CN2791736Y

CN2791736Y - Radiating apparatus special for micro computer

Info

Publication number: CN2791736Y
Application number: CN 200520018493
Authority: CN
Inventors: 郑万成
Original assignee: QINGANG ZIXUN CO Ltd
Current assignee: QINGANG ZIXUN CO Ltd
Priority date: 2005-05-11
Filing date: 2005-05-11
Publication date: 2006-06-28
Anticipated expiration: 2015-05-11

Abstract

The utility model relates to a heat-dissipating device special for a microcomputer. The utility model is the radiating device which is applied to a mainboard of a microcomputer mainframe and assists chips to carry out heat dissipation. The heat-dissipating device comprises a heat-dissipating board and a heat conducting board, wherein the heat-dissipating board covers the back surface of the motherboard, the heat conducting board is combined with the surface of the chip on the front surface of the mainboard. A heat conducting component which penetrates an open hole of the mainboard is arranged at the position where the heat conducting board is arranged, so as to be contacted and combined with the heat-dissipating board. Thus, the heat-dissipating device special for the microcomputer, that the heat conducting board and the heat conducting component can transfer heat energy to the heat-dissipating board and then the heat energy of the chips is exhausted out through contact between the heat-dissipating board and a casing.

Description

The microcomputer heat radiating device special

Technical field

The relevant a kind of microcomputer heat radiating device special of the utility model refers in particular to a kind of motherboard chosen place that is installed in micro-mainframe computer, but the heat abstractor that assist process device and various chip dispel the heat via casing.

Background technology

Personal computer science and technology is maked rapid progress now, the electronic package of various specific functions all develops towards integrated circuit, cooperate micron technology to drive maturation more, and people are for smart littleization of computing machine and powerful demand, computer main frame panel of knowing and processor thereof and various chip specification are dwindled again and again, and computing and memory function are more attained powerful, use volume quite little the and micro-mainframe computer that function is huge of essence arise at the historic moment (consulting shown in Figure 4), and be different from traditional desktop PC main frame or mobile computer etc.

Yet known processor or chip heat radiator design, still only terminate in traditional desktop PC field, fail to meet the micro-mainframe computer user demand of new co-volume exquisiteness, consult Figure 1 and Figure 2, known heat abstractor uses the preferable metal material of thermal conductivity to make a radiating seat 10 usually, on radiating seat 10, hang down and be provided with several dissipation fins 101, thus radiating seat 10 is attached at the processor 30 in motherboard front or above the chip 40, the heat energy that promptly utilizes radiating seat 10 and radiating fin 101 eliminating processors 30 or chip 40 to be produced, and when special demands, can be in conjunction with a fan 20 forced air supplies on this radiating seat 10, to promote integral heat sink power.

Because being characterised in that, the micro-mainframe computer maximum make motherboard, Winchester disk drive, CD-ROM drive utilize the casing of storehouse mode and special size, specification to finish assembling, make the micro-mainframe computer overall appearance quite exquisite, the casing inner space relatively also dwindles, on take off known towering radiating seat 10 and fan 20 and be difficult to stack on the processor of micro-mainframe computer or use above the chip; Especially the heat abstractor formed of traditional heat-dissipating seat 10 and fan 20, the system radiating fan that must cooperate the casing back side or side to set up hot type, this kind heat radiation, heat extraction mode can not meet micro-mainframe computer architectural feature and user demand at all, adopt known radiating seat 10, fan 20 and enclosure system fan if force, the micro-mainframe computer volume is increased once again, lose that original exquisiteness does not take up space and effect such as easy to use.

Summary of the invention

The utility model fundamental purpose is to provide a kind of microcomputer heat radiating device special, it is a kind of motherboard chosen place that can be installed in micro-mainframe computer, assist motherboard plate face processor and various chip cooling, and can be via the heat abstractor of casing with the heat energy discharge.

According to above-mentioned purpose, implementation content of the present utility model comprises that the preferable metal material heat sink of a thermal conductivity is covered on the motherboard back side, and pastes with the casing inner wall of special radiator structure; And one heat-conducting plate be incorporated into the chip surface in motherboard front, be provided with a heat-conducting piece in the heat-conducting plate chosen place and pass the set perforate of motherboard, make this heat-conducting piece contact combination with heat sink, forming heat-conducting plate and heat-conducting piece thus can be with thermal energy transfer to heat sink, utilizes heat sink to contact with casing again and discharges the microcomputer heat radiating device special of chip heat energy.

Description of drawings

Fig. 1: be the heat abstractor stereographic map of known desktop PC main frame.

Fig. 2: be the heat abstractor side view of known desktop PC main frame.

Fig. 3: be the schematic perspective view of the utility model heat abstractor decomposing state.

Fig. 4: be the schematic perspective view of the utility model heat abstractor Assembly Action.

Fig. 5: the sectional schematic diagram of forming state for the utility model heat abstractor.

Fig. 6: be the schematic perspective view of another embodiment decomposing state of the utility model.

Fig. 7: be the schematic perspective view of another embodiment Assembly Action of the utility model.

Fig. 8: the sectional schematic diagram of forming state for another embodiment of the utility model.

Drawing reference numeral:

1.... motherboard 11... processor

12... chip 13... perforate

2.... heat sink 21... through hole

22... fixation kit 23... keeper

231.. lockhole 3.... heat-conducting plate

31... heat-conducting piece 311.. lockhole

4.... casing 41... radiating fin

5.... fan

Embodiment

As shown in drawings, microcomputer heat radiating device special of the present utility model, it is a kind of heat radiating device special of assisting micro-mainframe computer sheet processor and chip to dispel the heat, comprise that the set perforate of motherboard 1 chosen place 13, a heat sink 2, a heat-conducting plate 3 and a casing 4 form, and can cooperate a fan 5 to be installed in application above the heat-conducting plate 3, wherein:

Motherboard 1, as shown in Figure 3, be that a kind of circuit board bread contains and is provided with processor 11 (central processing units, abbreviation CPU), the computer main frame panel (Motherboard) of various chip 12 (for example display chip, north bridge chips, South Bridge chip or the like), various interface slot, connectivity port and other necessary electronic package, be the article of known technology, so do not give unnecessary details in addition; But select in the motherboard 1 plate face of processor 11 or chip 12 1 sides and be provided with a perforate 13 that is through to the back side (icon is that selected processor 11 1 sides are offered), provide following heat sink 2 to place;

Heat sink 2, to shown in Figure 5,, offer several through holes 21 as Fig. 3 in heat sink 2 plate faces for the preferable sheet metal of a kind of thermal conductivity (for example copper coin or aluminium sheet) is covered on motherboard 1 back side, in through hole 21, place a fixation kit 22 (for example screw), for the 3 contact combinations of following heat-conducting plate; In addition 2 chosen places of this heat sink are provided with most keepers 23, and this keeper 23 can be column for being placed through motherboard 1 front, reach heat sink 2 location assembling functions, and are provided with a lockhole 231 in keeper 23 ends, can provide following fan 5 sealed;

Heat-conducting plate 3, extremely shown in Figure 5 as Fig. 3, also be to be the preferable sheet metal of a kind of thermal conductivity (for example copper coin or aluminium sheet), be to paste processor 11 or chip 12 surfaces (icon is to paste with processor 11 surfaces to contact) that is incorporated into motherboard 1 front, the heat energy that is produced in the time of can absorbing processor 11 or chip 12 runnings; Convex with a heat-conducting piece 31 in these heat-conducting plate 3 one avris and pass the set perforate 13 of motherboard 1, make this heat-conducting piece 31 contact combination with the heat sink 2 at motherboard 1 back side; Wherein, described heat-conducting piece 31 can be one-body molded with heat-conducting plate 3 or separate manufacturing weld again constitute, be provided with most lockholes 311 in its end face, sealed for the fixation kit 22 of heat sink 2;

