CN2651817Y - Water cooler for temperature adjustable computer CPU and hard disk - Google Patents
Water cooler for temperature adjustable computer CPU and hard disk Download PDFInfo
- Publication number
- CN2651817Y CN2651817Y CN 03223781 CN03223781U CN2651817Y CN 2651817 Y CN2651817 Y CN 2651817Y CN 03223781 CN03223781 CN 03223781 CN 03223781 U CN03223781 U CN 03223781U CN 2651817 Y CN2651817 Y CN 2651817Y
- Authority
- CN
- China
- Prior art keywords
- water
- hard disk
- water cooler
- cpu
- main frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A temperature adjustable water-cooling device for computer CPU and hard disk is provided, which connects a semiconductor refrigeration mainframe positioned outside a computer mainframe case with a CPU water-cooler and a hard disk water-cooler inside the case to form a closed loop pipeline. Wherein, water, the circulating pump forcible heat-exchange medium inside the semiconductor refrigeration mainframe is circulated inside the closed loop pipeline; the circulated water bring the heat of the CPU and the hard disk outside the case to exchange with the semiconductor refrigeration mainframe; in addition, the utility model is capable of setting the cooling temperature value of the CPU and the hard disk to cool the CPU and the hard disk and emitting the heat outside the computer mainframe case finally.
Description
Affiliated technical field
But the utility model relates to a kind of temperature adjustment, is used to cool off the water cooling plant of computer CPU, hard disk, especially can set the cooling surface temperature value of CPU, hard disk, and the thermal value of CPU, hard disk is distributed outside the cabinet.
Background technology
As everyone knows, the type of cooling of computer CPU adopts forced air cooling in the cabinet mostly at present, or installs the semiconductor chilling plate cooling between forced air cooling heating radiator and cpu chip additional; The hard disk type of cooling has: natural air cooled and install fan forced air cooling mode additional.And the above type of cooling can only be cooled off CPU and hard disk in the host computer cabinet, can not regulate amount of cooling water according to the thermal value situation of CPU and hard disk, accurately regulate the temperature value of CPU and hard disk, and the thermal value of CPU and hard disk can not be rapidly, be dispersed into outside the cabinet fully.
Summary of the invention:
For overcoming existing C PU, the hard disk type of cooling, can not regulate amount of cooling water according to the thermal value situation of CPU and hard disk, accurately set the temperature value of CPU, hard disk, and can not take CPU, hard disk thermal value to cabinet outer shortcoming, but the utility model provides a kind of temperature adjustment computer CPU, hard disk cooling device, this device can be regulated CPU, the required amount of cooling water of hard disk, and can accurately be cooled to the desired temperature value that the user sets to CPU, hard disk, and the thermal value of CPU and hard disk is dispersed into outside the cabinet.
Technical scheme:
But a kind of temperature adjustment computer CPU, hard disk water cooling plant have the semiconductor refrigerating main frame outside computer host box; CPU water cooler, hard disk water cooler are arranged in the cabinet; And the connector that is installed in the cabinet backboard arranged.
The semiconductor refrigerating main frame has semiconductor chilling plate, and the cooling piece huyashi-chuuka (cold chinese-style noodles) is glued with metal water cooler, and water cooler is connected to water circulating pump, and the cooling piece hot side has aluminium alloy heat radiator and radiator fan, and host panel has temperature controller; By connector, water pipe links to each other the outer semiconductor refrigerating main frame of computer host box and is connected into a closed loop water circulation line with CPU water cooler, hard disk water cooler in the cabinet, and water circulates in pipeline as the exchange heat medium.
Below in conjunction with drawings and Examples the utility model is further specified.
Description of drawings:
Fig. 1 is the stereographic map (synoptic diagram) that the utility model is implemented in the host computer cabinet.
Fig. 2 is connector front view (synoptic diagram).
Fig. 3 is connector vertical view (synoptic diagram).
Fig. 4 is a CPU water cooler stereographic map (synoptic diagram).
