CN2777757Y - Conductor frame with enhanced heat radiation effect and package thereof - Google Patents
Conductor frame with enhanced heat radiation effect and package thereof Download PDFInfo
- Publication number
- CN2777757Y CN2777757Y CN 200520016991 CN200520016991U CN2777757Y CN 2777757 Y CN2777757 Y CN 2777757Y CN 200520016991 CN200520016991 CN 200520016991 CN 200520016991 U CN200520016991 U CN 200520016991U CN 2777757 Y CN2777757 Y CN 2777757Y
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip carrier
- pin
- semiconductor package
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The utility model relates to a conducting wire rack with enhanced heat radiation effect and a packaging element thereof. The conducting wire rack comprises a chip holder bearing at least one semiconductor chip, a plurality of pipe pins arranged at two sides of the chip holder, heat radiating wings used for transferring the heat of the chip to the outside via a connecting part connected with the chip holder and extended parts which are formed on the chip holder and are different from idle zones at both sides of the pipe pins, and thus the area of the metal parts of the body of the packaging element is enlarged. The heat radiating wings and the connecting ends of the chip holder are provided with open holes since the utility model enlarges the area of the chip holder and the metal area of a connecting part, the areas of the open holes of the connecting part are reduced, the problem that the heat radiating efficiency of the heat radiating wings is decreased due to the overlarge areas of the holes of the existing connecting part is solved, and the problem that the chip holder is not flat since the mechanical stress of a mould is decreased by the existing conducting wire rack in the working procedure of the conducting wire rack is avoided, and bonding force between the heat radiating wings and a packaging colloid is enhanced.
Description
Technical field
The utility model is about a kind of lead frame and packaging part thereof, and particularly (Heat-sink Small OutlinePackage is HSOP) with its application lead frame about a kind of heat radiating type small size semiconductor package part of strengthening radiating effect.
Background technology
The conventional semiconductors chip is to form semiconductor package part with lead frame (Lead Frame) as chip carrier.This lead frame comprises chip carrier and is formed at this chip carrier many pins on every side, after treating that semiconductor chip is bonded on the chip carrier and electrically connects this chip and pin with bonding wire, utilize potting resin to coat the inner segment of this chip, chip carrier, bonding wire and pin again, form the semiconductor package part of this tool lead frame.
With lead frame of a great variety as the semiconductor sealing of chip carrier, as QFP semiconductor package part (Quad Flat Package), QFN (Quad-Flat Non-leaded) semiconductor package part, SOP semiconductor package part (Small Outline Package), HSOP semiconductor package part (Heat-sink Small Outline Package) or DIP semiconductor package part (Dual in-linePackage) etc., HSOP semiconductor package part wherein, as United States Patent (USP) the 5th, 877, No. 937 and Japan Patent JP01217386 are disclosed, it is by setting up the radiating efficiency that radiating wing (Wing Tab) improves packaging part, so often use high power, on the electronic product of high electric current.
In addition, the semiconductor package part of conventional wires frame type is in order further to improve the electrical quality of semiconductor package part, on this semiconductor chip except utilizing holding wire (Signal Wire) to electrically connect each pin, also can be by the mode of downward routing (Down Bond), electrically connect the chip carrier of chip ground mat and this lead frame with earth connection (Ground Wire), just this lead frame routing distributed area of doing to electrically connect with bonding wire can comprise around this pin part and this chip carrier.
The heat exchange pattern of HSOP semiconductor package part mainly is the radiating wing (Wing Tab) that is connected via with lead frame chip carrier (Die Pad), heat on the chip is transmitted to printed circuit board (PCB) (Printed Circuit Board) fast, thereby the grounding plate (Ground Plane) by printed circuit board (PCB) is rapidly with heat release.
Fig. 1 is existing HSOP semiconductor package part.The lead frame 10 of this HSOP semiconductor package part 1 mainly comprises: be used to place the chip carrier 11 of chip, the connecting portion 14 that is laid in many pin ones 2 that these chip carrier 11 both sides and chip electrically connect, the heat on the chip is transmitted to the radiating wing 13 on the printed circuit board (PCB) and is connected this chip carrier 11 and radiating wing 13.Wherein this connecting portion 14 has a plurality of holes 140, and this lead frame is low to be put in (Down Set) operation because of the mould mechanical stress causes chip carrier 11 irregular problems in order to reduce, and can strengthen the adhesion of radiating wing 13 and packing colloid.
But, because this hole 140 is positioned on the connecting portion 14 that connects this chip carrier 11 and radiating wing 13, excessive hole area will reduce the radiating efficiency of radiating wing 13, when making this packaging part be used for the electronic product of high power, high electric current, may damage because of packaging part can't effectively shed chip heat; Moreover, when the earthing device area deficiency of printed circuit board (PCB) or chip carrier 11 areas are not enough, can cause packaging part effectively chip heat to be shed, and then cause product electrically to lose efficacy.
Therefore, how to design a kind of lead frame and packaging part thereof of strengthening radiating effect, thoroughly solve the problem that can't effectively chip heat be shed and cause product electrically to lose efficacy that has now because of packaging part, and then improve the quality and the acceptance rate of this lead frame and packaging part thereof, having become for this reason, association area needs the urgent problem that solves.
The utility model content
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present utility model is to provide a kind of lead frame and semiconductor package part structure thereof of strengthening radiating effect, it is by the metallic area of the connecting portion of increase lead frame chip carrier and chip carrier and radiating wing junction, the idle district, both sides that differs from pin on this chip carrier forms extension, increase the area of this packaging part base metal part, improve the radiating efficiency of this lead frame so can increase its area of dissipation.
For reaching above-mentioned and other purpose, the lead frame of reinforcement radiating effect of the present utility model comprises: chip carrier is used to carry at least one semiconductor chip; Many pins are laid in the both sides of this chip carrier; Radiating wing is connected to the connecting portion of chip carrier, and the heat of chip is transmitted to the external world; And extension, be formed on the idle district, both sides that this chip carrier differs from this pin, increased the area of this packaging part base metal part.In addition, around this chip carrier, design perforate, solve because of the chip carrier area strengthens for example Encapsulation Moulds that produces and flow product reliability problems such as delamination inhomogeneous or that thermal stress causes too greatly.
The utility model also provides a kind of packaging part of strengthening the lead frame of radiating effect in addition, this packaging part comprises: lead frame has chip carrier, is distributed in many pins of these chip carrier both sides, the connecting portion by being connected to chip carrier is transmitted to the heat of chip extraneous radiating wing and is formed on the extension that this chip carrier differs from the idle district, both sides of pin; At least one semiconductor chip connects and puts on this chip carrier; Many bonding wires electrically connect this semiconductor chip and this lead frame; And packing colloid, coat this semiconductor chip, bonding wire and lead frame partly.
In sum, the lead frame of reinforcement radiating effect of the present utility model and packaging part thereof are the idle district's formation in the both sides extensions that differs from pin at this chip carrier, increase the area of this packaging part base metal part, increased area of dissipation, improved the radiating efficiency of this lead frame.On the other hand, compare with the connecting portion design perforate of chip carrier at radiating wing with existing lead frame, the utility model is by the area of this chip carrier of expansion and the metallic area of connecting portion, on radiating wing, form perforate with the chip carrier link, reduce this connecting portion perforated area, solved the excessive problem that reduces the radiating wing radiating efficiency of existing connecting portion hole area, avoid existing lead frame to reduce the low irregular problem of chip carrier that causes because of the mould mechanical stress in (Down Set) operation of putting of lead frame, strengthened the adhesion of radiating wing and packing colloid.
Description of drawings
Fig. 1 is the lead frame vertical view of existing HSOP semiconductor package part;
Fig. 2 is the lead frame vertical view of reinforcement radiating effect of the present utility model;
Fig. 3 A and Fig. 3 B are the pin partial enlarged drawing and the profiles of the lead frame of reinforcement radiating effect of the present utility model; And
Fig. 4 is the HSOP semiconductor package part schematic diagram of reinforcement radiating effect of the present utility model.
Embodiment
Embodiment
Below by specific instantiation execution mode of the present utility model is described.
Below to be applicable to heat radiating type small size semiconductor package part (the Heat-sink Small Outline Package that strengthens radiating effect, HSOP) lead frame is an example, describe specific embodiment of the utility model in detail, but lead frame of the present utility model is not limited thereto, also can be the conducting wire frame structure of other type.
See also Fig. 2, it is the lead frame schematic diagram of reinforcement radiating effect of the present utility model, this figure shows the construction unit relevant with the utility model in a schematic way, and this construction unit is not to draw according to actual quantity and dimension scale, and the actual lead frame and the topology layout of semiconductor package part should be complicated more.
The lead frame 20 of reinforcement radiating effect of the present utility model mainly comprises: for the chip carrier 21 of placing semiconductor chip, many pin twos 2 that are laid in these chip carrier 21 both sides, be connected to the radiating wing 23 of chip carrier 21 connecting portions 24 and differ from the extension 25 that idle district, pin two 2 both sides is extended to form by this chip carrier 21.
This lead frame 20 has enlarged the area of chip carrier 21, increased the area of this packaging part base metal part, so can increase area of dissipation, thereby improve the radiating efficiency of this lead frame 20, simultaneously, for avoiding strengthening the inhomogeneous or thermal stress (thermal stress) of for example Encapsulation Moulds stream that chip carrier 21 areas the produce product reliability problems such as delamination that cause such as excessive, design forms perforate 210 around chip carrier 21 of the present utility model, has solved problems such as mould stream inequality or delamination.
This pin two 2 includes internal pin (Inner Lead) 221 and external pin (Outer Lead) 222.Wherein this internal pin is formed in the packing colloid (not marking), electrically connects use for follow-up chip and lead frame; This external pin 222 is formed at outside the packing colloid, is electrically connected to external device (ED) for the semiconductor package part of finishing packaging operation.Consider lead frame internal pin effect, and comply with the needs that amplify chip carrier 21 areas, so shortened the spacing of internal pin 222 with chip carrier 21.
This connecting portion 24 connects this chip carrier 21 and this radiating wing 23.The utility model is by enlarging the metallic area of this connecting portion 24, on radiating wing 23, form perforate 230 with chip carrier 21 links, like this, can avoid existing lead frame to reduce the low irregular problem of chip carrier that causes because of the mould mechanical stress in (Down Set) operation of putting of lead frame, and strengthen the purpose of radiating wing 23 and packing colloid adhesion, because of reducing the perforated area of this connecting portion 24, strengthened the radiating efficiency of this radiating wing 23 simultaneously.
This extension 25 is formed at the idle district, both sides that this chip carrier 21 differs from this pin two 2, and extend to the guide rail 30 that this lead frame is used to connect pin, can increase the area of this packaging part base metal part like this by this extension 25, and then improved area of dissipation, increase the radiating efficiency of this lead frame 20.
See also Fig. 3 A and Fig. 3 B again,, be used to stop extraneous aqueous vapor to be penetrated into the inside of this packaging part via the external pin 221 of lead frame 20 at the pin two 2 of lead frame 20 fluted (Notch) 223 of partial design near the packing colloid edges.
See also Fig. 4, it is the lead frame semiconductor package part schematic diagram of reinforcement radiating effect of the present utility model, the lead frame schematic diagram that please cooperate Fig. 2 simultaneously, this packaging part comprises: many pin twos 2 that lead frame 20, this lead frame 20 have chip carrier 21, be laid in these chip carrier 21 both sides conduct heat to the connecting portion 24 of extraneous radiating wing 23, connection-core bar 21 and radiating wing 23 and the extension 25 that is extended to guide rail 30 by the idle district, both sides that this chip carrier 21 differs from pin.Wherein, this lead frame 20 has increased the metal part area of chip carrier 21 and connecting portion 24; At least one semiconductor chip 28 connects and puts on this chip carrier 21; Many bonding wires 29 are used to electrically connect this semiconductor chip 28 and lead frame 20; And packing colloid 31, be used to coat this semiconductor chip 28, bonding wire 29 and part lead frame 20, expose outside the external pin 222 and radiating wing 23 outer ends of conduction rack 20, for example be electrically connected to external device (ED)s such as printed circuit board (PCB) 26 for this packaging part by this external pin 222 and radiating wing 23 outer ends.
This bonding wire 29 comprises signal bond wires 292 and ground connection bonding wire 291, the routing distributed area of this lead frame 20 can comprise around internal pin 221 parts and this chip carrier 21 of this pin two 2, chip 28 connect put behind this chip carrier 21, except utilizing signal bond wires 292 to electrically connect the internal pin 221 of chip and each pin two 2, also can utilize ground connection bonding wire 291 to electrically connect the chip carrier 21 of chip 28 ground mats (not marking) and this lead frame 20, again by this radiating wing 23, be electrically conducted ground plane 260 in the printed circuit board (PCB) 26 for example by electric conducting material 32.In order to make chip effectively utilize bonding wire and lead frame to electrically connect, generally can on this lead frame, follow part (chip carrier and internal pin) and form weld layer for bonding wire, the material of this lead frame 20 mainly is the copper metal, the material of weld layer is metal levels such as silver, nickel/palladium, when semiconductor chip 28 and 20 of lead frames utilize bonding wire (gold thread) 29 to electrically connect, by weld layer (silver-colored material) the formation eutectic structure of bonding wire (golden material) 29, make bonding wire 29 engage and be electrically connected on the lead frame 20 with the routing distributed area of this lead frame 20.
Therefore, the lead frame of reinforcement radiating effect of the present utility model and packaging part thereof mainly are the areas that enlarges this chip carrier, and form extension in the idle district, both sides that this chip carrier differs from pin, increased the area of this packaging part base metal part, thus increase this lead frame area of dissipation, improved radiating efficiency.Simultaneously, the utility model is also by reducing the area of this connecting portion hole, increased the metallic area of this connecting portion, solved the excessive problem that reduces the radiating wing radiating efficiency of existing connecting portion hole area, avoid existing lead frame to reduce the low irregular problem of chip carrier that causes because of the mould mechanical stress in (Down Set) operation of putting of lead frame, strengthened the adhesion of radiating wing and packing colloid.
Claims (27)
1. a lead frame of strengthening radiating effect is characterized in that, this lead frame comprises:
Chip carrier is used to carry at least one semiconductor chip;
Many pins are laid in the both sides of this chip carrier;
Radiating wing is connected to the connecting portion of chip carrier, and the heat of chip is transmitted to the external world; And
Extension is formed on the idle district, both sides that this chip carrier differs from this pin, has increased the area of this packaging part base metal part.
2. lead frame as claimed in claim 1 is characterized in that, this lead frame is a lead frame of strengthening the heat radiating type small size semiconductor package part of radiating effect.
3. lead frame as claimed in claim 1 is characterized in that this lead frame has enlarged the area of this chip carrier, has increased the area of this packaging part base metal part.
4. lead frame as claimed in claim 3 is characterized in that, this lead frame is formed with perforate around the chip carrier of this enlarged-area.
5. lead frame as claimed in claim 3 is characterized in that, this lead frame is to chip carrier that should enlarged-area and consider lead frame internal pin effect, has shortened the spacing of pin and chip carrier.
6. lead frame as claimed in claim 1 is characterized in that this extension extends to the guide rail that this lead frame is used to connect pin.
7. lead frame as claimed in claim 1 is characterized in that, this lead frame has increased this connecting portion metallic area, strengthens the radiating efficiency of this radiating wing.
8. lead frame as claimed in claim 1 is characterized in that, this lead frame forms perforate with the chip carrier link on radiating wing, reduce simultaneously on this connecting portion and form perforate.
9. lead frame as claimed in claim 1 is characterized in that this pin comprises internal pin and external pin.
10. lead frame as claimed in claim 1 is characterized in that, the pin of this lead frame is fluted near the partial design at packing colloid edge.
