CN2864985Y - Cooling device for electronic element - Google Patents
Cooling device for electronic element Download PDFInfo
- Publication number
- CN2864985Y CN2864985Y CN 200520143075 CN200520143075U CN2864985Y CN 2864985 Y CN2864985 Y CN 2864985Y CN 200520143075 CN200520143075 CN 200520143075 CN 200520143075 U CN200520143075 U CN 200520143075U CN 2864985 Y CN2864985 Y CN 2864985Y
- Authority
- CN
- China
- Prior art keywords
- stores
- groove
- heat
- inlet
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 239000012809 cooling fluid Substances 0.000 claims description 36
- 239000002826 coolant Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 abstract 7
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 13
- 239000006096 absorbing agent Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009183 running Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A radiation device for electronic elements which comprises a storage slot, cooling liquid provided in said storage slot, a canal connecting said storage slot for cooling liquid flowing, an extraction unit for extracting said cooling liquid, a cooling-down unit for cooling down the temperature of the cooling liquid, and a heat diffusion unit for exchanging heat of said electronic elements. Said storage slot is equipped with a liquid inlet, a liquid outlet and an extending pipe with its one end connecting with said liquid inlet and the other end extending to the storage space which is far from said liquid outlet. The cooling liquid flows into said storage slot along with said extending pipe to prolong the flowing path and periods of the cooling liquid, thereby this utility model promotes the heat dissipation rate of said radiation device by providing the cooling liquid with relatively long periods to exchange heat with said storage slot to reduce the temperature.
Description
[technical field]
The utility model relates to a kind of heat abstractor, particularly relates to a kind of heat abstractor that is used for electronic component.
[background technology]
Along with scientific and technological progress, many electronic components marched toward all miniaturization, design characteristics such as high-speed, the microprocessor in the computer product (CPU) especially, characteristics attract the consumer to buy to upgrade faster especially.The height but the CPU of high-speed computation more, the heat of generation also can be healed, if can't be immediately promptly with the heat band from CPU, tend to cause computer to work as problems such as machine, data damage, therefore, how handling the electronic component heat dissipation problem in when running, is that the dealer constantly makes great efforts the direction studied.
Consult Fig. 1, generally be used at present the heat abstractor 1 of electronic component, but be that heat exchange ground is connected with this electronic component 100, the hot type that produces during with these electronic component 100 runnings from, itself operate normally to keep this electronic component 100.This heat abstractor 1 comprises absorber 11, a refrigerant 12, a pump 13, a condensing unit 14, of a hollow can be for the ccontaining reservoir 15 of this refrigerant 12, and a conduit 16 that is connected with this reservoir 15.
This conduit 16 has a port of export 161 that is connected with this reservoir 15, and one is connected with this reservoir 15 and in contrast to the arrival end 162 of this port of export 161.This absorber 11 is to be connected with this conduit 16 and to be in contact with one another with this electronic component 100, and can carry out heat exchange action to this electronic component 100.This pump 13 is arranged on this conduit 16 and contiguous these arrival end 162 places, uses so that this refrigerant 12 flows out these reservoirs 15 from the arrival end 162 of this conduit 16.This condensing unit 14 is arranged on this conduit 16 and contiguous these port of export 161 places, and this condensing unit 14 has a condenser pipe 141 that is continuous bending and is connected with this conduit 16, and several pieces are arranged at intervals at the fin 142 on this condenser pipe 141.
When this refrigerant 12 is extracted by this pump 13 and after flowing out this reservoir 15, just flows into this absorber 11 inside along this conduit 16, the heat that these electronic component 100 starts are produced is convenient to be heat catalysis with this absorber 11, is passed to this refrigerant 12.
This refrigerant 12 continues to flow and enters the condenser pipe 141 of this condensing unit 14, this refrigerant 12 just carried out heat exchange with this condenser pipe 141 and arranged from entrained heat this moment, and by the tube wall of this condenser pipe 141 be in contact with one another with fin 142 and with heat row to the external world.
This refrigerant 12 is arranging heat to the external world, just can flow via this port of export 161 and inject this reservoir 15, and carry out heat exchange by this reservoir 15, and it is once more that heat transferred is extremely extraneous, temperature with this refrigerant 12 of further reduction, and extract and circulate by this pump 13 so that the heat that produces during these electronic component 100 starts can arrange rapidly from, make this electronic component 100 stablize the purpose of normal operation and reach.
Yet; when this refrigerant 12 flows in these reservoirs 15 by the port of export 161 of this conduit 16; owing to do not have deflector between this port of export 161 and the arrival end 162; so that this reservoir 15 is promptly flowed out by the arrival end 162 of this conduit 16 in regular meeting during this refrigerant 12; thereby shorten the time that this refrigerant 12 and this reservoir 15 carry out heat exchange; be difficult for making this refrigerant 12 further to reduce temperature, for the integral heat sink efficient of this heat abstractor 1, relatively just can't further improve.
Therefore, how to improve the integral heat sink efficient of this heat abstractor 1, just become relevant dealer and need be improved part.
[utility model content]
The purpose of this utility model is to provide a kind of heat abstractor that is used for electronic component, can prolong cooling fluid in flow path that stores groove and flowing time, with the radiating efficiency of further raising heat abstractor.
For achieving the above object, the utility model provides a kind of heat abstractor that is used for electronic component, include one and define a groove that stores that stores the space, one is placed in this stores cooling fluid in the space, one can be for the conduit of this coolant flow, one extracting unit, one cooling unit, an and heat transfer unit, this stores groove and offers and be communicated with this and store an inlet and a liquid outlet of space and space, this stores groove and has an extension, the one end is connected with this inlet, the other end then extends to this and stores in the space and away from this liquid outlet, this conduit has a port of export that is connected with this inlet that stores groove, and one be connected with this liquid outlet that stores groove and in contrast to the arrival end of this port of export, this extracting unit is arranged on this conduit and contiguous this arrival end, in order to extract this cooling fluid, making it store the space via this flows to this arrival end, this cooling unit is arranged on this conduit and contiguous this port of export, in order to reduce the temperature of this cooling fluid, this heat transfer unit is arranged on this conduit, and between this extracting unit and cooling unit, this heat transfer unit contacts with this electronic component, so that this electronic component is carried out heat exchange.Flow into this by this cooling fluid along this extension and store groove, and prolong the flow path and the flowing time of this cooling fluid, make this cooling fluid have long time and this to store groove and carry out heat exchange, improve the radiating efficiency of this heat abstractor to reduce temperature.
The described heat abstractor that is used for electronic component, it is characterized in that: this stores groove and also has a sidewall that can supply this inlet and liquid outlet to be provided with at interval respectively, and this end that stores the extension of groove is connected with this inlet, and the other end then vertically extends to respect to this sidewall and stores in the space.
The described heat abstractor that is used for electronic component, it is characterized in that: this stores groove and also has a sidewall that can supply this inlet and liquid outlet to be provided with at interval respectively, and this end that stores the extension of groove is connected with this inlet, and the other end then extends to this liquid outlet direction with respect to this sidewall slope ground and stores in the space.
The utility model flows into this by this cooling fluid along this extension that stores groove and stores the space, therefore prolonged the flow path and the flowing time of this cooling fluid, on the one hand this cooling fluid has comparatively sufficient time and this to store groove to carry out heat exchange action, and entrained heat is arranged to extraneous, reduce the temperature of this cooling fluid; On the other hand, then be to avoid this cooling fluid after this inlet flows into this and stores groove, just promptly from this liquid outlet row from.By above-mentioned mode, just can make this cooling fluid have long time and this to store groove and carry out heat exchange to reduce temperature, improve the radiating efficiency of this heat abstractor, so that this electronic component can be kept normal operation.
[description of drawings]
Fig. 1 is a user mode schematic diagram, and the existing heat abstractor that is used for electronic component is described.
Fig. 2 is a user mode schematic diagram, illustrates that the utility model is used for first preferred embodiment of the heat abstractor of electronic component.
Fig. 3 is a user mode schematic diagram, illustrates that the utility model is used for second preferred embodiment of the heat abstractor of electronic component.
[embodiment]
Below by preferred embodiment and accompanying drawing the heat abstractor that the utility model is used for electronic component is elaborated.
Before the utility model is described in detail, be noted that in the following description similar elements is to represent with identical numbering.
Consult Fig. 2, the utility model is used for first preferred embodiment of the heat abstractor 3 of electronic component, include one and define a groove 31, that stores that stores space 311 and be placed in this and store cooling fluid 32 in the space 311, conduit 33, extracting units 34, a cooling unit 35 that can flow for this cooling fluid 32, and a heat transfer unit 36.
This stores groove 31 is made by Heat Conduction Material, and this stores an inlet 312 and a liquid outlet 313 of space 311 and the external world and space to offer connection, this stores groove 31 and has an extension 314, reaching one can be for the sidewall 315 of this inlet 312 with liquid outlet 313 difference interval settings, one end of this extension 314 is connected with this inlet 312, and the other end then extends to these liquid outlet 313 directions obliquely with respect to this sidewall 315 and stores in the space 311.
This conduit 33 has a port of export 331 that is connected with this inlet 312 that stores groove 31, and one is connected with this liquid outlet 313 that stores groove 31 and in contrast to the arrival end 332 of this port of export 331.
This extracting unit 34 is arranged on this conduit 33 and contiguous this arrival end 332, in order to extract this cooling fluid 32, makes it store space 311 via this and flows to this arrival end 332, and in the present embodiment, this extracting unit 34 is pumps.
This cooling unit 35 is arranged on this conduit 33 and contiguous this port of export 331, and have one and be the curved and cooling pipe 351 that be connected with this conduit 33 of Curved Continuous, several pieces and this cooling pipe 351 fin that are in contact with one another 352, an and fan 353 that is arranged on the described fin 352.
This heat transfer unit 36 is arranged on this conduit 33, between this extracting unit 34 and cooling unit 35, this heat transfer unit 36 has one and is connected with this conduit 33 and is located at hollow housing 361 on this electronic component 2, and several pieces are located at the radiating fin 362 in this housing 361 at interval.
When these electronic component 2 starts, the heat that it produced can be passed on this housing 361 and the described radiating fin 362, relends by this cooling fluid 32 this housing 361 inside of flowing through, and carries out heat exchange action with described radiating fin 362 simultaneously.
This cooling fluid 32 continues to flow along this conduit 33, just 351 inside are managed in the cooling of this cooling unit 35 of can flowing through, and by the tube wall of this cooling pipe 351 be in contact with one another with described fin 352 and with heat row to the external world, and utilize the 353 running air-supplies of this fan and accelerate the rate of heat dispation of described fin 352, so that this cooling fluid 32 can reduce temperature.
When this cooling fluid 32 continues to flow, can flow into this along this extension 314 that stores groove 31 and store space 311, at this moment, this cooling fluid 32 just can be prolonged in flow path and the flowing time that this stores groove 31 inside, and because this stores groove 31 is by Heat Conduction Material (copper for example, aluminium) made, thermal transmission coefficient is higher, this cooling fluid 32 can store groove 31 with this and carry out heat exchange action, and entrained heat is arranged from extremely extraneous, reduce the temperature of this cooling fluid 32, moreover, after also can avoiding this cooling fluid 32 to flow into this storing groove 31, just promptly flow out, shorten storing the time that groove 31 carries out heat exchange with this from this liquid outlet 313.
By above-mentioned design, make this cooling fluid 32 can only in this lowers the temperature unit 35, not get rid of heat to reduce temperature, can also in storing groove 31, this prolong flow path and flowing time, and store groove 31 heat radiation by this, with further reduction temperature, and when this cooling fluid 32 is circulated, can accelerate the heat that row is produced from these electronic component 2 starts in this conduit 33, to improve the radiating efficiency of this heat abstractor 3, make this electronic component 2 can keep normal operation.
Consult Fig. 3, the utility model is used for second preferred embodiment of the heat abstractor 3 of electronic component, roughly be similar to this first preferred embodiment, include one equally and define a groove 31, that stores that stores space 311 and be placed in this and store cooling fluid 32 in the space 311, conduit 33, extracting units 34, a cooling unit 35 that can flow for this cooling fluid 32, and a heat transfer unit 36.This stores groove 31 is made by Heat Conduction Material, and this stores an inlet 312 and a liquid outlet 313 of space 311 and the external world and space to offer connection, this stores groove 31 and has an extension 314, and a sidewall 315 that can supply this inlet 312 and liquid outlet 313 to be provided with at interval respectively.
Different places only are: an end of this extension 314 is connected with this inlet 312, and the other end then vertically extends to respect to this sidewall 315 and stores in the space 311.
This extension 314 that stores groove 31 can flow into this and stores groove 31 flow path and the flowing time when inner in order to prolong this cooling fluid 32, this cooling fluid 32 can store groove 31 with this and carry out heat exchange, and heat transferred is extremely extraneous, so that this cooling fluid 32 is further cooled off and reduced temperature, improve the radiating efficiency of this heat abstractor 3 whereby.
By above-mentioned explanation as can be known, the utility model is used for the heat abstractor 3 of electronic component, extending to this by an end of this extension 314 stores in the space 311 and away from this liquid outlet 313, so that this cooling fluid 32 can prolong flow path and flowing time in this stores groove 31, flow out from this liquid outlet 313 and be unlikely promptly.This cooling fluid 32 is carried out heat exchange action by storing groove 31 with this, and entrained heat is arranged from extremely extraneous, and then reduce the temperature of this cooling fluid 32, compared to the heat abstractor 1 that generally is used for electronic component, the cooling fluid 32 of the utility model heat abstractor 3 can be cooled to lower temperature, the heat row who is produced in the time of can be more quickly with these electronic component 2 starts from, improve the radiating efficiency of this heat abstractor 3, so can reach effect of the present utility model really.
Claims (3)
1. heat abstractor that is used for electronic component, include one and define a groove that stores that stores the space, one is placed in this stores cooling fluid in the space, one conduit for this coolant flow, one extracting unit, one cooling unit, an and heat transfer unit, this stores groove and offers and be communicated with this and store an inlet and a liquid outlet in space, this conduit has a port of export that is connected with this inlet that stores groove, and one be connected with this liquid outlet that stores groove and in contrast to the arrival end of this port of export, this extracting unit is arranged on this conduit and contiguous this arrival end, this cooling unit is arranged on this conduit and contiguous this port of export, this heat transfer unit is arranged on this conduit and between this extracting unit and cooling unit, this heat transfer unit contacts with this electronic component, it is characterized in that:
This stores groove and has an extension, and this extension one end is connected with this inlet, and the other end then extends to and stores in the space and away from this liquid outlet.
2. the heat abstractor that is used for electronic component according to claim 1, it is characterized in that: this stores groove and also has a sidewall for this inlet and the interval setting of liquid outlet difference, and this end that stores the extension of groove is connected with this inlet, and the other end then vertically extends to respect to this sidewall and stores in the space.
3. the heat abstractor that is used for electronic component according to claim 1, it is characterized in that: this stores groove and also has a sidewall for this inlet and the interval setting of liquid outlet difference, and this end that stores the extension of groove is connected with this inlet, and the other end then extends to this liquid outlet direction with respect to this sidewall slope ground and stores in the space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520143075 CN2864985Y (en) | 2005-12-19 | 2005-12-19 | Cooling device for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520143075 CN2864985Y (en) | 2005-12-19 | 2005-12-19 | Cooling device for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2864985Y true CN2864985Y (en) | 2007-01-31 |
Family
ID=37677436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520143075 Expired - Fee Related CN2864985Y (en) | 2005-12-19 | 2005-12-19 | Cooling device for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2864985Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
-
2005
- 2005-12-19 CN CN 200520143075 patent/CN2864985Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070131 Termination date: 20100119 |