Fig. 5 is a CPU water cooler internal view (synoptic diagram).
Fig. 6 is a hard disk water cooler stereographic map (synoptic diagram).
Fig. 7 is a hard disk water cooler internal view (synoptic diagram).
Fig. 8 is a semiconductor refrigerating main frame water cooler internal view (synoptic diagram).
Fig. 9 is a semiconductor refrigerating main frame vertical view (synoptic diagram).
Figure 10 is the secondary water tank longitudinal sectional view (synoptic diagram) of semiconductor refrigerating main frame.
Figure 11 is a semiconductor refrigerating main frame longitudinal sectional view (synoptic diagram).
Figure 12 is the utility model temperature control circuit schematic diagram.
Figure 13 is a semiconductor refrigerating main frame front view (synoptic diagram).
In Fig. 1-13: 1 semiconductor refrigerating main frame, 2 semiconductor refrigerating main frame cooling water outlets, 3 semiconductor refrigerating main frame hot water inlets, 4 semiconductor refrigerating main frame radiator fans, 5 semiconductor refrigerating main frame heating radiators, 6 attached water casees, 7 filler, 8 thermoregulation knobs, 9 computer host power supplies, 10 stube cables, the fast plug-in unit of 11 power supplys, 12 connectors, 13 computer host box backboards, 14 computer host box panels, 15 hard disk water coolers, 16 computer main boards, 17 hot wires, 18CPU water cooler button spring, 19CPU water cooler, 20CPU water cooler hot water outlet, 21CPU water cooler cold water inlet, 22 hard disk water cooler hot water outlets, 23 hard disk water cooler cold water inlets, 24 host computer box plates, 25 hard disk water cooler fixed iron pieces, 26 hard disks, 27 computer host box lamina tectis, 28 water pumps, 29 semiconductor refrigerating main frame water coolers, 30 temperature control circuit boards, 31 semiconductor refrigerating host panels, 32 motors, 33 semiconductor chilling plates, 34 thermofins, 35 hard disk water cooler fixed iron piece screw holes, 36 connector hot-water lines, 37 connector cold water pipes, 38 thermal resistances, 39 hoses, 40 controllable silicons, 41 level window, the 42 liquid level upper limits, 43 liquid level lower limits, 44 liquid levels, 45 temperature scales, 46 semiconductor refrigerating main frame water cooler rising pipes, 47 semiconductor refrigerating main frame water cooler filling pipes, antiskid glue cushion at the bottom of the 48 semiconductor refrigerating main frames.
Embodiment:
In Fig. 1, semiconductor refrigerating main frame 1 is placed on the computer host box lamina tecti 27, by CPU water cooler button spring 18, with CPU water cooler 19 and CPU chip of computer fastening, and thermal resistance 38 is fixed between cpu chip and the CPU water cooler 19, between cpu chip and CPU water cooler 19, evenly scribble heat-conducting silicone grease; By three hard disk water cooler fixed iron pieces 25, hard disk water cooler 15 and hard disk 26 hot side fastenings also evenly can be scribbled heat-conducting silicone grease therebetween; By hose 39, semiconductor refrigerating main frame cooling water outlet 2 is linked to each other with connector cold water pipe 37, connector cold water pipe 37 is linked to each other with CPU water cooler cold water inlet 21, CPU water cooler hot water outlet 20 is linked to each other with hard disk water cooler cold water inlet 23, hard disk water cooler hot water outlet 22 is linked to each other with connector hot-water line 36, connector hot-water line 36 is linked to each other with semiconductor refrigerating main frame hot water inlet 3, finally semiconductor refrigerating main frame water cooler 29, water pump 28, CPU water cooler 19, hard disk water cooler 15 connect one and become the closed loop pipeline; The stube cable 10 of semiconductor refrigerating main frame 1 passes connector 12 and links to each other with computer host power supply 9 by the fast plug-in unit 11 of power supply, allows semiconductor refrigerating main frame 1 obtain power supply.
Among Figure 13, inject water to filler 7, allow be full of water in attached water case 6 and the pipeline, guarantee that liquid level 44 is between the liquid level upper limit 42 and the liquid level lower limit 43 in the level window 41, according to the temperature scale in the semiconductor refrigerating host panel 31 45, regulate thermoregulation knob 8 and can set CPU, hard disk temperature control value.
Start host computer, semiconductor refrigerating main frame 1 gets electric, and while pump motor 32 gets electric, and water pump 28 work force the water cycle in the pipeline mobile, and water (flow) direction is shown in 39 arrows of hose among Fig. 1.
Temperature control circuit board 30 detects cpu chip surface temperature value by thermal resistance 38: 1. when cpu chip surface temperature value is higher than set temperature value, controllable silicon 40 conductings, semiconductor chilling plate 33 gets electric refrigeration and semiconductor refrigerating main frame water cooler 29 carries out heat interchange, semiconductor chilling plate 33 absorbs water from CPU, the heat that hard disk brings, by semiconductor refrigerating main frame heating radiator 5 and semiconductor refrigerating main frame radiator fan 4 heat is dispersed in the outer air of computer housing, 2. when cpu chip surface temperature value is lower than set temperature value, controllable silicon 40 turn-offs, and semiconductor chilling plate 33 stops refrigeration.Temperature control circuit board 30 will be according to 38 detected value and set temperature value comparison, repeats that 1. 2. CPU, hard disk are cooled to set temperature value the most at last.
Connector 12 sizes equate with computer host box backboard 13 dust-break bars in Fig. 2, Fig. 3, can be easily installed on the computer host box backboard 13.
In Fig. 5, Fig. 7, Fig. 8, CPU water cooler 19 is cut apart 3 water flow grooves, hard disk water cooler 15 is divided into 4 water flow grooves, semiconductor refrigerating main frame water cooler 29 is divided into 4 water flow grooves, water (flow) direction is shown in arrow among the figure, this design avoids current by short circuit, can allow in the water cooler water fully and contact carry out heat interchange, improved heat exchanger effectiveness.
The beneficial effects of the utility model are: according to the caloric value situation of CPU, hard disk, and the active adjustment cooling Amount reaches the surface temperature value that the user sets CPU, hard disk, and CPU, hard disk caloric value in the cabinet Be dispersed into outside the cabinet.
Claims (5)
1. but temperature adjustment computer CPU, the hard disk water cooling plant, the semiconductor refrigerating main frame is arranged outside computer host box, the CPU water cooler is arranged in cabinet, the hard disk water cooler, pass through connector, water pipe is semiconductor refrigerating main frame and CPU water cooler, the hard disk water cooler is connected becomes a closed loop water cooling back installation, it is characterized in that: the semiconductor refrigerating main frame has semiconductor chilling plate, the cooling piece huyashi-chuuka (cold chinese-style noodles) has metal water cooler, water cooler is connected to water circulating pump, hot side has aluminium alloy heat radiator and radiator fan, host panel has temperature controller, pass through connector, water pipe is semiconductor refrigerating main frame and CPU water cooler, the hard disk water cooler links to each other and is connected into a closed loop water circulation line, and water circulates in pipeline as the exchange heat medium.
2. semiconductor refrigerating main frame water cooler according to claim 1 is characterized in that: semiconductor refrigerating main frame water cooler is a rectangular parallelepiped of being made by metallic copper, four water flow grooves that inside has three-piece metal copper barrier to become; There are three mouths of a river the outside, and upper side is the hot water inlet, and left surface is cooling water outlet and additional water pipe.
3. CPU water cooler according to claim 1, it is characterized in that: the CPU water cooler is a square of being made by the metallic copper sealing, three water flow grooves that inside has two metallic copper barriers to become, the outer square upper surface is a cold water inlet, the diagonal line place is a hot water outlet.
4. hard disk water cooler according to claim 1, it is characterized in that: the hard disk water cooler is a rectangular parallelepiped of being made by the metallic copper sealing, four water flow grooves that inside has three-piece metal copper barrier to become, exterior top surface has three undercut shape hard disk water cooler fixed iron pieces.
5. connector according to claim 1 is characterized in that: connector has two strip metal pipes and one to connect power lead soon; Metal tube runs through inside and outside the host computer cabinet, and connecing power lead soon has cabinet nipple and coupling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03223781 CN2651817Y (en) | 2003-02-20 | 2003-02-20 | Water cooler for temperature adjustable computer CPU and hard disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03223781 CN2651817Y (en) | 2003-02-20 | 2003-02-20 | Water cooler for temperature adjustable computer CPU and hard disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2651817Y true CN2651817Y (en) | 2004-10-27 |
Family
ID=34325963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03223781 Expired - Fee Related CN2651817Y (en) | 2003-02-20 | 2003-02-20 | Water cooler for temperature adjustable computer CPU and hard disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2651817Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN107386030A (en) * | 2017-07-31 | 2017-11-24 | 中铁西北科学研究院有限公司 | The heat-staple method of frozen soil foundation is safeguarded using semiconductor driving heat-pipe refrigerating |
| CN109634389A (en) * | 2018-12-17 | 2019-04-16 | 沈阳体育学院 | Hard disc of computer water cooling module testing jig and hard disc of computer water cooling component |
-
2003
- 2003-02-20 CN CN 03223781 patent/CN2651817Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN107386030A (en) * | 2017-07-31 | 2017-11-24 | 中铁西北科学研究院有限公司 | The heat-staple method of frozen soil foundation is safeguarded using semiconductor driving heat-pipe refrigerating |
| CN109634389A (en) * | 2018-12-17 | 2019-04-16 | 沈阳体育学院 | Hard disc of computer water cooling module testing jig and hard disc of computer water cooling component |
| CN109634389B (en) * | 2018-12-17 | 2022-03-11 | 沈阳体育学院 | Computer hard disk water-cooling component test fixture |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8701429B2 (en) | Air conditioning system | |
| CN203432016U (en) | Desk-type portable semiconductor refrigeration air conditioner | |
| CN102160171A (en) | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack | |
| CN104833011A (en) | Outdoor unit for air conditioner | |
| CN201396875Y (en) | Special air conditioner for embedded cabinet | |
| CN202231001U (en) | Chip cooling device for control module of variable frequency air conditioner | |
| KR20180132789A (en) | Air conditioning system | |
| CN201599988U (en) | Water-cooling environmental-protection central air conditioner of semiconductor ceramic chip | |
| CN2651817Y (en) | Water cooler for temperature adjustable computer CPU and hard disk | |
| CN102734873A (en) | Distributed heat management device of communication machine room | |
| CN2410678Y (en) | Computer host radiator | |
| CN211429864U (en) | Single rack data center liquid cooling structure | |
| CN205491614U (en) | Integral type cooling device | |
| CN202902469U (en) | Distributed heat management device of communication machine room | |
| CN205014512U (en) | Air conditioner outdoor unit | |
| CN211240639U (en) | Heat radiation system of high-power combined electrical cabinet | |
| CN2909795Y (en) | Water-cooled heat sink with cooling chip | |
| CN209299654U (en) | Compressor test equipment and controller radiator | |
| CN207378964U (en) | A kind of automatically controlled plate heat dissipating device and air-conditioner outdoor unit | |
| CN216745559U (en) | Stable tower top dry type air cooler with convection cooling structure | |
| CN112930082B (en) | Radiating method for control panel of range hood | |
| CN210399246U (en) | Air condensing units and air conditioner | |
| CN2651806Y (en) | Low-consumption computer housing | |
| CN214198944U (en) | Control circuit board, electrical apparatus box, air conditioning system | |
| CN2745112Y (en) | Low power dissipation computer case |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Ye Jin Document name: Notification of Termination of Patent Right |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |