaging body.In addition, after being mounted to computer system, it can cooperate and normal operation with system in order to ensure packaging body, more can carry out system's stage test to packaging body, and this packaging body for high-order or expensive IC chip is necessary.
According to the difference of the encapsulation kenel of packaging body, the test suite of packaging body also can be different.(its test suite comprises a testing circuit board and a test jack for Quad Flat No-lead, the QFN) packaging body of encapsulation kenel, and wherein test jack is mounted on the testing circuit board with regard to non-pin square flat.Test jack comprises an insulating body and many elastic probes (pogo-pin), and wherein these elastic probes are arranged within the insulating body, and the arrangement of these elastic probes is disposed corresponding to the electrode bumps contact of QFN packaging body to be measured.In addition, the part surface corresponding to test jack of testing circuit board also has a plurality of testing cushion, and the lower end of these elastic probes is flexibly to contact these testing cushion respectively.
When the QFN packaging body is mounted to test jack, and during the continuing surface of the contact face of QFN packaging body contact insulating body, the upper end of these elastic probes contacts the electrode bumps contact on the contact face of these QFN packaging bodies respectively, make these elastic probes will be respectively as the electrical passage between these testing cushion of these electrode bumps contacts of QFN packaging body and testing circuit board.Therefore, the QFN packaging body can be electrically connected to testing circuit board via test jack, so that the IC chip within the QFM packaging body is carried out testing electrical property.
Yet, known test jack corresponding to the QFN packaging body test, raising along with the pin density of QFN packaging body, make that the arrangement pitch of these elastic probes of known test jack is too narrow and small for the size of elastic probe, so will cause the capacitive coupling (capacitive coupling) between adjacent elastic probe to increase, so cause impedance do not match (impedancemismatch) worsen and reduce the quality that signal transmits more.This test accuracy for the integral body of test suite is quite disadvantageous.
Summary of the invention
In view of this, the purpose of this utility model provides a kind of test jack that is used for the testing electrical property of electric package unit, in order to promote the quality that its signal transmits.
Based on above-mentioned purpose or other purposes, the utility model proposes a kind of test jack, be suitable for being assembled on the testing circuit board, to be applied to the testing electrical property of an electric package unit, wherein testing circuit board has a plurality of testing cushion, and electric package unit has the contact face of a plurality of contacts in electric package unit, and these contacts be an alignment line arrange, test jack comprises an insulating body and a plurality of probe.Insulating body has a continuing surface, in order to accept the contact face of electric package unit.A plurality of probes are arranged within the insulating body, in order to respectively as the electrical passage between these contacts and these testing cushion, wherein these probes are suitable for contacting these contacts respectively, and at least three adjacent probes of these probes are to be staggered corresponding to alignment line to arrange.
Described according to preferred embodiment of the present utility model, the distance between at least two adjacent probe of these above-mentioned probes adds the sixth along the width of alignment line of upper contact more than or equal to the distance between wantonly two neighbors of these contacts.
Described according to preferred embodiment of the present utility model, these above-mentioned probes all are staggered corresponding to alignment line and arrange.
Described according to preferred embodiment of the present utility model, these above-mentioned probes are elastic probe.
Described according to preferred embodiment of the present utility model, above-mentioned test jack is applicable to the test of the electric package unit of cubic flat pin-free type.
Based on above-mentioned purpose or other purposes, the utility model proposes a kind of test jack, be suitable for being assembled on the testing circuit board, to be applied to the testing electrical property of an electric package unit, wherein testing circuit board has a plurality of testing cushion, and electric package unit has the contact face of a plurality of contacts in electric package unit, and these contacts be an alignment line arrange, test jack comprises an insulating body and a plurality of probe.Insulating body has a continuing surface, in order to accept the contact face of electric package unit.A plurality of probes are arranged within the insulating body, in order to respectively as the electrical passage between these contacts and these testing cushion, wherein these probes are suitable for contacting these contacts respectively, and the distance between at least two adjacent probe of these probes is greater than the distance between wantonly two neighbors of these contacts.
Described according to preferred embodiment of the present utility model, the distance between at least two adjacent probe of above-mentioned these adds the sixth along the width of alignment line of upper contact more than or equal to the distance between wantonly two neighbors of these contacts.
Described according to preferred embodiment of the present utility model, at least three adjacent probes of these above-mentioned probes are staggered corresponding to alignment line and arrange.
Described according to preferred embodiment of the present utility model, these above-mentioned probes are elastic probe.
Described according to preferred embodiment of the present utility model, above-mentioned test jack is applicable to the test of the electric package unit of cubic flat pin-free type.
Based on above-mentioned, change by the arrangement mode of test jack internal probe of the present utility model position, at least make the capacitive coupling between certain adjacent two probe reduce, and then the quality that causes preferable impedance matching (impedance matched) and promote the signal transmission, thereby the accuracy of the testing electrical property of raising electric package unit.
For above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 illustrates the package assembly schematic side view of a kind of test suite and the electric package unit of the utility model first embodiment.
Fig. 2 illustrates the schematic top plan view of the local member of Fig. 1.
Fig. 3 illustrates the package assembly schematic top plan view of the local member of a kind of test suite of the utility model second embodiment and electric package unit.
Fig. 4 illustrates the package assembly schematic top plan view of the local member of a kind of test suite of the utility model the 3rd embodiment and electric package unit.
Fig. 5 illustrates the package assembly schematic top plan view of the local member of a kind of test suite of the utility model the 4th embodiment and electric package unit.
100: test suite
110: testing circuit board
112: testing cushion
120,320,520,720: test jack
122: insulating body
122a: continuing surface
124,324,324a, 324b, 324c, 324d, 524,724: probe
200: electric package unit
210: the contact face
210a, 410a, 610a, 810a: contact
A: alignment line
D1, d2, d1 ', d2 ', d1 ", d2 ": the distance between adjacent probe
L1, L2: differential-pair signal line
W: contact width
Embodiment
Please refer to Fig. 1, it illustrates the package assembly schematic side view of a kind of test suite and the electric package unit of the utility model first embodiment.Test suite 100 is suitable for the testing electrical property of an electric package unit 200 (for example for QFN packaging body), and wherein electric package unit 200 has a contact face 210, and it has a plurality of contact 210a and is disposed on the contact face 210.
Test suite 100 comprises a testing circuit board 110 and a test jack 120.Testing circuit board 110 has a plurality of testing cushion 112.In addition, test jack 120 sets to testing circuit board 110, and wherein test jack 120 is to be mounted on the testing circuit board 110 in mode such as affixed or detachable.Test jack 120 comprises an insulating body 122 and a plurality of probes 124.Insulating body 122 has a continuing surface 122a, in order to accept the contact face 210 of electric package unit 200.A plurality of probes 124 are arranged within the insulating body 122, and as the electrical passage between these contacts 210a and these testing cushion 112, wherein these probes 124 are suitable for contacting respectively these contacts 210a in order to respectively.
When electric package unit 200 is mounted to test jack 120, and during the continuing surface 122a of the contact face 210 contact insulating bodies 122 of electric package unit 200, the upper end of these probes 124 will contact these contacts 210a on the contact face 210 of electric package unit 200 respectively, make these probes 124 respectively as the electrical passage between these contacts 210a and these testing cushion 112, meaning is promptly as the electrical passage between electric package unit 200 and the testing circuit board 110.Therefore, electric package unit 200 can be electrically connected to testing circuit board 110 via test jack 120, come the IC chip (Fig. 1 does not illustrate) within the electric package unit 200 is carried out testing electrical property so can see through testing circuit board 110.It should be noted that, these probes 124 within insulating body 122 can adopt elastic probe (pogo-pin), itself can stretch in response to suffered strength size, thereby the upper end of guaranteeing these probes 124 can both contact these contacts 210a on the contact face 210 of electric package unit 200 respectively.
Please also refer to Fig. 1 and Fig. 2, wherein Fig. 2 illustrates the schematic top plan view of the local member of Fig. 1.Relative position for 124 of these probes of these contacts 210a that shows electric package unit 200 and test jack 120, for the electrical equipment packaging body 200 of Fig. 1, Fig. 2 only illustrates the part contact 210a of electric package unit 200, in like manner, for the test jack 120 of Fig. 1, Fig. 2 only illustrates the part probe 124 of test jack 120.As shown in Figure 2, these contacts 210a of electric package unit 200 arranges along an alignment line A, and these probes 124 of test jack 120 have at least three adjacent probes to be staggered arrangement corresponding to alignment line A, or these all probes 124 all are staggered arrangement corresponding to alignment line A.
