CN2708503Y - Liquid flow path board for water-cooling radiator - Google Patents
Liquid flow path board for water-cooling radiator Download PDFInfo
- Publication number
- CN2708503Y CN2708503Y CN 200420048979 CN200420048979U CN2708503Y CN 2708503 Y CN2708503 Y CN 2708503Y CN 200420048979 CN200420048979 CN 200420048979 CN 200420048979 U CN200420048979 U CN 200420048979U CN 2708503 Y CN2708503 Y CN 2708503Y
- Authority
- CN
- China
- Prior art keywords
- flow path
- liquid flow
- water
- stream
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 35
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 230000004308 accommodation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a liquid flow path board for water-cooling radiator which makes use of two flow path boards with slots to assemble a radiation fin. A liquid flow path is formed between the slots of the two flow path boards, and the radiation fin is affixed on an integrated circuit; when the integrated circuit runs, the heat quantity produced by the integrated circuit can be carried away by the flowing liquid in the liquid flow path so as to decrease the temperature of the integrated circuit.
Description
Technical field
The utility model relates to a kind of liquid flow path plate of water-cooling type radiator, relates in particular to a kind of interior liquid flow path plate of water-cooling type radiator of integrated circuit.
Background technology
Along with development of science and technology; the processing speed of integrated circuit is also more and more faster in the computer; usually can install heat abstractor additional on the integrated circuit; the heat that is used for being produced when integrated circuit turned round is distributed to the external world; the processing speed of integrated circuit increases more; the heat that is produced during its running is just big more; then heat abstractor just must have better radiating effect; integrated circuit can be operated normally; reason is overheated and reduce the effect of integrated circuit; known integrated circuit heat dissipation device comprises a kind of water-cooling type radiator; it utilizes a fin to be attached on the integrated circuit; be provided with pipeline in the fin; liquid flows in pipeline; the heat that is produced when utilizing flowing of liquid that integrated circuit turned round is taken away; but the pipeline in the known fin is single stream; it utilizes single pipeline to form bending in fin; though will can increase area of dissipation after the pipeline bending; but its area of dissipation size still can't contain the surface of entire heat dissipation sheet; and the liquid of unit volume is longer by the time of fin; cause cooling rate limited, make the radiating effect of water-cooling type radiator not good, really have its inconvenience in the use.
Summary of the invention
The utility model strengthens area of dissipation because the shortcoming of aforesaid known heat abstractor has designed a kind of liquid flow path plate with the water-cooling type radiator on multithread road, to increase the effect of water-cooling type radiator.
For reaching the purpose of above-mentioned utility model, the utility model has designed a kind of liquid flow path plate of water-cooling type radiator, and wherein, a side of stream plate forms the short slot at a plurality of connection stream plates two ends, two stream plates make up relatively with the short slot side, form liquid flow path between the short slot of two stream plates.
That is to say, in the liquid flow path plate of water-cooling type radiator of the present utility model, stream plate one side forms a plurality of short slots, two stream plates make up relatively with the short slot side, form liquid flow path between the short slot of two stream plates, the stream plate can be used in fin and the radiating seat, and fin and radiating seat utilize water pipe to connect can become one group of water-cooling type radiator, fin is installed on the integrated circuit, and the heat that is produced in the time of integrated circuit can being moved is taken away.
Advantage of the present utility model is, utilize many liquid flow paths in the stream plate, can increase the contact area of liquid and integrated circuit, and then can take away the heat that is produced when more moving by integrated circuit, and utilize the stream plate of two different materials up and down, increase radiating effect.
Description of drawings
Fig. 1 is an end view of the present utility model.
Fig. 2 is the outside drawing of the utility model embodiment.
Fig. 3 is the assembly exploded view of Fig. 2 embodiment.
Fig. 4 is the outside drawing of another embodiment of the utility model.
Fig. 5 is the sectional side view of another embodiment of the utility model.
Fig. 6 is the part assembly exploded view of Fig. 5 embodiment.
Fig. 7 is user mode figure of the present utility model.
Embodiment
See also shown in Figure 1ly, the utility model is a stream plate 11, and it can form fin 10.Fin 10 is made up of two stream plates 11, and stream plate 11 materials that contact with integrated circuit 70 can be copper, and another sheet stream plate 11 materials can be aluminium.A side is provided with a plurality of short slots 12 that are parallel to each other and connect stream plate 11 two ends on the stream plate 11.See also shown in Figure 3ly, be formed with the protuberance 13 parallel on stream plate 11 1 lateral margins, be formed with the recess 14 parallel on another lateral margin with short slot 12 with short slot 12.The stream plate 11 that two structures are identical is staggered relatively and fixing with protuberance 13 places and recess 14 places, promptly forms a fin 10.Like this, 12 of the short slots of two stream plates 11 form a liquid flow path 121.See also Fig. 2 and shown in Figure 3, be respectively equipped with the connecting plate 20 of tool accommodation space 201 at the two ends of the opening of the liquid flow path 121 of fin 10.The connecting plate 20 of one side is provided with a water inlet pipe 21, and the connecting plate 20 of opposite side is provided with an outlet pipe 22, and inlet tube and outlet tube 21,22 communicates with accommodation space 201.
See also shown in Figure 4ly, be provided with one group of radiating fin 30 on fin 10, radiating fin 30 mode such as can weld is fixed on the stream plate 11 of a side, or is formed in one with a stream plate 11 wherein.
See also shown in Figure 7, fin 10 and radiating seat 40 can be combined into one group of water-cooling type radiator, the water inlet pipe 21 of fin 10 is connected with water pipe 60 with the outlet pipe 43 of radiating seat 40, the outlet pipe 22 of fin 10 is connected with water pipe 61 with the water inlet pipe 44 of radiating seat 40, be provided with a pump (not shown) at water inlet pipe 44 places of radiating seat 40 in addition, with the water that flows in the connecting plate 20 of outlet pipe 22 sides of fin 10, send in the contiguous block 42 of water inlet pipe 44 sides of radiating seat 40, integrated circuit 70 is installed in fin 10 belows.
When integrated circuit 70 operations, the liquid that is flowed into by water inlet pipe 21 can flow in the liquid flow path in the fin 10 121, the heat that liquid is produced when by this integrated circuit 70 being moved is taken away, the liquid in the fin 10 is sent into the water inlet pipe 44 of radiating seat 40 by pump via outlet pipe 22, after the liquid that be the condition of high temperature this moment enters water inlet pipe 44, flow in the liquid flow path 121 of the stream plate 11 in the radiating seat 40, effect by radiating fin 41 and fan 50, the heat of liquid in the radiating seat 40 is taken away, this moment, liquid was returned to low-temperature condition, then liquid flows into the water inlet pipe 21 of fin 10 again via the outlet pipe 43 of radiating seat 40, continues the temperature that circulation reduces integrated circuit 70.
Claims (4)
1. the liquid flow path plate of a water-cooling type radiator is characterized in that, a side of stream plate forms the short slot at a plurality of connection stream plates two ends, and two stream plates make up relatively with the short slot side, form liquid flow path between the short slot of two stream plates.
2. the liquid flow path plate of water-cooling type radiator as claimed in claim 1 is characterized in that, two stream plates are respectively different heat conductor materials.
3. the liquid flow path plate of water-cooling type radiator as claimed in claim 1 or 2 is characterized in that, each short slot is parallel to each other.
4. the liquid flow path plate of water-cooling type radiator as claimed in claim 3 is characterized in that, is formed with the protuberance parallel with short slot on stream plate one lateral margin, is formed with the recess parallel with short slot on another lateral margin, and two stream plates make up with respect to recess with protuberance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420048979 CN2708503Y (en) | 2004-06-01 | 2004-06-01 | Liquid flow path board for water-cooling radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420048979 CN2708503Y (en) | 2004-06-01 | 2004-06-01 | Liquid flow path board for water-cooling radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2708503Y true CN2708503Y (en) | 2005-07-06 |
Family
ID=34851440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200420048979 Expired - Fee Related CN2708503Y (en) | 2004-06-01 | 2004-06-01 | Liquid flow path board for water-cooling radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2708503Y (en) |
-
2004
- 2004-06-01 CN CN 200420048979 patent/CN2708503Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |