CN209150073U - A kind of pedestal and substrate mobile device of bearing semiconductor substrate - Google Patents
A kind of pedestal and substrate mobile device of bearing semiconductor substrate Download PDFInfo
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- CN209150073U CN209150073U CN201821942757.2U CN201821942757U CN209150073U CN 209150073 U CN209150073 U CN 209150073U CN 201821942757 U CN201821942757 U CN 201821942757U CN 209150073 U CN209150073 U CN 209150073U
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Abstract
The utility model relates to a kind of pedestal of bearing semiconductor substrate and substrate mobile devices, wherein, substrate mobile device includes pedestal and Bernoulli Jacob's pneumatic device, at least one is provided on pedestal for carrying the film trap of substrate, it is equipped with a gas port at the edge of each film trap, the venthole of gas port is located at the lower section of substrate.The air inlet of gas port is used to receive the gas for being used to lift substrate that external pneumatic device is passed through.Substrate mobile device in the utility model is cooperated by gas port and Bernoulli Jacob's pneumatic device, it realizes from jack-up substrate and is adsorbed onto substrate on Bernoulli Jacob's pneumatic device and entirely take piece process, and avoid and be easy to cause damage to substrate surface and edge in the prior art in manual manipulation piece, influence the problem of substrate surface quality.
Description
Technical field
The utility model belongs to technical field of manufacturing semiconductors, and in particular to a kind of pedestal and lining of bearing semiconductor substrate
Bottom mobile device.
Background technique
Although the degree of automation of semiconductor equipment is promoted increasingly as semiconductor industry develops, manual manipulation is caused to serve as a contrast
The chance at bottom substantially reduces, but the phenomenon is only confined to a small number of 12 cun and the above wafer fab men.At home, still have a large amount of half
Conductor industry, 6,8 cun of boards and general semiconductor industry, as light emitting diode industry, the 4 of photovoltaic solar industry, 6 cun of productions are set
Standby need to manually fill takes, and with the raising of technological level, also more stringent to the quality control of substrate surface.
Original is easily damaged the operation that substrate is pulled out out of pedestal film trap using vacuum WAND or other substitutes
Edges of substrate and surface, impact product yield；And the sucked type of directly contact substrate surface is taken to take piece that can cause
It particle contamination and a degree of weighs wounded.
Therefore the problem of influence during taking piece manually to substrate becomes current urgent need to resolve how is reduced.
Utility model content
(1) technical problems to be solved
In order to solve the above problem of the prior art, the utility model provides the pedestal and lining of a kind of bearing semiconductor substrate
Bottom mobile device solves and is easy to cause damage to substrate surface and edge in the prior art when taking piece manually, influences substrate
The problem of surface quality.
(2) technical solution and effect
In order to achieve the above object, the main technical schemes of the utility model use include:
On the one hand the utility model provides a kind of pedestal of bearing semiconductor substrate, be provided at least one on pedestal and be used for
The film trap for carrying substrate is equipped with a gas port at the edge of each film trap, and the venthole of gas port is located at the substrate of film trap carrying
Lower section；The air inlet of gas port is used to receive the gas for being used to lift substrate that external pneumatic device is passed through.
Gas port is set at the edge of each film trap in the utility model, and is matched with external pneumatic device, air guide
The air-flow in hole derives from pneumatic device, and the gas provided using pneumatic device is exported through the venthole of gas port, is made using air pressure
The partial region of substrate holds up certain height, avoids damage caused by due to agitating substrate or adsorb the surface of substrate,
The mechanical mechanism for also simplifying redundancy required when entire pedestal lower part is using thimble jack-up substrate in the prior art simultaneously, is saved
Cost.
Optionally, to be passed through gas to the air inlet of gas port convenient for pneumatic device, being provided on pedestal makes pneumatic device
At least one card slot protruded into, each card slot are located at the slot of each film trap along region, and connect with the air inlet of corresponding gas port
It is logical.
On the other hand the utility model provides a kind of substrate mobile device including above-mentioned pedestal, substrate mobile device is also
It include: Bernoulli Jacob's pneumatic device；Bernoulli Jacob's pneumatic device includes: the air inlet being connected to external air source, for logical to gas port
Enter the gas outlet of gas, and the adsorption orifice for adsorbing the substrate lifted.
Entire substrate mobile device is cooperated by gas port and Bernoulli Jacob's pneumatic device, and the air-flow of gas port derives from
Bernoulli Jacob's pneumatic device, and the air-flow of Bernoulli Jacob's pneumatic device not only can be used for jacking up substrate, but also can be used for adsorbing substrate,
By the utilizations different twice to same air-flow, realizes from jack-up substrate and substrate is adsorbed onto Bernoulli Jacob's pneumatic device
On entirely take piece process.Whole system structure is simple, easy to operate, at low cost, is suitble to large-scale production and application.
