CN2859806Y - Cross fluid flow pin-rib array minisize heat exchanger - Google Patents
Cross fluid flow pin-rib array minisize heat exchanger Download PDFInfo
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- CN2859806Y CN2859806Y CN 200620001679 CN200620001679U CN2859806Y CN 2859806 Y CN2859806 Y CN 2859806Y CN 200620001679 CN200620001679 CN 200620001679 CN 200620001679 U CN200620001679 U CN 200620001679U CN 2859806 Y CN2859806 Y CN 2859806Y
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- fluid
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Abstract
A fluid passing by needle-rib array type micro heat exchanger-a cooling device, belonging to microelectronics technology field. The device comprise a fluid passage sheet superposed and packaged together in order, outlet fluid-guide sheet, inlet fluid-guide sheet, heat conduction sheet. Fluid passage sheet is mounted with fluid inlet and outlet connected with outer pipeline. Outlet fluid-guide sheet is mounted with outlet passage, fluid inlet and outlet. Inlet fluid-guide sheet is mounted with fluid inlet positioned at corresponding position of fluid inlet of fluid passage sheet, and also fluid guide bridge, fluid inlet slot and fluid outlet slot. Heat conduction sheet is mounted with fluid inlet passage and needle-rib array. The present minitype heat exchanger is based on fluid passing by needle-rib principle and be a effective device for promoting temperature distribution uniformity of heat-emitting device surface to be cooled.
Description
Technical field:
The utility model belongs to microelectronics technology, relates to a kind of cooling device.
Background technology:
Along with the continuous development of industrial technology, various electronic products direction little, in light weight towards volume invariably, high heat flux develops.Therefore, for the electronic equipment of a new generation, the design limit of traditional cooler and manufacturing technology can't meet the requirements.The development of micro-cooler comes from the heat dissipation problem that solves high speed integrated circuit, at present to the various high heat flux field development that weight limits and volume restrictions are arranged, as aerospace industry, electronic devices and components cooling, high power semiconductor lasers cooling, chemical-process heat transfer etc.Its main purpose is in order to reduce electronic equipment because of the overheated probability that breaks down and damage, and improves the performance and the reliability of electronic equipment simultaneously.
The micro-cooler of actively setting about studying and using both at home and abroad comprises at present: micro-heat exchanger, little refrigerator, micro-channel heat sink, the equal backing of micro heat pipe and integrated micro-cooler etc.Wherein micro-channel heat sink has obtained the more concern of people because of its processing and fabricating technology comparative maturity.But there is the limitation in two designs in micro-channel heat sink.One is because the big flow resistance that small size produced; Its two because coolant variations in temperature between inlet, outlet is bigger, thereby cause the heat exchange surface temperature distributing disproportionation.Along with developing rapidly of micro-processing technology, some micro heat exchangers based on different heat transfer mechanism, superior performance will continue to bring out.
Summary of the invention:
The purpose of this utility model is to provide a kind of micro heat exchanger, and its heat-transfer mechanism is the heat convection of cross fluid flow pin-rib array.
A kind of cross fluid flow pin-rib array minisize heat exchanger is characterized in that, as shown in Figure 1, includes the overlapping successively flow 1 excessively that is packaged together, and goes out conductance flow 2, the flow deflector 3 that becomes a mandarin, heat transfer sheet 4; Cross and have fluid intake 5 and the fluid issuing 6 that is connected with exterior line in the flow 1; Go out conductance flow 2 and be provided with out circulation road 7, having fluid intake 8 and fluid issuing 9 with fluid intake 5 and the fluid issuing 6 corresponding positions crossed in the flow 1; Becoming a mandarin also is being provided with fluid intake 10 with the fluid intake 5 corresponding positions of crossing in the flow 1 on the flow deflector 3, also is provided with water conservancy diversion bridge 11 on it, the seam 12 and go out stream seam 13 of becoming a mandarin, and micro heat exchanger encapsulation back water conservancy diversion bridge 11 can go out circulation road 7 and fluid issuing 9 is communicated with; Be manufactured into circulation road 14 and pin rib array 15 with engraving method on the heat transfer sheet 4.
