CN2684342Y - 绝缘封装线圈组件 - Google Patents

绝缘封装线圈组件 Download PDF

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Publication number
CN2684342Y
CN2684342Y CNU2003201303352U CN200320130335U CN2684342Y CN 2684342 Y CN2684342 Y CN 2684342Y CN U2003201303352 U CNU2003201303352 U CN U2003201303352U CN 200320130335 U CN200320130335 U CN 200320130335U CN 2684342 Y CN2684342 Y CN 2684342Y
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CN
China
Prior art keywords
insulated packaging
coil body
several conducting
insulating sealed
sealed layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2003201303352U
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English (en)
Inventor
林志鸿
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LIANBAO ELECTRONIC CO Ltd
Linkcom Manufacturing Co Ltd
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LIANBAO ELECTRONIC CO Ltd
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Publication date
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Priority to CNU2003201303352U priority Critical patent/CN2684342Y/zh
Priority to US11/012,757 priority patent/US20050141205A1/en
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Publication of CN2684342Y publication Critical patent/CN2684342Y/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F17/062—Toroidal core with turns of coil around it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H01F30/16—Toroidal transformers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

一种绝缘封装线圈组件。为提供一种体积小、容纳空间大、充分发挥特性及功能的线圈组件，提出本实用新型，它包括至少一个线圈本体、数个导电端子及绝缘封装层；数个导电端子分别连接线圈本体绕线的两端；绝缘封装层以包裹方式封装包裹线圈本体及数个导电端子一部分；未被绝缘封装层包裹的数个导电端子外露部分外露于绝缘封装层的底面。

Description

绝缘封装线圈组件
技术领域
本实用新型属于线圈组件，特别是一种绝缘封装线圈组件。
背景技术
在所有电子产品都趋于小型化设计的情形下，这些电子产品内的电路板线路布局成为最重要的部分。
当电子线路完成规划后，所提供的电子元件安装空间都非常有限。而为了让电子产品的特性及功能发挥到极至，许多电子元件因负载增加而必须加大使用空间。例如变压器，为了应用方面必须增加线圈的匝数，相对需要较大的体积施以绝缘封装，但又不能超出外接设备预定线路的规划范围，而使生产业者在产品的设计无不绞尽脑汁力求突破。
举例而言，如图1所示，习用的小型变压器在线圈本体外围被施以绝缘封装层10后，其供导电连接的端子11是从绝缘封装层10的两侧面12、13伸出，并形成转折朝向电路板的方向延伸，最后以端子11的底面与电路板连接。
这样的设计原本没有什么问题，但可预见的是端子11外露的部分已超过了绝缘封装层10所包裹的范围，如果，该变压器被预定安装使用的范围非常有限，则势必会压缩绝缘封装层10的内容空间以求与线路布局相匹配，当然，这也直接影响了原先要求变压器能够提供的特性及效果。
发明内容
本实用新型的目的是提供一种体积小、容纳空间大、充分发挥特性及功能的绝缘封装线圈组件。
本实用新型包括至少一个线圈本体、数个导电端子及绝缘封装层；数个导电端子分别连接线圈本体绕线的两端；绝缘封装层以包裹方式封装包裹线圈本体及数个导电端子一部分；未被绝缘封装层包裹的数个导电端子外露部分外露于绝缘封装层的底面。
由于本实用新型包括至少一个线圈本体、数个导电端子及绝缘封装层；数个导电端子分别连接线圈本体绕线的两端；绝缘封装层以包裹方式封装包裹线圈本体及数个导电端子一部分；未被绝缘封装层包裹的数个导电端子外露部分外露于绝缘封装层的底面。组装时，本实用新型以其数个导电端子外露于绝缘封装层底面的外露部分与外接的电路板连接，使绝缘封装层可涵盖电路板上预留的全部空间，换言之，其内部的容纳空间相对增大，从而，进一步可让产品设计者在电子产品趋于小型化、电子元件安装空间有限的情形下，仍能充分发挥电子元件的特性及功能。不仅体积小，而且容纳空间大、充分发挥特性及功能，从而达到本实用新型的目的。
附图说明
图1、为习知的绝缘封装线圈组件结构示意立体图。
图2、为本实用新型结构示意立体图。
图3、为本实用新型局部剖视结构示意立体图。
图4、为习知的绝缘封装线圈组件与本实用新型对照比较示意图。
具体实施方式
如图2、图3所示，本实用新型包括一个或一个以上的线圈本体20、数个导电端子30及绝缘封装层40。
线圈本体20可由铁芯22及缠绕于铁心22外围的线圈绕组21构成。
数个导电端子30分别连接于线圈绕组21绕线的两端。
绝缘封装层40以包裹方式封装包裹线圈本体20及数个导电端子30一部分，并使未被绝缘封装层包裹的数个导电端子30外露部分31外露于绝缘封装层40的底面41。
组装时，如图4所示，本实用新型以其数个导电端子30外露于绝缘封装层40底面的外露部分31与外接的电路板50连接。利用上述结构设计，使本实用新型整体占用有限电路板50的布局情形下，能够容纳更多或更大的线圈本体20，从而产生最经济效果。
如图4所示，位于上方习知绝缘封装线圈组件与位于下方的本实用新型直接对比时，在占用相同电路板面积AA’的条件下，习知的绝缘封装线圈组件的导电端子11是从绝缘封装层10的两侧面伸出，并形成转折朝向电路板14方向延伸，所以在空间上占据了部分电路板14的面积，致使绝缘封装层10可涵盖的范围相对较小，也就是其容纳空间小。
本实用新型数个导电端子30未被绝缘封装层40包裹的外露部分31外露于绝缘封装层40的底面41，所以绝缘封装层40可涵盖电路板50上预留的全部空间，换言之，其内部的容纳空间相对增大，从而，进一步可让产品设计者在电子产品趋于小型化、电子元件安装空间有限的情形下，仍能充分发挥电子元件的特性及功能。

Claims (1)

1、一种绝缘封装线圈组件，它包括至少一线圈本体、数个导电端子及绝缘封装层；数个导电端子分别连接线圈本体绕线的两端；绝缘封装层以包裹方式封装包裹线圈本体及数个导电端子一部分；其特征在于所述的未被绝缘封装层包裹的数个导电端子外露部分外露于绝缘封装层的底面。
CNU2003201303352U 2003-12-24 2003-12-24 绝缘封装线圈组件 Expired - Fee Related CN2684342Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2003201303352U CN2684342Y (zh) 2003-12-24 2003-12-24 绝缘封装线圈组件
US11/012,757 US20050141205A1 (en) 2003-12-24 2004-12-16 Insulating package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2003201303352U CN2684342Y (zh) 2003-12-24 2003-12-24 绝缘封装线圈组件

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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505811A (en) * 1968-09-23 1970-04-14 Gen Electric Control system for a combined gas turbine and steam turbine power plant
US3590480A (en) * 1968-10-03 1971-07-06 Theodore H Johnson Jr Method of manufacturing a pulse transformer package
US5015981A (en) * 1990-08-21 1991-05-14 Pulse Engineering, Inc. Electronic microminiature packaging and method
US6297720B1 (en) * 1995-08-10 2001-10-02 Halo Electronics, Inc. Electronic surface mount package
US5656985A (en) * 1995-08-10 1997-08-12 Halo Electronics, Inc. Electronic surface mount package
US6320489B1 (en) * 1995-08-10 2001-11-20 Halo Electronics, Inc. Electronic surface mount package with extended side retaining wall
US6662431B1 (en) * 1997-08-06 2003-12-16 Halo Electronics, Inc. Electronic surface mount package
US6642827B1 (en) * 2000-09-13 2003-11-04 Pulse Engineering Advanced electronic microminiature coil and method of manufacturing

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