CN2694524Y - 电连接器 - Google Patents

电连接器 Download PDF

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CN2694524Y
CN2694524Y CNU032804210U CN03280421U CN2694524Y CN 2694524 Y CN2694524 Y CN 2694524Y CN U032804210 U CNU032804210 U CN U032804210U CN 03280421 U CN03280421 U CN 03280421U CN 2694524 Y CN2694524 Y CN 2694524Y
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electric connector
terminal
arm
opening
installed surface
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约瑟夫·R·考桑斯盖
安祖·郑
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material

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  • Coupling Device And Connection With Printed Circuit (AREA)
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Abstract

本实用新型公开了一种具有可移除盖体的电连接器，其包括于其安装面设有若干收容通道的本体及收容于收容通道内的端子，端子包括用于电性连接电路板的尾部。盖体设有一对延伸入收容通道的臂部，该臂部于邻近安装面处形成有开口。端子的尾部定位于该开口内。可熔元件暴露于该开口内且熔合至端子的尾部上。

Description

电连接器
【技术领域】
本实用新型是有关一种电连接器，尤其涉及一种通过附着于端子上的焊球而安装于电路板上的电连接器。
【背景技术】
通常电子设备内的电路板上安装有多种电连接器，以实现多种功能。随着电子设备小型化的发展趋势，电子设备内的电路板的尺寸亦相应减小，而同时电子设备的功能越来越多，为了实现更多的功能，尺寸有限的电路板上需要安装更多的电连接器以满足电子设备的要求。所以，电连接器的尺寸亦必须减小，这意味着电连接器的导电端子之间的间距亦随之减小。同时，减小导电端子间距也是高密度电连接器的要求。
采用表面安装技术(Surface Mount Technology，SMT)焊接至电路板的电连接器在小型化的趋势下，同样要求减小导电端子之间距。然而，表面焊接技术需要导电端子间保持良好的间距，减小端子间距会增加相邻电路板上的焊接垫片发生短路的风险。
球状格栅阵列(Ball Grid Array，BGA)技术是被广泛应用的一种SMT技术，对于BGA电连接器，焊接时，附着于端子脚上的焊球被定位于电路板上相对应的焊接垫片上，该焊接垫片通常预先设置有印刷或者浸镀而成的焊膏层。然后电连接器与电路板被加热至一定温度，在该温度下，焊膏及焊球的至少一部分熔化，而使焊球熔合至导电垫片上。采用BGA的方式将电连接器电性连接至电路板上具有很多优点。重要的是，大多数情况下，焊球的焊接表面需要共面，以形成完全平坦的安装接口。焊球的共面度受到焊球自身尺寸及于电连接器上的位置所影响。焊球的最终尺寸取决于初始状态下焊球与焊接垫片的总体积。如何保证导电端子的焊球的共面度是对制造者的一个挑战。
美国专利第6,093,035号、第6,024,584号、第6,079,991号、第6,164,983号、第6,325,644号及第6,042,389号均揭示了一种导电端子附着有焊球的电连接器。
美国专利第6,093,035号揭示的电连接器包括设有若干通道的绝缘本体，该通道由绝缘本体的对接面向安装面延伸。安装面设有一与通道相连通的开口。针脚状的端子收容于通道内，该端子的尾部延伸入安装面的开口内，该开口黏附有焊球。开口用于在水平X轴与Y轴方向上定位导电端子上黏附的焊球。导电端子的尾部没有与焊球接触，如此，影响焊球于Z方向上的定位。然而，将焊球熔合至端子的尾部上取决于设置于开口处的均衡且合适数量的焊膏。尾部与焊球之间的距离决定于可变的焊膏的数量。因此，焊球于Z方向上的定位由绝缘本体的安装面及焊球与端子的尾部间的距离所决定。
美国专利第6,042,389号所揭示的电连接器包括设有若干收容通道的本体部，收容通道由本体部的对接面向安装面方向延伸。安装面还设有与收容通道相连通的开口，针脚型端子于其尾部设有一对肩部，插入时，该肩部与收容通道的底端相配合，如此于竖直方向上定位导电端子。端子设有一延伸入开口的焊接片。焊球熔合至焊接片之前先定位于开口处。为了将端子固持于收容通道内，开口收容了大量焊膏。在焊球黏附于端子尾部的焊接片以后，焊球及焊膏暴露于开口，且形成与开口形状相同的焊接块。所以，焊接块与开口底部相配合以防止端子于收容通道内向上移动。
然而，前述专利均存在一个问题，开口处设有大量的焊膏，当电连接器通过热风回流制程将焊球熔合至端子上时，焊料会发生虹吸现象而由开口处沿端子上溢。尽管，端子的中间部上设有涂层或/和隔热构造，然而，由于端子与通道之间仍存在间隙，焊料上溢仍然是一个问题。
所以，有必要对前述电连接器的端子构造进行改良以解决上述技术问题。
【实用新型内容】
本实用新型的主要目的在于提供一种电连接器，其具有一可移除的盖体，可方便稳固地将可熔元件黏附于针脚型端子上。
为达成上述实用新型目的，本实用新型采用以下技术方案：一种电连接器包括本体、端子、盖体及可熔元件，本体设有由配接面延伸贯穿至安装面的收容通道，端子收容于收容通道内，包括用于与电路板电性连接的尾部，盖体组装于本体上，包括向下延伸入收容通道内且于邻近安装面处环绕住端子的臂部，该臂部的自由端之间还设有开口，可熔元件系黏附于端子的尾部且暴露于开口处。
与现有技术相比，本实用新型电连接器具有如下有益效果：盖体于邻近安装面处设有开口，该开口用以预先定位焊球，盖体的臂部于邻近安装面处设有接合点以抵靠住端子的尾部，如此可方便稳固地将可熔元件黏附于端子上。
【附图说明】
图1是本实用新型电连接器带有盖体的剖视示意图。
图2是垂直于图1所示的方向的剖视示意图。
图3是沿图1的线III-III方向的剖视图。
图4是图1所示的端子的立体放大图。
图5是本实用新型的另一实施方式的电连接器的剖视示意图。
【具体实施方式】
请参阅图1及图2所示的第一实施方式中，电连接器1设有一安装于其上的可拆卸的盖体5。电连接器1还包括设有收容通道20的绝缘本体2。该收容通道20由绝缘本体2的顶部配接面200向底部安装面202延伸，且大体成矩形结构。
请同时参阅图4所示，端子3呈“Z”形结构，然而，本领域普通技术人员可将该端子结构修改为其它形状。端子3设有一扁平主体部30及一对由主体部30的相对两端的侧缘向相反方向侧向延伸而出的翼部32。翼部32与收容通道20的侧壁发生配合，用来为端子3固持于绝缘本体2内提供足够的固持力。主体部30包括设置于邻近配接面200处的配合部302、由配合部302向远离配合部302的方向延伸且邻近安装面202的尾部304及连接配合部302与尾部304的中间部306，配合部302用以与对接连接器(未图示)的偏置端子相配合。
可拆卸的盖体5由绝缘聚合物一体射出成型，该绝缘聚合物可承受采用表面焊接技术(SMT)时的热风回流温度，例如，液晶聚合物。盖体5包括暴露于绝缘本体2的配接面200外的顶板50及一对由顶板50向下延伸入收容通道20内的臂部52。臂部52彼此被端子的主体部30间隔开且大体填充收容通道20邻近安装面202处，以环绕住端子尾部304。在较佳实施方式中，臂部52设有相对的倾斜面522以形成一开口524，该开口524邻近于安装面202。端子3的尾部304延伸入开口524且该尾部304具有一收容于该开口524内的自由端3040。可熔元件焊球4定位于该开口524内且熔合于端子3的尾部304。
请参阅图3结合图1所示，每一臂部52包括一具有两配合点5250的端部525，该配合点5250与焊球4相连接。在本实用新型的较佳实施方式中，臂部52还设有一连接两配合点5250的弯曲面526，该弯曲面526还可使焊球4形状一致，以与焊球4相连接。焊球4亦可由一臂部52与端子3的尾部304共同定位。
将焊球4安置于开口524后，电连接器1于回流工序中焊球4熔合至端子3的尾部304上。焊球4暴露于开口524之外，用以焊接至电路板上(如图1及图5所示)。
在电连接器1焊接至电路板的焊接垫片(未图示)之前时，真空抓取装置(未图示)吸住盖体5的顶板50，以将焊球4准确定位于合适的焊膏上。电连接器1及电路板6被加热至一定温度，此时，焊膏及焊球4的部分或全部熔化，而使焊球4与电路板上的焊接垫片熔合，如此，电连接器1与电路板6通过焊球4达成可靠的电性连接，最后，在电连接器1安装至电路板6后，盖体5被移除。
请参阅图5所示，第二实施方式中，电连接器1′亦设有一安装于其上的盖体5′。该电连接器1′具有与电连接器1大体相同的形状，而端子3′呈矩形，相当于端子3去除其一对翼部32。该端子3′通过其相对两边缘与收容通道20的内壁20a配合而固持于收容通道20内。盖体5′包括暴露于电连接器1的上配接面200的外的顶板50′及一对由顶板50′向下延伸入收容通道20内的臂部52′。这对臂部除增设一对垂直于下安装面202的相对面528，且焊球4定位于该对相对面528之间。
值得注意的是，由于电连接器1是高密度电连接器，其配接面200内设有大量的收容通道20，抓取装置无法直接抓取电连接器1至电路板6上。本实用新型中的盖体5(5′)设有暴露出绝缘本体2的配接面200的顶板50(50′)以解决上述问题，所以，可省略用于被抓取装置抓取的抓取帽。
盖体5(5′)于邻近安装面202处设有开口524，该开口524用以预先定位焊球4，盖体的臂部52(52′)于邻近安装面202处设有接合点以紧密抵靠住尾部304，如此焊球4与端子3相熔合及焊球4焊接至电路板6上时提供防止焊料上溢的功能。臂部52(52′)也可于内表面设有防溢锡的涂层，以进一步防止焊料从尾部304向配合部302的上溢情形，该种涂层可采用镀镍。

Claims (10)

1.一种电连接器，其包括本体、端子及可熔元件，本体设有由配接面延伸贯穿至安装面的收容通道，端子收容于收容通道内，包括用于与电路板电性连接的尾部，可熔元件黏附于端子的尾部，其特征在于：电连接器还包括盖体，盖体组装于本体上，包括向下延伸入收容通道内且邻近安装面处环绕住端子的臂部，所述臂部的自由端之间设有开口，所述可熔元件暴露于所述开口处。
2.如权利要求1所述的电连接器，其特征在于：开口由所述臂部的两相对倾斜面于臂部的自由端上形成。
3.如权利要求2所述的电连接器，其特征在于：可熔元件包括有焊料。
4.如权利要求3所述的电连接器，其特征在于：所述焊料大体呈球形。
5.如权利要求3所述的电连接器，其特征在于：臂部设有接合点，以于邻近安装面处与端子相抵靠，以阻挡焊料上溢。
6.如权利要求5所述的电连接器，其特征在于：臂部设有大体垂直于本体的安装面的两相对面，所述可熔元件定位于该两相对面之间。
7.如权利要求1、2、3、4、5或6所述的电连接器，其特征在于：端子包括配合部及连接配合部与尾部的中间部，所述配合部邻近本体的安装面以与对接元件电性接触。
8.如权利要求7所述的电连接器，其特征在于：配合部、中间部及尾部位于同一平面内以形成一平板状主体部。
9.如权利要求8所述的电连接器，其特征在于：端子设有一个由所述主体部横向延伸而成的至少一个翼部，该翼部用以与收容通道的侧壁相配合。
10.如权利要求1所述的电连接器，其特征在于：所述端子的尾部收容于开口内。
CNU032804210U 2003-05-13 2003-09-09 电连接器 Expired - Fee Related CN2694524Y (zh)

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