Optionally, the adjustment to air-flow velocity for convenience, Bernoulli Jacob's pneumatic device further include: be used for adjusting gas flow
Gas control switch.
In specific example, Bernoulli Jacob's pneumatic device is vacuum WAND.
Optionally, vacuum WAND includes: pen container with cavity and the suction tray being connected with pen container；Air inlet and go out
Port is arranged on pen container, and adsorption orifice is arranged on the adsorption plane of suction tray, and adsorption orifice is connected with the cavity of pen container.
The working principle of vacuum WAND and vacuum WAND in the prior art in the utility model is entirely different, this is practical
Suction caused by vacuum WAND in novel saves current city entirely from the high-speed flow in the cavity of pen container
Vacuum pump used in vacuum WAND, is greatly saved cost on face.
Optionally, cavity be connected with adsorption orifice place cross-sectional area it is minimum, to meet the requirement of bernoulli principle, make to inhale
Air pressure at attached mouth is minimum and plays suction-operated.
Detailed description of the invention
Fig. 1 is the side view for the pedestal that following examples provide；
The top view of Fig. 2 is the film trap that following examples provide when being circle on pedestal film trap, gas port and card slot；
The top view of Fig. 3 is the film trap that following examples provide when being rectangular on pedestal film trap, gas port and card slot；
Fig. 4 is the structural schematic diagram for the vacuum WAND that following examples provide；
Fig. 5 is the side view of vacuum WAND shown in Fig. 4.
[description of symbols]
1: pedestal；2: film trap；3: gas port；4: card slot；5: pen container；6: air inlet；7: gas outlet；8: suction tray；9: inhaling
Attached mouth；10: Gas control switch；11: handle.
Specific embodiment
It is with reference to the accompanying drawing, right by specific embodiment in order to understand in order to preferably explain the utility model
The utility model is described in detail.
Referring to figs. 1 to Fig. 3, the application on the one hand a kind of pedestal of bearing semiconductor substrate is provided, be provided on pedestal 1 to
Few one is equipped with a gas port 3 for carrying the film trap 2 of substrate, at the edge of each film trap 2, and the venthole of gas port 3 is located at
The lower section for the substrate that film trap 2 carries.What the pneumatic device that the air inlet of gas port 3 is used to receive outside was passed through is used to lift substrate
Gas, gas via gas port 3 venthole export, to hold up the substrate carried in film trap 2.
Wherein, above-mentioned film trap 2 can be circle shown in Figure 2, be also possible to it is rectangular shown in Fig. 3, be applicable in
In circular substrate or square shaped substrate.Certainly, film trap 2, which also can according to need, is designed to other shapes, to meet not similar shape
The requirement of the substrate of shape, depending on actual conditions, the present embodiment by way of example only, and is not limited thereof.
Above-mentioned gas port 3 does not penetrate the bottom of pedestal 1, and the air inlet of general gas port 3 is located at the area Cao Yan of film trap 2
Domain, in practical applications, to be passed through gas to the air inlet of gas port 3 convenient for pneumatic device, being provided on pedestal 1 makes pneumatically
At least one card slot 4 that device protrudes into, each card slot 4 are located at the slot of each film trap 2 along region, and with corresponding gas port 3
Air inlet connection.
Using vacuum WAND, perhaps other substitutes agitate substrate or take directly contact lining in compared to the prior art
The sucked type of bottom surface takes piece, and the damage caused by the edge of substrate or surface is larger, not can guarantee the surface matter of substrate
Amount.Gas port 3 is set at the edge of each film trap 2 in the present embodiment, and is matched with external pneumatic device, gas port 3
Air-flow derives from pneumatic device, and the gas provided using pneumatic device is exported through the venthole of gas port 3, makes substrate using air pressure
Partial region hold up certain height, avoid because agitate substrate or adsorb substrate surface due to caused by damage, simultaneously
The mechanical mechanism for also simplifying redundancy required when entire 1 lower part of pedestal is using thimble jack-up substrate in the prior art, is saved
Cost.
Above-mentioned pneumatic device can use following Bernoulli Jacob's pneumatic devices, in this way, after substrate lifts up, Ke Yishun
Will definitely Bernoulli Jacob's pneumatic device protrude into the bottom of substrate, substrate is carried out using the adsorption orifice 9 opened up on Bernoulli Jacob's pneumatic device
Absorption.Certainly, above-mentioned pneumatic device is also possible to that the device of gas is provided separately, at this point, can adopt after substrate lifts up
It is adsorbed after protruding into the bottom of substrate with other adsorbent equipments, to complete entirely to take the process of piece.For pneumatic device
Specific structure the present embodiment by way of example only, is not limited thereto.
