CN2777759Y - High-power surface stuck LED with high heat radiation performance - Google Patents

Abstract

The utility model relates to a high power surface stuck light emitting diode with high heat radiation performance. The utility model is provided with a base, wherein the central part of which is provided with a cylindrical body, wherein the top of which is provided with a groove. The base and the cylindrical body are integrally formed. The bottom of the base is provided with a connecting hole. The base can be connected with a heat radiation block outside through the lower part, and a good heat radiation performance is obtained. A light emitting diode chip is positioned in the groove and penetrates through two electrical contact points to be electrically connected with a circuit extending device. The light emitting diode chip is directly electrically connected with the circuit extending device, and the light emitting diode chip directly penetrates through the base to radiate heat, which leads the light emitting diode to have the structure of electricity and heat separation.

Description

The high-power surface adhesion type LED of tool high-cooling property

Technical field

The utility model relates to a kind of high-power surface adhesion type LED of tool high-cooling property, it is the light-emitting diode that refers to that especially a kind of conduction, heat structure separate, it is to disclose to make when surface-mounting LED assemble, external circuit connect and heat radiation in conjunction with can about the complete electricity, the structure of thermal release of different directions.

Background technology

Light-emitting diode (Light Emitting Diode; LED) be the element that semi-conducting material is made, it also is a kind of fine solid state light emitter, can convert electrical energy into light, not only volume is little, and the life-span is long, driving voltage is low, reaction rate is fast, vibration strength is special good, can cooperate the demand of light, the thin and miniaturization of various application apparatuss, become product very universal in the daily life already.

LED's is of a great variety, roughly is divided into visible light and invisible light two classes according to emission wavelength.With the separation of brightness 1 candle light (cd) as general LED and high-brightness LED, the former is widely used in various indoor demonstration purposes to visible light LED again, and the latter then is suitable for outdoor demonstration, as automobile the 3rd brake light, outdoor information board and traffic sign etc.; Along with the progress of light-emitting diode chip for backlight unit manufacturing technology, the luminous efficiency of light-emitting diode hurriedly increased with day, and the light-emitting diode chip for backlight unit production of large-size simultaneously also reaches its maturity.By promoting circulating current, total luminance that single High Power LED crystal grain can produce can reach number and pick up lumen even lumens up to a hundred, thereby light-emitting diode had been considered as replacing the new-type lighting source of incandescent lamp bulb both at home and abroad in recent years, and various countries industries, universities and research institutors there's no one who doesn't or isn't active development can produce light-emitting diode chip for backlight unit, encapsulation and the Design of Luminaires of high lumen output.

But the increase of High Power LED supporter circulating current, the heat that is produced also increase synchronously, and how luminous efficiency and the reliability of efficiently radiates heat so as to guaranteeing light-emitting diode becomes the High Power LED encapsulation and use very important problem.

In order to solve High Power LED chip overheating problem, light-emitting diode chip for backlight unit sticked together on the size metal block good greater than conventional stent and thermal conductivity becomes tangible trend.The United States Patent (USP) that one U.S. Lumileds company of High Power LED leading manufacturer was applied for February 2 calendar year 2001 " bulletin number US65902352 " discloses, the High Power LED chip is sticked together in the good metal pedestal upper end of a heat conduction, so as to the quick dispersion light-emitting diode chip for backlight unit high heat that (for example 350mA) produced under the normal running electric current.Be subject to the demand of light emission diode package member actual size miniaturization, the volume of this metal pedestal and surface area are still limited, the heat dispersing scarce capacity, the larger sized external metallization radiator of its metal pedestal and another must be combined during actual the use, so as to strengthening the efficiently radiates heat ability, could (for example 350mA) long-time use under the normal running electric current.Yet, the circuit of LED link direction of this invention case is identical in conjunction with the direction of external heat sink with metal pedestal, the both positive and negative polarity conducting forms short circuit on the circuit, the upper surface of used external heat sink must have one deck electrical insulation layer to link for the circuit of light-emitting diode both positive and negative polarity, the existence of this electrical insulation layer not only reduces the capacity of heat transmission of radiator, cause simultaneously assembling go up to want simultaneously treatment circuit adopt soldering in conjunction with and radiator adopts the high degree of difficulty operation of non-soldering combination.

