CN215898264U

CN215898264U - Active and passive heat dissipation system of intelligent head display equipment

Info

Publication number: CN215898264U
Application number: CN202120830989.4U
Authority: CN
Inventors: 张银潇; 何浪
Original assignee: Shanghai Quli Information Technology Co ltd
Current assignee: Shanghai Quli Information Technology Co ltd
Priority date: 2021-04-22
Filing date: 2021-04-22
Publication date: 2022-02-22
Anticipated expiration: 2031-04-22

Abstract

The utility model relates to the technical field of intelligent application, in particular to an active and passive heat dissipation system of intelligent head display equipment, which adopts a heat pipe to dissipate heat quickly, increases the heat dissipation area by a lug boss and heat dissipation fins, achieves more excellent heat dissipation effect and improves the reliability; the PCB board comprises an aluminum magnesium alloy bracket, a passive heat dissipation mechanism, a heat transfer mechanism, a heat dissipation conduction device part, a heat pipe fixing steel sheet, a PCB board, a first heating chip, first heat conduction silica gel, a heat pipe fixing copper sheet, a second heating chip, second heat conduction silica gel and third heat conduction silica gel, wherein the passive heat dissipation mechanism is fixed on the aluminum magnesium alloy bracket through screws, heat is conducted between the heat dissipation conduction device part and the heat pipe fixing copper sheet through the heat conduction silica gel, the heat transfer mechanism is fixed on the aluminum magnesium alloy bracket through the heat pipe fixing steel sheet, and then the heat transfer mechanism is fixed with the heat pipe fixing copper sheet through welding and is in contact with the first heating chip through the first heat conduction silica gel; and finally, the second heating chip conducts heat to the heat dissipation and conduction device part through the third heat conduction silica gel.

Description

Active and passive heat dissipation system of intelligent head display equipment

Technical Field

The utility model relates to the technical field of intelligent application, in particular to an active and passive heat dissipation system of intelligent head display equipment.

Background

As is well known, an active and passive heat dissipation system for smart head display devices is an auxiliary device for performing active and passive heat dissipation on smart head display devices, and is widely used in the field of smart applications; the financial technology is in the development stage of China, and can be roughly divided into an early informatization stage, an internet stage, a mobility stage, an intellectualization stage and a future change stage, at present, the financial industry gradually advances into an 'intelligent finance' stage, and the investment of financial institutions on technical personnel and resources is gradually deepened; leading-edge technologies such as big data, cloud computing, artificial intelligence and the like are used for further improving links such as marketing, wind control, throwing and grinding, throwing and considering, product innovation, customer management and the like in the financial industry; the development of cloud computing, big data, artificial intelligence, the Internet of things and 5G technology, software and hardware is changing day by day; people can shop on the internet, take out the goods on the spot by the mobile phone, get a car by the mobile phone, and enjoy all the convenience brought by the internet by moving fingers, wherein the internet already covers the clothes and residents of the people; when the application scene of the consumption internet tends to be saturated, the application of the internet gradually starts to change to occupy the next highest point, namely the industrial internet; the intelligent head display equipment is used as a machine which bears the Internet and has certain specific functions, usually, higher power is required to be applied to meet the requirement of use, the problem of serious equipment heating is caused by the use of the high power, and the scheme that the heat pipe is independently used by the heat dissipation equipment at the present stage has the following problems that 1, the heat pipe is independently used for heat dissipation, and the heat inside the head display cannot be quickly led out of a shell;

2. the temperature of part of the heating chips is too high;

3. the fan unilateral air-out can't compromise heat source all around for the radiating effect is not good, and then influences the use of intelligent head display equipment, leads to the reliability relatively poor.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems, the present invention provides an active and passive heat dissipation system for an intelligent head display device, which uses a heat pipe to dissipate heat quickly, uses a centrifugal fan to blow air quickly to cool, and uses a boss and heat dissipation fins to increase the heat dissipation area, thereby achieving a more excellent heat dissipation effect and improving reliability.

The utility model discloses an active and passive heat dissipation system of intelligent head display equipment, which comprises an aluminum magnesium alloy support, a passive heat dissipation mechanism, a heat transfer mechanism, a heat dissipation and conduction device part, a heat pipe fixing steel sheet, a PCB (printed circuit board), a first heating chip, first heat conduction silica gel, a heat pipe fixing copper sheet, a second heating chip, second heat conduction silica gel, third heat conduction silica gel, and the PCB, wherein the passive heat dissipation mechanism is fixed on the aluminum magnesium alloy support through screws, heat is conducted between the heat dissipation and conduction device part and the heat pipe fixing copper sheet through the second heat conduction silica gel, the heat transfer mechanism is fixed on the aluminum magnesium alloy support through the heat pipe fixing steel sheet, and then the heat transfer mechanism is fixed with the heat pipe fixing copper sheet through welding and is contacted with the first heating chip through the first heat conduction silica gel; and finally, the second heating chip conducts heat to the heat dissipation and conduction device part through the third heat conduction silica gel.

According to the active and passive heat dissipation system of the intelligent head display equipment, the heat transfer mechanism adopts the heat pipe.

The active and passive heat dissipation system of the intelligent head display equipment adopts a centrifugal fan as the passive heat dissipation mechanism.

The utility model discloses an active and passive heat dissipation system of intelligent head display equipment.

Compared with the prior art, the utility model has the beneficial effects that: 1. after the whole machine operates, the heat transfer mechanism guides the temperature of the heating chip to the heat dissipation bracket.

2. The passive heat dissipation mechanism can blow air to the periphery to take away the heat around.

3. The aluminum magnesium alloy support is provided with a heat dissipation and conduction device part at a position close to the heating chip, and heat conduction is carried out through third heat conduction silica gel.

4. The heating chip is conducted to the heat pipe fixing copper sheet through the first heat conduction silica gel, and then conducted to the heat dissipation and conduction device component through the second heat conduction silica gel.

Drawings

FIG. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic side view of the present invention;

in the drawings, the reference numbers: 101. an aluminum magnesium alloy bracket; 102. a centrifugal fan; 103. a heat pipe; 104. Heat dissipation fins; 105. fixing the steel sheet by the heat pipe; 106. a pcb board; 107. a first heat generating chip; 108. a first thermally conductive silica gel; 109. fixing a copper sheet by the heat pipe; 110. an aluminum magnesium alloy boss; 111. a second heat generating chip; 112. second heat-conducting silica gel; 113. and third heat-conducting silica gel.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.

As shown in fig. 1 to 2, the active and passive heat dissipation system for an intelligent head display device of the present invention includes an al-mg alloy support 101, a passive heat dissipation mechanism, a heat transfer mechanism, a heat dissipation and conduction device component, a heat pipe fixing steel sheet 105, a PCB 106, a first heat-generating chip 107, a first heat-conducting silica gel 108, a heat pipe fixing copper sheet 109, a second heat-generating chip 111, a second heat-conducting silica gel 112, and a third heat-conducting silica gel 113, wherein the PCB 106 is fixed on the al-mg alloy support 101 by screws, the heat dissipation and conduction device component and the heat pipe fixing copper sheet 109 conduct heat through the second heat-conducting silica gel 112, the heat transfer mechanism is fixed on the al-mg alloy support 101 by the heat pipe fixing steel sheet 105, and then the heat transfer mechanism is fixed with the heat pipe fixing copper sheet 109 by welding and is in contact with the first heat-generating chip 107 through the first heat-conducting silica gel 108; finally, the second heating chip 111 conducts heat to the heat dissipation and conduction device component through the third heat conduction silica gel 113; 1. after the whole machine is operated, the heat transfer mechanism guides the temperature of the first heating chip 107 to the heat dissipation bracket.

3. The aluminum magnesium alloy bracket 101 has a heat dissipation and conduction device component at a position close to the second heat generating chip 111, and heat conduction is performed through the third heat conductive silicone 113.

4. The first heat-generating chip 107 is thermally conducted to the heat pipe fixing copper sheet 109 through the first heat-conducting silica gel 108, and then is thermally conducted to the heat dissipation and conduction device component through the second heat-conducting silica gel 112.

According to the active and passive heat dissipation system of the intelligent head display equipment, the heat transfer mechanism adopts the heat pipe 103; the heat pipe is adopted to rapidly conduct the heat to the heat dissipation support, so that a large amount of passive heat dissipation of the chip is increased.

According to the active and passive heat dissipation system of the intelligent head display equipment, the centrifugal fan 102 is adopted as the passive heat dissipation mechanism; through adopting open centrifugal fan heat dissipation scheme, can blow away the temperature of on the heat dissipation support and PCB board fast, reduce entire system's temperature.

The utility model discloses an active and passive heat dissipation system of intelligent head display equipment, wherein a heat dissipation conduction device part comprises heat dissipation fins 104 and an aluminum magnesium alloy boss 110; by adopting the mode of increasing the bosses and the radiating fins, the radiating area is increased, and the problem of overhigh temperature of a part of heating chips can be solved.

The active and passive heat dissipation system of the intelligent head display equipment is characterized in that when the intelligent head display equipment works, 1, after the whole machine runs, the heat pipe 103 guides the temperature of the first heating chip 107 to the heat dissipation support.

2. The centrifugal fan 102 is an open centrifugal fan, and can blow air around to take away heat around.

3. The aluminum magnesium alloy bracket 101 has an aluminum magnesium alloy boss 110 at a position close to the second heat generating chip 111, and heat conduction is performed through third heat conducting silica gel 113.

4. The first heat-generating chip 107 is thermally conducted to the heat pipe fixing copper sheet 109 through the first heat-conducting silicone 108, and then thermally conducted to the heat-dissipating fins 104 through the second heat-conducting silicone 112.

The active and passive heat dissipation system of the intelligent head display equipment is implemented in a common mechanical mode in an installation mode, a connection mode or a setting mode as long as the beneficial effects of the system can be achieved.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. An active and passive heat dissipation system of an intelligent head display device is characterized by comprising an aluminum magnesium alloy support (101), a passive heat dissipation mechanism, a heat transfer mechanism, a heat dissipation and conduction device part, a heat pipe fixing steel sheet (105), a PCB (106), a first heating chip (107), first heat-conducting silica gel (108), a heat pipe fixing copper sheet (109), a second heating chip (111), second heat-conducting silica gel (112) and third heat-conducting silica gel (113), wherein the passive heat dissipation mechanism is fixed on the aluminum magnesium alloy support (101) through screws, heat is conducted between the heat dissipation and conduction device part and the heat pipe fixing copper sheet (109) through the second heat-conducting silica gel (112), and the heat transfer mechanism is fixed on the aluminum magnesium alloy support (101) through the heat pipe fixing steel sheet (105), then the heat transfer mechanism is fixed with a heat pipe fixing copper sheet (109) through welding, and is contacted with a first heating chip (107) through first heat-conducting silica gel (108); and finally, the second heating chip (111) conducts heat to the heat dissipation and conduction device component through the third heat conduction silica gel (113).

2. The active and passive heat dissipation system of claim 1, wherein the heat transfer mechanism employs a heat pipe (103).

3. The active and passive heat dissipation system of smart head display device as recited in claim 2, wherein the passive heat dissipation mechanism employs a centrifugal fan (102).

4. The active and passive heat dissipation system of smart head display device according to claim 3, wherein the heat dissipation conducting means comprises heat dissipation fins (104) and aluminum magnesium alloy bosses (110).