CN2745112Y - Low power dissipation computer case - Google Patents
Low power dissipation computer case Download PDFInfo
- Publication number
- CN2745112Y CN2745112Y CNU2004200670170U CN200420067017U CN2745112Y CN 2745112 Y CN2745112 Y CN 2745112Y CN U2004200670170 U CNU2004200670170 U CN U2004200670170U CN 200420067017 U CN200420067017 U CN 200420067017U CN 2745112 Y CN2745112 Y CN 2745112Y
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- Prior art keywords
- heat
- power supply
- cabinet
- heat conduction
- radiator
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- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer case with low power consumption. The utility model comprises a side panel, a back panel, a power supply, a liquid cooling device and a heat radiation channel, wherein, the liquid cooling device comprises a cooling liquid case, a heat exchanger, a radiator and liquid guide pipes. The cooling liquid case is circularly connected with the heat exchanger and the radiator in series through the liquid guide pipes, and then the cooling liquid case, the heat exchanger and the radiator form a sealed and circular water loop through the liquid guide pipes. The power supply is arranged on the lower part of the interior of the computer case. The heat radiation channel comprises a heat conducting inlet, a heat conducting channel and a heat conducting outlet. The heat conducting inlet is connected with a radiator of the power supply, and thus the heat of the power supply is conducted to the heat radiation channel. The heat conducting outlet corresponds to a heat radiation opening which is arranged on the upper part of the side panel or the back panel. The lower parts and the upper parts of the side panel or the back panel are respectively provided with a cold air guide-in hole and hot air guide-out hole. The utility model can effectively eliminate the heat in the computer case in a no power consumption method or a slight power consumption method, and reduce the temperature of the computer case.
Description
Technical field
The utility model relates to a kind of casing of electric equipment, especially relates to a kind of computer cabinet.
Background technology
Existing computer cabinet all comprises lamina tecti, side panel, rear panel usually, and power supply, because power supply is a kind of high power consumption equipment, for guaranteeing its operate as normal, described power supply all has a bigger fan of power to be its heat radiation usually.In addition, be installed in the heat generating components that high power consumption is all arranged on the motherboard of cabinet inside usually, as CPU, various coprocessors etc., also has the lower integrated circuit board of some power consumptions, as be used to connect display card, card of surfing Internet, sound card of display etc., like this, the heat that the various power consumption parts of cabinet inside produce will make the temperature of cabinet inside be accumulated to a very high degree, makes the computing machine cisco unity malfunction.For addressing this problem, on computer cabinet, as fan also is installed on the rear panel of cabinet, to solve the heat dissipation problem of cabinet inside.
Along with increasing of computer function, in the inside of computer cabinet increasing current consuming apparatus is installed, as CD-ROM drive, lightscribe machine etc., like this, not only high-power power supply has bigger power consumption, produces more heat, and equipment itself also produces heat.With regard to present computer cabinet, the various heat generating components of its inside approximately produce 35 watts to 45 watts heat power consumption, for stoping the rising of the cabinet inside temperature that these heat power consumptions cause, 2 to 5 fans are installed in computer cabinet usually, for example on power supply, on the cabinet rear panel and on the bigger heat generating components of power consumption, this makes present computer cabinet itself because a large amount of power consumption of its mounted fan generation.
The utility model content
For solving the problem that there are a large amount of power consumptions in aforementioned calculation machine enclosure itself, the utility model provides the computer cabinet of low-power consumption, uses this cabinet can realize that not power consumption mode gets rid of the heat of cabinet inside, thereby the temperature in the cabinet is reduced greatly.
The low-power consumption computer cabinet that the utility model provides comprises side panel, rear panel, and power supply, and described power supply is arranged on bottom in the cabinet; Described cabinet also includes heat conduction mouth, passage of heat and goes out the heat dissipation channel of heat conduction mouth, describedly goes into the radiator that the heat conduction mouth connects described power supply, makes the heat of described power supply be transmitted to described heat dissipation channel; Describedly go out the heat conduction mouth and be docked at the thermovent that side panel or rear panel top are provided with.
Describedly go into the heat conduction mouth and comprise the heat conduction side plate that forms the heat conduction mouth; Described passage of heat inside is provided with at least one heat-transfer passage; It is described that to go out the heat conduction mouth be the heat conduction cavity.
The bottom of described side panel and rear panel is respectively arranged with the cold air entrance hole; The top of described side panel and rear panel is respectively arranged with the hot gas leadout hole.
Because the utility model power supply that cabinet is comprised is arranged on bottom in the cabinet, helps heat that power supply the is sent convection action by thermal current like this and be discharged to outside the cabinet from the cabinet internal upper part.And, the utility model also is provided with the heat dissipation channel that includes heat conduction mouth, passage of heat and go out the heat conduction mouth in cabinet, go into the heat conduction mouth and be connected described with the radiator of described power supply, describedly go out heat conduction mouth and the corresponding setting of the thermovent that is arranged on side panel or rear panel top, be transmitted to described heat dissipation channel with regard to the heat that makes power supply like this, and then go out the heat conduction mouth and be discharged to outside the cabinet; In addition, based on such scheme, the utility model is respectively arranged with the cold air entrance hole in the bottom of described side panel and rear panel; The top of described side panel and rear panel is respectively arranged with the hot gas leadout hole, thereby has strengthened the effect of thermal convection in the cabinet, more helps the heat in the cabinet is discharged to outside the cabinet.
From the above,, can be discharged to outside the cabinet by heat dissipation channel for the heat of power supply in the computer cabinet, thus the temperature of reduction power supply; Be dispersed into heat in the cabinet for heat-producing devices such as power supply or parts, and the heat that is dispersed in the cabinet by described Control device of liquid cooling is discharged to outside the cabinet effectively by the cold air entrance hole of the bottom of described side panel and rear panel, the hot gas leadout hole on top.
Description of drawings
Fig. 1 is the right parallax stereogram of embodiment described in the utility model;
Fig. 2 is the left parallax stereogram of embodiment described in the utility model;
Fig. 3 is the Control device of liquid cooling synoptic diagram that embodiment described in the utility model adopts;
Fig. 4 is the heat dissipation channel synoptic diagram that embodiment described in the utility model adopts;
Fig. 5 is the upward view of Fig. 4;
Fig. 6 is first kind of side panel synoptic diagram that embodiment described in the utility model adopts;
Fig. 7 is second kind of side panel synoptic diagram that embodiment described in the utility model adopts;
Fig. 8 is the rear panel synoptic diagram that embodiment described in the utility model adopts.
Embodiment
The utility model utilizes the principle of heat interchange and thermal convection, by technological means such as Control device of liquid cooling and heat dissipation channel are set, the heat of computer cabinet internal heat generation equipment or parts is discharged to the cabinet outside.Concrete implementation is at first with reference to figure 1 and Fig. 2, Fig. 1, the 2nd, the right side of embodiment described in the utility model, left parallax stereogram.Low-power consumption computer cabinet described in the figure comprises the major part that computer cabinet has, as lamina tecti, side panel, rear panel, and power supply etc., also comprise the Control device of liquid cooling that the utility model provides specially.Described Control device of liquid cooling further comprises: tank for coolant 1, the heat interchanger 2 of cavity is arranged and the heating radiator 3 and the catheter 4,5,6 of fluid passage are arranged, described tank for coolant 1 is connected by the catheter circulation with described heat interchanger 2, heating radiator 3, makes described tank for coolant and described heat interchanger, heating radiator form sealing and round-robin water loop by described catheter.
In order when specifically implementing the utility model, to make things convenient for being connected and maintenance of tank for coolant 1, heat interchanger 2 and heating radiator 3, tank for coolant 1 in this example, heat interchanger 2 and heating radiator 3 include an inlet and an outlet respectively, utilize described entrance and exit, described tank for coolant 1 is connected by the catheter circulation with described heat interchanger 2, heating radiator 3, and concrete connection can also be with reference to figure 3.Specifically, the outlet 11 of tank for coolant 1 is connected by catheter 4 with the inlet 21 of heat interchanger 2, the outlet 22 of heat interchanger 2 is connected by catheter 5 with the inlet 36 of heating radiator 3, the outlet 37 of heating radiator 3 is connected by catheter 6 with the inlet 12 of tank for coolant 1, has so just formed a sealing and round-robin liquid heat-radiation loop.
The aforesaid liquid cooling device is when concrete the use, and heat interchanger 2 is fixing or be arranged on the heater element in the cabinet, as the CPU8 on the motherboard.If it is a plurality of that such heater element has, as also comprising coprocessor etc., can be with a plurality of heat interchanger polyphones or in parallel the use.In illustrated example, heat interchanger is arranged on the main heat generating components on the motherboard that is installed in support plate 9 inboards, as CPU, and heating radiator 3 is arranged on the outside of support plate; Described tank for coolant 1 is placed on the bottom in the cabinet.
When specific implementation aforesaid liquid cooling device, described tank for coolant 1 and heating radiator 3 can be set flexibly, for example the lamina tecti with tank for coolant 1 and cabinet is designed to one, and heating radiator 3 is designed to side panel of cabinet or the like.
For making above-mentioned Control device of liquid cooling reach better effect, increase liquid round-robin flow, be provided with micropump 7 in described tank for coolant 1 inside in this example, the micropump 7 in this example is 4 watts, and described micropump 7 is in the inner outlet 11 that connects tank for coolant of tank for coolant.
Need to prove that be being connected and maintenance of convenient described tank for coolant 1, heat interchanger 2 and heating radiator 3, described catheter adopts soft catheter, promptly flexible catheter be the best, as hose etc.
In above-mentioned example, described heating radiator 3 further includes a plurality of radiators that fluid passage is arranged 31,32,33 and 34 that are connected in series mutually by fluid path, for increasing area of dissipation, being convenient to make and reason such as reduce cost, each radiator comprises that a plurality of hot channels 35 are not (if consider above-mentioned factor certainly, described radiator can only be a cavity), simultaneously, also be provided with heat radiator in the described hot channel outside.
When the utility model is specifically implemented, only adopt above-mentioned Control device of liquid cooling can solve the heat dissipation problem of heat generating components, but, for the such highly energy-consuming parts of equivalent current supply, in order better to solve its heat dissipation problem, also adopted following concrete technical scheme in this example: power supply is arranged on bottom in the cabinet, like this, just can utilize the convection effect of hot-air, the heat that impels power supply to be dispersed into cabinet inside is discharged to outside the cabinet.Simultaneously, for strengthening heat radiation for power supply, also be provided with the heat dissipation channel 10 that includes heat conduction mouth 101, passage of heat 102 and go out heat conduction mouth 103 in this example, describedly go into the radiator that the heat conduction mouth connects described power supply, specifically, describedly go into the heat conduction mouth and comprise the heat conduction side plate 1011 and 1012 that forms the heat conduction mouth, heat conduction side plate 1011 is connected with the radiator of power supply with 1012, with reference to figure 2 and Fig. 4.Power supply shown in the figure is for having removed shell, only having comprised the structural drawing of radiator, and described radiator is normally used heat radiator.In the described in the drawings connection, heat conduction side plate 1011 is connected with heat radiator 22 by heat-conducting plate, heat conduction side plate 1012 is connected (can certainly be connected with heat radiator 21) by heat-conducting plate with heat radiator 20, if power supply also has other heat radiator, then preferably other heat radiator is connected with the heat radiator that has been connected with described heat conduction side plate by heat-conducting plate, to transmit its heat.For example the heat radiator shown in the figure 21 is connected with heat radiator 20 by heat-conducting plate 23.By above-mentioned connection, not only the heat transferred of described heat radiator can be arrived described heat conduction side plate, also formed the thermal dissipating path to the heat conduction side plate, will make the heat of described power supply be transmitted to described heat dissipation channel like this, by being discharged to out heat conduction mouth 103 on the heat dissipation channel from the power supply heat sinking sheet.Describedly go out heat conduction mouth 103 and the corresponding setting of the thermovent that is arranged on side panel or rear panel top.The cabinet rear panel 40 that Fig. 8 describes comprises that one is arranged on the thermovent 41 on top and is arranged on the power port 42 of bottom (when power supply places cabinet inside, can be provided with) herein, usually go out the physical dimension of heat conduction mouth 103 and the size of thermovent 41 and adapt, as measure-alike.Need to prove that thermovent 41 can be described in figure be opening completely, also opening but comprise ventilative micropore not.
In this example, described passage of heat inside is provided with at least one heat-transfer passage 1021, be generally a heat-transfer passage group that comprises a plurality of heat-transfer passages, the heat dissipation channel 10 with heat-transfer passage group can obviously find out that the heat-transfer passage shown in Fig. 5 is 12 by Fig. 5.Also be respectively equipped with on the heat conduction side plate 1011,1012 in this example and comprise a plurality of rules or irregular aperture, so also help the heat in the cabinet being discharged to outside the cabinet by heat dissipation channel 10.And describedly go out heat conduction mouth 103 and be cavity structure.In other example, can be for only there be the passage of a cavity passage of heat inside, and heat-transfer passage 1021 also can extend to out heat conduction mouth 103.
This example has also adopted other scheme to strengthen the heat radiation of cabinet inside, with reference to figure 6,7,8, promptly is respectively arranged with the cold air entrance hole in the bottom of described side panel and rear panel; The top of described side panel and rear panel is respectively arranged with the hot gas leadout hole, will quicken the heat flow effect of cabinet inside like this, improves radiating effect.As can be seen, the shape of cold air entrance hole and hot gas leadout hole can be arbitrarily from Fig. 6,7,8.
Recited above is concrete preferred embodiment of the utility model, and in this embodiment, water is cooked liquid coolant, can certainly be with other various available liquid coolants, as transformer oil.In fact, in other embodiment of the present utility model, in described tank for coolant 1, do not adopt micropump can reach case radiation effect preferably yet.Also can only adopt Control device of liquid cooling, a lower-powered fan is set on cabinet again, also can realize getting rid of the heat of cabinet inside, thereby the temperature in the cabinet is reduced greatly in little power consumption mode; Also can only adopt the power supply underlying, and the mode that sets heat dissipation channel and lower-powered fan solves the heat dissipation problem of cabinet.
Need explanation, the bottom that above-mentioned two kinds of schemes can be combined in described side panel and rear panel is respectively arranged with the cold air entrance hole; The top of described side panel and rear panel is respectively arranged with the technical scheme of hot gas leadout hole, improves the radiating effect of cabinet.Certainly, if adopt preferred embodiment of the present utility model, can have better radiating effect, be an experiment correlation data table below:
| Computer model | Computer configuration | Actual demand power | The traditional scheme temperature in chassis | Traditional scheme heat radiation consumed power (fan power) | The utility model scheme temperature in chassis | The utility model scheme heat radiation consumed power |
| Compatible | 4 processors, two hard disk, two CD-ROM drives, 512MHz internal memory, network interface card, internal modem, 64MHz binary channels video card 2.4GHz run quickly | 250 watts | 40 degree Celsius (environment temperature is 35 degree) | 22 watts | 38 degree Celsius | 4 watts |
| Compatible | 1GHz is to 3 processors, two hard disk, two CD-ROM drives, 512MHz internal memory, network interface card, built-in accent, modulator-demodulator, 32MHz video card | 200 watts | 40 degree Celsius above (environment temperature is 35 degree) | 12 watts | 36 degree Celsius | 4 watts |
Experiment shows, adopts scheme described in the utility model, can realize getting rid of the heat of cabinet inside with not power consumption or little power consumption (as 4 watts) mode, thereby the temperature in the cabinet is reduced greatly, compares with existing fan heat sink conception, better saves energy.
Need point out also that at last the technical solution of the utility model is that example is set forth with the vertical chassis, and in the reality, the technical solution of the utility model is applied to horizontal chassis has better technical effect equally, just the size or the change of shape of parts.
Claims (3)
1, a kind of low-power consumption computer cabinet comprises side panel, rear panel, and power supply, it is characterized in that, described power supply is arranged on bottom in the cabinet; Described cabinet also includes heat conduction mouth, passage of heat and goes out the heat dissipation channel of heat conduction mouth, describedly goes into the radiator that the heat conduction mouth connects described power supply, makes the heat of described power supply be transmitted to described heat dissipation channel; Describedly go out the heat conduction mouth and be docked at the thermovent that side panel or rear panel top are provided with.
2, low-power consumption computer cabinet according to claim 1 is characterized in that, describedly goes into the heat conduction mouth and comprises the heat conduction side plate that forms the heat conduction mouth; Described passage of heat inside is provided with at least one heat-transfer passage; It is described that to go out the heat conduction mouth be the heat conduction cavity.
3, low-power consumption computer cabinet according to claim 1 and 2 is characterized in that, the bottom of described side panel and rear panel is respectively arranged with the cold air entrance hole; The top of described side panel and rear panel is respectively arranged with the hot gas leadout hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200670170U CN2745112Y (en) | 2003-08-12 | 2003-08-12 | Low power dissipation computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200670170U CN2745112Y (en) | 2003-08-12 | 2003-08-12 | Low power dissipation computer case |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03270611 Division CN2651806Y (en) | 2003-08-12 | 2003-08-12 | Low-consumption computer housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2745112Y true CN2745112Y (en) | 2005-12-07 |
Family
ID=35579889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2004200670170U Expired - Fee Related CN2745112Y (en) | 2003-08-12 | 2003-08-12 | Low power dissipation computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2745112Y (en) |
-
2003
- 2003-08-12 CN CNU2004200670170U patent/CN2745112Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |