CN2659032Y

CN2659032Y - Heat sink structure of radio communication device

Info

Publication number: CN2659032Y
Application number: CN 03252686
Authority: CN
Inventors: 简弘智
Original assignee: Lite On Technology Corp
Current assignee: Yogon Science & Technology Co., Ltd.
Priority date: 2003-09-29
Filing date: 2003-09-29
Publication date: 2004-11-24
Anticipated expiration: 2013-09-29

Abstract

The utility model relates to a radiation mechanism arranged at a wireless communication device, which comprises a circuit board, a temperature chip of induction and detection chip and two mini fans, wherein a microprocessor is positioned on the circuit board; the temperature chip of induction and detection is positioned at a proper position at the circuit board and connected with a heat conductor of induction and detection contacting the microprocessor; two mini fans are arranged at two opposite sides of the circuit board and connected with the temperature chip of induction and detection. The utility model makes the temperature chip of induction and detection connected with the circuit board arranged at the wireless communication device and uses the heat conductor of induction and detection connected with the temperature chip of induction and detection to monitor the temperature of the microprocessor arranged at the circuit board and then drives two mini fans to cool and radiate the microprocessor. Further, the rotation speed of two mini fans can be controlled in accordance with the monitored temperature till a complete stop. The utility model is characterized in a design which integrates the radiation improving the microprocessor efficiency with the electricity saving.

Description

The radiator structure of radio communication device

Technical field

The utility model relates to a kind of radiator structure of radio communication device, is particularly useful for a kind of radio communication device, and it monitoring the temperature of a microprocessor, and then activates two mini-fans by a temperature sensing chip, to dispel the heat.

Background technology

Present mobile phone is with in conjunction with functions such as PDA, multimedias, even the network gaming of JAVA, it must play the film format of MPEG or the music archive form of MP3, the mobile phone of this moment has been to have stepped into the mobile phone of multimedia era, this mobile phone must be handled considerable computing, the load of its microprocessor certainly will be more and more heavier, meeting the multiduty function of present mobile phone, even multimedia functions such as video conference or satellite television.

Mobile phone is in the past only handled some simple calculations; and what face now is complex calculation as personal computer; so very quick and very numerous and diverse calculation process; cause microprocessor to produce a large amount of heat; heat can cause the microprocessor loss of function; constantly the computing meeting produces a large amount of heats; and cause microprocessor processes speed to slow down; even shut down or the like; though so constantly research and development innovation always of radio communication device at present, the heat dissipation problem that its microprocessor faced also must be resolved thereupon.

Therefore, how proposing a kind of radiator structure of novel radio communication device at the problems referred to above, thereby improve the insurmountable shortcoming of microprocessor heat dissipation problem of conventional wireless communications devices, is that people look forward to the problem that solved for a long time always.The communication of utility model the utility model proposes a kind of radiator structure of radio communication device, thereby can address the above problem.

Summary of the invention

Main purpose of the present utility model, be to provide a kind of radiator structure of radio communication device, utilize a temperature sensing chip to carry out monitoring temperature to a microprocessor, and be connected with two mini-fans, when the temperature of temperature sensing chip monitoring is too high, by activating these two mini-fans to carry out heat radiation to microprocessor.

Secondary objective of the present utility model is to provide a kind of radiator structure of radio communication device, and it utilizes a plurality of heat radiation conduits to be covered in the top of a circuit board, and is provided with a heat carrier in these central authorities, with to the microprocessor auxiliary heat dissipation.

Secondary objective of the present utility model, be to provide a kind of radiator structure of radio communication device, it utilizes this this mini-fan of temperature sensing chip controls, and under the different height of monitoring temperature of micro, the rotating speed of control mini-fan, it is one can take into account the radiator structure of usefulness, heat radiation and power saving.

In order to achieve the above object, the utility model provides a kind of radiator structure of radio communication device, and its primary structure comprises: a circuit board, and the top of this circuit board connects a microprocessor; One temperature sensing chip, it is placed in the appropriate location of this circuit board, and this temperature sensing chip connects a sensible heat call wire, and this sensible heat call wire contacts with this microprocessor; Two mini-fans, it places the relative both sides of this circuit board, and is connected with this temperature sensing chip; And a plurality of heat radiation conduits, it is placed in the top of this circuit board, and the central authorities of these a plurality of heat radiation conduits comprise a heat carrier, and this heat carrier contacts with the top of this microprocessor; Wherein, monitor the temperature of this microprocessor, dispel the heat to activate these two mini-fans by this sensible heat call wire of this temperature sensing chip, and by these a plurality of heat radiation conduits and this heat carrier with auxiliary heat dissipation.

The radiator structure of above-mentioned radio communication device, it utilizes a temperature sensing chip to be connected on the circuit board of a radio communication device, monitor the temperature of the microprocessor on this circuit board by a sensible heat call wire of this temperature sensing chip, microprocessor is dispelled the heat carrying out to drive two mini-fans, and can be according to the temperature of being monitored, and control the rotating speed of these two mini-fans even stop usefulness that improves microprocessor to dispel the heat and the design that has power saving concurrently.

Description of drawings

Fig. 1: be the top view of preferred embodiment of the present utility model;

Fig. 2: be the end view of preferred embodiment of the present utility model;

Fig. 3 A: be the schematic diagram of a preferred embodiment of the present utility model;

Fig. 3 B: be the enforcement schematic diagram of another preferred embodiment of the present utility model; And

Fig. 3 C: be the enforcement schematic diagram of another preferred embodiment of the present utility model.

