CN2753499Y - 颗粒形焊料 - Google Patents

颗粒形焊料 Download PDF

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Publication number
CN2753499Y
CN2753499Y CN 200420054748 CN200420054748U CN2753499Y CN 2753499 Y CN2753499 Y CN 2753499Y CN 200420054748 CN200420054748 CN 200420054748 CN 200420054748 U CN200420054748 U CN 200420054748U CN 2753499 Y CN2753499 Y CN 2753499Y
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China
Prior art keywords
welding flux
fine particles
utility
model
scolder
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Expired - Fee Related
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CN 200420054748
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English (en)
Inventor
孙扬善
周健
薛烽
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Southeast University
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Southeast University
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Priority to CN 200420054748 priority Critical patent/CN2753499Y/zh
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Publication of CN2753499Y publication Critical patent/CN2753499Y/zh
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Abstract

本实用新型公开了一种用于制备焊膏的颗粒形焊料，包括焊料细颗粒，在细颗粒的外表面上设有封闭型锡壳。与现有技术相比，本实用新型具有如下优点：由于本实用新型用锡材料制作的壳体将焊料细颗粒封闭在其中，使焊料细颗粒与助焊剂相隔绝，避免了焊料细颗粒与助焊剂直接接触，而锡又可以是焊料的组成成分之一，因此，具有本实用新型所述结构的颗粒形焊料具有稳定性好的优点。

Description

颗粒形焊料
                              技术领域
本实用新型涉及一种用于制备焊膏的原材料，尤其涉及一种用于制备焊膏的颗粒形焊料。
                              背景技术
目前，在制备焊膏时是将焊料细颗粒和助焊剂混合在一起，由于焊料细颗粒长期处于助焊剂之中，会发生电化学反应，因此，现有的焊膏稳定性差。
                              发明内容
本实用新型提供一种稳定性好的用于制备焊膏的颗粒形焊料。
本实用新型采用如下技术方案：
一种用于制备焊膏的颗粒形焊料，包括焊料细颗粒，在细颗粒的外表面上设有封闭型锡壳。
与现有技术相比，本实用新型具有如下优点：
由于本实用新型用锡材料制作的壳体将焊料细颗粒封闭在其中，使焊料细颗粒与助焊剂相隔绝，避免了焊料细颗粒与助焊剂直接接触，而锡又可以是焊料的组成成分之一，因此，具有本实用新型所述结构的颗粒形焊料具有稳定性好的优点。
                              附图说明
图1是本实用新型结构示意图。
                            具体实施方式
一种用于制备焊膏的颗粒形焊料，包括焊料细颗粒2，在细颗粒2的外表面上设有封闭型锡壳1。

Claims (1)

1、一种用于制备焊膏的颗粒形焊料，包括焊料细颗粒(2)，其特征在于在细颗粒(2)的外表面上设有封闭型锡壳(1)。
CN 200420054748 2004-12-28 2004-12-28 颗粒形焊料 Expired - Fee Related CN2753499Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420054748 CN2753499Y (zh) 2004-12-28 2004-12-28 颗粒形焊料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200420054748 CN2753499Y (zh) 2004-12-28 2004-12-28 颗粒形焊料

Publications (1)

Publication Number Publication Date
CN2753499Y true CN2753499Y (zh) 2006-01-25

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ID=35925609

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200420054748 Expired - Fee Related CN2753499Y (zh) 2004-12-28 2004-12-28 颗粒形焊料

Country Status (1)

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CN (1) CN2753499Y (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103619529A (zh) * 2011-09-02 2014-03-05 三菱综合材料株式会社 焊料粉末以及使用该粉末的焊料用浆料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103619529A (zh) * 2011-09-02 2014-03-05 三菱综合材料株式会社 焊料粉末以及使用该粉末的焊料用浆料
US8882934B2 (en) 2011-09-02 2014-11-11 Mitsubishi Materials Corporation Solder powder, and solder paste using solder powder

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C19 Lapse of patent right due to non-payment of the annual fee
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