Referring to Fig. 4 and Fig. 5, according to the another aspect of the application, the present embodiment provides a kind of linings including above-mentioned pedestal 1
Bottom mobile device, the substrate mobile device further include: Bernoulli Jacob's pneumatic device.Bernoulli Jacob's pneumatic device includes: and external air source
The air inlet 6 of connection, for being passed through the gas outlet 7 of gas, and the absorption for adsorbing the substrate lifted to gas port 3
Mouth 9.
Wherein, the course of work of above-mentioned Bernoulli Jacob's pneumatic device is foundation bernoulli principle, specifically: in air-flow,
If flow velocity is small, pressure is with regard to big；If flow velocity is big, pressure is with regard to small.It is based on bernoulli principle, gas at above-mentioned gas outlet 7
Pressure is maximum, can hold up the partial region of substrate after the export of the venthole of gas port 3；Air pressure at above-mentioned adsorption orifice 9
Minimum, can as suction source and generate air-breathing, to adsorb the bottom of substrate.
Entire substrate mobile device utilizes the gas port 3 on pedestal 1 and Bernoulli Jacob's pedestal based on bernoulli principle as a result,
1 cooperates, on the one hand the air-flow in Bernoulli Jacob's pneumatic device is used for by acting on lining through gas port 3 after the outflow of gas outlet 7
The bottom at bottom substrate to be jacked up, on the other hand the air-flow can produce suction when flowing through adsorption orifice 9 and subsequent to substrate
Generate suction-operated.By the utilizations different twice to same air-flow, realizes from jack-up substrate and be adsorbed onto substrate
Piece process is entirely taken on Bernoulli Jacob's pneumatic device.
Both it had avoided and has agitated substrate using vacuum WAND or other substitutes in the prior art or take direct contact
The sucked type of substrate surface is picked and placed and is damaged caused by the edge or surface of substrate；Entire 1 lower part of pedestal is simplified simultaneously
The mechanical mechanism of required redundancy when using thimble jack-up substrate；In addition, suction required when suction piece is pneumatic from Bernoulli Jacob
High-speed flow in device also saves vacuum pump used in vacuum WAND on current market, and then enormously simplifies entire
System structure is suitble to large-scale production.
Adjustment to air-flow velocity for convenience, Bernoulli Jacob's pneumatic device further include: the gas for adjusting gas flow
Regulating switch 10.
During specific implementation, above-mentioned Bernoulli Jacob's pneumatic device is vacuum WAND.
Specifically, vacuum WAND includes: pen container 5 with cavity and the suction tray 8 being connected with pen container 5, air inlet
Mouth 6 and gas outlet 7 are arranged on pen container 5, and adsorption orifice 9 is arranged on the adsorption plane of suction tray 8, and the sky of adsorption orifice 9 and pen container 5
Chamber is connected.In practical applications, cavity be connected with adsorption orifice 9 place cross-sectional area it is minimum, to meet bernoulli principle
It is required that keeping the air pressure at adsorption orifice 9 minimum and playing suction-operated.
The working principle of vacuum WAND and vacuum WAND in the prior art in the present embodiment is entirely different, the prior art
In vacuum WAND need vacuum pump as suction source, be evacuated generating suction by cavity of the vacuum pump to pen container 5.
And suction caused by the vacuum WAND in the present embodiment is entirely from the high-speed flow in the cavity of pen container 5, by sky
It is intracavitary to ventilate, suction is generated at adsorption orifice 9 using bernoulli principle, thus save vacuum WAND on current market
Used vacuum pump, is greatly saved cost.
Wherein, the shape of suction tray 8 can be selected according to actual needs, such as can be designed to shown in Fig. 4
Cuboid can also not limited this using other shapes, the application.In order to which user's holding is more convenient, in vacuum
It is additionally provided with handle 11 at air inlet 6 on the pen container 5 of sucking pen, the operation in order to user to vacuum WAND.
The application method of above-mentioned substrate mobile device, specifically includes the following steps:
Step 1: when taking out the substrate that pedestal 1 carries, gas is passed through to gas port 3 using Bernoulli Jacob's pneumatic device, with
Lift the partial region of the substrate in film trap 2.
Wherein, the air inlet 6 of Bernoulli Jacob's pneumatic device connects external air source, such as can be compressed air or High Purity Nitrogen
Gas, Bernoulli Jacob's pneumatic device are extend into card slot 4, and the air-flow from Bernoulli Jacob's pneumatic device imports substrate after gas port 3
Bottom, and then the partial region of substrate is lifted up.
