CN2800491Y - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN2800491Y CN2800491Y CN 200520057381 CN200520057381U CN2800491Y CN 2800491 Y CN2800491 Y CN 2800491Y CN 200520057381 CN200520057381 CN 200520057381 CN 200520057381 U CN200520057381 U CN 200520057381U CN 2800491 Y CN2800491 Y CN 2800491Y
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- mentioned
- heat
- heat pipe
- heat radiation
- radiator fan
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Abstract
The utility model discloses a heat radiation device matched with a heating electronic chip to be used, which comprises a heat radiation bottom board, a heat radiation fan and heat guide pipes, wherein the heat radiation fan is arranged on one side of the heat radiation device which also comprises a supporting frame; the supporting frame is fixedly arranged on the heat radiation bottom board; the heat radiation fan is fixedly arranged on one side surface of the supporting frame; the heat guide pipes are vertically coupled with one side surface of the heat radiation bottom board; the other side surface of the heat radiation bottom board can be stuck with the surface of the electronic chip; the adjacent heat guide pipes are kept with a gap to enable airflow which is discharged into from the heat radiation fan to smoothly flow through the surface of the heat guide pipes which comprise a first and a second ends; the first end is an evaporation end, and the second end is a condensing end; the first end of the heat guide pipes is coupled with one side surface of the heat radiation bottom board. The heat radiation device has good heat radiation effect and can meet the requirement of heat radiation of the electronic chip of high heating quantity.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly relates to a kind of heat abstractor that is used for the heating electronic chip in the main frame.
Background technology
For the electronic chip of some high heatings,, be to add above it usually to put heat abstractor and keep its operate as normal such as the central processing unit of computer.Heat abstractor with central processing unit is that example illustrates below.
A wherein big class of the heat abstractor of traditional central processing unit is made up of heat radiation copper billet, radiating fin group, heat pipe and radiator fan, wherein the radiating fin group is coupled to a wherein side of heat radiation copper billet, and the another side of heat radiation copper billet attaches mutually with the surface of heating electronic chip to be dispelled the heat, and heat pipe and radiating fin group couple, and radiator fan then is arranged on the top or the side of radiating fin group.After heat conducts to heat abstractor from central processing unit, because heat pipe has the little characteristics of thermal resistance, so heat can conduct to an end of heat pipe rapidly, this end has just formed the evaporation ends of heat pipe, heat passes through the backflow of the cooling fluid of heat pipe inside at heat pipe then, heat conducts to the other end of heat pipe fast, this end has just formed the condensation end of heat pipe, when heat conducts to condensation end by the evaporation ends of heat pipe, heat constantly conducts to the radiating fin group, and the radiating fin group to have multiaspect long-pending by some, the radiating fin that heat conduction efficiency is high is formed, so heat is gone out by the surface diffusion of radiating fin, add put radiating fin group side or above radiator fan increased the convection current of air and quickened distributing of radiating fin surface heat.
Along with the increase of central processing unit operating frequency, the heat that produces in the time of its work also increases greatly, and that youngest must increase the heat radiation power of heat abstractor thereupon.If continue to adopt above-mentioned heat abstractor to satisfy the heat radiation requirement of high-frequency central processing unit, will mainly be to consider from following three aspects: the one, the size and the quantity that increase the radiating fin group increase area of dissipation; The 2nd, the quantity that increases heat pipe is come the transmission of accelerated heat; The 3rd, the power that strengthens radiator fan strengthens the cross-ventilation on radiating fin group surface.But increase radiating fin group area merely, may cause the entire heat dissipation device volume excessive, can not satisfy the requirement of confined space restriction in the mainframe box of computer; And excessively increase the power of radiator fan, may cause producing bigger noise in the course of work of entire heat dissipation device and can not comply with relevant regulations.Therefore, for the heat abstractor of high-frequency central processing unit, we must change mentality of designing, design a kind of heat abstractor of central processing unit, have preferable radiating effect, and the radiating requirements that can satisfy the electronic chip with golf calorific value.
Summary of the invention
For addressing the above problem, the utility model has disclosed a kind of heat abstractor, and this heat abstractor has preferable radiating effect, can satisfy the radiating requirements of the electronic chip that golf calorific value is arranged.
Heat abstractor of the present utility model adopts following technical scheme to realize: heat abstractor of the present utility model is used with heating electronic chip to be dispelled the heat, this heat abstractor comprises radiating bottom plate, radiator fan and heat pipe, above-mentioned radiator fan is arranged at a side of this heat abstractor, above-mentioned heat abstractor also comprises a bracing frame, this bracing frame be fixedly set in above-mentioned radiating bottom plate on, and above-mentioned radiator fan is fixedly set on the wherein side of this bracing frame; Above-mentioned heat pipe vertically is coupled to a side of above-mentioned radiating bottom plate, and the another side of above-mentioned radiating bottom plate can be attached at the surface of above-mentioned electronic chip; Keep a space between above-mentioned heat pipe is adjacent, make the air-flow that enters from above-mentioned radiator fan can flow through the surface of above-mentioned heat pipe smoothly.
Preferable, above-mentioned heat pipe comprises first, second end, wherein first end is an evaporation ends, and second end is a condensation end, and first end of above-mentioned heat pipe and a side of above-mentioned radiating bottom plate couple; An above-mentioned bracing frame wherein side is provided with a mesopore that holds above-mentioned radiator fan, and the air-flow that above-mentioned radiator fan is entered is discharged to the surface of above-mentioned heat pipe through this mesopore.
Compared with prior art, in the heat abstractor of the present utility model, owing to adopt the alternative radiating fin group in the past of more heat pipe, and the fire end of heat pipe is coupled to a side of the radiating bottom plate of this heat abstractor, make the heat on the above-mentioned radiating bottom plate can conduct to above-mentioned heat pipe fast, simultaneously because heat pipe has preferable capacity of heat transmission, thereby heat can be conducted fast, and above-mentioned radiator fan has quickened the air flows on the surface of above-mentioned heat pipe, further improved radiating efficiency, therefore, radiator fan of the present utility model has better heat radiating effect, can satisfy the radiating requirements of the electronic chip with golf calorific value.
Description of drawings
Fig. 1 is the stereogram of the utility model heat abstractor.
Fig. 2 is the three-dimensional exploded view of heat abstractor of the present utility model.
Fig. 3 is the front view of heat abstractor of the present utility model.
Embodiment
Be illustrated in figure 1 as the stereogram of the utility model heat abstractor.Heat abstractor 10 of the present utility model comprises: a radiating bottom plate 110 is the preferable metal derby of a heat conduction, and the one side can be attached to heating electronic chip (not shown) surface to be dispelled the heat, and has the effect of the heat radiation copper billet in the traditional heat-dissipating device; And some heat pipes 120, above-mentioned heat pipe 120 is vertically installed in the another side of above-mentioned radiating bottom plate 110, and first end 121 of above-mentioned heat pipe 120 is coupled to a side of above-mentioned radiating bottom plate 110, and second end 122 of above-mentioned heat pipe 120 is then away from above-mentioned radiating bottom plate 110; This heat abstractor 10 also comprises a bracing frame 130 and a radiator fan 140, wherein, this radiator fan 140 is a side air intake and the fan of opposite side air-out, above-mentioned radiator fan 140 is arranged at a wherein side of above-mentioned bracing frame 130, and above-mentioned bracing frame 130 is locked on the above-mentioned radiating bottom plate 110 by screw 150.
As shown in Figure 2, be the three-dimensional exploded view of heat abstractor of the present utility model.Hence one can see that, first side 131 of above-mentioned bracing frame 130 is provided with a mesopore 132, the air outlet of the size of this mesopore 132 and above-mentioned radiator fan 140 is roughly the same, above-mentioned radiator fan 140 work are made, cold air can pass through above-mentioned mesopore 132 and the above-mentioned heat pipe 120 of flowing through from the air outlet of above-mentioned radiator fan 140; And in the above-mentioned heat abstractor 10, on the side of above-mentioned relatively radiator fan 140 (being the exhaust outlet 133 of above-mentioned heat abstractor 10), above-mentioned heat pipe 120 is exposed and do not stopped by above-mentioned bracing frame 130, make cold air flow that above-mentioned radiator fan 140 enters behind above-mentioned heat pipe 120, from the exhaust outlet 133 of above-mentioned heat abstractor 10 and discharge.
And in above-mentioned heat abstractor 10, above-mentioned heat pipe 120 is industry and is usually used in heat pipe in the heat abstractor, and this heat pipe 120 is closed, and these heat pipe 120 inside can be working fluid, or these heat pipe 120 two ends are open shape, are beneficial to and the outside air convection current.And an end of this heat pipe 120 is evaporation ends (or fire end), and the other end is condensation end (or colling end).So in the utility model, first end 121 of above-mentioned heat pipe 120 is an evaporation ends, this evaporation ends abuts on the radiating bottom plate 110, and second end 122 is a condensation end, and this condensation end is away from radiating bottom plate 110.
Simultaneously in conjunction with the front view of heat abstractor of the present utility model 10 shown in Figure 3 (visual angle with the exhaust outlet 133 of this heat abstractor 10 is reference), above-mentioned heat pipe 120 marshallings, make above-mentioned heat pipe 120 maintain a space 160 linearly radially between adjacent, to flow through the smoothly surface of above-mentioned heat pipe 120 of the cold air that above-mentioned radiator fan 140 is entered, promptly quicken the air-flow exchange velocity on above-mentioned heat pipe 120 surfaces, can bring into play the radiating efficiency of this heat abstractor 10 to greatest extent.