11. a wire-frame type semiconductor package part of strengthening radiating effect is characterized in that, this packaging part comprises:
Lead frame has chip carrier, is distributed in many pins of these chip carrier both sides, the connecting portion by being connected to chip carrier is transmitted to the heat of chip extraneous radiating wing and is formed on the extension that this chip carrier differs from the idle district, both sides of pin;
At least one semiconductor chip connects and puts on this chip carrier;
Many bonding wires electrically connect this semiconductor chip and this lead frame; And
Packing colloid coats this semiconductor chip, bonding wire and lead frame partly.
12. semiconductor package part as claimed in claim 11 is characterized in that, this packaging part is for strengthening the heat radiating type small size semiconductor package part of radiating effect.
13. semiconductor package part as claimed in claim 11 is characterized in that, this packaging part enlarges the area of this chip carrier, has increased the area of this packaging part base metal part.
14. semiconductor package part as claimed in claim 13 is characterized in that, this packaging part is formed with perforate around the chip carrier of this enlarged-area.
15. semiconductor package part as claimed in claim 13 is characterized in that, this packaging part is to chip carrier that should enlarged-area and consider lead frame internal pin effect, has shortened the spacing of pin and chip carrier.
16. semiconductor package part as claimed in claim 11 is characterized in that, this extension extends to the guide rail that this lead frame is used to connect pin.
17. semiconductor package part as claimed in claim 11 is characterized in that, this packaging part increases this connecting portion metallic area, has improved the radiating efficiency of this radiating wing.
18. semiconductor package part as claimed in claim 11 is characterized in that, this packaging part forms perforate with the chip carrier link on radiating wing, reduce the perforate that forms at this connecting portion simultaneously.
19. semiconductor package part as claimed in claim 11 is characterized in that, this pin comprises internal pin and external pin.
20. semiconductor package part as claimed in claim 11 is characterized in that, this packaging part is fluted near the packing colloid edge designs at this pin.
21. semiconductor package part as claimed in claim 11 is characterized in that, this packaging part also is included in the routing distributed area of this lead frame and is laid with weld layer.
22. semiconductor package part as claimed in claim 21 is characterized in that, the routing distributed area of this lead frame is this pin inside part.
23. semiconductor package part as claimed in claim 21 is characterized in that, the routing distributed area of this lead frame is around this chip carrier.
24. semiconductor package part as claimed in claim 21 is characterized in that, the material of this lead frame mainly is the copper metal, and the material of this weld layer is a kind of in silver or the nickel/palladium metal.
25. semiconductor package part as claimed in claim 11 is characterized in that, this bonding wire comprises signal bond wires and ground connection bonding wire.
26. semiconductor package part as claimed in claim 25 is characterized in that, this signal bond wires is used to electrically connect the pin of semiconductor chip and lead frame.
27. semiconductor package part as claimed in claim 25 is characterized in that, this ground connection bonding wire is used to electrically connect this semiconductor chip and this chip carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520016991 CN2777757Y (en) | 2005-04-21 | 2005-04-21 | Conductor frame with enhanced heat radiation effect and package thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520016991 CN2777757Y (en) | 2005-04-21 | 2005-04-21 | Conductor frame with enhanced heat radiation effect and package thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2777757Y true CN2777757Y (en) | 2006-05-03 |
Family
ID=36745133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520016991 Expired - Lifetime CN2777757Y (en) | 2005-04-21 | 2005-04-21 | Conductor frame with enhanced heat radiation effect and package thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2777757Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111726945A (en) * | 2020-06-19 | 2020-09-29 | 湖南金康光电有限公司 | Packaging method of camera module |
-
2005
- 2005-04-21 CN CN 200520016991 patent/CN2777757Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111726945A (en) * | 2020-06-19 | 2020-09-29 | 湖南金康光电有限公司 | Packaging method of camera module |
| CN111726945B (en) * | 2020-06-19 | 2021-11-02 | 湖南金康光电有限公司 | Packaging method of camera module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150421 Granted publication date: 20060503 |