The United States Patent (USP) that people such as Gorg Bognes Lappersdorf were applied on October 10th, 2003 (bulletin number US2004/0075100A1), disclose similar High Power LED package design, its heat radiating metal pedestal is identical with the direction that its circuit both positive and negative polarity externally links in conjunction with the direction of external heat sink, has the difficulty in aforesaid heat radiation ill effect and the assembling in the practical application.

No. the 488557th, the TaiWan, China patent announcement number of being applied in the precious electronics corporation of Taiwan on the 13rd light in June calendar year 2001, the light emitting diode construction of the low thermal resistance that it disclosed, see also Figure 1A, it is the structural representation for the low thermal resisting LED of known techniques; As shown in the figure, a kind of low thermal resisting LED encapsulating structure, comprise: a low thermal resisting LED, it is provided with a heating panel 10 ', one luminescence chip 12 ' is arranged on the heating panel 10 ', the both positive and negative polarity connection pad of luminescence chip 12 ' is to be connected with a printed circuit board (PCB) 13 ', and forms a protective coating 14 '; One cooling base 3 ' is that the heating panel 10 ' with low thermal resisting LED is connected; And a circuit substrate 2 ', be that the printed circuit board (PCB) 13 ' with low thermal resisting LED is connected; Whereby, reduce luminescence chip 12 ' and connect surface temperature thermal resistance to the air, and improve light-emitting diode usefulness.

It is upwards to be connected with circuit substrate 2 ' for printed circuit board (PCB) 13 ' that the structure that it disclosed electrically connects, the part of heat radiation then sees through the heating panel 10 ' that this luminescence chip connected and combines with cooling base 3 ' downwards, though what it disclosed electrically adopts different directions to combine with the mechanism of heat radiation, but shortcoming be heating panel 10 ' with the heating panel pedestal between do not have pressing to form closely to combine so that radiating effect is had a greatly reduced quality.The other embodiment of this case (as B figure) utilizes screw locking two printed circuit board (PCB)s up and down, though can reach the purpose of pressing heating panel and cooling base, but because of upper printed circuit board belongs to the not strong yielding material of rigidity, after the locking of both sides screw, certainly lead to warpage, cause the tiny gold thread (the general line of this gold thread directly is 0.03mm) fracture or the damage that link between chip both positive and negative polarity and printed circuit board (PCB), have a strong impact on the reliable reliability of this light-emitting diode.

Therefore, how a kind of surface-mounting LED of novel tool high-cooling property is proposed at the problems referred to above, not only can improve the shortcoming that conventional surface mount type light emitting diode construction is difficult for heat radiation, can make again, thermal release, be not to use for a long time the person eagerly to look forward to and the inventor person of bearing in mind always always, and the inventor is based on the research of engaging in the light-emitting diode Related product for many years, exploitation, and sale practical experience, it is the idea of thinking and improveing, through research and design in many ways, special topic is inquired into, finally work out a kind of surface-mounting LED improvement of tool high-cooling property, can solve the above problems.

Summary of the invention

Main purpose of the present utility model, be to provide a kind of high-power surface adhesion type LED of tool high-cooling property, it is the pedestal that utilizes integrally formed high heat-conducting, the central portion of this pedestal is to have a column, the top of this column is to have a groove, and this groove is the person of using that is for ccontaining this light-emitting diode chip for backlight unit.This base bottom comprises at least one connecting hole, and this connecting hole can be the through hole that runs through, and also can be to have the blind hole that screw thread does not run through.By a locked instrument, for example: screw, with a radiator of outside, for example: radiating block, add thermal grease and be coated on the composition surface, firm locking sees through the person of using that is that this kind structure can reach high-effect heat radiation.

For reaching above-mentioned each purpose and effect thereof of censuring, the utility model is the structure that discloses a kind of surface-mounting LED, it is to disclose a pedestal and a middle pertusate circuit extension apparatus be combined into that uses high heat-conducting, this base bottom comprises at least one connecting hole, this connecting hole can be the through hole that runs through, also can be to have the blind hole that screw thread does not run through, borrow and one of add radiator and combine.This pedestal central portion passes the middle hole of this circuit extension apparatus, borrows fire resistant resin to be combined into one.The central portion of this pedestal is to have a column, the top of this column is to have a groove, wherein this pedestal and this column are the persons of being formed in one, this groove is to put one or more light-emitting diode chip for backlight unit, this light-emitting diode chip for backlight unit is to do an electric connection with the circuit extension apparatus that is positioned at this pedestal top, through the copper foil circuit on this circuit extension apparatus or metal guide frame and external circuit circulation through the positive and negative electrical contact on the chip.Because this light-emitting diode chip for backlight unit is directly to do electric connection with this circuit extension apparatus, this light-emitting diode chip for backlight unit is directly to do a heat radiation through this pedestal, and making this surface-mounting LED is structure person for an electricity, thermal release.

Description of drawings

Figure 1A: it is the structural representation for the surface-mounting LED of known techniques;

Figure 1B: it is the structural representation for the surface-mounting LED of another known techniques;

Fig. 2 A to Fig. 2 B: it is the structural representation for the pedestal of the light-emitting diode of a preferred embodiment of the present utility model;

Fig. 3: it is the vertical view for the circuit extension apparatus of a preferred embodiment of the present utility model;

Fig. 4: it is to be the circuit extension apparatus of a preferred embodiment of the present utility model structure perspective view in conjunction with pedestal;

Fig. 5: it is to attempt thoroughly for the structure of the circuit extension apparatus combination light harvesting cup of a preferred embodiment of the present utility model;

Fig. 6: it is the perspective view for the surface-mounting LED of the high-cooling property of a preferred embodiment of the present utility model;

Fig. 7: it is the structural representation for the plastic overmold conductive metal frames of another preferred embodiment of the present utility model;

Fig. 8 A: it is the vertical view that connects this plastic overmold conductive metal frames for the pedestal of another preferred embodiment of the present utility model;

Fig. 8 B: it is the perspective view that connects this plastic overmold conductive metal frames for the pedestal of another preferred embodiment of the present utility model;

Fig. 9: it is the perspective view for the surface-mounting LED of the high-cooling property of another preferred embodiment of the present utility model;

Figure 10: it is the structural representation for the pedestal of the light-emitting diode of another preferred embodiment of the present utility model;

Figure 11: it is the perspective view for the surface-mounting LED of the high-cooling property of another preferred embodiment of the present utility model.

Symbol description:

1 '～surface-mounting LED

2 '～circuit substrate

3 '～heat-radiating substrate

10 '～heating panel

12 '～luminescence chip

13 '～printed circuit board (PCB)

14 '～protective layer

1～surface-mounting LED

10～pedestal

12～column

14～groove

15a～connecting hole

15b～connecting hole

16～connection blind hole

The light-emitting diode chip for backlight unit of 20～horizontal type electrode

22～routing

24～routing

30～circuit board

31～central hole

32～electrical contact

34～electrical contact

35a～through hole

35b～through hole

36～connection gasket

38～connection gasket

40～light harvesting cup

50～outside radiating block

51a～screw hole

51b～screw hole

52～upper surface

54～through hole

71a～screw

71b～screw

72～screw

80～circuit external plate

81～connection gasket

82～connection gasket

91～plastic overmold conductive metal frames

93a～electrical pin

93b～electrical pin

Embodiment

Because the surface-mounting LED of known techniques all is to see through identity element with heat radiation electrically, perhaps its cooling mechanism is to do one with a heat dissipation element again through circuit board earlier to be connected, and, the stacker of light-emitting diode chip for backlight unit with outside heating panel two between combine and failed enough pressure and exist, impel its radiating effect to reduce, so the utility model is the structure that proposes the surface-mounting LED of the high heat radiation function of a tool, to solve each shortcoming of known techniques.

At first, see also Fig. 2 A to Fig. 5, it is the structure perspective diagram for the manufacture process of the light-emitting diode of a preferred embodiment of the present utility model; Shown in Fig. 2 A (end view) and Fig. 2 B (top view), surface-mounting LED of the present utility model is to comprise a pedestal 10, and this pedestal 10 is highly heat-conductive materials, can be selected from gold, copper, aluminium, silver, graphite or its alloy or compound, the central portion of this pedestal 10 is to have a column 12, the top of this column 12 is to have a groove 14, and wherein this groove 14 is the usefulness for ccontaining light-emitting diode chip for backlight unit 20, and the two bottom sides of this pedestal 10 respectively has a connecting hole 15a and a 15b who runs through.Figure 3 shows that a circuit extension apparatus 30, in the utility model is to do an explanation with a printed circuit board (PCB) (PCB that promptly is commonly called as), wherein this printed circuit board (PCB) has a central hole 31, its upper surface contains and connects the connection gasket 32 and 34 that the light-emitting diode chip for backlight unit both positive and negative polarity is used, and the connection connection gasket 36 and 38 that external circuit is used is provided, there is copper foil circuit to connect between the two.Respectively there is a groove 35a and a 35b both sides, when practical application is provided in conjunction with the lock screw space of external heat sink.Then, in the upper set of this pedestal 10 should the printed circuit board (PCB) 30 of circuit extension apparatus.The central hole 31 that the central portion column 12 of this pedestal 10 passes this printed circuit board (PCB) from this printed circuit board (PCB) below, as shown in Figure 4.Be with closing by resistant to elevated temperatures gluing between this pedestal 10 and the printed circuit board (PCB) 30.This circuit board 30 provides two electrical contacts 32,34, and the positive and negative electrode (not shown) that makes this light-emitting diode chip for backlight unit 20 is through breaking gold thread or aluminum steel 22,24 to electrically connect; The person of connecing puts a light harvesting cup 40 again in the top of this circuit board 30, and in cup an amount of epoxy resin of filling or silica gel in order to protect this light-emitting diode chip for backlight unit and to collect the light that this light-emitting diode chip for backlight unit produces, as shown in Figure 5.This light harvesting cup can be metal or plastics ejection formation.

So the electric connection of surface-mounting LED 1 of the present utility model is leading by the circuit extension apparatus, and heat radiation is leading by pedestal 10.The utility model provides the structure of an electricity, thermal release, the part that electrically connects is direct and circuit board joins, and the part of heat radiation, be that this light-emitting diode chip for backlight unit directly is connected with pedestal, its connection of electricity, heat that is different from known techniques is when being that with heat radiation cooling base of the present utility model engages with external heat sink, can utilize connecting hole on the pedestal to reach and combine closely, and can effectively promote the purpose of radiating effect with screw locking.

See also Fig. 6, it is to be the embodiment of the utility model in practical application, and pedestal is in conjunction with the structure perspective diagram of outside radiating block; Comprise the element except the utility model embodiment one as shown in the figure, further include the radiating block 50 of an outside, in conjunction with screw 71a, the 71b of pedestal 10 with radiating block 50 usefulness of outside, and the external circuit board 80.Wherein Wai Bu radiating block is drilled with two screw hole 51a, 51b on the position of the both sides of corresponding pedestal 10 connecting hole 15a, 15b, for locking in conjunction with screw 71a, 71b.Be to increase the effective contact area with pedestal 10, the upper surface 52 coating thermal grease (not shown)s of radiating block 50 that can be externally by the locking of screw 71a, 71b, are effectively promoted the thermal conduction effect between pedestal 10 and the radiating block 50.The circuit side connector face then is the external connection pad 36,38 that sees through on the circuit extension apparatus 30, respectively with circuit external plate 80 on connection gasket 81,82, with soldering connect and, reach the circuit communication purpose.Need processing one hole Tong Dong in advance on the external circuit board 80, to avoid the bright dipping of the utility model light-emitting diode.

Again, see also Fig. 7 to Fig. 9, it is the circuit extension apparatus structure perspective diagram for another preferred embodiment of the present utility model; As shown in the figure, the utility model is a kind of circuit extension apparatus that adopts a plastic overmold conductive metal frames, this plastic body be hollow so as to holding pedestal, wherein conductive metal frames is to comprise two electrical pin 93a, 93b to engage usefulness to provide with light-emitting diode chip for backlight unit both positive and negative polarity and external circuit.Moreover, seeing also Fig. 8 A (top view) and Fig. 8 B (end view), it is top view and end view for this plastic overmold support of base combination of another preferred embodiment of the present utility model.Pedestal is to adopt resistant to elevated temperatures resin with combining of plastic overmold support.As shown in the figure, this light-emitting diode chip for backlight unit 20 sees through routing 22,24 and makees an electric wire with this metallic support 93a, 93b and be connected, and wherein the direction of this metallic support 93a, 93b is that connecting hole 15a, 15b with this pedestal staggers mutually.Filling epoxy resin or silica gel between light-emitting diode chip for backlight unit 20 and plastic overmold support 91 are so as to protection light-emitting diode chip for backlight unit and increase illumination effect.See also Fig. 9, it is to be the assembling schematic diagram in the application of another preferred embodiment of the present utility model; As shown in the figure, with this pedestal 10 and this plastic overmold conductive metal frames 91 use viscoses do one be connected after, use lock member 71a, 71b and make this surface-mounting LED pedestal 10 can force to do one to be connected with the radiating block 50 of an outside, as for being connected of external circuit (not shown), can utilize electrical pin 93a, the 93b of conductive metal frames to connect.See through this kind structure, more technical characterictic of the present utility model can be described, electricity, thermal release that the utility model is illustrated, it is different with the direction of heat radiation for connecting electrical direction, and element electrical and that heat radiation is seen through does not have overlapping use, so can cause better radiating effect.

The utility model can be a through hole as shown in the previous example in order to the base bottom connecting hole in conjunction with outside radiating block, also can be to have the blind hole that screw thread does not run through.Shown in Figure 10, be the pedestal 10 structure perspective diagrams of another preferred embodiment of the present utility model; Wherein the base bottom connecting hole is changed in the bottom of pedestal central authorities column 12 and is drilled with helicoid blind hole 16 by each through hole that runs through of one of both sides, this pedestal is with after plastic overmold conductive metal frames 91 combines, and the constitutional diagram that connects outside radiating block 50 is shown in Figure 10 one.Wherein outside radiating block has consistent reach through hole 54, utilizes a locking screw 72 in conjunction with this pedestal 10 and this outside radiating block 50.The close-fitting of screw thread on this locking screw and this base bottom blind hole 16, this pedestal 10 can be pressed by brute force with this outside radiating block 50 and, reach the function of efficiently radiates heat.

Not being subject to one with light-emitting diode chip for backlight unit shown in the utility model, can be that most chips use simultaneously, as long as connection gasket and circuit on the circuit extension apparatus increase with chip-count.

Claims (10)

1. the high-power surface adhesion type LED of a tool high-cooling property is characterized in that, primary structure is to comprise:

One pedestal, the central portion of this pedestal are to have a column, and the top of this column is to have a groove, and this base bottom has at least one connecting hole, and wherein this pedestal and this column are to be formed in one;

At least one light-emitting diode chip for backlight unit, it is to be placed in the groove of this pedestal;

One circuit extension apparatus, it is to have a central hole, the external positive and negative electrical contact of positive and negative electrical contact of at least one pair of and extension, wherein this positive and negative electrical contact is positioned at the upper surface of circuit extension apparatus, be to be used for doing an electric connection with the both positive and negative polarity of light-emitting diode chip for backlight unit, this circuit extension apparatus is positioned at the top of this pedestal, and both are with the high-temperature plastic combination;

Wherein, this light-emitting diode chip for backlight unit utilizes gold thread or aluminum steel to connect with this circuit extension apparatus and does electric connection, and the extension circuit that should see through on the circuit extension apparatus upper surface is connected with external circuit.

2. the high-power surface adhesion type LED of tool high-cooling property according to claim 1 is characterized in that: the connecting hole of this pedestal is the through hole that runs through.

3. the high-power surface adhesion type LED of tool high-cooling property according to claim 1 is characterized in that: the connecting hole of this pedestal is to have the blind hole that screw thread does not run through.

4. the high-power surface adhesion type LED of tool high-cooling property according to claim 2 is characterized in that: this pedestal can directly lock via the radiating block of this connecting hole and an outside.

5. the high-power surface adhesion type LED of tool high-cooling property according to claim 1 is characterized in that: this circuit extension apparatus is to can be the printed circuit board (PCB) that is printed on circuit.

6. the high-power surface adhesion type LED of tool high-cooling property according to claim 1 is characterized in that: this circuit extension apparatus is the conductive metal frames that can be plastic overmold.

7. the high-power surface adhesion type LED of tool high-cooling property according to claim 1 is characterized in that: this circuit extension apparatus can further comprise a light harvesting cup, and this light harvesting cup is the top that is positioned at this circuit extension apparatus.

8. the high-power surface adhesion type LED of tool high-cooling property according to claim 1 is characterized in that: the high heat-conducting of this pedestal is to can be gold, silver, copper, aluminium, graphite or its alloy or compound.

9. the high-power surface adhesion type LED of a tool high-cooling property is characterized in that the primary structure of the high-power surface adhesion type LED of described tool high-cooling property is to comprise:

One pedestal, the central portion of this pedestal are to have a column, and the top of this column is to have a groove, and this base bottom has at least one connecting hole, and wherein this pedestal and this column are to be formed in one;

One or more light-emitting diode chip for backlight unit, it is to be placed in the groove of this pedestal;

The plastic overmold conductive metal frames of one hollow, it is to have the positive and negative electrical contact of at least one pair of and extend the electrical pin of both sides, and this plastic overmold conductive metal frames is the top that is positioned at this pedestal, and both are with the high-temperature plastic combination;

Wherein, this light-emitting diode chip for backlight unit utilizes gold thread or aluminum steel to connect with the positive and negative electrical contact of this plastic overmold conductive metal frames and does electric connection, sees through the electrical pin of this plastic overmold conductive metal frames and is connected with external circuit.

10. the high-power surface adhesion type LED of a tool high-cooling property is characterized in that the high-power surface adhesion type LED primary structure of described tool high-cooling property is to comprise:

One pedestal, the central portion of this pedestal are to have a column, and the top of this column is to have a groove, and the bottom of this pedestal central portion column has a threaded blind hole that do not run through, and wherein this pedestal and this column are to be formed in one;

One or more light-emitting diode chip for backlight unit, it is to be placed in the groove of this pedestal;

The plastic overmold conductive metal frames of one hollow, it is to have the positive and negative electrical contact of at least one pair of and extend the electrical pin of both sides, and this plastic overmold conductive metal frames is the top that is positioned at this pedestal, and both are with the high-temperature plastic combination;

Wherein, this light-emitting diode chip for backlight unit utilizes gold thread or aluminum steel to connect with the positive and negative electrical contact of this plastic overmold conductive metal frames and does electric connection, sees through the electrical pin of this plastic overmold conductive metal frames and is connected with external circuit.

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