Step 2: mobile Bernoulli Jacob's pneumatic device contacts the adsorption orifice 9 of Bernoulli Jacob's pneumatic device and adsorbs to have lifted
The bottom of substrate.
Specifically, when substrate lifts up, Bernoulli Jacob's pneumatic device is taken advantage of a situation and protrudes into the bottom of substrate, inhaled using air-flow
The bottom of substrate is adsorbed on Bernoulli Jacob's pneumatic device by the suction generated at attached mouth 9, such as is adsorbed on above-mentioned vacuum WAND
On suction tray 8.
Step 3: the Bernoulli Jacob's pneumatic device for being adsorbed with substrate being removed to the film trap 2 of pedestal 1, to complete to take from film trap 2
Substrate out.
Entire application method is easy to operate, by the utilizations different twice to same air-flow, realizes from jack-up substrate
And substrate is adsorbed on Bernoulli Jacob's pneumatic device and entirely takes piece process, avoid in the prior art using vacuum WAND or
Other substitutes of person agitate substrate or take directly contact substrate surface sucked type pick and place and to the edge or table of substrate
It is damaged caused by face, substantially increases the surface quality of substrate.
More than, it is only the preferred embodiment of the utility model, is not the limitation for doing other forms to utility model,
Any person skilled in the art is changed or is modified as equivalent variations possibly also with the technology contents of the disclosure above
Equivalent embodiment.But it is all without departing from the content of the technical scheme of the utility model, according to the technical essence of the utility model to
Any simple modification, equivalent variations and remodeling, still fall within the protection scope of technical solutions of the utility model made by upper embodiment.
Claims (7)
1. a kind of pedestal of bearing semiconductor substrate, which is characterized in that be provided at least one on pedestal (1) for carrying substrate
Film trap (2)；
A gas port (3) are equipped at the edge of each film trap (2), the venthole of the gas port (3) is located at the film trap
(2) lower section of the substrate carried；
The air inlet of the gas port (3) is used to receive the gas for being used to lift the substrate that external pneumatic device is passed through.
2. the pedestal of bearing semiconductor substrate as described in claim 1, which is characterized in that
At least one card slot (4) for protruding into the pneumatic device, each card slot (4) position are provided on the pedestal (1)
It is connected in the slot of each film trap (2) along region, and with the air inlet of the corresponding gas port (3).
3. a kind of substrate mobile device including pedestal described in the claims 1 or 2, which is characterized in that the substrate moves
Dynamic device further include: Bernoulli Jacob's pneumatic device；
Bernoulli Jacob's pneumatic device includes: the air inlet (6) being connected to external air source, for being passed through gas to gas port (3)
Gas outlet (7), and the adsorption orifice (9) for adsorbing the substrate lifted.
4. substrate mobile device as claimed in claim 3, which is characterized in that
Bernoulli Jacob's pneumatic device further include: the Gas control switch (10) for adjusting gas flow.
5. substrate mobile device as claimed in claim 4, which is characterized in that
Bernoulli Jacob's pneumatic device is vacuum WAND.
6. substrate mobile device as claimed in claim 5, which is characterized in that
The vacuum WAND includes: pen container (5) with cavity and the suction tray (8) being connected with the pen container (5)；
The air inlet (6) and the gas outlet (7) are arranged on the pen container (5), and the adsorption orifice (9) is arranged in the suction
On the adsorption plane of attached disk (8), and the adsorption orifice (9) is connected with the cavity of the pen container (5).
7. substrate mobile device as claimed in claim 6, which is characterized in that
The cavity be connected with the adsorption orifice (9) place cross-sectional area it is minimum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821942757.2U CN209150073U (en) | 2018-11-23 | 2018-11-23 | A kind of pedestal and substrate mobile device of bearing semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821942757.2U CN209150073U (en) | 2018-11-23 | 2018-11-23 | A kind of pedestal and substrate mobile device of bearing semiconductor substrate |
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| Publication Number | Publication Date |
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| CN209150073U true CN209150073U (en) | 2019-07-23 |
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| CN201821942757.2U Active CN209150073U (en) | 2018-11-23 | 2018-11-23 | A kind of pedestal and substrate mobile device of bearing semiconductor substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223809A (en) * | 2018-11-23 | 2020-06-02 | 东泰高科装备科技有限公司 | Base for bearing semiconductor substrate, substrate moving device and using method thereof |
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2018
- 2018-11-23 CN CN201821942757.2U patent/CN209150073U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223809A (en) * | 2018-11-23 | 2020-06-02 | 东泰高科装备科技有限公司 | Base for bearing semiconductor substrate, substrate moving device and using method thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210128 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: Room A129-1, No. 10 Zhongxing Road, Changping District Science and Technology Park, Beijing 102200 Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |