CN201599988U

CN201599988U - Water-cooling environmental-protection central air conditioner of semiconductor ceramic chip

Info

Publication number: CN201599988U
Application number: CN2010201048359U
Authority: CN
Inventors: 李兴武
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-01-28
Filing date: 2010-01-28
Publication date: 2010-10-06
Anticipated expiration: 2020-01-28

Abstract

A water-cooling environmental-protection central air conditioner of a semiconductor ceramic chip is an environmental-protection air conditioner which is cooled and heated by the semiconductor ceramic chip. The water-cooling environmental-protection central air conditioner adopts a semiconductor technology of using electric energy to cool and heat, directly converts an electric energy source into a cold source and a heat energy, does not have mechanical sliding elements, has no noise and harmful gas, achieves the purposes of cooling and heating by changing working polarity of a direct-current power supply, cools and heats the air in a room by an aluminium radiator, achieves the effect of adjusting the temperature for the air in the room, also can be communicated with a water inlet and a water outlet of a household water circulating radiator to rise the temperature of circulating water of other rooms, also can be connected with an underground heated pipeline under the floor to rise the temperature for the room, also can be connected with a water circulating mattress to directly rise the temperature for a human body in winter so as to play a role of an electronic boiler; and the semiconductor heating and cooling component and a fan are both assembled in a machine cabinet, therefore, the water-cooling environmental-protection central air conditioner can be randomly moved to any place in the room, and is suitable for being used in houses and offices due to a plurality of characteristics of convenient installation and the like.

Description

Semiconductive ceramic chip water-cooled environmental protection air-conditioner

Technical field

The utility model relates to a kind of design and manufacturing technology of novel environment friendly air-conditioner

Background technology

At present, known air conditioner structure, form by outdoor air compressor and indoor condenser, crossflow fan fan, utilize cold and hot handing-over principle, heat with the air compressor cold-peace, the compressor power consumption is big, waste electric energy, cold-producing medium are this refrigeration Ji of freon, freon gas, the environment ozone layer are had destruction, the outdoor mounted compressor, in the room, punch, problems such as be inconvenient to install.

Summary of the invention

Be to overcome existing air conditioner, waste electric energy and the freon cold-producing medium problems such as environment and outdoor mounted main frame inconvenience that damage the ozone layer order of the present utility model.

The utility model provides a kind of residential central air conditioning device that is freezed and heated by the semiconductive ceramic chip; during refrigeration work; by the semiconductive ceramic chip is refrigerated source; to the cold subzero that is cooled to of blade inserting aluminium radiator; crossflow fan sucks the outermost heat air when rotating; after air conditioner inside becomes cold wind with the radiator circulating filtration; be discharged into the outside; so just reached the effect that reduces temperature; by the temperature sensor thermometric; indoorly shut down when reaching design temperature, when room temperature is higher than design temperature in starting.

When heating work, during the anti-phase power supply of supply current, the front of semiconductive ceramic chip transfers to and heats duty, the semiconductive ceramic chip heats to aluminium radiator, reach the heat of 50 degree above freezing, after by crossflow fan the cold air of outside being sucked that main frame is inner and becomes hot blast with the exchange of radiator circulating filtration, hot blast is being discharged into outside the main frame, to the room heating of heating, so just can heat heating winter uses, the electrical bar while feed-tank that is equipped with of water tank side is heated, delivery port is connected to a booster water pump, the water inlet pipe pressurizing feedwater that is used for outer water receiving circulation radiator, the water return outlet of the water tank of main frame also has a valve, the return pipe that is used for water receiving circulation radiator, when upper water box heats, hot water in the water tank circulates in external radiator simultaneously, can play Electronic boiler effect simultaneously to the room heating, during semiconductor chip work, no bath sound, voltage is 12 volt-amperes of full voltages of direct current, and freezing and heat assembly in the master is assembled in a rack inside entirely, so just can arbitrarily move Anywhere indoor.

Realization of the present utility model

Semiconductive ceramic chip 2, be contained in the back side refrigeration cool-down of aluminium blade inserting aluminium radiator 3, when rotating, suck the outermost heat air with crossflow fan 4 again, air conditioner is inner become cold wind with radiator 3 circulations after, be discharged into the outside, so just reaching the effect that reduces temperature

During chip 2 positive refrigeration, the power supply of electrode positive, the back side is the state of heating, heat below the chip is sent to following water tank 6 heat radiations to heat by aluminium radiator 5, has three kinds of types of cooling to lower the temperature in the water tank, 1 water-cooling pattern, 2 air cooling way, 3 circulating water flow flowing modes, the jumbo water of the interior injection of water tank carries out nature to radiator and cools, carry out reducing temperature twice with 13 pairs of water 8 surfaces of fan, with immersible pump 7, water is sucked the back discharge mutually the opposing party, the water endless form is lowered the temperature.Core backside heat temperature is controlled on 0 below 25 degree, like this above the semiconductive ceramic chip 2 refrigeration can reach 0 spend below.

When chip 2 fronts heat work, the semiconductive ceramic chip is when cathodal current is powered, the front of chip transfers to and heats duty, positive surface temperature heats and can reach more than 50 degree above freezing, chip front side is given top radiator 3 heating, reach the temperature of 50 degree above freezing above, 4 hot blast is discharged into outside the main frame according to circumstances by crossing current,, can heats the heating use winter to the room heating of heating, the side of water tank 10 is equipped with the electrical bar feed-tank and is heated, delivery port is connected to a booster water pump, is used for the water inlet pipe pressurizing feedwater of outer water receiving circulation radiator, and the water return outlet of the water tank of main frame also has a valve, the return pipe that is used for water receiving circulation radiator, when upper water box heated, the hot water in the water tank is circulation in external (X) group radiator simultaneously, can play the Electronic boiler effect to the room heating simultaneously, when refrigeration work, valve between cyclic water tank 10 and the water tank 12 is opened, and is used for recirculated water and passes through, when heating work, valve 11 is closed, allow water tank 10 sealing heating and with locate to connect the circulation of radiator group.

Description of drawings;

Fig. 1 is a cut-away view

Fig. 2 semiconductive ceramic chip figure

Fig. 3 aluminium fin inserting type heat radiator figure

Fig. 4 cross flow fan figure

Fig. 5 chip cooling

Fig. 6 water storage type spacing water tank figure that circulates

Lower header connection layout on Fig. 7 chip and the aluminium radiator

Fig. 8 lower header figure

Fig. 9 thermal insulative board figure

Accompanying drawing number

1 host power supply thermostat, 2 semiconductor refrigeration chips, 3 aluminium fin inserting type heat radiators, 4 crossflow fans, 5 chip radiators, the 6 water storage types spacing water tank that circulates, 7 condensers, 8 water, 9 divert oneself from loneliness or boredom water pipe, 10 cyclic water tanks, 11 valves, 12 large water tanks, 13 fans, 14 extraction fans, 15 electrical bars, 16 booster water pumps, 17 backwater valves, 18 sieve silks, 19, thermal insulative board

The specific embodiment

In Figure of description 1, cross flow fan 4 usefulness sieve silks 18 are fixed on the top in the rack, above the aluminium radiator fin 3, sieve silk 18 passes the aluminium radiator 5 of ceramic chip, chip 2 is clipped in the middle, allow the surface of chip 2 directly be attached to aluminium radiator 3 bottoms, cyclic water tank 6 usefulness sieve silks be fixed on from bottom to top aluminium radiator 3 below, the aluminium radiator 5 of chip is contained in the inside, the water inlet pipe of cyclic water tank 6 is connected with immersible pump 7 delivery ports, and the discharge outlet of cyclic water tank directly is inserted in following water tank 10 the insides.

The back side of semiconductor refrigeration chip 2 has been connected thermolysis with aluminium radiator 5, diffusing device 5 bottoms of aluminium are inserted in cooling water tank 6 inside entirely and go heat radiation, fan 13 usefulness sieve silks be fixed on lower header 12 above, cooperate water tank to carry out the second wind cooling cooling, immersible pump 7 is housed in the water tank 12, also played simultaneously the effect that water flows and circulation is lowered the temperature, three mouths are made a call in the side of water tank 10, three electrical bars of packing into, interior external application sieve silk and fixing, connect the water inlet pipe that a booster water pump 16 is connected on outer water circulation radiator above the following outlet pipe of water tank 10, top, the side return pipe valve of water tank 10 is connected on the radiator drainpipe of outer water circulation, plays the effect of a water circulation.

Claims

1. semiconductive ceramic chip water-cooled environmental protection air-conditioner is characterized in that; At the main frame internal upper part cross flow fan (4) is housed, have aluminum fin-inserted radiator (3) below, the radiator back side has semiconductive ceramic chip (2), the back side of semiconductive ceramic chip (2) is connected with aluminum fin-inserted radiator (5), aluminium radiator (5) bottom is inserted in chip cyclic water tank (6) the inside entirely, the water inlet of cyclic water tank (6) is connected with sebific duct with immersible pump (7) delivery port at bottommost, the delivery port of cyclic water tank (6) is at the frame mode of the topmost position of water tank (10), immersible pump (7) is equipped with in lower header (12) bottom, the both sides, top of lower header (12) hang with fan (13), ventilating fan (14) is equipped with on lower header 12 tops, the endless form that lower header (12) and water tank (10) externally use a valve (11) to be connected, electrically heated rod (15) is equipped with in the side of water tank (10), the bottom outlet pipe of water tank (10) is connected to the water inlet that a booster water pump (16) is used to connect water circulation radiator, a valve is arranged at the top of water tank (10), be used to connect the return pipe of water circulation radiator, a thermal insulative board (19) is housed, the frame mode of sealing lower header (12) and aluminium radiator (3) below the aluminium radiator (3).