CN2650449Y

CN2650449Y - Part fixing structure

Info

Publication number: CN2650449Y
Application number: CN 200320100929
Authority: CN
Inventors: 郭方
Original assignee: Delta Optoelectronics Inc
Current assignee: Taida Electronic Industry Co Ltd; Delta Optoelectronics Inc
Priority date: 2003-10-10
Filing date: 2003-10-10
Publication date: 2004-10-20
Anticipated expiration: 2013-10-10

Abstract

A part fixing structure is provided, which is suitable for fixing a component on a plate; wherein, the plate has a first surface, a relevant second surface and a plug hole, the plug hole passing through the plate is connected with the first surface and the second surface of the plate. The part fixing structure has at least one inserting part and one salient part, wherein, the inserting part has a first end rim and a second end rim, the first end rim is connected with the component, and the second end rim can be inserted into the plug hole. Moreover, the salient part forms on the second end rim surface, when the second end rim is inserted into the plug hole, the inserting part can form a structural interference with the plate from the salient part and along the extension of inserting hole.

Description

Part fixing structure

Technical field

The utility model relates to a kind of fixed structure, and particularly a kind of part fixing structure, it is applicable to securing part to a plate object, the portion of plugging together of this part is by a protuberance and along the bearing of trend of inserting hole, and with the mutual constructive interference of plate object, thereby retaining element is to plate object.

Background technology

Along with electronics technology advance by leaps and bounds, make various electronic products day by day popularly be applied in the middle of our work and life electronic products such as the most common especially at present information and household electrical appliances.In order to allow these electronic products produce special function, electronic product almost has a motherboard, it is made of many electronic components and circuit board, and wherein these electronic components are to be assembled to circuit board, and are electrically connected to each other via the internal wiring of circuit board.

With regard to the technology that general electronic component is assembled to circuit board, if electronic component need be used more powerful connection strength when being connected to circuit board, the electronic component of connector types such as (Connector) for example, (PinThrough Hole, packaging technology PTH) is assembled to electronic component on the circuit board can to utilize the pin insert type.The packaging technology of pin insert type is the pin of electronic component to be inserted the perforation of circuit board, be fixed in the perforation of circuit board with the pin configuration ground of a scolder (Solder) more afterwards electronic component, make can not produce relative displacement between electronic component and the circuit board, to reach electrically being connected between electronic component and the circuit board with structural.In addition, the packaging technology of pin insert type can also be applied on structural connection between fin and the circuit board.

Please in regular turn with reference to Figure 1A, Figure 1B, it illustrates the schematic diagram of existing a kind of fin assembling processing procedure in regular turn.Existing fin assembling processing procedure is to be used for a fin 100 is assembled to a circuit board 200.Shown in Figure 1A, circuit board 200 has a first surface 210, a corresponding second surface 220 and an inserting hole 230, and inserting hole 230 is to run through circuit board 200, and the first surface 210 of connecting circuit plate 200 and second surface 220.In addition, one pin 120 is formed on the bottom that existing fin assembling processing procedure also is included in fin 100, wherein pin 120 has one first ora terminalis 122 and one second ora terminalis 124, and first ora terminalis 122 of pin 120 is to be connected to

fin

100, and 124 of second ora terminalis of pin 120 insert inserting hole 230.

Shown in Figure 1B, after second ora terminalis 124 of pin 120 inserts the inserting hole 230 of circuit board 200, in order to strengthen pin 120 and circuit board 200 structural connection the each other, to guarantee that fin 100 can firmly be assembled on the circuit board 200, usually all can utilize the mode of wave soldering (WaveSoldering), make weldering stream (Solder Flow) formed solder bump 240 will show admittedly in second ora terminalis 124 of pin 120 and the intersection of the second surface 220 of circuit board 200.

And for example shown in Figure 1A, during the conveying of fin 100 and circuit board 200, the situation that can take place to vibrate slightly unavoidably between fin 100 and the circuit board 200, but these vibrations all may influence the relative position between the inserting hole 230 of second ora terminalis 124 of pin 120 and circuit board 200, the impulsive force that is subjected to welding stream when second ora terminalis 124 of pin 120, and and when producing relative displacement between the circuit board 200, so will make indirectly and produce relative displacement between fin 100 and the circuit board 200, at last after solder bump 240 solidifies, the segment distance G of will being separated by undeservedly between fin 100 and the circuit board 200 is shown in Figure 1B.

Produce relative displacement in order to improve between circuit board 200 and the fin 100 at experience wave soldering processing procedure back, after through the wave soldering processing procedure, in case when finding that the pin 120 of fin 100 produces relative displacement with circuit board 200, can utilize the mode of artificial repair welding, it is the mode of heavy industry (Rework), again the melting solder bump 240, again fin 100 and circuit board 200 are drawn close mutually, so after solder bump 240 solidifies, the bottom of fin 100 can be close proximity to the first surface 210 of circuit board 200.Yet, when the ratio that produces relative displacement between fin 100 and the circuit board 200 is higher, will expend great deal of labor in the heavy industry mode of drawing close fin 100 and circuit board 200 by melting solder bump 240.

Similarly, produce relative displacement in order to improve between circuit board 200 and the fin 100 at experience wave soldering processing procedure back, fin 100 and circuit board 200 still can carry out the wave soldering processing procedure before, use in advance tool with fin 100 closely pressure holding on circuit board 200, and through after the wave soldering processing procedure, will not have between fin 100 and the circuit board 200 Figure 1B apart between the G every.Yet, if use tool fixed form is prevented the generation apart from G, then need according to the position of fin 100 with respect to circuit board 200, and then respective production goes out the tool that fin 100 can be positioned on the circuit board 200, and before carrying out the wave soldering processing procedure, then need a large amount of manpowers to use tool earlier, make the bottom of fin 100 can be close proximity to the first surface 210 of circuit board 200.

Based on above-mentioned, can firmly be fixed on the circuit board in order to ensure the bottom of fin, no matter be heavy industry or the fixing mode of tool, the cost that these two kinds of improvement modes all will cause groups of fins to be filled to circuit board significantly improves.

The utility model content

Supervise in this, the purpose of this utility model is exactly in that a kind of part fixing structure is provided, in order to securing part to a plate object.

For reaching above-mentioned purpose of the present utility model, the utility model proposes a kind of part fixing structure, it is applicable to securing part to a plate object, wherein plate object has a second surface and an inserting hole of a first surface, correspondence, and inserting hole is to run through plate object, and connects first surface and second surface.This part fixing structure comprises that at least one plugs together a portion and a protuberance.At first, the portion of plugging together has one first ora terminalis and one second ora terminalis, and first ora terminalis is to be connected with part, and second ora terminalis is to be suitable for inserting inserting hole.In addition, protuberance is the surface that is formed at second ora terminalis, when second ora terminalis inserts inserting hole, the portion of plugging together be thus protuberance along the bearing of trend of inserting hole, and with the mutual constructive interference of plate object.

According to the described part fixing structure of preferred embodiment of the present utility model, also comprise a solder bump, it is disposed at the intersection of the second surface and second ora terminalis, and extends to the gap between second ora terminalis and the inserting hole.

According to the described part fixing structure of preferred embodiment of the present utility model, it is one-body molded wherein plugging together portion and protuberance, and protuberance for example is that institute of the portion that plugs together punch forming via the part forms.

Described according to preferred embodiment of the present utility model, above-mentioned part fixing structure, wherein part is to be a fin, and the portion of plugging together is a pin of fin for this reason.

Described according to preferred embodiment of the present utility model, above-mentioned part fixing structure, wherein part is to be an electronic component, and the portion of plugging together is a pin of electronic component for this reason.

Based on above-mentioned, the utility model is that a protuberance is formed on second ora terminalis of the portion of plugging together, so when second ora terminalis of the portion of plugging together inserts the inserting hole of plate object, the portion of plugging together can be by protuberance and along the bearing of trend of inserting hole, make to plug together between portion and the plate object and structurally interfere mutually, and then effectively part is fixed on the plate object, make part during the wave soldering processing procedure, it still can firmly be fixed on the plate object, does not produce relative displacement and do not have between fin and the plate object.

Description of drawings

For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below, wherein:

Figure 1A, Figure 1B illustrate the schematic diagram of existing a kind of fin assembling processing procedure in regular turn.

Fig. 2 A, Fig. 2 B illustrate a kind of part fixing structure according to preferred embodiment of the present invention in regular turn, and it is applied to the schematic diagram of part assembling processing procedure.

Embodiment

Please refer to Fig. 2 A, Fig. 2 B, it illustrates a kind of part fixing structure according to preferred embodiment of the present invention in regular turn, and it is applied to the schematic diagram of part assembling processing procedure.Shown in Fig. 2 A, part fixing structure of the present utility model is to be applicable to a part 300 is fixed to a plate object 400, wherein part 300 for example is a fin or an electronic component, be to be example with the fin, and plate object 400 for example is a printed circuit board (PCB) herein.At first, plate object 400 has a second surface 420 and an inserting hole 430 of a first surface 410, correspondence, and wherein inserting hole 430 is to run through plate object 400, and connects the first surface 410 and the second surface 420 of plate object 400.

Shown in Fig. 2 A, the part fixing structure of this preferred embodiment comprises that at least one plugs together a portion 320 and a protuberance 326.At first, plug together portion 320 and have one first ora terminalis 322 and one second ora terminalis 324, and first ora terminalis 322 that plugs together portion 320 is to be connected with

part

300, and 324 of second ora terminalis that plug together portion 320 are suitable for inserting the inserting hole 430 of plate object 400.In addition, the protuberance 326 that plugs together portion 320 is to form the surface that protrudes in second ora terminalis 324.In addition, plug together portion 320 and for example be formed in one, and protuberance 326 for example is that 320 punch formings of the portion that plugs together via the part form with protuberance 326.

Shown in Fig. 2 A, when second ora terminalis 324 inserts inserting hole 430, plugging together portion 320 can be by protuberance 326 and along the bearing of trend of inserting hole 430, and with plate object 400 mutual constructive interference, and the part near plate object 400 of mating parts 300 is resisted against the first surface 410 of plate object 400, makes that plugging together portion 320 can be fixed in part 300 on the plate object 400 effectively.Therefore, after through the wave soldering processing procedure, the bottom that can guarantee part 300 plugs together portion 320 and can not produce relative displacements with plate object 400.

Shown in Fig. 2 B, part fixing structure of the present utility model also can comprise a solder bump 440, it is during the wave soldering processing procedure, be formed at the second surface 420 and the intersection that plugs together second ora terminalis 324 of portion 320 of plate object 400, and may extend to gap between second ora terminalis 324 and the inserting hole 430, reaching structural connection the between part 300 and the plate object 400, or even electrically connect.It should be noted that during the wave soldering processing procedure protuberance 326 of heat radiation fixed structure can structurally be interfered part 300 and plate object 400 along the bearing of trend of patchhole 430.In addition, after the wave soldering processing procedure, solder bump 440 and plug together portion 320 and can provide enough structural strength jointly between part 300 and the plate object 400, in order to firmly part 300 is fixed on the plate object 400.

In sum, the utility model is to form a protuberance on the surface of second ora terminalis of the portion of plugging together, so when second ora terminalis of the portion of plugging together inserts the inserting hole of plate object, the portion of plugging together is by protuberance and along the bearing of trend of inserting hole, make between the portion of plugging together and the plate object and can structurally interfere mutually, and then a part that will be connected in the portion of plugging together indirectly is fixed on the plate object.Therefore, when utilizing the pin insert type

(PTH) packaging technology, when being assembled to part (for example fin or electronic component) on the plate object (for example printed circuit board (PCB)), part fixing structure of the present utility model can be fixed to part on the plate object, make the portion that plugs together of part fixing structure in the impulsive force of the weldering stream that is subjected to wave soldering, plugging together portion still can firmly be positioned on the plate object via protuberance, make and can not produce the gap of not expecting between the bottom of part and the plate object, or can control effectively and not expect the size in gap, and then significantly promote the process rate that part is assembled to plate object.

Though the utility model discloses as above with a preferred embodiment; right its is not in order to limit the utility model; anyly have the knack of this skill person; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection range of the present utility model is as the criterion when looking accompanying the claim person of defining.

Claims

1. part fixing structure, be applicable to securing part to a plate object, wherein this plate object has a second surface and an inserting hole of a first surface, correspondence, wherein this inserting hole runs through this plate object, and connection first surface and second surface, it is characterized in that this part fixing structure comprises at least:

One plugs together portion, has one first ora terminalis and one second ora terminalis, and wherein this first ora terminalis is to be connected with this part, and this second ora terminalis is to be suitable for inserting this inserting hole; And

One protuberance is formed at the surface of this second ora terminalis, and when this second ora terminalis inserted this inserting hole, wherein this portion of plugging together was by the bearing of trend of this protuberance along this inserting hole, and with the mutual constructive interference of this plate object.

2. part fixing structure as claimed in claim 1 is characterized in that wherein this part fixing structure also comprises a solder bump, and it is disposed at the intersection of this second surface and this second ora terminalis, and extends to the hole between this second ora terminalis and this inserting hole.

3. part fixing structure as claimed in claim 1 is characterized in that, wherein this plugs together portion and this protuberance is one-body molded.

4. part fixing structure as claimed in claim 1 is characterized in that, wherein this protuberance is to plug together portion's punch forming via this to form.

5. part fixing structure as claimed in claim 1 is characterized in that, wherein this part is to be a fin, and this portion of plugging together is the pin for this fin.

6. part fixing structure as claimed in claim 1 is characterized in that, wherein this part is to be an electronic component, and this portion of plugging together is the pin for this electronic component.