Wherein, description of reference numerals is as follows:

10 circuit boards

12 microprocessors

20 temperature sensing chips

22 sensible heat call wires

30 mini-fans

40 heat radiation conduits

42 heat carriers

Embodiment

Further understand and understanding for architectural feature of the present utility model and the effect that reached are had, below the utility model be elaborated by preferred embodiment:

The utility model is to utilize a temperature sensing chip to carry out the temperature control to microprocessor, by two mini-fans, heat radiation conduit and heat carriers, to carry out the heat radiation to this microprocessor.

At first, consult Fig. 1 and Fig. 2, it is the top view and the end view of a preferred embodiment of the utility model; The radiator structure of a kind of radio communication device of the present utility model comprises circuit board 10, a temperature sensing chip 20, two mini-fans 30 and a plurality of heat radiation conduits 40 of a radio communication device.

This circuit board 10 comprises a microprocessor 12, and this temperature sensing chip 20 is positioned over a side of this microprocessor 12, and this temperature sensing chip 20 connects a sensible heat call wire 22, and this sensible heat call wire 22 contacts with this microprocessor 12, to carry out the monitoring temperature to this microprocessor 12.

And these two mini-fans 30 are positioned at the relative both sides of this circuit board 10 to be put, and these two mini-fans, 30 controlled this temperature sensing chips 20 that are formed on; Moreover these a plurality of heat radiation conduits 40 are positioned over the top of this circuit board 10, are provided with a heat carrier 42 in the central authorities of these a plurality of heat radiation conduits 40, and this heat carrier 42 is positioned at the top of this microprocessor 12, and contact with this microprocessor 12.

Consult Fig. 3 A, it is the heat radiation schematic diagram of a preferred embodiment of the present utility model; As shown in the figure, the radiator structure of radio communication device of the present utility model, the temperature of being monitored by this sensible heat call wire 22 when this temperature sensing chip 20 is during greater than the temperature set, this moment, this temperature sensing chip 20 promptly activated these two mini-fans 30 to dispel the heat, these two mini-fans 30 can be subjected to this temperature sensing chip 20 controls, when monitor temperature during much larger than design temperature, this moment can be via the rotating speed of these temperature sensing chip 20 these two mini-fans 30 of control, carry out quick heat radiating to increase rotating speed, if monitor temperature is during less than this design temperature, this temperature sensing chip 20 promptly can stop the rotation of these two mini-fans 30, and the behavior of heat radiation just consigns to this heat carrier 42 and a plurality of heat radiation conduits 40.

Consult Fig. 3 B and Fig. 3 C, it is the enforcement schematic diagram of another preferred embodiment of the present utility model; As shown in the figure, if during a plurality of heat radiation conduit of the present utility model 40 fine and close arrangements, the wind direction approach of its heat radiation just as shown in Figure 3A, a mini-fan is that another mini-fan of air inlet is an air outlet, promptly a mini-fan is the suction-type fan, and one is discharge formula fan; When if a plurality of heat radiation conduits 40 are arranged for loosening, the wind direction approach of this heat radiation just can be shown in Fig. 3 B and Fig. 3 C, Fig. 3 B is all air outlet for these two mini-fans 30, and promptly two mini-fans are all discharge formula fan, and this moment, air inlet was the loose space of a plurality of heat radiation conduits; If these two mini-fans 30 are all air inlet, promptly two mini-fans are all the suction-type fan, and this moment, air outlet was the loose space of a plurality of heat radiation conduits, shown in Fig. 3 C.

The utility model utilize a temperature sensing chip with provide with a radio communication device in little processing carry out the monitoring of temperature, and by controlling two mini-fans to dispel the heat, when temperature is not higher than design temperature, the work of heat radiation this moment is paid in a plurality of heat radiation conduits and a heat carrier and is carried out, when if temperature is higher than design temperature, this temperature sensing chip promptly can activate these two mini-fans to dispel the heat, it further discloses can be by the temperature sensing chip with the rotating speed of controlling these two mini-fans even stop, to dispel the heat and can have the function of power saving concurrently.

Above said content; it only is a preferred embodiment of the present utility model; be not to be used for limiting protection range of the present utility model; all variation and modifications of being carried out according to the described shape of the utility model claim, structure, feature and spirit all should be included in the claim of the present utility model.

Claims

1. the radiator structure of a radio communication device is characterized in that comprising:

One circuit board, the top of this circuit board connects a microprocessor;

One temperature sensing chip, it is placed in the appropriate location of this circuit board, and this temperature sensing chip connects a sensible heat call wire, and this sensible heat call wire contacts with this microprocessor;

Two mini-fans, it places the relative both sides of this circuit board, and is connected with this temperature sensing chip; And

A plurality of heat radiation conduits, it is placed in the top of this circuit board, and the central authorities of these a plurality of heat radiation conduits comprise a heat carrier, and this heat carrier contacts with the top of this microprocessor.

2. the radiator structure of radio communication device as claimed in claim 1 is characterized in that this two mini-fans, and one is the suction-type fan, and one is discharge formula fan.

3. the radiator structure of radio communication device as claimed in claim 1 is characterized in that these two mini-fans are all the suction-type fan.

4. the radiator structure of radio communication device as claimed in claim 1 is characterized in that these two mini-fans are all discharge formula fan.

5. the radiator structure of radio communication device as claimed in claim 1 is characterized in that these a plurality of heat radiation conduits can be fine and close the arrangement.

6. the radiator structure of radio communication device as claimed in claim 1 is characterized in that these a plurality of heat radiation conduits can be loose the arrangement.