The several certificates of group of the pin rib array 15 that the utility model proposes are cooled device to the requirement of Temperature Distribution design, and increase group number can improve the uniformity of heat-transfer surface Temperature Distribution, but need become a mandarin seam 12 and go out the quantity of stream seam 13 of corresponding increase.For more clearly describing the structure of heat transfer sheet 4, Fig. 1 (e), Fig. 1 (f) and Fig. 1 (g) have provided front view, heat transfer sheet A-A profile and the heat transfer sheet B-B profile of heat transfer sheet 4 respectively.
As shown in Figure 2, cross fluid flow pin-rib array minisize heat exchanger 16 will be formed after each sheet assembled package of heat exchanger.Can form the circulation of fluid of sealing in heat exchanger inside, the fluid order of flowing through is: fluid intake 5, fluid intake 8, fluid intake 10, go into circulation road 14, the seam 12 that becomes a mandarin, pin rib array 15, go out stream seam 13, go out circulation road 7, water conservancy diversion bridge 11, fluid issuing 9 and fluid issuing 6.Cooling fluid will be divided into two-way and flow along the direction parallel with heat-transfer area after the seam 12 that becomes a mandarin enters, and laterally skim over pin rib array 15, absorb heat from heat-transfer area and pin rib surface, flow out heat-transfer surface after go out stream seam 13.
The micro heat exchanger that the utility model proposes is based on cross fluid flow pin-rib array thermal convection principle.Pin rib shape (circular, square, triangle etc.), pin rib size (highly, equivalent diameter etc.), the arrangement mode of pin rib in the array (in-line arrangement, fork row etc.), the density degree of pin rib in the array, the group number of pin rib array etc. all can be according to the actual conditions optimal design on the heat-transfer area.Pin rib array has been expanded heat-transfer area on the one hand effectively, has improved heat transfer efficiency; Adopt on the other hand and optimize rational pin rib array packet layout mode, can greatly improve the uniformity of the surface temperature distribution that is cooled.Therefore, cross fluid flow pin-rib array minisize heat exchanger is one of effective ways that reduce heater members heating surface maximum temperature, reduction variations in temperature.
Heat-exchange working medium can be selected air, water, cold-producing medium etc. respectively for use.According to used working medium and device optimum working temperature scope, on heating surface, will form the monophasic fluid heat convection of cross fluid flow pin-rib array, the phase-change heat-exchange of cross fluid flow pin-rib array is realized the cooling technology requirement.
The micro heat exchanger sheet can be selected materials such as oxygen-free copper, silicon for use, and the global geometric shape size can require to determine according to be cooled device size and overall encapsulation.Be applicable to the cooling of bar shaped, circle, heating surface such as square.
Description of drawings:
Fig. 1: the structural representation with in-line arrangement round pin rib array of the present utility model;
Among the figure: 1, cross flow, 2, go out conductance flow 2,3, become a mandarin flow deflector 2,4, heat transfer sheet, 5, fluid intake, 6, fluid issuing, 7, go out circulation road, 8, fluid intake, 9, fluid issuing, 10, fluid intake, 11, water conservancy diversion bridge, 12, the seam that becomes a mandarin, 13, go out the stream seam, 14, go into circulation road; 15, pin rib array (in-line arrangement circle).
