CN2759113Y

CN2759113Y - Heat radiation module for electronic apparatus

Info

Publication number: CN2759113Y
Application number: CN 200420058595
Authority: CN
Inventors: 王峰谷; 张钧毅
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2004-12-15
Filing date: 2004-12-15
Publication date: 2006-02-15
Anticipated expiration: 2014-12-15

Abstract

The utility model relates to a heat radiation module for an electric device, which comprises a heat conducting pipe, a base, a radiating fin set and at least one spring piece, wherein the base is a stamping piece, is arranged at one end of the heat conducting pipe, and is provided with at least one fixing hole, the radiating fin set is corresponding to the base and is arranged at the other end of the heat conducting pipe, and the spring piece is arranged at the base. The base of the utility model is made in the stamping mode, and the spring piece causes that the base of the heat radiation module is tightly attached to an electronic component in an electronic device; compared with the public technique, as the base is a stamping piece, the height of the base structure of the heat radiation module is low; hence, the utility model has the advantages of low cost and thin volume.

Description

The radiating module of electronic installation

Technical field

The utility model relates to the radiating module of a kind of radiating module, particularly a kind of electronic installation.

Background technology

Electronic component (as: chip) in the electronic installation (as: notebook computer) often produces a large amount of heat energy under operating state now, and cause the rising of this electronic component temperature, if there is not suitable heat radiation, to make this electronic component generation superheating phenomenon, cause its running unstable, even cause whole electronic installation generation work to stop or when the phenomenon of machine, and along with the speed of various electronic components improves constantly, the heat that it produced also improves constantly, and the radiating module that therefore is applied to various electronic installations is promptly day by day important.Please refer to Fig. 1, Fig. 1 is the radiating module structure figure of known computer chip, this radiating module comprises base 11, elastic sheet body 12, heat pipe 13 and radiating fin group 14, this base 11 is fixed on the chip (not expressing among the figure) by this elastic sheet body 12, the heat energy that this chip is produced conducts to this radiating fin group 14 via this base 11 and this heat pipe 13, fan assembly (not expressing among the figure) produces cooling blast by this radiating fin group 14, heat is disseminated in air, reach the purpose that reduces this chip temperature.

This elastic sheet body 12 has a plurality of installing holes 15, these installing holes 15 are in order to be bolted in this elastic sheet body 12 on the circuit board at this chip place with screw, a plurality of elastic arms 16 by this elastic sheet body 12, the elasticity of vertical direction when providing this base 11 to install, make this radiating module can be applicable to the chip of differing heights, and this base 11 is fitted tightly with this chip surface.

But, above-mentioned radiating module has following point, first, this base 11 is to adopt forging type to make, yet the die life of general casting technique is shorter, not if adopt the manufacture of punching press, its mould has long useful life, therefore the cost that adopts forging type to make is difficult for reducing, the second, because this elastic sheet body 12 is positioned at this base 11 tops, therefore increased the structure height that this radiating module is positioned at this chip top, and at present electronic installation be particular about compact, this kind design limit the range of application of this radiating module.

Comprehensive above technology contents, known radiating module has manufacturing cost and the higher shortcoming of structure height.

Summary of the invention

Main purpose of the present utility model is to solve the radiating module of present electronic installation owing to have cast construction, therefore manufacturing cost be difficult for the problem that reduces with and the structure height problem of higher, and then a kind of radiating module with impact style manufacturing and tool slimming design is proposed to address the above problem.

For achieving the above object, the utility model discloses a kind of radiating module of novel electron device, comprise: heat pipe, base, the radiating fin group reaches a slice shell fragment at least, this base is a stamping parts, be arranged at an end of this heat pipe and have at least one fixing hole, this radiating fin group is with respect to this base, be arranged at the other end of this heat pipe, this shell fragment is arranged on this base, this shell fragment has at least one installing hole, this installing hole cooperates this fixing hole of this base in order to this base is arranged on the electronic component in this electronic installation, and because the elasticity of this shell fragment, make this radiating module can be applicable to the electronic component of differing heights, and this base and this electronical elements surface are fitted tightly.

The radiating module of electronic installation of the present utility model, its base is with the impact style manufacturing, therefore compare with known technology, its manufacturing cost is lower, and it makes this base of this radiating module be provided with and fit tightly on the electronic component in this electronic installation by a slice shell fragment at least, compare with known technology, this substructure height of this radiating module is lower, therefore can be applicable to the electronic installation of more slimming.

Content that relevant the utility model is more detailed and feasible execution mode, with reference to

Description of drawings is as follows.

Description of drawings

The accompanying drawing simple declaration

Fig. 1 is the radiating module structure figure of known computer chip.

Fig. 2 is the specific embodiment of the utility model structure chart.

Fig. 3 is the mounting structure figure of the utility model shell fragment and base.

Fig. 4 is the mounting structure figure of the utility model L type structure gusset and base.

The main element description of symbols

(known)

11 bases

12 elastic sheet body

13 heat pipes

14 radiating fin groups

15 installing holes

16 elastic arms

(the utility model)

20 heat pipes

30 bases

31 fixing holes

32,33 rectangular protrusions

40 radiating fin groups

50L type structure gusset

51 vertical component effects

52 horizontal parts

53,54 rectangle holes

60 shell fragments

61 installing holes

71 screws

72 retaining elements

Embodiment

Please refer to Fig. 2, Fig. 2 is the specific embodiment of the utility model structure chart, it is the radiating module of computer chip (as central processing unit), mainly comprise heat pipe 20, base 30, radiating fin group 40, at least one L type structure gusset 50 reaches a slice shell fragment 60 at least, this base 30 is a stamping parts, be arranged at an end of this heat pipe 20, its material can adopt the preferable metal (as copper or aluminium) that conducts heat, this radiating fin group 40 is with respect to this base 30, be arranged at the other end of this heat pipe 20, these L type structure gussets 50 are stamping parts, its material can adopt the preferable metal (as copper or aluminium) of heat transfer and be arranged on this base 30 with welding manner, these shell fragments 60 are made with metal material and are arranged on this base 30 with welding manner, and it can also be spirally connected or the riveted joint mode is arranged on this base 30, when this base 30 is arranged on this chip with screw 71, the heat energy that this chip produces conducts to this radiating fin group 40 via this base 30 and this heat pipe 20, fan assembly (not expressing among the figure) produces cooling blast by this radiating fin group 40, heat is disseminated in air, reach the purpose that reduces this chip temperature.

Please refer to Fig. 3, Fig. 3 is the mounting structure figure of the utility model shell fragment and base, these shell fragments 60 have installing hole 61,61 pairs of this installing holes should base 30 fixing hole 31, screw 71 can be fixed with retaining element 72 in another surface of this base 30 after passing this installing hole 61 and this fixing hole 31, this retaining element can adopt E type ring (E Ring), make this screw 71 not this shell fragment 60 of reason elasticity and separate with this base 30, so, operating personnel's this screw 71 that when this base 30 is installed, can directly lock, and the screw of must not taking in addition, therefore can improve the efficient of installation exercise, in addition, because the elasticity of this shell fragment 60, this base 30 is after installing, can elasticity activity in the certain limit of vertical direction, so the utility model can be applicable to the chip of differing heights, and the activity elasticity of above-mentioned vertical direction also can be offset and installs and the tolerance of manufacture process, guarantee that this base 30 and the surface of this chip fit tightly, and make to the utlity model has higher radiating efficiency.

Please refer to Fig. 4, Fig. 4 is the mounting structure figure of the utility model L type structure gusset 50 and base 30, this L type structure gusset 50 is a stamping parts, comprise vertical component effect 51 and horizontal part 52, this horizontal part 52 is welded on this base 30, and this vertical component effect 51 fits with this heat pipe 20, to increase the heat transfer area of this heat pipe 20, in addition, this L type structure gusset 50 also has the function that increases these base 30 structural strengths.

In the present embodiment, this L type structure gusset 50 has two

rectangle holes

53,54, the long limit of these two

rectangle holes

53,54 is vertical mutually, and this base 30 also has corresponding

rectangular protrusions

32,33, its function is in order to location and mistake proofing, make the situation of the unlikely generation of operating personnel installing anisotropy, for example take place that this L type structure gusset 50 horizontally rotates 180 degree and situation that its vertical component effect 51 and this heat pipe 20 are not fitted.

As mentioned above, the radiating module of electronic installation of the present utility model, its base adopts stamping parts, and therefore the cast member than known technology has the low advantage of cost, and its structure height is low than known technology also, therefore has more the advantage of slimming.

The above is preferred embodiment of the present utility model only, is not in order to limit practical range of the present utility model.The ordinary skill of technical field that the present invention belongs to should be understood various embodiment and change to such an extent that do not breaking away from the total spirit of the present utility model and the following execution of scope, scope of the present utility model is limited by claims, equates in fact that with claim of the present utility model the interior various modifications of making that reach in the claim scope all are regarded as being contained in the interest field of the present utility model.

Claims

1. the radiating module of an electronic installation is used in the heat radiation of electronic component, it is characterized in that comprising:

Heat pipe;

Base is arranged at an end of this heat pipe, and this base has at least one fixing hole;

The radiating fin group with respect to this base, is arranged at the other end of this heat pipe; And

At least a slice shell fragment is arranged on this base, and this shell fragment has at least one installing hole, and this installing hole cooperates this fixing hole of this base in order to this base is arranged on this electronic component.

2. the radiating module of electronic installation according to claim 1 is characterized in that the material of this base comprises copper or aluminium.

3. the radiating module of electronic installation according to claim 1 is characterized in that this base is with the impact style manufacturing.

4. the radiating module of electronic installation according to claim 1 is characterized in that also comprising at least one block structure gusset, is arranged on this base.

5. the radiating module of electronic installation according to claim 4 is characterized in that this structure gusset comprises L type structure gusset.

6. the radiating module of electronic installation according to claim 4 is characterized in that the material of this structure gusset comprises copper or aluminium.

7. the radiating module of electronic installation according to claim 4 is characterized in that the surperficial smooth in this heat pipe of this structure gusset, makes the heat energy of this base conduct to this heat pipe via this structure gusset.

8. the radiating module of electronic installation according to claim 4 is characterized in that this structure gusset also has at least one rectangle hole and this base also has identical rectangular protrusions.

9. the radiating module of electronic installation according to claim 1 is characterized in that this fixation spring tab is to be spirally connected or the riveted joint mode is arranged on this base.

10. the radiating module of electronic installation according to claim 1 is characterized in that this fixation spring tab is arranged on this base with welding manner.

11. the radiating module of electronic installation according to claim 1 is characterized in that this base sees through the mode of being spirally connected with at least one screw and is arranged on this electronic component.

12. the radiating module of electronic installation according to claim 11 is characterized in that this screw also comprises retaining element.

13. the radiating module of electronic installation according to claim 12 is characterized in that this retaining element comprises E type ring (Ering).