CN2760049Y - Rotary magnetic control sputter with diffuser plate - Google Patents

Rotary magnetic control sputter with diffuser plate Download PDF

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Publication number
CN2760049Y
CN2760049Y CN 200420117946 CN200420117946U CN2760049Y CN 2760049 Y CN2760049 Y CN 2760049Y CN 200420117946 CN200420117946 CN 200420117946 CN 200420117946 U CN200420117946 U CN 200420117946U CN 2760049 Y CN2760049 Y CN 2760049Y
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oxonium ion
thin film
cathode tube
magnetic control
plate
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CN 200420117946
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Chinese (zh)
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邓凤山
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Abstract

The utility model provides a rotary magnetic control sputtering device with a diffuser plate, which is used for forming optical thin film on a base plate. The device comprises a reaction chamber, cathode tubes, a rotary circular cylinder, an oxygen ion source and a uniform diffusion board, wherein the cathode tubes are symmetrically and respectively arranged at both sides of the reaction chamber. The rotary circular cylinder is arranged in the reaction chamber so as to suck sputtering atoms released from the cathode tubes, so the bearing base plate is formed with sputtering thin film and the oxygen ion source can provide oxygen ions. The uniform diffusion board is arranged between the oxygen ion source and the rotary circular cylinder, so the oxygen ions can uniformly diffuse on the sputtering thin film of a part of the base plate and the oxygen ions can form uniform optical thin film via the oxidation of the sputtering thin film.

Description

Rotary magnetic control sputtering apparatus with diffuser plate
Technical field
The utility model relates in particular to the rotary magnetic control sputtering apparatus with diffuser plate about a kind of rotary magnetic control sputtering apparatus.
Background technology
At present, optically coated product nearly all adopts electron beam evaporation plating and forms.Just, this kind evaporation belongs to the technique means that efficient is low, low-quality, cost is high.In order to improve the counter productive of being brought of evaporation, existing magnetic control sputtering plating is used for replacing evaporation, and expectation can provide optical coating cheaper, higher quality by this.
Just, under oxidizing reaction, the optical coating that utilizes magnetic control sputtering plating to produce, it is too poor, unstable to face sedimentation effect easily, and the arc light that is caused in process of plating easily, and damage provides the sputtered target material of sputter atom and the substrate that forms sputtering thin film.
Based on the problems referred to above, No. 4420385 patent of the U.S. proposes to form respectively the sputter program of sputtering thin film and the oxidation program of this sputtering thin film of oxidation.But, be oxygen molecule because its oxidation program utilizes, but not oxonium ion, therefore, the oxidation program of this method is too slow in the speed that forms optical thin film.
In order to improve this kind situation, No. 146919 patent in No. the 4851095th, the U.S. and Taiwan mentioned changing the efficient that adopts oxonium ion and increase the oxidation program.Just, because its air extractor and skimming baffle design are still suitable inadequately, cause and effectively sputter program and oxidation program separately to be carried out, so, oxonium ion in the oxidation program may be with the sputtered target material oxidation in the sputter program, make and sputtered target material electroconductibility variation reduce the sputtered ions that is discharged, and then prolong the time that sputtering thin film forms.And, adopt the formed optical coating of this kind method, because of also can't be effectively with sputter program and oxidation program separately, cause the oxonium ion complete oxidation sputtering thin film of failing, so, still must handle in addition, make its optical coating can complete oxidation.In a word, sputter program and oxidation program being carried out continuously and effectively separately, is to make the high-quality very important problem of optical thin film.
In addition, in No. 6274014 patent of the U.S., be the Sauerstoffatom bundle oxidation sputtering thin film that utilizes radial frequency (RF) to produce.Though can improve above problem, since the process that produces the Sauerstoffatom bundle very complexity and cost are too high, and do not meet economic benefit.
In addition, the negative electrode that the sputter atom is provided of conventional planar formula, easily the Distribution of Magnetic Field because of its magnet assembly only produces in certain specific direction, and the sputtered target material that causes discharging the sputter atom is by inhomogeneous consumption, and slattern the not sputtered target material in Distribution of Magnetic Field.