When heat abstractor of the present utility model 10 and heating electronic chip to be dispelled the heat (among the figure for showing) when being used, because the radiating bottom plate 110 of this heat abstractor 10 has good capacity of heat transmission, so the heat that produces during electronic chip work can conduct to the radiating bottom plate 110 of above-mentioned heat abstractor 10 fast, simultaneously, because a side of above-mentioned radiating bottom plate 110 couples mutually with first end 121 (being fire end) of above-mentioned some heat pipes 120, so the heat on the above-mentioned radiating bottom plate 110 can second end 122 (being condensation end) to above-mentioned heat pipe 120 conducts via first end 121 of above-mentioned heat pipe 120 rapidly, and this moment, above-mentioned radiator fan 140 sucked cool ambient air and behind the mesopore 132 via above-mentioned bracing frame 130, enter above-mentioned heat abstractor 10, and cold air flows in the cold space 160 that keeps between above-mentioned heat pipe 120 is adjacent with fast speed, when air flow stream is crossed above-mentioned heat pipe 120 surperficial, the surface of said flow and above-mentioned heat pipe 120 is owing to heat exchange takes place temperature difference, thereby make the cold air that enters from above-mentioned radiator fan 140 behind the surface of above-mentioned heat pipe 120 of flowing through, after heat taken away from above-mentioned heat pipe 120 endlessly, and from the exhaust outlet 133 of this heat abstractor 10 and discharge.
And, can also further improve above-mentioned heat abstractor 10, at its exhaust outlet 133 places radiating fin group (not shown) being set further increases radiating efficiency.
In sum, compare with existing heat abstractor, in the heat abstractor 10 of the present utility model, because the radiating fin group that adopts more heat pipe 120 to substitute in the past, and the fire end (i.e. first end 121) of above-mentioned heat pipe 120 is coupled to a side of the radiating bottom plate 110 of this heat abstractor 10, make the heat on the above-mentioned radiating bottom plate 110 can conduct to above-mentioned heat pipe 120 fast, simultaneously because heat pipe has preferable capacity of heat transmission, thereby heat can be conducted fast, and above-mentioned radiator fan 140 has quickened the air flows on the surface of above-mentioned heat pipe, further improved radiating efficiency, therefore, heat abstractor of the present utility model has preferable radiating effect, can satisfy the radiating requirements of the electronic chip with golf calorific value.
Claims (5)
1. heat abstractor, be used with heating electronic chip to be dispelled the heat, this heat abstractor comprises radiating bottom plate, radiator fan and heat pipe, above-mentioned radiator fan is arranged at a side of this heat abstractor, it is characterized in that: above-mentioned heat abstractor also comprises a bracing frame, this bracing frame is fixedly set on the above-mentioned radiating bottom plate, and above-mentioned radiator fan is fixedly set on the wherein side of this bracing frame; Above-mentioned heat pipe vertically is coupled to a side of above-mentioned radiating bottom plate, and the another side of above-mentioned radiating bottom plate can be attached at the surface of above-mentioned electronic chip; Keep a space between above-mentioned heat pipe is adjacent, make the air-flow that enters from above-mentioned radiator fan can flow through the surface of above-mentioned heat pipe smoothly.
2. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned heat pipe comprises first, second end, and wherein first end is an evaporation ends, and second end is a condensation end, and first end of above-mentioned heat pipe and a side of above-mentioned radiating bottom plate couple.
3. heat abstractor as claimed in claim 1 is characterized in that: an above-mentioned bracing frame wherein side is provided with a mesopore that holds above-mentioned radiator fan, and the air-flow that above-mentioned radiator fan is entered is discharged to the surface of above-mentioned heat pipe through this mesopore.
4. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned radiator fan is a side air intake, and the fan of opposite side air-out.
5. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned bracing frame by screw in above-mentioned radiating bottom plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520057381 CN2800491Y (en) | 2005-04-26 | 2005-04-26 | Heat radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520057381 CN2800491Y (en) | 2005-04-26 | 2005-04-26 | Heat radiator |
Publications (1)
Publication Number | Publication Date |
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CN2800491Y true CN2800491Y (en) | 2006-07-26 |
Family
ID=36842984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200520057381 Expired - Fee Related CN2800491Y (en) | 2005-04-26 | 2005-04-26 | Heat radiator |
Country Status (1)
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CN (1) | CN2800491Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110101403A (en) * | 2019-05-06 | 2019-08-09 | 明峰医疗系统股份有限公司 | A kind of CT panel detector structure convenient for heat management |
-
2005
- 2005-04-26 CN CN 200520057381 patent/CN2800491Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110101403A (en) * | 2019-05-06 | 2019-08-09 | 明峰医疗系统股份有限公司 | A kind of CT panel detector structure convenient for heat management |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060726 Termination date: 20120426 |