Fig. 1 (e): the heat transfer sheet front view that the utlity model has in-line arrangement round pin rib array;
Fig. 1 (f): the heat transfer sheet A-A profile that the utlity model has in-line arrangement round pin rib array;
Fig. 1 (g): the heat transfer sheet B-B profile that the utlity model has in-line arrangement round pin rib array;
Fig. 2: the utility model schematic diagram with structure shown in Figure 1;
Among the figure: 16, micro heat exchanger;
Fig. 3: the schematic diagram of the utility model cooling semiconductor laser bar;
Among the figure: 17, semiconductor laser bar;
Fig. 4: the structural representation with fork row round pin rib array of the present utility model;
Among the figure: 15, pin rib array (fork row is circular);
Fig. 5: the structural representation with the square pin rib of in-line arrangement array of the present utility model;
Among the figure: 15, pin rib array (in-line arrangement is square);
Fig. 6: the structural representation with the square pin rib array of fork row of the present utility model;
Among the figure: 15, pin rib array (row is square for fork);
Fig. 7: the schematic diagram of the utility model cooling large power semiconductor laser array;
Among the figure: 18, positive source, 19, insulating barrier, 20, light, 21, inlet tube, 22, outlet, 23, sealing ring;
Fig. 8: the heat exchanger structure schematic diagram that has fluid intake, outlet on the heat transfer sheet.
Among the figure: 24, fluid intake, 25, fluid issuing.
Embodiment:
Embodiment 1:
As shown in Figure 3, with cross fluid flow pin-rib array minisize heat exchanger cooling semiconductor laser bar 17, a kind of length of typical semiconductor laser strip 17, width, thickness are of a size of 10000 * 1000 * 115 microns
3Several evenly distributed generating lasers are wherein arranged, cross fluid flow pin-rib array minisize heat exchanger 16 is by flow 1 excessively shown in Figure 1, go out conductance flow 2, flow deflector 3 becomes a mandarin, heat transfer sheet 4 is welded successively, every is rectangle, width is identical with the length of semiconductor laser bar 17, semiconductor laser bar 17 is fixed on the heat transfer sheet 4, in-line arrangement round pin rib array 15 by three groups totally 72 diameters be that 300 microns round pin rib is formed, the height of pin rib is half of heat transfer sheet 4 thickness, be 300 microns, pin rib in-line arrangement is arranged.The seam 12 that becomes a mandarin has three and go out stream seam 13 and have four.Cross flow 1, go out conductance flow 2, the thickness of the flow deflector 3 that becomes a mandarin is 300 microns, the thickness of heat transfer sheet 4 is 600 microns.Can form the circulation of fluid of sealing in cross fluid flow pin-rib array minisize heat exchanger inside, the fluid order of flowing through is: fluid intake 5, fluid intake 8, fluid intake 10, go into circulation road 14, the seam 12 that becomes a mandarin, in-line arrangement round pin rib array 15, go out stream seam 13, go out circulation road 7, water conservancy diversion bridge 11, fluid issuing 9 and fluid issuing 6.Cooling fluid is after the seam 12 that becomes a mandarin enters, to be divided into two-way flows along the direction parallel with heat-transfer area, laterally skim over in-line arrangement round pin rib array 15, absorb heat from heat-transfer area and pin rib surface, flow out heat-transfer surface after go out stream seam 13, the heat that generating laser is produced and passes on the heat transfer sheet 4 is taken away, and has realized that high heat flux conducts heat.
Embodiment 2:
As shown in Figure 4, pin rib array on heat transfer sheet 4 15 adopts fork to arrange and puts, whole pin rib array 18 by three groups totally 66 diameters be that 300 microns round pin rib is formed, the height of pin rib is half of heat transfer sheet 4 thickness, is 300 microns.Cross flow 1, go out conductance flow 2, the thickness of the flow deflector 3 that becomes a mandarin is 300 microns, the thickness of heat transfer sheet 4 is 600 microns.Can form the circulation of fluid of sealing in cross fluid flow pin-rib array minisize heat exchanger inside, the fluid order of flowing through is: fluid intake 5, fluid intake 8, fluid intake 10, go into circulation road 14, the seam 12 that becomes a mandarin, fork row's round pin rib array 15, go out stream seam 13, go out circulation road 7, water conservancy diversion bridge 11, fluid issuing 9 and fluid issuing 6.Cooling fluid is after the seam 12 that becomes a mandarin enters, to be divided into two-way flows along the direction parallel with heat-transfer area, laterally skim over fork row round pin rib array 15, absorb heat from heat-transfer area and pin rib surface, flow out heat-transfer surface after go out stream seam 13, the heat that generating laser is produced and passes on the heat transfer sheet 4 is taken away, and has realized that high heat flux conducts heat.
