CN2814674Y - Novel integrated circuit or discrete component ultrathin pinless packaging structure - Google Patents

Novel integrated circuit or discrete component ultrathin pinless packaging structure Download PDF

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Publication number
CN2814674Y
CN2814674Y CNU200520070604XU CN200520070604U CN2814674Y CN 2814674 Y CN2814674 Y CN 2814674Y CN U200520070604X U CNU200520070604X U CN U200520070604XU CN 200520070604 U CN200520070604 U CN 200520070604U CN 2814674 Y CN2814674 Y CN 2814674Y
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China
Prior art keywords
pin
metal layer
chip
encapsulating structure
integrated circuit
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Expired - Lifetime
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CNU200520070604XU
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Chinese (zh)
Inventor
梁志忠
谢洁人
陶玉娟
葛海波
王达
周正伟
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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Priority to CNU200520070604XU priority Critical patent/CN2814674Y/en
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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Abstract

The utility model relates to a kind of new type integrated circuit or discrete components ultra-thin non-pin encapsulating structure, comprise chip bearing base (11), pin carrying base (12) in the routing, chip (4), metal wire (5) and plastic-sealed body (6), it is characterized in that: described chip bearing base (11) comprises intermediate base island (1.1) and front metal layer (2) and metal layer on back (9), pin (1.2) and front metal layer (2) and metal layer on back (9) in the middle of pin carrying base (12) comprises in the described routing, the front metal layer (2.1) of chip bearing base (11) is gone up and is implanted chip (4), the positive connection with metal wire (5) two ends respectively with Ji Dao (1.1) front metal layer (2.2) of chip (4) made the encapsulating structure semi-finished product, encapsulating structure semi-finished product front is sealed with plastic-sealed body (6), and make Ji Dao (1.1) and pin (1.2) protrude from plastic-sealed body (6) surface.The utility model weldering sexuality is strong, best in quality, cost is lower, production is smooth and easy, applicability is strong, the multicore sheet is arranged all puzzlements that the plastic packaging material infiltration flexibly, can not take place.

Description

New type integrated circuit or discrete components ultra-thin non-pin encapsulating structure
Technical field:
The utility model relates to a kind of new type integrated circuit or discrete components ultra-thin non-pin encapsulating structure.Belong to integrated circuit or discrete component encapsulation technology field.
Background technology:
Traditional integrated circuit or discrete components ultra-thin non-pin encapsulating structure, its encapsulation pattern is for being listed as old formula aggregate through being cut into single unit.Its substrate pattern is the lead-in wire frame.It mainly has the following disadvantages:
1, special adhesive tape uses special glue to bring when preventing that the plastics high pressure from sealing, and plastic packaging material can be penetrated on the lead frame, thereby increases the danger of external pin insulation; If but still have the plastic packaging material infiltration, then be easy to external pin is plated the palladium damage layer influence weldering sexuality during reprocessing.So, material cost, reprocessing cost and quality all have influence to a certain degree.
2, the two-sided plating palladium of substrate can be produced in this technology smoothly in order to make routing technology and output external pin, plates expensive palladium material on the two sides of lead frame.So, except electroplating cost was higher, the routing parameter also will be set special parameter at this material, causes because the parameter disunity directly influences the smooth and easy of production line.
3, pollute because lead frame uses special-purpose chemical adhesive tape, the solvent of adhesive tape gasifies out because of high temperature easily in various high-temperature technologies, and indirect pollution or the nip of covering chip and the interior pin of routing usually cause the instability of routing ability.
4, the property applied flexibly of chip, external pin is subjected to the restriction of conventional lead frame, the arrangement that the external pin of multicore sheet and different outputs also only can be inflexible, and the property applied flexibly is lower.
5, external pin weldering sexuality is subjected to the restriction of conventional lead frame, and the external pin of output is the same flat with colloid (plastic encapsulation body) bottom also, even the danger of depression is arranged; And chemical agent such as scaling powder etc. all can't be discharged smoothly when surface mount, so the weldering sexuality can be greatly affected.
6, expensive high-temperature high-pressure chemical adhesive tape will be sticked in the traditional lead frame back side of wire ball bonding, power also is partially absorbed because of the soft of adhesive tape easily in the routing process, so usually cause getting loose of routing contact, thereby influence is produced and the reliability during the product routing.
Summary of the invention:
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of new type integrated circuit or discrete components ultra-thin non-pin encapsulating structure that sexuality is strong, best in quality, cost is lower, production is smooth and easy, applicability is strong, all puzzlements of plastic packaging material infiltration flexibly, can not take place the arrangement of multicore sheet that weld is provided.
The purpose of this utility model is achieved in that a kind of new type integrated circuit or discrete components ultra-thin non-pin encapsulating structure, comprises pin carrying base, chip, metal wire and plastic-sealed body in chip bearing base, the routing, is characterized in:
Described chip bearing base comprises intermediate base island and front metal layer and metal layer on back,
Pin and front metal layer and metal layer on back in the middle of pin carrying base comprises in the described routing,
Implant chip on the front metal layer of chip bearing base,
Chip front side is connected with the metal wire two ends respectively with basic island front metal layer makes the encapsulating structure semi-finished product,
Encapsulating structure semi-finished product front is sealed with plastic-sealed body, and make Ji Dao and pin protrude from the plastic-sealed body surface.
The utility model integrated circuit or discrete components ultra-thin non-pin encapsulating structure, its encapsulation pattern also adopts the old formula aggregate of row through being cut into single unit.Its substrate pattern is for first etches needed Ji Dao and pin at substrate.Compare with traditional integrated circuit or discrete component encapsulating structure, the utlity model has following advantage:
1, because of adopting the substrate mode without lead frame, so need not use the rubber belt material of special-purpose high temperature high voltage resistant, so material cost is corresponding lower, and many puzzlements that plastic packaging material permeates, quality is bad, cost improves can not take place fully.
2, the substrate front side of chip region adopts traditional silver-plated mode in the interior foot section of routing, and is popular and cost is low, and the routing parameter is used and generally got final product.Substrate back signal output external pin adopts zinc-plated mode, and cost is low, easily produces.
3, need not to use any chemical adhesive tape fully, thus need not consider pollution problems fully, so produce simply smooth and easy, with low cost.
4, because of adopting new-type packaging technology and structure, in chip region or the external pin of routing output can fully play ability and space.
5, the external pin of exporting in the new-type encapsulating structure protrudes from the plastic-sealed body surface, and twice etching guaranteed the absolute coplanarity between external pin in addition.Single-point like this independently welding manner can be kept at present the generally weldering sexuality of chip, does not worry also whether surface mount can be unstable, and quality is more stable than conventional package pattern.
6, adopt the substrate-type encapsulation, it adopts the parameter of general chip to produce in the routing process and gets final product, and reliability is also secure, thereby utilizes produce smooth and easy, and steady quality is with low cost.
Description of drawings:
Fig. 1 is new type integrated circuit of the present utility model or discrete components ultra-thin non-pin encapsulating structure schematic diagram.
Embodiment:
Referring to Fig. 1, the utility model is a kind of new type integrated circuit or discrete components ultra-thin non-pin encapsulating structure, mainly is made up of pin carrying base 12, chip 4, metal wire 5 and plastic-sealed body 6 in chip bearing base 11, the routing.Be characterized in:
Described chip bearing base 11 comprises intermediate base island 1.1 and front metal layer 2 and metal layer on back 9,
Pin 1.2 and front metal layer 2 and metal layer on back 9 in the middle of pin carrying base 12 comprises in the described routing,
Implant chip 4 on the front metal layer 2.1 of chip bearing base 11,
4 positive connections with metal wire 5 two ends respectively with basic island 1.1 front metal layers 2.2 of chip are made the encapsulating structure semi-finished product,
Encapsulating structure semi-finished product front is sealed with plastic-sealed body 6, and make basic island 1.1 and pin 1.2 protrude from plastic-sealed body 6 surfaces.
Described basic island 1.1 and pin 1.2 front metal layers 2 are gold or silver, copper, nickel, and metal layer on back 9 is gold, silver, copper, tin, nickel palladium layer.Metal wire 5 is gold thread or silver-colored line, copper cash, aluminum steel.

Claims (5)

1, a kind of new type integrated circuit or discrete components ultra-thin non-pin encapsulating structure comprise pin carrying base (12), chip (4), metal wire (5) and plastic-sealed body (6) in chip bearing base (11), the routing, it is characterized in that:
Described chip bearing base (11) comprises intermediate base island (1.1) and front metal layer (2) and metal layer on back (9),
Pin (1.2) and front metal layer (2) and metal layer on back (9) in the middle of pin carrying base (12) comprises in the described routing,
The front metal layer (2.1) of chip bearing base (11) is gone up and is implanted chip (4),
The positive connection with metal wire (5) two ends respectively with Ji Dao (1.1) front metal layer (2.2) of chip (4) made the encapsulating structure semi-finished product,
Encapsulating structure semi-finished product front is sealed with plastic-sealed body (6), and make Ji Dao (1.1) and pin (1.2) protrude from plastic-sealed body (6) surface.
2, a kind of new type integrated circuit according to claim 1 or discrete components ultra-thin non-pin encapsulating structure is characterized in that one deck elargol layer (3) is arranged on chip bearing base (11) the front metal layer (2.1), and chip (4) is arranged on the elargol layer (3).
3, a kind of new type integrated circuit according to claim 1 and 2 or discrete components ultra-thin non-pin encapsulating structure is characterized in that Ji Dao (1.1) and pin (1.2) front metal layer (2) are golden or silver, copper, nickel.
4, a kind of new type integrated circuit according to claim 1 and 2 or discrete components ultra-thin non-pin encapsulating structure is characterized in that metal wire (5) is gold thread or silver-colored line, copper cash, aluminum steel.
5, a kind of new type integrated circuit according to claim 1 and 2 or discrete components ultra-thin non-pin encapsulating structure is characterized in that Ji Dao (1.1) and pin (1.2) metal layer on back (9) are gold, silver, copper, tin, nickel palladium layer.
CNU200520070604XU 2005-04-07 2005-04-07 Novel integrated circuit or discrete component ultrathin pinless packaging structure Expired - Lifetime CN2814674Y (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107146777A (en) * 2017-05-27 2017-09-08 江苏长电科技股份有限公司 One kind exempts from cutting encapsulating structure and its manufacturing process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107146777A (en) * 2017-05-27 2017-09-08 江苏长电科技股份有限公司 One kind exempts from cutting encapsulating structure and its manufacturing process

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