Casing 4, as Fig. 4 and shown in Figure 5, be the special size of the utility model microcomputer, normalized hollow host machine casing, be provided with several dissipation fins 41 in casing 4 outsides, heat sink 2, the heat-conducting plate 3 that can provide above-mentioned motherboard 1 and assembling to finish are placed in the casing 4, heat sink 2 back sides are pasted with casing 4 inner faces contact;

Architectural feature and space assembled relation by above-mentioned motherboard 1, heat sink 2, heat-conducting plate 3 and casing 4, promptly form the micro-mainframe computer heat radiating device special that the utility model is done, and can use in conjunction with a known thin type wind transmission fan 5 in heat-conducting plate 3 tops, as Fig. 4 and shown in Figure 5, be that fan 5 is locked on keeper 23 ends, just be positioned at heat-conducting plate 3 tops, to reach the forced air supply heat radiation function.

The utility model is when application implementation, be the heat energy that is produced when directly absorbing motherboard 1 processor 11 or chip 12 runnings by described heat-conducting plate 3, heat energy is passed to the heat sink 2 at motherboard 1 back side via heat-conducting piece 31, because this heat sink 2 is to paste with casing 4 inner faces, so can further give casing 4 with thermal energy transfer, and utilize several dissipation fins 41 that heat energy is got rid of, hot type is gone out the micro-mainframe computer system.Because the utility model utilizes heat sink 2, heat-conducting plate 3 and special casing 4 radiator structures to form the microcomputer heat abstractor, needn't be or the side system fan of setting up departments in addition in casing 4 back sides, and need not use known towering radiating seat, so can meet the smart little micro-mainframe computer user demand of volume, under the smart little situation of micro-mainframe computer casing 4 volumes, reach good heat radiation, heat extraction effect simultaneously, to keep the host computer system normal operation.

Other consults Fig. 6 to shown in Figure 8, the utility model also can offer two symmetrical perforates 13 (icon is that selected processor 11 1 sides are offered) in the processor 11 or single-chip 12 sides of motherboard 1, and be provided with two heat-conducting pieces 31 of corresponding perforate 13 in heat-conducting plate 3 two sides, these heat-conducting piece 31 structures are same as described above, make two heat-conducting pieces 31 pass two perforates 13 and be positioned at motherboard 1 back side, in heat sink 2 contact combinations, can reach heat conduction, heat radiation power and more attain effects such as rapid again.

Claims

1. microcomputer heat radiating device special is characterized in that comprising:

One motherboard is provided with a perforate that runs through motherboard in sides of chip;

One heat sink pastes and is incorporated into the motherboard back side;

One heat-conducting plate pastes and is incorporated into motherboard front chip surface, convexes with a heat-conducting piece in chosen place, makes heat-conducting piece pass the motherboard perforate and contacts combination with the heat sink that is positioned at the back side;

One casing, ccontaining motherboard, heat sink, heat-conducting plate make heat sink paste with the casing inner face and contact in inside, and composition can operate chip heat energy and be passed to the microcomputer heat radiating device special that casing is discharged via heat-conducting plate, heat-conducting piece and heat sink.

2. microcomputer heat radiating device special as claimed in claim 1, it is characterized in that: the sides of chip of this motherboard offers two perforates, this heat-conducting plate is provided with two heat-conducting pieces of corresponding perforate, makes two heat-conducting pieces pass two perforates and contacts combination with the heat sink that is positioned at the motherboard back side.

3. microcomputer heat radiating device special as claimed in claim 1 or 2 is characterized in that: this chip is a processor.

4. microcomputer heat radiating device special as claimed in claim 1 or 2 is characterized in that: this heat sink is provided with most through holes in plate face chosen place, is provided with fixation kit in through hole, and this heat-conducting piece end is provided with most lockholes, and is sealed by fixation kit and lockhole.

5. microcomputer heat radiating device special as claimed in claim 1 or 2 is characterized in that: this casing is provided with several dissipation fins in the outside.