CN2817070Y - Central processor rediating device structure - Google Patents
Central processor rediating device structure Download PDFInfo
- Publication number
- CN2817070Y CN2817070Y CN 200520058804 CN200520058804U CN2817070Y CN 2817070 Y CN2817070 Y CN 2817070Y CN 200520058804 CN200520058804 CN 200520058804 CN 200520058804 U CN200520058804 U CN 200520058804U CN 2817070 Y CN2817070 Y CN 2817070Y
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- processing unit
- central processing
- heat
- arch sheet
- frame
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiation device structure of a central processing unit, which comprises a supporting frame, wherein one side of the supporting frame is provided with an arch sheet; a copper block which can be abutted with the central processing unit is arranged in the position of the supporting frame corresponding to the arch sheet; the side of the supporting frame provided with the arch sheet is provided with a fixing connecting foot used for fixing the supporting frame in an electronic device system; the other side of the supporting frame is provided with a holding frame; the central part of the holding frame is hollow, and the external side of the holding frame is provided with a plurality of holding holes; one end of each heat pipe is positioned in a space formed by the arch sheet and the copper block in parallel, and the other end respectively passes through a heat radiation fin sheet and is correspondingly inserted into the holding holes; the heat radiation fin sheet is positioned on the hollow part of the holding frame; a shaft flow fan is fixed on the holding frame. The utility model can uniformly conduct heat on the central processing unit (CPU) into the heat radiation fin sheet, and the shaft flow fan can generate forced convection to result in high heat radiation performance.
Description
Technical field
The utility model is about radiator, especially relates to the heat-pipe radiator of central processing unit (CPU).
Background technology
Along with the raising of computer CPU operating frequency and improving constantly of CPU transistor integrated level, though through the super low-power consumption design, the heat of its generation constantly increases, and this has just limited the raising of the CPU speed of service.If heat radiation is little good, generation high temperature then in service can damage CPU.Computer run speed is fast more, and frequency is high more, and its inner heat that produces is many more, and CPU particularly produces to heat and to accumulate to a certain degree, and computer is frequently crashed, even assembly such as damage CPU.
Event adopts the method for fan radiation fin to cool off CPU before, but the shortcoming that the method exists is the fan life weak point, and power consumption is big, and noise is big, is not suitable for long-term use, and one works as the fan damage will cause deadlock even burn out CPU.
For this reason, occur the radiator of multiple band heat pipe at present, be illustrated in figure 1 as a kind of cpu heat of notebook computer.It comprises a supporting construction 1, it is made up of a cooling base 11 and a bracing frame 12, and a centrifugal fan 2 is positioned at air inlet 121 places of bracing frame 12, and radiating fin 3 is positioned on this bracing frame 12, some heat pipes 4 are in juxtaposition, and connect the bottom of cooling base 11 and the bottom of radiating fin 3.Mat is above-mentioned, and the heat on the CPU that cooling base 11 bottom surfaces are contacted (figure does not show) is led on the radiating fin 3 by heat pipe 4, produces forced convertion by centrifugal fan 2 again, reaches the purpose of heat radiation.
But above-mentioned radiator still has following shortcoming:
This heat pipe 4 is positioned at radiating fin 3 bottom surfaces side by side, can not evenly fast CPU be gone up heat and be transmitted to the radiating fin heat radiation by heat pipe, its heat-sinking capability a little less than, cause when cpu power is big, need just can reach forced convertion preferably, so this kind structure takies in the horizontal direction than large space with larger area radiating fin 3;
This supporting construction 1 is complicated, and needs die cast, and manufacturing process is complicated, so cost is higher.
Summary of the invention
Main purpose of the present utility model provides the strong central processing unit construction for heat radiating device of a kind of heat-sinking capability.
For achieving the above object, the central processing unit construction for heat radiating device that the utility model adopted comprises: a bracing frame, the one side is provided with an arch sheet, be provided with a copper billet that can fit with central processing unit with this arch sheet opposite position, and this side also is provided with and is used for fixing the fixed pin of this bracing frame in electronic apparatus system, the opposite side of this bracing frame is provided with bearing frame, among this bearing frame between the position be hollow out, its lateral surface is provided with some bearings hole; Some heat pipes, one end are arranged in above-mentioned arch sheet and the formed space of copper billet side by side, and its other end passes radiating fin respectively and correspondence is inserted in the above-mentioned bearing hole, and this radiating fin is positioned at the hollow out position of bearing frame; One aerofoil fan is fixed on the described bearing frame.
Mat is above-mentioned, the utility model directly is plugged into heat pipe in the radiating fin, can be good at evenly being transmitted to the heat on the central processing unit (CPU) in the radiating fin, and then by aerofoil fan generation forced convertion, cause heat dispersion higher, so when cpu power is big, no longer need to use the larger area radiating fin, cause the space of saving horizontal direction.
In the preferred embodiment of the utility model, the side that support frame as described above is provided with the arch sheet becomes one " worker " type structure, and described fixed pin lays respectively on four pin of this " worker " type structure.This kind structure is simpler, can directly be stamped to form, and causes manufacturing cost to reduce.
Description of drawings
Below in conjunction with embodiment and accompanying drawing the utility model is described in detail below:
Fig. 1 is the background technology upward view.
Fig. 2 is the decomposing schematic representation of the utility model.
Fig. 3 is the stereogram of the utility model one embodiment.
Fig. 4 is the stereogram of another embodiment of the utility model
Embodiment
To be example below, central processor construction for heat radiating device among the utility model will be described with the notebook computer.
As shown in Figure 2, the structure of the utility model comprises:
One bracing frame 6, the one side becomes one " worker " type structure 61, the position is an arch sheet 611 between among this " worker " type structure, it a little upwards arches upward, with these arch sheet 611 opposite positions are sealed a copper billet 62 that can fit with central processing unit arranged, form a space between the arch sheet 611 that this arches upward and this copper billet 62, and also be provided with in this side and be used for fixing the fixed pin 612 of bracing frame 6 in the electronic apparatus system (not shown), fixed pin described in the present embodiment is to extend respectively from four pin places of " worker " type structure 61 to be provided with one " L " type structure, horizontal plane in this " L " type structure is provided with through hole 6121, for lock-in component lock and.
The opposite side of this bracing frame 6 is provided with a bearing frame 63, among this bearing frame 63 between position 631 are hollow outs, its lateral surface 632 is provided with some bearings hole 6321;
Some heat pipes 64, one end are arranged in above-mentioned arch sheet and the formed space of copper billet side by side, and its other end then scatters, and pass radiating fin 65 respectively and correspondence is inserted in the above-mentioned bearing hole 6321, and this radiating fin 65 just is positioned at the hollow out position of bearing frame 63;
One aerofoil fan 66, it is locked on the bearing frame 63 by screw 661, and as shown in Figure 3, the air-out direction of this aerofoil fan 66 is with respect to radiating fin 65.Certainly, but also the air intake direction of this aerofoil fan 66 with respect to radiating fin 65 (as shown in Figure 4).
Mat is above-mentioned, and the heat on the CPU that copper billet 62 bottom surfaces are contacted (figure does not show) is led on the radiating fin 65 by heat pipe 64, produces forced convertion by aerofoil fan 66 again, reaches the purpose of heat radiation.
Be separately and be plugged into respectively in the radiating fin 65 in the present embodiment with heat pipe 64, can be good at the heat on the central processing unit (CPU) evenly is transmitted in the radiating fin 65, and then by aerofoil fan 66 generation forced convertions, cause heat dispersion higher, so when cpu power is big, no longer need to use the larger area radiating fin, cause the space of saving horizontal direction.
Claims (5)
1. central processing unit construction for heat radiating device is characterized in that this structure comprises:
One bracing frame, the one side is provided with an arch sheet, be provided with a copper billet that can fit with central processing unit with this arch sheet opposite position, and this side also is provided with and is used for fixing the fixed pin of this bracing frame in electronic apparatus system, the opposite side of this bracing frame is provided with bearing frame, the position is a hollow out between among this bearing frame, and its lateral surface is provided with some bearings hole;
Some heat pipes, one end are arranged in above-mentioned arch sheet and the formed space of copper billet side by side, and its other end passes radiating fin respectively and correspondence is inserted in the above-mentioned bearing hole, and this radiating fin is positioned at the hollow out position of bearing frame;
One aerofoil fan is fixed on the described bearing frame.
2. central processing unit construction for heat radiating device according to claim 1, it is characterized in that: the side that this bracing frame is provided with the arch sheet becomes one " worker " type structure, and described fixed pin lays respectively on four pin of this " worker " type structure.
3. as central processing unit construction for heat radiating device as described in the claim 2, it is characterized in that: described fixed pin is to extend respectively from four pin places of " worker " type structure to be provided with one " L " type structure.
4. central processing unit construction for heat radiating device according to claim 1, it is characterized in that: the air-out direction of described aerofoil fan is with respect to radiating fin.
5. central processing unit construction for heat radiating device according to claim 1, it is characterized in that: the air intake direction of described aerofoil fan is with respect to radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520058804 CN2817070Y (en) | 2005-05-27 | 2005-05-27 | Central processor rediating device structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520058804 CN2817070Y (en) | 2005-05-27 | 2005-05-27 | Central processor rediating device structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2817070Y true CN2817070Y (en) | 2006-09-13 |
Family
ID=36996880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520058804 Expired - Fee Related CN2817070Y (en) | 2005-05-27 | 2005-05-27 | Central processor rediating device structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2817070Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852120A (en) * | 2009-10-26 | 2010-10-06 | 李钢坤 | Electric booster and control method thereof |
| US7855889B2 (en) | 2007-02-09 | 2010-12-21 | Foxconn Technology Co., Ltd. | Resilient fastener and thermal module incorporating the same |
| CN103140118A (en) * | 2011-12-05 | 2013-06-05 | 英业达股份有限公司 | Heat dissipation assembly |
-
2005
- 2005-05-27 CN CN 200520058804 patent/CN2817070Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7855889B2 (en) | 2007-02-09 | 2010-12-21 | Foxconn Technology Co., Ltd. | Resilient fastener and thermal module incorporating the same |
| CN101852120A (en) * | 2009-10-26 | 2010-10-06 | 李钢坤 | Electric booster and control method thereof |
| CN101852120B (en) * | 2009-10-26 | 2012-05-23 | 李钢坤 | Electric booster and control method thereof |
| CN103140118A (en) * | 2011-12-05 | 2013-06-05 | 英业达股份有限公司 | Heat dissipation assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060913 Termination date: 20120527 |