Please refer to Fig. 3, it illustrates the package assembly schematic top plan view of the local member of a kind of test suite of the utility model second embodiment and electric package unit.For the relative position of 324 of these probes of these contacts 410a that shows electric package unit and test jack 320, Fig. 3 only illustrates the part contact 410a of electric package unit and the part probe 324 of test jack 320.As shown in Figure 3, the different arrangement modes that are in probe of first embodiment of second embodiment and Fig. 2, these probes 324 of Fig. 3 are the same with these contacts 410a all to be arranged along an alignment line A, and between at least two adjacent probe of these probes 324 apart from d1 greater than between any two neighbors of these contacts 410a apart from d2.Apart from d1 be to add the sixth of upper contact 410a more than or equal to distance d2 apart from the pass of d2 along the width w of alignment line A apart from d1, its mathematical notation formula is d1 〉=d2+ (w/6).
Offer a piece of advice it, among second embodiment, probe 324 can be subdivided into the probe 324a and the 324d of usefulness as control probe (control pin), and as the probe 324b and the 324c of the usefulness of signal probe (signal pin).Via as can be known above-mentioned, can reduce capacitive coupling between signal probe apart from the increase of d1 between probe 324b and the 324c.In addition, though between probe 324a and the probe 324b and the distance between probe 324c and the probe 324d therefore reduce, but because control probe (that is probe 324a and 324d) is the signal of carrying low frequency, and its frequency is lower than the frequency that signal probe (that is probe 324b and 324c) is carried, thus the capacitive coupling between signal probe and the control probe a little less than.One of them that it should be noted that probe 324b and 324c can be used as the usefulness of power probe (power pin) or grounded probe (ground pin), and probe 324a and 324d can be used as the usefulness of floating probe (floatingpin).
Please refer to Fig. 4, it illustrates the package assembly schematic top plan view of the local member of a kind of test suite of the utility model the 3rd embodiment and electric package unit.For the relative position of 524 of these probes of these contacts 610a that shows electric package unit and test jack 520, Fig. 4 only illustrates the part contact 610a of electric package unit and the part probe 524 of test jack 520.As shown in Figure 4, second embodiment of the 3rd embodiment and Fig. 3 is different be on the testing circuit board of Fig. 4, have one differential to (differential pair) signal wire L1, L2, therefore, in this case, the 3rd embodiment with differential-pair signal line L1, the arrangement mode of the contacted probe 524 of L2 is suitable for taking the arrangement mode of second embodiment, that is with differential-pair signal line L1, the spacing distance d1 ' of the contacted probe 524 of L2 greater than between any two neighbors of these contacts 610a apart from d2 ', and apart from d1 ' and apart from the relation between the d2 ' as described in second embodiment.
Please refer to Fig. 5, it illustrates the package assembly schematic top plan view of the local member of a kind of test suite of the utility model the 4th embodiment and electric package unit.For the relative position of 724 of these probes of these contacts 810a that shows electric package unit and test jack 720, Fig. 5 only illustrates the part contact 810a of electric package unit and the part probe 724 of test jack 720.As shown in Figure 5, the 4th embodiment is the matched combined of first embodiment and second embodiment.These contacts 810a arranges along an alignment line A, and these probes 724 of test jack 720 have at least three adjacent probes to be staggered corresponding to alignment line A to arrange, or these all probes 724 all are staggered corresponding to alignment line A and arrange.In addition, between at least two adjacent probe of these probes 724 apart from d1 " greater than between any two neighbors of these contacts 810a apart from d2 ", and apart from d1 " and apart from d2 " between relation as described in second embodiment.
In sum, change by the arrangement mode of test jack internal probe of the present utility model position, at least make that the capacitive coupling of (for example particularly between the signal probe of two carrying high-frequency signals) reduces between certain adjacent two probe, and then the quality that causes preferable impedance matching and promote the signal transmission, thereby the accuracy of the testing electrical property of raising electric package unit.In addition, because the size that the utility model need not dwindle probe only needs adjust the position of the probe in the test jack slightly when the processing test jack, so can save the production cost of test jack with the design of the high density contact that meets electric package unit.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; anyly have the knack of this skill person; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection domain of the present utility model is as the criterion when looking accompanying the claim person of defining.
Claims (10)
1, a kind of test jack, be suitable for being assembled on the testing circuit board, to be applied to the testing electrical property of an electric package unit, wherein this testing circuit board has a plurality of testing cushion, and this electric package unit has the contact face of a plurality of contacts in this electric package unit, and those contacts be an alignment line arrange, it is characterized in that wherein said test jack comprises:
One insulating body has a continuing surface, in order to accept this contact face of this electric package unit; And
A plurality of probes, be arranged within this insulating body, as the electrical passage between those contacts and those testing cushion, wherein those probes are suitable for contacting those contacts respectively in order to respectively, and at least three adjacent probes of those probes are to be staggered corresponding to this alignment line to arrange.
2, test jack according to claim 1 is characterized in that the distance between at least two adjacent probe of wherein said those probes adds the sixth of this contact along the width of this alignment line more than or equal to the distance between wantonly two neighbors of those contacts.
3, test jack according to claim 1 is characterized in that wherein said those probes all are staggered corresponding to this alignment line and arrange.
4, test jack according to claim 1 is characterized in that wherein said those probes are elastic probe.
5, test jack according to claim 1 is characterized in that it is the test jack of the electric package unit of a cubic flat pin-free type.
6, a kind of test jack, be suitable for being assembled on the testing circuit board, to be applied to the testing electrical property of an electric package unit, wherein this testing circuit board has a plurality of testing cushion, and this electric package unit has the contact face of a plurality of contacts in this electric package unit, and those contacts be an alignment line arrange, it is characterized in that wherein said test jack comprises:
One insulating body has a continuing surface, in order to accept this contact face of this electric package unit; And
A plurality of probes, be arranged within this insulating body, in order to respectively as the electrical passage between those contacts and those testing cushion, wherein those probes are suitable for contacting those contacts respectively, and the distance between at least two adjacent probe of those probes is greater than the distance between wantonly two neighbors of those contacts.
7, test jack according to claim 6 is characterized in that the distance between wherein said those at least two adjacent probe adds the sixth of this contact along the width of this alignment line more than or equal to the distance between wantonly two neighbors of those contacts.
8, test jack according to claim 6, at least three adjacent probes that it is characterized in that wherein said those probes are to be staggered corresponding to this alignment line to arrange.
9, test jack according to claim 6 is characterized in that wherein said those probes are elastic probe.
10, test jack according to claim 6 is characterized in that it is the test jack of the electric package unit of a cubic flat pin-free type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520106284 CN2881651Y (en) | 2005-08-26 | 2005-08-26 | Testing socket for electrical property of electric package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520106284 CN2881651Y (en) | 2005-08-26 | 2005-08-26 | Testing socket for electrical property of electric package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2881651Y true CN2881651Y (en) | 2007-03-21 |
Family
ID=37881495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520106284 Expired - Lifetime CN2881651Y (en) | 2005-08-26 | 2005-08-26 | Testing socket for electrical property of electric package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2881651Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430354B (en) * | 2007-11-08 | 2011-01-05 | 环旭电子股份有限公司 | Test method and apparatus for pin element |
| CN107247163A (en) * | 2017-06-13 | 2017-10-13 | 睿力集成电路有限公司 | A kind of integrated circuit component test jack and test platform |
-
2005
- 2005-08-26 CN CN 200520106284 patent/CN2881651Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430354B (en) * | 2007-11-08 | 2011-01-05 | 环旭电子股份有限公司 | Test method and apparatus for pin element |
| CN107247163A (en) * | 2017-06-13 | 2017-10-13 | 睿力集成电路有限公司 | A kind of integrated circuit component test jack and test platform |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150826 Granted publication date: 20070321 |
|
| EXPY | Termination of patent right or utility model |