CN2777752Y - Carriage for removing adhesive film on semiconductor wafer - Google Patents
Carriage for removing adhesive film on semiconductor wafer Download PDFInfo
- Publication number
- CN2777752Y CN2777752Y CN 200520002339 CN200520002339U CN2777752Y CN 2777752 Y CN2777752 Y CN 2777752Y CN 200520002339 CN200520002339 CN 200520002339 CN 200520002339 U CN200520002339 U CN 200520002339U CN 2777752 Y CN2777752 Y CN 2777752Y
- Authority
- CN
- China
- Prior art keywords
- substrate
- mucous membrane
- semiconductor wafer
- disk
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a carrier for removing adhesive films on semiconductor wafers, and provides an auxiliary device for semiconductor manufacture, which has the advantages of convenient operation, simple structure and low production cost. The utility model comprises a base plate and an adsorbing structure, wherein the base plate is provided with an upper surface on which a wafer with adhesive films is arranged upward, a lower surface and a plurality of guiding pores which penetrate from the upper surface to the lower surface. The adsorbing structure is arranged at the lower surface of the base plate, is communicated with and absorbs the wafer through a plurality of guiding pores on the base plate.
Description
Technical field
The utility model belongs to semiconductor manufacturing servicing unit, mucous membrane carrier on particularly a kind of removal semiconductor wafer.
Background technology
As shown in Figure 1, disk must grind 10, cutting 12, encapsulation 13 and test processing procedures such as 14 after finishing electronic circuit and making.Yet when wafer grinding, the electronic circuit on the protection disk must stick disk one deck mucous membrane usually, lives disk with protection.And after grinding is finished, again disk is placed on the mucous membrane removal board mucous membrane is removed automatically.But it is costly that mucous membrane is removed board, makes manufacturing cost improve relatively.And the mucous membrane in existing manufactory is removed the mucous membrane removal that board is only applicable to 8 disks, and along with the density of manufacture of semiconductor improves, 12 wafer design have become trend.But for existing manufactory, then must purchase the board that is fit to the production of 12 disks separately, it is millions of easily to comprise that mucous membrane is removed board, and real is huge expenditure of manufactory.Therefore, when 8 disks are converted to 12 disks, how to reduce purchasing of board, reduce production costs, real is the important topic that present manufactory must solve.
Summary of the invention
The purpose of this utility model provides mucous membrane carrier on a kind of easy and simple to handle, simple in structure, removal semiconductor wafer of reducing production costs.
The utility model comprises substrate and adsorption structure; Substrate is provided with upper surface for mucous membrane disk setting up, lower surface and connects several guide holes to lower surface by upper surface; Adsorption structure is arranged at the lower surface of substrate, and several guide holes are communicated with and adsorb disk on substrate.
Wherein:
Adsorption structure is for adsorbing into base lower surface the evacuator of vacuum state.
Because the utility model comprises substrate and adsorption structure; Substrate is provided with upper surface for mucous membrane disk setting up, lower surface and connects several guide holes to lower surface by upper surface; Adsorption structure is arranged at the lower surface of substrate, and several guide holes are communicated with and adsorb disk on substrate.During use, the disk that will adhere to mucous membrane is arranged on the upper surface of substrate, makes the top of mucous membrane towards substrate.When adsorption structure starts, several guide holes on the substrate adsorb into vacuum with the lower surface of substrate, and the disk that will be positioned on the upper surface of base plate adsorbs, can easily mucous membrane be removed, suitable facility in operation, needn't purchase the expensive board that removes separately, can effectively reduce production costs.And the utility model structure is quite simple, can effectively reduce production costs.Not only easy and simple to handle, and simple in structure, reduce production costs, thereby reach the purpose of this utility model.
Description of drawings
Fig. 1, be existing semiconductor manufacture flow path figure.
Fig. 2, be the utility model structural representation front view.
Fig. 3, be the utility model user mode schematic diagram.
Embodiment
As shown in Figure 2, the utility model comprises substrate 20 and adsorption structure 30.
As shown in Figure 3, during use, the disk 34 that will adhere to mucous membrane 32 is arranged on the upper surface 22 of substrate 20, makes the top of mucous membrane 32 towards substrate 20.When adsorption structure 30 starts, several guide holes 26 on the substrate 20 adsorb into vacuum with the lower surface 24 of substrate 20, and the disk 34 that will be positioned at the upper surface 22 of substrate 20 adsorbs, can easily mucous membrane 32 be removed, suitable facility in operation, needn't purchase the expensive board that removes separately, can effectively reduce production costs.And the utility model structure is quite simple, can effectively reduce production costs.
Claims (2)
1, mucous membrane carrier on a kind of removal semiconductor wafer is characterized in that it comprises substrate and adsorption structure; Substrate is provided with upper surface for mucous membrane disk setting up, lower surface and connects several guide holes to lower surface by upper surface; Adsorption structure is arranged at the lower surface of substrate, and several guide holes are communicated with and adsorb disk on substrate.
2, mucous membrane carrier on the removal semiconductor wafer according to claim 1 is characterized in that described adsorption structure is for adsorbing into base lower surface the evacuator of vacuum state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520002339 CN2777752Y (en) | 2005-02-04 | 2005-02-04 | Carriage for removing adhesive film on semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520002339 CN2777752Y (en) | 2005-02-04 | 2005-02-04 | Carriage for removing adhesive film on semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2777752Y true CN2777752Y (en) | 2006-05-03 |
Family
ID=36745129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520002339 Expired - Fee Related CN2777752Y (en) | 2005-02-04 | 2005-02-04 | Carriage for removing adhesive film on semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2777752Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107539596A (en) * | 2017-09-29 | 2018-01-05 | 常熟市荣达电子有限责任公司 | A kind of chip packaging box and its operating method |
| CN110790007A (en) * | 2019-10-14 | 2020-02-14 | 湖北光安伦科技有限公司 | Stripping and transferring device and method for Bar-shaped Bar of semiconductor laser |
-
2005
- 2005-02-04 CN CN 200520002339 patent/CN2777752Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107539596A (en) * | 2017-09-29 | 2018-01-05 | 常熟市荣达电子有限责任公司 | A kind of chip packaging box and its operating method |
| CN110790007A (en) * | 2019-10-14 | 2020-02-14 | 湖北光安伦科技有限公司 | Stripping and transferring device and method for Bar-shaped Bar of semiconductor laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060503 |