Embodiment 3:
As shown in Figure 5, pin rib array on heat transfer sheet 4 15 adopts in-line arrangements to arrange, whole pin rib array 15 by three groups totally 72 cross sections be (300 * 300 microns on square
2) the pin rib form, the height of pin rib is half of heat transfer sheet 4 thickness, is 300 microns.Cross flow 1, go out conductance flow 2, the thickness of the flow deflector 3 that becomes a mandarin is 300 microns, the thickness of heat transfer sheet 4 is 600 microns.Can form the circulation of fluid of sealing in cross fluid flow pin-rib array minisize heat exchanger inside, the fluid order of flowing through is: fluid intake 5, fluid intake 8, fluid intake 10, go into circulation road 14, the seam 12 that becomes a mandarin, the square pin rib of in-line arrangement array 15, go out stream seam 13, go out circulation road 7, water conservancy diversion bridge 11, fluid issuing 9 and fluid issuing 6.Cooling fluid is after the seam 12 that becomes a mandarin enters, to be divided into two-way flows along the direction parallel with heat-transfer area, laterally skim over the square pin rib of in-line arrangement array 15, absorb heat from heat-transfer area and pin rib surface, flow out heat-transfer surface after go out stream seam 13, the heat that generating laser is produced and passes on the heat transfer sheet 4 is taken away, and has realized that high heat flux conducts heat.
Embodiment 4:
As shown in Figure 6, pin rib array on heat transfer sheet 4 15 adopts fork to arrange and puts, whole pin rib array 15 by three groups totally 66 cross sections be (300 * 300 microns on square
2) the pin rib form, the height of pin rib is half of heat transfer sheet 4 thickness, is 300 microns.Cross flow 1, go out conductance flow 2, the thickness of the flow deflector 3 that becomes a mandarin is 300 microns, the thickness of heat transfer sheet 4 is 600 microns.Can form the circulation of fluid of sealing in cross fluid flow pin-rib array minisize heat exchanger inside, the fluid order of flowing through is: fluid intake 5, fluid intake 8, fluid intake 10, go into circulation road 14, the seam 12 that becomes a mandarin, the square pin rib array 15 of fork row, go out stream seam 13, go out circulation road 7, water conservancy diversion bridge 11, fluid issuing 9 and fluid issuing 6.Cooling fluid is after the seam 12 that becomes a mandarin enters, to be divided into two-way flows along the direction parallel with heat-transfer area, laterally skim over the square pin rib array 15 of fork row, absorb heat from heat-transfer area and pin rib surface, flow out heat-transfer surface after go out stream seam 13, the heat that generating laser is produced and passes on the heat transfer sheet 4 is taken away, and has realized that high heat flux conducts heat.
Embodiment 5:
As shown in Figure 7, adopt the utility model cooling large power semiconductor laser array, this array is made up of M luminescence unit, and M=4 scribbles insulating barrier 19 between each luminescence unit in the present embodiment; Each luminescence unit comprises: positive source 18, micro heat exchanger 16 and place semiconductor laser bar 17 and insulating barrier 19 between them, and micro heat exchanger 16 is simultaneously as power cathode, and semiconductor laser bar 17 emits beam 20 under effect of electric field.Fluid enters each micro heat exchanger 16 respectively through inlet tube 21, flows out through outlet 22; Rubber seal 23 sealings are arranged between inlet tube 21, outlet 22 and the micro heat exchanger 16.
In the present embodiment, the micro heat exchanger 16 of the top is identical with structure shown in Figure 1, be no fluid intake and fluid issuing on the heat transfer sheet 4, be processed with fluid intake 24 and fluid issuing 25 respectively with fluid intake 5 and the fluid issuing 6 corresponding positions crossed in the flow 1 on the heat transfer sheet 4 of the micro heat exchanger 16 of below, as shown in Figure 8, like this, cooling fluid can enter each micro heat exchanger respectively through same root entry pipe, and, realized cooling to the folded battle array of high power semiconductor lasers through same outlet outflow.
Claims (3)
1, a kind of cross fluid flow pin-rib array minisize heat exchanger is characterized in that: include the overlapping successively flow (1) excessively that is packaged together, go out conductance flow (2), the flow deflector that becomes a mandarin (3), heat transfer sheet (4); Cross and have fluid intake (5) and the fluid issuing (6) that is connected with exterior line in the flow (1); Go out conductance flow (2) and be provided with out circulation road (7), having fluid intake (8) and fluid issuing (9) with fluid intake (5) and the corresponding position of fluid issuing (6) crossed in the flow (1), the flow deflector (3) that becomes a mandarin is gone up and also is being provided with fluid intake (10) with the corresponding position of crossing in the flow (1) of fluid intake (5), also be provided with water conservancy diversion bridge (11), the spaced apart seam (12) and go out stream seam (13) of becoming a mandarin on it, heat transfer sheet (4) is provided with into circulation road (14) and pin rib array (15); Wherein, cross flow (1), go out conductance flow (2), the flow deflector that becomes a mandarin (3) is not communicated with between separately the fluid passage on the heat transfer sheet (4) mutually; Pin rib array (15) on the heat transfer sheet (4) is arranged in the groove on the heat transfer sheet (4); The seam (12) and go out stream seam (13) and be arranged on heat transfer sheet (4) and go up the corresponding position of pin rib array (15) of becoming a mandarin on the flow deflector (3) becomes a mandarin, go into circulation road (14) and become a mandarin seam (12) conducting, go out stream seam (13) and go out circulation road (7) conducting, the water conservancy diversion bridge (11) on the flow deflector that becomes a mandarin (3) will go out and go out circulation road (7) and fluid issuing (9) conducting in the conductance flow (2).
2, a kind of cross fluid flow pin-rib array minisize heat exchanger according to claim 1 is characterized in that: the cross sectional shape of pin rib is circular, square or triangle in the described pin rib array (15), and the arrangement mode of pin rib adopts in-line arrangement or fork row in the array.
3, a kind of cross fluid flow pin-rib array minisize heat exchanger according to claim 1 and 2 is characterized in that: the group number of described pin rib array (15) is more than or equal to 1, and pin rib height is less than the thickness of heat transfer sheet (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620001679 CN2859806Y (en) | 2006-01-24 | 2006-01-24 | Cross fluid flow pin-rib array minisize heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620001679 CN2859806Y (en) | 2006-01-24 | 2006-01-24 | Cross fluid flow pin-rib array minisize heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2859806Y true CN2859806Y (en) | 2007-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620001679 Expired - Fee Related CN2859806Y (en) | 2006-01-24 | 2006-01-24 | Cross fluid flow pin-rib array minisize heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2859806Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102422112A (en) * | 2009-05-08 | 2012-04-18 | 阿尔斯托姆科技有限公司 | Heat transfer sheet for rotary regenerative heat exchanger |
| CN111386011A (en) * | 2020-01-09 | 2020-07-07 | 西安交通大学 | Side flow impact micro-channel cold plate and electronic equipment |
-
2006
- 2006-01-24 CN CN 200620001679 patent/CN2859806Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102422112A (en) * | 2009-05-08 | 2012-04-18 | 阿尔斯托姆科技有限公司 | Heat transfer sheet for rotary regenerative heat exchanger |
| CN102422112B (en) * | 2009-05-08 | 2014-12-24 | 阿尔斯托姆科技有限公司 | Heat transfer sheet for rotary regenerative heat exchanger |
| CN111386011A (en) * | 2020-01-09 | 2020-07-07 | 西安交通大学 | Side flow impact micro-channel cold plate and electronic equipment |
| CN111386011B (en) * | 2020-01-09 | 2021-04-27 | 西安交通大学 | Side flow impact micro-channel cold plate and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070117 Termination date: 20100224 |