The utility model content
Main purpose of the present utility model by even diffuser plate, effectively separately carries out sputter program and oxidation program in that a kind of rotary magnetic control sputtering apparatus with diffuser plate is provided.
Another purpose of the present utility model is providing a kind of rotary magnetic control sputtering apparatus with diffuser plate, by the diffusion plate of adjusting even diffuser plate and the distance of rotor upper substrate, and avoid causing established optical thin film to be damaged because of evenly diffuser plate and substrate distance are near excessively.
Another purpose of the present utility model is providing a kind of rotary magnetic control sputtering apparatus with diffuser plate, drives sputtered target material by the rotation of cathode tube tube wall, consumes the sputtered target material that discharges the sputter atom equably.
Based on above-mentioned purpose, the utility model provides a kind of rotary magnetic control sputtering apparatus with diffuser plate, is used to form gradually on the substrate optical thin film.This device comprises reaction chamber, cathode tube, rotor, oxonium ion source and even diffuser plate.
Reaction chamber is in order to provide the sputter environment.Cathode tube is arranged at the both sides of reaction chamber symmetrically respectively, and discharges the contained sputter atom of cathode tube.Rotor is arranged in the reaction chamber, is made on the substrate that is carried and is formed sputtering thin film by the sputter atom that cathode tube discharged by attracting.The oxonium ion source is arranged between this cathode tube, and oxonium ion is provided.Evenly diffuser plate is arranged between oxonium ion source and the rotor, and oxonium ion is uniformly dispersed on the sputtering thin film of part substrate, forms uniform optical thin film by the oxidation sputtering thin film.
Above-mentioned even diffuser plate is by going into the gas plate and the diffusion plate is constituted, and wherein going into the gas plate is tabular body, and has into the air to open mouth, is the arcuation body and spread plate, and has and go into the opening of giving vent to anger that the air to open mouth communicates with each other.When even diffuser plate is set, for the diffusion plate of arcuation body will be columned rotor near external form as far as possible, the oxonium ion that the oxonium ion source is provided is able to via air intake and air outlet, and evenly diffusing throughout to have on the sputtering thin film of the substrate that contacts with the diffusion plate.And,, make oxonium ion be difficult for diffusing to once again other zone in the reaction chamber, and then avoid this cathode tube of oxonium ion oxidation because the diffusion plate will be columned rotor near external form as far as possible.
Can describe in detail and appended graphic being further understood by following utility model about advantage of the present utility model and spirit.
Description of drawings
Fig. 1 is the synoptic diagram that the utlity model has the rotary magnetic control sputtering apparatus of diffuser plate.
Fig. 2 is the synoptic diagram of the even diffuser plate of the utility model.
Fig. 3 is the synoptic diagram of even diffuser plate of the utility model and rotor.
Fig. 4 is the synoptic diagram of the utility model cathode tube.
Fig. 5 is the diagrammatic cross-section of Fig. 4 cathode tube.
The synoptic diagram of Fig. 6 extraction pipe.
Among the figure
10 have rotary magnetic control sputtering apparatus 11 mechanical pumps of diffuser plate
12 reaction chambers, 13 turbo- pump 14a, 14b, 14c, 14d cathode tube
16 rotors, 18 oxonium ion sources, 20 even diffuser plates
22,24 sense of rotation 20a go into gas plate 20b diffusion plate
26 air flow lines, 28 cathode tube tube walls, 30 magnet assemblies
32 sputtered target materials, 33 off-gas pumps, 34,36 extraction pipes
Embodiment
See also Fig. 1, Fig. 1 is the synoptic diagram that the utlity model has the rotary magnetic control sputtering apparatus of diffuser plate.As shown in Figure 1, the rotary magnetic control sputtering apparatus 10 that the utlity model has diffuser plate mainly comprises by reaction chamber 12, cathode tube 14a, 14b, 14c and 14d, rotor 16, oxonium ion source 18 and even diffuser plate 20.As for the air pressure of mechanical pump 11 and turbo-pump 13 major control reaction chambers, and outside oxonium ion source 18 and in the turbo-pump 13 that the reaction chamber 12 of oxonium ion source 18 offsides is provided with respectively, make the air pressure of reaction chamber 12 to be more evenly distributed.
Above-mentioned reaction chamber 12 is in order to provide the sputter environment.Cathode tube 14a and 14b and cathode tube 14c and 14d are arranged at the both sides of reaction chamber 12 symmetrically respectively, and discharge the contained sputter atom of cathode tube 14a, 14b, 14c and 14d.The sputter atom then can be the atom of titanium (Ti), tantalum (Ta), niobium (Nb), silicon (Si) and other similar quality.But, at this lay special stress on, it is symmetry that this cathode tube needs only in quantity, and restriction must not have two or more in both sides.Rotor 16 is arranged in the reaction chamber 12, and the sputter atom by attracting to be discharged by cathode tube 14a, 14b, 14c and 14d makes on the substrate that is carried and forms sputtering thin film.The oxonium ion source then is to be arranged between cathode tube 14a and 14b and cathode tube 14c and the 14d, and oxonium ion is provided.
The program of being carried out at rotary magnetic control sputtering apparatus 10 can roughly be divided into sputter program and oxidation program.In the sputter program, cathode tube 14a and 14b can make earlier on its nearest substrate and form sputtering thin film.So, when the sputter program begins to carry out, continue rotation, so the substrate that it carried can form sputtering thin film earlier from cathode tube 14a and the nearer part of 14b earlier because rotor 16 is following sense of rotation 22.Then, can be in the oxidation program, by the oxonium ion that oxonium ion source 18 is provided, oxidation sputtering thin film and form optical thin film.Then, when substrate that rotor 16 will have this optical thin film rotates near cathode tube 14c and the 14d, can on optical thin film, form another layer sputtering thin film again.Above-mentioned oxonium ion source can discharge the above oxygen ion current of 2Amp at least, and has the energy between the 300Watt to 1000watt, and the oxygen pressure in reaction chamber 12 is between the 0.1mTorr to 1mTorr.
In the above-mentioned program, work continuously, can solve the part existing issue though sputter program and oxidation program are reached.But if when not having the existing of even diffuser plate 20, the oxonium ion in the oxidation program will be because of can't effectively controlling its diffusion, and then the sputtered ions that is discharged in the sputter program is reduced.In addition, if when not having the existing of even diffuser plate 20, also cause oxonium ion arbitrarily to be diffused in the reaction chamber 12 easily, the complete oxidation sputtering thin film of failing.Therefore, evenly diffuser plate 20 is arranged between oxonium ion source 18 and the rotor 16, and its purpose mainly is uniformly dispersed on the sputtering thin film of part substrate oxonium ion, and forms uniform optical thin film by the oxidation sputtering thin film.
See also Fig. 2, Fig. 2 is the synoptic diagram of the even diffuser plate of the utility model.As shown in Figure 2, even diffuser plate 20 of the present utility model has into gas plate 20a and diffusion plate 20b.Going into gas plate 20a is tabular body, and has into the air to open mouth, and diffusion plate 20b is the arcuation body, and has and go into the opening of giving vent to anger that the air to open mouth communicates with each other.
See also Fig. 3, Fig. 3 is the synoptic diagram of even diffuser plate of the utility model and rotor.As shown in Figure 3, when even diffuser plate 20 is set, for the diffusion plate 20b of arcuation body will be columned rotor 16 near external form as far as possible, so, can be substantially arcuation and the very small long and narrow tunnel of spacing of formation between diffusion plate 20b and the rotor 16.Therefore, if the oxonium ion that oxonium ion source 18 is provided, with as air flow line 26 via air intake and air outlet, evenly diffuse throughout and can make oxonium ion can not diffuse to other zone of reaction chamber once again with on diffusion plate 20b has the sputtering thin film of the substrate that contacts the time.
In sum, because the particular design of the even diffuser plate 20 of the utility model, make and rotor 16 between formed long and narrow tunnel, make oxonium ion only can within this, evenly spread, thereby can effectively sputter program and oxidation program separately be carried out, and because rotor 16 can continue rotation, so, the utlity model has the rotary magnetic control sputtering apparatus 10 of diffuser plate, sputter program and oxidation program are carried out continuously and effectively separately, and then utilize it to form high-quality optical thin film expeditiously and produce optical filter.
In addition, also can be by the diffusion plate 20a that adjusts even diffuser plate 20 and the distance of rotor 16 upper substrates, and avoid near excessively because of even diffuser plate 20 and substrate distance, cause established optical thin film to be damaged.
See also Fig. 4, Fig. 4 is the synoptic diagram of the utility model cathode tube.As shown in Figure 4, have the magnet assembly 30 that produces magnetic field in the cathode tube tube wall 28 of the cathode tube 14a in Fig. 1, and be the sputtered target material 32 of the sputter atom that discharges in cathode tube tube wall 28 outside.
See also Fig. 5, Fig. 5 is the diagrammatic cross-section of Fig. 4 cathode tube.Fig. 5 is the sectional view of AA ' line among Fig. 4.Magnet assembly 30 is made of the single N utmost point and the S utmost point adjacent thereto, so the Distribution of Magnetic Field of magnet assembly 30 will be between two S utmost points of the N utmost point.
Cooperate and consult Fig. 1, the Distribution of Magnetic Field of magnet assembly that can understand cathode tube 14a and 14b is haply towards rotor 16, therefore, if cathode tube tube wall 28 can not rotate when driving sputtered target material 32, only can consume the part in the magnetic field range that two S utmost points of the N utmost point are constituted, make that after after a while, sputtered target material 32 surfaces present uneven.So in order to improve this problem, the utility model cathode tube 14a will follow sense of rotation 24 and continue rotation, makes when 28 rotations of cathode tube tube wall drive sputtered target material 32, will consume the sputtered target material 32 that discharges the sputter atom equably.
See also Fig. 6, the synoptic diagram of Fig. 6 extraction pipe.As shown in Figure 6, one or both sides in even diffuser plate 20 are provided with extraction pipe 34 or 36 in addition, and by with take out the off-gas pump 33 that organ pipe 34 is connected with 36, make to be detached by off-gas pump 33 from the oxonium ion that diffuses out between the diffusion plate 20b of as shown in Figure 3 even diffuser plate 20 and the rotor 16.
By the above detailed description of preferred embodiments, hope can be known description feature of the present utility model and spirit more, and is not to come category of the present utility model is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the desire application of the utility model institute of various changes and tool equality.

Claims (13)

1. the rotary magnetic control sputtering apparatus with diffuser plate is used to form an optical thin film on the substrate gradually, it is characterized in that:
This device comprises:
One reaction chamber, this reaction chamber is in order to provide the sputter environment;
One cathode tube, this cathode tube discharge the contained sputter atom of this cathode tube;
One rotor, this rotor are arranged in this reaction chamber, by attracting by this sputter atom that this cathode tube discharged, make to form on this substrate that is carried a sputtering thin film;
One oxonium ion source, this oxonium ion source is arranged between this cathode tube, and an oxonium ion is provided; And
One even diffuser plate, this even diffuser plate is arranged between this oxonium ion source and this rotor, and this oxonium ion is uniformly dispersed on this sputtering thin film of this substrate of part, forms this optical thin film uniformly by this sputtering thin film of oxidation.
2. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that: described sputter atom can be titanium, tantalum, niobium, Siliciumatom.
3. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that: wherein the oxonium ion source can discharge the above oxygen ion current of 2Amp at least, and has the energy between the 300Watt to 1000watt.
4. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that: wherein the oxygen pressure in the reaction chamber is between the 0.1mTorr to 1mTorr.
5. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that: formed this optical thin film can be in order to produce an optical filter.
6. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that: described cathode tube is arranged at the both sides of this reaction chamber symmetrically respectively.
7. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that: outside the described oxonium ion source and in the turbo-pump that this reaction chamber of this oxonium ion source offside is provided with respectively, make the air pressure of this reaction chamber to be more evenly distributed.
8. rotary magnetic control sputtering apparatus as claimed in claim 1, it is characterized in that: described cathode tube is cylindric, in a cathode tube tube wall of this cathode tube, has a magnet assembly that produces magnetic field, and outside this cathode tube tube wall, be a sputtered target material of this sputter atom of discharging, the Distribution of Magnetic Field of this magnet assembly is haply towards this rotor, and when this cathode tube tube wall rotation drives this sputtered target material, will consume this sputtered target material that discharges this sputter atom equably.
9. rotary magnetic control sputtering apparatus as claimed in claim 1 is characterized in that:
This even diffuser plate further comprises:
One goes into the gas plate, and this goes into the gas plate is tabular body, and has into the air to open mouth;
One diffusion plate, this diffusion plate is the arcuation body, and has the opening of giving vent to anger of going into this that air to open mouth communicates with each other;
Wherein, when this even diffuser plate is set, for this diffusion plate of arcuation body will be columned this rotor near external form as far as possible, this oxonium ion that this oxonium ion source is provided, be able to via this air intake and this air outlet, evenly diffuse throughout and to spread plate with this and have on this sputtering thin film of this substrate that contacts.
10. the described rotary magnetic control sputtering apparatus of claim 9, it is characterized in that: a side of described diffusion plate is provided with an extraction pipe in addition, and, make to be detached from this oxonium ion that diffuses out between this diffusion plate and this rotor by an off-gas pump that is connected with this extraction pipe.
11. the described rotary magnetic control sputtering apparatus of claim 9, it is characterized in that: the both sides of described diffusion plate are provided with an extraction pipe in addition, and, make to be detached by this off-gas pump from this oxonium ion that diffuses out between this diffusion plate and this rotor by an off-gas pump that is connected with this extraction pipe.
12. the described rotary magnetic control sputtering apparatus of claim 9 is characterized in that: when making processes needs, can adjust the distance of this substrate on the diffusion plate of this even diffuser plate and this rotor.
13. even diffuser plate, an one sputter program and an oxidation program are carried out continuously and effectively separately, in this sputter program, one cathode tube can discharge a sputter atom, make and to form a sputtering thin film on the substrate that is carried by a rotor, in this oxidation program, an oxonium ion that is provided by an oxonium ion source, will form an optical thin film by this sputtering thin film of oxidation, it is characterized in that: this even diffuser plate that has into a gas plate and a diffusion plate is set between this oxonium ion source and this rotor, this goes into the gas plate is tabular body, and have into the air to open mouth, and this diffusion plate is the arcuation body, and has the opening of giving vent to anger of going into this that air to open mouth communicates with each other, and, when this even diffuser plate is set, for this diffusion plate of arcuation body will be columned this rotor near external form as far as possible, this oxonium ion that this oxonium ion source is provided, be able to via this air intake and this air outlet, evenly diffuse throughout and to spread plate with this and have on this sputtering thin film of this substrate that contacts, this oxonium ion can not spread once again.
CN 200420117946 2004-10-20 2004-10-20 Rotary magnetic control sputter with diffuser plate Expired - Fee Related CN2760049Y (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102373405A (en) * 2010-08-09 2012-03-14 邓凤山 Device and method for depositing CIGS absorbed layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102373405A (en) * 2010-08-09 2012-03-14 邓凤山 Device and method for depositing CIGS absorbed layer
CN102373405B (en) * 2010-08-09 2014-08-06 台积太阳能股份有限公司 Device and method for depositing CIGS absorbed layer

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C19 Lapse of patent right due to non-payment of the annual fee
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