TW200714392A - Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder - Google Patents
Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powderInfo
- Publication number
- TW200714392A TW200714392A TW095136215A TW95136215A TW200714392A TW 200714392 A TW200714392 A TW 200714392A TW 095136215 A TW095136215 A TW 095136215A TW 95136215 A TW95136215 A TW 95136215A TW 200714392 A TW200714392 A TW 200714392A
- Authority
- TW
- Taiwan
- Prior art keywords
- silver
- composite powder
- copper composite
- production
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Disclosed is a silver-copper composite powder having a silver microparticle attached thereto, which is finely granulated, has an even particle size, is excellent in low temperature sintering property and can be used for a wide variety of application purposes. Also disclosed is a method of production of the silver-copper composite powder. The silver-copper composite powder comprises a silver-copper composite powder and a silver microparticle attached onto the composite powder. The method of production of the silver-copper composite powder comprises the steps of: contacting a silver-copper composite powder with a solution containing a silver complex, wherein the solution is prepared by mixing and dissolving silver nitrate and a complexing agent while stirring; and adding a reducing agent to the resulting solution to thereby cause the precipitation of a silver microparticle onto the surface of a silver-copper powder.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289930A JP5080731B2 (en) | 2005-10-03 | 2005-10-03 | Fine silver particle-attached silver-copper composite powder and method for producing the fine silver particle-attached silver-copper composite powder |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200714392A true TW200714392A (en) | 2007-04-16 |
TWI304003B TWI304003B (en) | 2008-12-11 |
Family
ID=37906236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095136215A TW200714392A (en) | 2005-10-03 | 2006-09-29 | Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5080731B2 (en) |
KR (1) | KR101301634B1 (en) |
TW (1) | TW200714392A (en) |
WO (1) | WO2007040195A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI453076B (en) * | 2009-02-11 | 2014-09-21 | Univ Nat Cheng Kung | Synthesis of nanosize-controllable core-shell materials |
TWI763637B (en) * | 2015-10-26 | 2022-05-11 | 日商同和電子科技有限公司 | Metal composite powder and method for producing same |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009116349A1 (en) * | 2008-03-21 | 2009-09-24 | 旭硝子株式会社 | Copper nanoparticle-coated copper filler, method for producing the same, copper paste, and article having metal film |
WO2010018781A1 (en) * | 2008-08-11 | 2010-02-18 | 地方独立行政法人大阪市立工業研究所 | Composite nanoparticle and process for producing same |
KR101101359B1 (en) * | 2009-11-30 | 2012-01-02 | 주식회사 지오션 | Copper flake powder for silver coated and manufacturing method |
CN103379973A (en) * | 2011-03-31 | 2013-10-30 | 户田工业株式会社 | Silver-coated copper powder and method for producing same, silver-coated copper powder-containing conductive paste, conductive adhesive agent, conductive film, and electric circuit |
KR101307238B1 (en) * | 2011-12-09 | 2013-09-11 | (주)선경에스티 | Method for producing silver coated copper powder |
KR20150064054A (en) * | 2012-10-03 | 2015-06-10 | 도다 고교 가부시끼가이샤 | Silver hybrid copper powder, method for producing same, conductive paste containing silver hybrid copper powder, conductive adhesive, conductive film and electrical circuit |
JP5785532B2 (en) * | 2012-11-30 | 2015-09-30 | 三井金属鉱業株式会社 | Silver-coated copper powder and method for producing the same |
JP6210723B2 (en) * | 2013-05-08 | 2017-10-11 | 三井金属鉱業株式会社 | Silver-coated nickel particles and method for producing the same |
JP2015034309A (en) * | 2013-08-07 | 2015-02-19 | 三井金属鉱業株式会社 | Composite copper particles and method for manufacturing the same |
JP6309758B2 (en) * | 2013-12-26 | 2018-04-11 | 三井金属鉱業株式会社 | Silver-coated copper powder and method for producing the same |
US20180264548A1 (en) * | 2015-01-09 | 2018-09-20 | Clarkson University | Silver Coated Copper Flakes and Methods of Their Manufacture |
CN105921737B (en) * | 2016-04-28 | 2018-01-19 | 中南大学 | The preparation method and conducting resinl of a kind of cuprum argentum composite powder |
JP2019206760A (en) * | 2019-07-03 | 2019-12-05 | Dowaエレクトロニクス株式会社 | Metal composite powder and manufacturing method thereof |
JP7414421B2 (en) * | 2019-08-05 | 2024-01-16 | 田中貴金属工業株式会社 | Gold powder, method for producing the gold powder, and gold paste |
EP4205886A4 (en) * | 2020-08-26 | 2024-01-24 | Mitsui Mining & Smelting Co., Ltd. | Silver-coated flake-form copper powder, and method for manufacturing same |
WO2023074580A1 (en) * | 2021-10-25 | 2023-05-04 | トッパン・フォームズ株式会社 | Sintered material, metal sintered compact, manufacturing method for sintered material, manufacturing method for joined body, and joined body |
CN114226724B (en) * | 2021-12-22 | 2024-01-16 | 合肥工业大学 | Copper@silver core-shell structure particle and related preparation method and application |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03133006A (en) * | 1989-10-18 | 1991-06-06 | Asahi Chem Ind Co Ltd | Silver-copper alloy group conductive paste and conductor using same |
JPH06128609A (en) * | 1992-10-15 | 1994-05-10 | Daido Steel Co Ltd | Production of ag-cu alloy powder |
JPH07331360A (en) * | 1994-06-06 | 1995-12-19 | Asahi Chem Ind Co Ltd | New copper alloy powder and its production |
JPH11310806A (en) * | 1998-04-28 | 1999-11-09 | Fukuda Metal Foil & Powder Co Ltd | Production of copper-silver composite powder for electrically conductive paste |
JP3874634B2 (en) * | 2001-08-10 | 2007-01-31 | 福田金属箔粉工業株式会社 | Flake-like silver powder for conductor paste and conductor paste using the same |
JP2005060831A (en) * | 2003-07-29 | 2005-03-10 | Mitsubishi Materials Corp | Composite metal powder and its production method, and silver clay |
JP4047304B2 (en) * | 2003-10-22 | 2008-02-13 | 三井金属鉱業株式会社 | Fine silver particle-attached silver powder and method for producing the fine silver particle-attached silver powder |
-
2005
- 2005-10-03 JP JP2005289930A patent/JP5080731B2/en active Active
-
2006
- 2006-09-29 TW TW095136215A patent/TW200714392A/en not_active IP Right Cessation
- 2006-10-02 WO PCT/JP2006/319675 patent/WO2007040195A1/en active Application Filing
- 2006-10-02 KR KR1020087008105A patent/KR101301634B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI453076B (en) * | 2009-02-11 | 2014-09-21 | Univ Nat Cheng Kung | Synthesis of nanosize-controllable core-shell materials |
TWI763637B (en) * | 2015-10-26 | 2022-05-11 | 日商同和電子科技有限公司 | Metal composite powder and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
TWI304003B (en) | 2008-12-11 |
WO2007040195A1 (en) | 2007-04-12 |
KR20080052646A (en) | 2008-06-11 |
JP2007100155A (en) | 2007-04-19 |
JP5080731B2 (en) | 2012-11-21 |
KR101301634B1 (en) | 2013-08-29 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |